M02066-51 - Mindspeed Technologies, Inc.

02066-DSH-001-D Mindspeed Technologies®November 2006

Preliminary Information / Mindspeed Proprietary and Confidential

Preliminary Information

The M02066 is a highly integrated, programmable laser driver intended for SONET/SDH applications with FEC to 3

Gbps. Using differential PECL data and clock inputs, the M02066 supplies the bias and modulation current

required to drive an edge-emitting laser. The modulation output can be DC-coupled to the laser diode, giving a

significant power saving over AC-coupled operation.

The M02066 includes automatic power control to maintain a constant average laser output power over temperature

and life. In addition, the modulation current can be temperature compensated to minimize variation in extinction

ratio over temperature.

Output flags indicate laser end of life as well as failure of the APC circuitry to maintain average output power.

General Note: This product was previously called the CX02066.

Features

• High speed operation; suitable for applications to 3 Gbps.

• Typical rise/fall times of 90 ps.

• DC or AC coupled modulation drive.

• Differential data and clock inputs to minimize pattern dependent

jitter.

• Independently Programmable Laser Bias and Modulation currents.

• Bias current to 100 mA and modulation current to 85 mA at VCC =

3.3 V

• Automatic Laser Power Control, with programmable temperature

compensation and ‘Slow-Start’.

• Bias and modulation current monitor

• Operates with +3.3 Volt supply

• Functionally compatible with MAX 3869

• The M02066-21 and M02066-51 are available in a BCC+24

package. The M02066-82 is available in a TQFP32 package.

• Available in RoHS compliant packages

Applications

• Short reach and Metro SONET/SDH

• Datacomms Modules

• Add/Drop Multiplexers

• Digital Cross Connects

Functional Block Diagram

X100

X60

Failure

Detect

DIS

ENA

FAIL

OCA

BIASMON

MODMON

IBIAS

IMOD

OUT-

OUT+

VCC

IBIAS

RMODSET

RTCSLOPE

RTCSTART

RMPCSET

VCC

CMPC

VREF

ROCA

OCASET

GNDA

RSHUNT

CSHUNT

CEN

CLK

DATA

MPC

SET

NOTE: BCC+24 Package

PD and MPCSET are comm on on Pin 13

BIASMON and MODMON are common on Pin 4

Preliminary Information

This document contains information on a new product. The parametric information, although not

fully characterized, is the result of testing initial devices.

M02066

3.3 Volt Laser Driver IC for Applications to 3 Gbps Data Sheet

02066-DSH-001-D Mindspeed Technologies®ii

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Preliminary Information

Ordering Information

Part Number Package

M02066-21 BCC+24 package with 20 ps or less DCD

M02066-51 BCC+24 package with 50 ps or less DCD

M02066-82 TQFP32 package with 80 ps or less DCD

M02066-EVME BCC+24 electrical evaluation board

M02066-T-EVM Optical evaluation board, TO-can laser

M02066G-21 * BCC+24 RoHS compliant package, with 20 ps or less DCD

M02066G-51 * BCC+24 RoHS compliant package, with 50 ps or less DCD

M02066G-82 * TQFP32 RoHS compliant package, with 80 ps or less DCD

* The letter “G” designator after the part number indicates that the device is RoHS-compliant. Refer to www.mindspeed.com for additional

information.

Revision History

Revision Level Date ASIC Revision Description

D Preliminary November 2006 x Added RoHS package information, updated format, no specification

changes.

BCC+24L Top View

78 9 10 11 12 13

24 23 22 21 20

CEN

DIS

GND

MON

FAIL

OCA

BIAS

OUT+

OUT-

GND

CLK

VCC

GNDA

CMPC

TCSTART

TCSLOPE

MODSET

OCASET

DIN

4mm

VCC

TQFP32 Top View

CLK

CEN

ENA

GND

FAIL

OCA

GND

OUT-

OUT+

BIAS

VCC

DIN

VCC

BIASMON

MODMON

VCC

GND A

CMPC

TCSLOPE

MPC SET

MOD SET

OCA SET

VCC

5mm

02066-DSH-001-D Mindspeed Technologies®1

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Preliminary Information

1.0 Product Specification

1.1 Absolute Maximum Ratings

These are the absolute maximum ratings at or beyond which the IC can be expected to fail or be damaged.

Functional operation at these levels is not implied.

1.2 Recommended Operating Conditions

Table 1-1. Absolute Maximum Ratings

Parameter Rating Units

Power supply (VCC-GND) -0.5 to +6.0 V

Operating ambient -40 to +85 °C

Storage temperature -65 to +150 °C

Maximum laser bias current 120 mA

Maximum laser modulation current (through OUT+/OUT2+, OUT-/OUT2-) 100 mA

Table 1-2. Recommended Operating Conditions

Parameter Rating Units

Power supply (VCC-GND) 3.3 ± 10% V

Junction temperature (die) -40 to + 120 °C

Operating ambient -40 to + 85 °C

Product Specification

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Preliminary Information

1.3 DC Characteristics

VCC=+3.3V ± 10%, TA=-40 °C to +85 °C, unless otherwise noted.

Table 1-3. DC Characteristics

Parameter Conditions Min Typ Max Units

Supply current IBIAS = 50 mA IMOD = 50 mA

Excluding IBIAS and IMOD

-57 - mA

Supply current IBIAS = 100 mA IMOD = 85 mA

Excluding IBIAS and IMOD

-70 75 mA

Bias current adjust range Limited by OCASET across temperature

range

2- 100 mA

Bias current with output disabled Tx_Disable = HIGH - - 300 µA

Maximum bias current limit TA = +85 °C (adjustable) 100(1) --mA

Change in OCASET over temperature - 200 - µA/°C

Monitor diode reverse bias voltage - 2.1 - V

Monitor diode current adjustment range 10 - 1500 µA

TTL/CMOS input HIGH voltage

(CEN, DIS)

2.0 - - V

TTL/CMOS input LOW voltage

(CEN, DIS)

-- 0.8 V

CMOS output HIGH voltage

(FAIL, OCA)

2.4 - - V

CMOS output LOW voltage

(FAIL, OCA)

-- 0.4 V

Differential input impedance Data and clock inputs 2.5 - - kΩ

Common-mode input voltage VCC-1.7 VCC-(VIN(Diff)/4) V

Self-biased common mode input voltage Data and clock inputs VCC-1.7 - VCC-0.47 V

NOTE:

(VCC = +3.3 V ±10%, TA = 40 °C to + 85 °C, unless otherwise noted)

1. ROCASET = 0 Ω

Product Specification

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Preliminary Information

1.4 AC Characteristics

VCC = +3.3V ±10%, TA = -40 °C to +85 °C, unless otherwise noted.

Table 1-4. AC Characteristics

Parameter Conditions Min. Typ. Max. Units.

Differential input voltage = 2 x (DIN HIGH - DIN LOW)

(clock inputs follow same relationship)

300 — 1860 mV

Modulation current range 2.5 — 85 mA

Modulation current with output disabled DIS=HIGH — — 300 µA

Programmable range for modulation

current temperature coefficient

Adjustable 500 — 104ppm/°C

Programmable temperature at which

modulation current TC compensation

enables

Programmed by choice of RTCSET 20 — 60 °C

Modulation output rise time

Modulation output fall time

20% to 80% into 25 Ω (1)

20% to 80% into 25 Ω

—

Overshoot of modulation output current Into 25 Ω load -10 — +10 %

Modulation output pulse width distortion Measured using alternating 1-0 pattern

RMODSET = 7 kΩ

20(2) ps

Modulation output pulse width distortion Measured using alternating 1-0 pattern

RMODSET = 7 kΩ

50(3) ps

Modulation output pulse width distortion Measured using alternating 1-0 patternRMODSET = 7

kΩ

80(4) ps

Modulation output random jitter rms 12 kHz to 20 MHz — — 4 mUI

Total output jitter (data input latch enabled) Peak-to-peak. Measured into 25 Ω load using 1867

MHz Bessel filter: 223-1 PRBS at 2.488 Gbps; using

clock inputs (includes PWD, random and

deterministic)

——42

(2) ps

Total output jitter (data input latch enabled) Peak-to-peak. Measured into 25 Ω load using 1867

MHz Bessel filter: 223-1 PRBS at 2.488 Gbps; using

clock inputs (includes PWD, random and

deterministic)

——72

(3) ps

Total output jitter (data input latch enabled) Peak-to-peak. Measured into 25 Ω load using 1867

MHz Bessel filter: 223-1 PRBS at 2.488 Gbps; using

clock inputs (includes PWD, random and

deterministic)

— — 100(4) ps

NOTES:

(VCC = +3.3 V ±10%, TA = 40 °C to + 85 °C, unless otherwise noted)

1. IMOD = 28 mA

2. Applies only to the M02066-21.

3. Applies only to the M02066-51.

4. Applies only to the M02066-82.

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Preliminary Information

2.0 Pin Description

2.1 Pin Descriptions

Table 2-1. Pin Descriptions (BCC+24)

Pin No. Name Function

1 CEN Clock enable input (TTL/CMOS). Set HIGH or not connected to use CLK inputs, LOW when not using CLK inputs

2 DIS Bias and modulation output disable (TTL/CMOS). LOW for normal operation

3 GND Ground

4 MON Monitor output, connect a resistor between this pin and VCC to monitor the sum of bias and modulation currents

5 FAIL Mean power control failure indicator (TTL/CMOS). Goes LOW when control loop is no longer able to maintain constant

current at PD

6 OCA Over-current alarm (TTL/CMOS). Goes LOW when IBIAS exceeds the preset bias current limit

CC Power supply

8 BIAS Laser bias current output

CC Power supply

10 OUT+ Positive modulation current output. Sinks current when DIN is HIGH

11 OUT- Negative modulation current output. Sinks current when DIN is HIGH

12 GNDAGround for output stage. (inductor to ground)

13 PD Monitor photo diode input. This input is connected to the monitor photodiode anode for automatic power control. A

resistor between this pin and ground sets the mean optical power

14 CMPC Mean power control loop dominant pole capacitor

15 GND Ground

16 TCSLOPE Connecting a resistor between this pin and ground sets the temperature coefficient of IMODSET (using the internal IC

temperature)

17 TCSTART Secondary temperature coefficient of IMOD. A resistor on this pin to ground sets the temperature at which the

temperature compensation starts

18 MODSET Modulation current set. Connect a resistor between this pin and ground to set

19 OCASET Over current alarm set. Connect a resistor between this pin and ground to set

20 VCC Power supply

21 DIN Positive data input (PECL). Self biased

Pin Description

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Preliminary Information

22 DIN Negative data input (PECL). Self biased

23 CLK Positive clock input (PECL). Self biased. Connect to Vcc if not used

24 CLK Negative clock input (PECL). Self biased. Can be disconnected if not used

NOTE:

The center pad must be connected to ground through an array of vias for good electrical and thermal performance.

Table 2-2. Pin Descriptions (TQFP 32)

Pin No. Name Function

1, 4, 7, 16,

18, 21, 25,

VCC Power supply

2DIN Positive data input (PECL). Self biased

3DIN Negative data input (PECL). Self biased

5CLK

Positive clock input (PECL). Self biased. Connect to Vcc if not used

6CLK

Negative clock input (PECL). Self biased. Can be disconnected if not used

8CEN

Clock enable input (TTL/CMOS). Set HIGH or not connected to use CLK inputs, LOW when not using CLK

inputs

9 ENA Bias and modulation output enable (TTL/CMOS). HIGH for normal operation

10 GND Ground

11 BIASMON

Bias monitor and temperature- dependent bias current limit. Connect a resistor between this pin and VCC to

monitor

12 MODMON Modulation current monitor. Connect a resistor between this pin and VCC to monitor

13 FAIL Mean power control failure indicator (TTL/CMOS). Goes LOW when control loop is no longer able to maintain

constant current at IPIN

14 OCA Over-current alarm (TTL/CMOS). Goes LOW when IBIAS exceeds the preset bias current limit

15 GND Ground

17 BIAS Laser bias current output

19 OUT+ Positive modulation current output. Sinks current when DIN is HIGH

20 OUT- Negative modulation current output. Sinks current when DIN is HIGH

22 GNDAGround for output stage (inductor to ground)

23 GNDAGround for output stage (inductor to ground)

24 PD Monitor photo diode input. This input is connected to the monitor photodiode anode for automatic power

control.

26 CMPC Mean power control dominant pole capacitor

Table 2-1. Pin Descriptions (BCC+24) (Continued)

Pin No. Name Function

Pin Description

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Preliminary Information

27 NC Not connected and may be grounded for compatibility with MAX3869

28 TCSLOPE

Connecting a resistor between this pin and ground sets the temperature coefficient of IMODSET (using the

internal IC temperature)

29 MPCSET A resistor between this pin and ground sets the mean optical power

30 MODSET Modulation current set. Connect a resistor between this pin and ground to set

31 OCASET Over current alarm set. Connect a resistor between this pin and ground to set

NOTE:

TCSTART is internally connected to 0 V in the TQFP32.

The center pad must be connected to ground through an array of vias for good electrical and thermal performance.

Table 2-2. Pin Descriptions (TQFP 32) (Continued)

Pin No. Name Function

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Preliminary Information

3.0 Functional Description

3.1 Overview

The M02066 laser driver consists of a high-speed modulation driver and a laser bias generator with mean power

control (MPC). It is optimized for high speed, low power operation at 3.3V supply. To minimize the pattern-

dependent jitter of the input signal, the device accepts an input clock signal for data retiming. This feature can be

enabled using the external CEN pin.

Figure 3-1. CX02068 Block Diagram

X100

X60

Failure

Detect

DIS

ENA

FAIL

OCA

BIASMON

MODMON

IBIAS

IMOD

OUT-

OUT+

VCC

IBIAS

RMODSET

RTCSLOPE

RTCSTART

RMPCSET

VCC

CMPC

VREF

ROCA

OCASET

GNDA

RSHUNT

CSHUNT

CEN

CLK

DATA

MPC

SET

NOTE: BCC+24 Package

PD and MPCSET are common on Pin 13

BIASMON and MODMON are common on Pin 4

Functional Description

02066-DSH-001-D Mindspeed Technologies®8

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Preliminary Information

3.2 Features

• High speed operation; suitable for applications to 3 Gbps.

• Typical rise/fall times of 90 ps.

• DC or AC coupled modulation drive.

• Differential data and clock inputs to minimize pattern dependent jitter.

• Independently Programmable Laser Bias and Modulation currents.

• Bias current to 100 mA and modulation current to 85 mA at VCC = 3.3 V

• Automatic Laser Power Control, with programmable temperature compensation and ‘Slow-Start’.

• Bias and modulation current monitor

• Operates with +3.3 Volt supply

• Functionally compatible with MAX 3869

• The M02066-21 and M02066-51 are available in a BCC+24 package. The M02066-82 is available in a TQFP32

package.

• Available in RoHS compliant packages

Functional Description

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Preliminary Information

3.3 Modulator

The M02066 modulation output is optimized for driving a 25Ω load; the minimum required voltage at OUT+ and

OUT- is 0.6V. To interface with the laser diode, a matching resistor (RD) is required for impedance matching. An

RC shunt network is necessary to compensate for the laser diode parasitic inductance, thereby improving the

optical eye.

Typical values are RSHUNT = 39Ω, CSHUNT = 3.9 pF.

These values will need to be optimized for a specific laser.Any capacitive loading at the cathode of a laser diode will

degrade the optical output performance. An inductor is used to isolate the BIAS pin from the laser cathode. See

Figure 3-1.

The modulator output stage is designed to drive up to 85mA in either AC-coupled or DC-coupled mode. DC-

coupled performance depends on the laser used.

RMODSET determines the modulation current according to the following formula: IMOD = 350/RMODSET

Figure 3-2 shows the modulation current for a given RMODSET resistor.

Figure 3-2. Modulation Current vs. RMODSET

Modulation Current in mA

0.00

10.00

20.00

30.00

40.00

50.00

60.00

70.00

80.00

90.00

0 10203040

Rmodset (kohms)

Imod (mA)

Functional Description

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Preliminary Information

3.4 Mean Power Control Loop

To maintain constant average optical power, the M02066 incorporates a control loop to compensate for the

changes in laser threshold current over temperature and lifetime. A monitor photodiode mounted in the laser

package is used to convert the optical power into a photocurrent. The MPC loop adjusts the laser bias current so

that the voltage at PD is matched to an on-chip reference voltage. The external resistor (RMPCSET) sets the optical

power.

RMPCSET = 1.28/IPIN

IPIN is the mean current from the monitor photodiode at the required mean laser power level (see laser

datasheet).The time constant of the loop is determined by CMPC. In some applications the internal capacitance at

CMPC may be sufficient and an external CMPC will not be required.

(at 6 dB cut off frequency) vs CMPC (for nominal process)

Figure 3-3 shows the bias current vs RMPCSET over the full operating temperature range.

Table 3-1. MPC Loop Bandwidth

CMPC 6 dB cutoff frequency

0 17 MHz

1 nF 100 kHz

10 nF 10 kHz

100 nF 1 kHz

Figure 3-3. Bias Current vs. RMPCSET

NOTE:

This curve will scale with monitor photodiode current transfer efficiency.

100

120

0 5000 10000 15000 20000 25000 30000 35000

RMPCSET Ω

Bias current

(mA)

-40 025 50 85

Symbols shown indicate °C

Functional Description

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Preliminary Information

There are two safety features integrated into the MPC loop; an Over-Current Alarm and an MPC loop failure alarm.

The Over-Current Alarm (OCA) circuit limits the maximum bias current generated by the M02060. The bias current

limit is set by an external resistor to ground, ROCA. When this limit is exceeded the OCA pin is asserted LOW.

Figure 3-4 shows the maximum bias current limit vs ROCA.

3.5 Safety Logic

Safety logic is provided in order to limit the maximum bias current. The bias current at which the safety logic trips

is set by an external resistor to ground (ROCA) from the OCASET pin. When the bias current limit is reached alarm

flag OCA is asserted LOW. A loop failure alarm is also provided to detect when the bias current can no longer be

adjusted to achieve the desired average optical power.

3.6 Data Input Latch

To minimize input data pattern-dependent jitter, a differential clock signal can be connected to the data input latch.

If CEN is HIGH, the input data is retimed by the rising edge of CLK+. If CEN is LOW, the input data is directly

connected to the output stage. If CEN is left floating it will be pulled HIGH by the internal circuitry. When this latch

function is not used, connect CLK+ to VCC and leave CLK- unconnected.

3.7 Enable Control

The M02066 incorporates a dual laser driver enable function. When ENA is LOW or DIS is HIGH, both the bias

and modulation currents are off. DIS and ENA are available on the M02066 die only, DIS is available on the BCC

package only, ENA is available on the TQPF package.

Figure 3-4. Typical limiting current vs ROCA (at 25 °C)

100

010000 20000 30000 40000

ROCA (Ω)

IOCA (mA)

Functional Description

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Preliminary Information

3.8 Current Monitors

The M02066 features bias and modulation current monitor outputs. The BIASMON output sinks a current equal to

nominally 1/60 of the laser bias current (IBIAS). The MODMON output sinks a current equal to nominally 1/60 of the

laser peak to peak modulation current (IMOD). BIASMON and MODMON should be connected through a pull-up

resistor to VCC. Choose a pull-up resistor value that ensures a voltage at BIASMON greater than VCC-1.6V and a

voltage at MODMON greater than VCC - 1.0V. These pins should be tied to VCC if not used.

3.9 Temperature Compensation

The reduction in slope efficiency of typical laser diodes caused by increased temperature can be compensated by

utilising the TCSTART and TCSLOPE features of the M02066. Under closed loop conditions the average optical

power will be maintained by the Mean Power Control loop, compensating for factors such as temperature and age.

However, as the laser slope efficiency reduces with increasing temperature the laser diode will require a greater

peak to peak current swing in order to maintain the same peak to peak optical output swing. To this end the

M02066 senses temperature and can be programmed to increase the modulation current amplitude accordingly.

Two external resistors are used to program the temperature compensation.

The temperature (TCSTART) at which the compensation begins to take effect is set by a resistor (RTCSTART) from

the TCSTART pin to ground. The rate of increase of modulation current with temperature (beyond TCSTART) is set

by a resistor (RTCSLOPE) from the TCSLOPE pin to ground.

As a safety feature, the M02066 limits the increased modulation current to twice the initial (ambient) modulation

current.

The effects of the two programming resistors are shown schematically in the Temperature Compensation graph

below.

If using the TQFP package; only TCSLOPE is programmable, TCSTART is connected to 0 V.

Figure 3-5. Typical Eye Diagram

2.5 Gbps optical eye @ -3 dBm

(1.87 GHz filter)

Functional Description

02066-DSH-001-D Mindspeed Technologies®13

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Preliminary Information

For more details on temperature compensation see the appropriate applications note.

Figure 3-6. Temperature Compensation

80 mA

IMOD

-40 °C

0 mA

+80 °C

TCSLOPE

TCSLOPE 2

RTCSTART 1

RTCSTART 2

TCSTART

TCSLOPE 1

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Preliminary Information

4.0 Packaging Specification

4.1 Packaging Specification

Figure 4-1. Bare Die Information

BIAS

GNDA

VCC

OUTP

OUTN

VCC

OCASET

MODSET

GND

MPCSET

TCSTART

TCSLOPE

CMPC

DIN

CEN

ENA

DIS

BIASMON

MODMON

FAIL

OCA

OUTP

OUTN

VCC

GNDA

GND

VCC

GND

VCC

CLK

GND

DIN

VCC

GND

VCC

CLK

VCC

GND

VCC

Dimensions:

Pad opening 84 x 84 µ

Die size 1790 x 1718 µ

Packaging Specification

02066-DSH-001-D Mindspeed Technologies®15

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Preliminary Information

Table 4-1. Pad Centers

PIN X Y PIN X Y PIN X Y PIN X Y

CEN -727 550 BIAS -550 -711 VCC 727 -550 GND 550 711

ENA -727 440 GNDA-440 -711 CMPC 727 -440 VCC 440 711

DIS -727 330 VCC -330 -711 GND 727 -33- DIN 330 711

GND -727 220 *OUTP -210 -711 TCSLOPE 727 -220 DIN 220 711

BIASMON -727 110 *OUTP -210 -711 GND 727 -110 VCC 110 711

MODMON -727 0 *OUTN 100 -711 TCSTART 727 0 GND 0 711

FAIL -727 -110 *OUTN 100 -711 MPCSET 727 110 VCC -110 711

GND -727 -220 VCC 220 -711 GND 727 220 CLK -220 711

OCA -727 -330 GNDA330 -711 MODSET 727 330 CLK -330 711

GND -727 -440 GNDA440 -711 OCASET 727 440 VCC -440 711

VCC -727 -550 PD 550 -711 VCC 727 550 GND -550 711

NOTE:

* Single pad/double bond

Packaging Specification

02066-DSH-001-D Mindspeed Technologies®16

Preliminary Information / Mindspeed Proprietary and Confidential

Preliminary Information

Figure 4-2. TQFP32 Package Information

Table 4-2. TQFP32 Package Dimensions

Dim Tol. 5 x 5 x 1.0 mm Dim Tol. 5 x 5 x 1.0 mm

N Lead count 32 e Typ. 0.50

A Max. 1.20 b ±0.05 0.22

A1 ±0.05 0.05 0 *** 0° - 7°

A2 ±0.05 1.00 01 ±4° 6°

A3 ±0.05 0.4365 R Max. 0.15

D ±0.15 7.00 R1 Typ. 0.15

D1 ±0.05 5.00 aaa Max. 0.08

E ±0.15 7.00 ccc Max. 0.08

E1 ±0.05 5.00 F1 ±0.10 2.67

L +0.15/-0.15 0.60 F2 ±0.10 2.67

L1 Ref. 1.00

E1E

PIN 1 ID. 0 0.50±.05

C0.50±.05X45°

-B-

-D-

-A-

12° TYP.

0.25

GAGE PLANE

SEATING PLANE

-C-ccc

-C-

A2 A

DETAIL X

TOP VIEW

BOTTOM VIEW

SIDE VIEW

DETAIL X

-H-

DETAIL A

0.17 MAX.

DETAIL A

CMaaa

COPLANARITY

Chamfer .203 (4

STAND

OFF

Exposed Pad

Packaging Specification

02066-DSH-001-D Mindspeed Technologies®17

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Preliminary Information

Figure 4-3. BCC+24L Package Information

Table 4-3. Features

DIE BCC+24 TQFP

ENA YES NO YES

DIS YES YES NO

BIASMON YES (1) YES

MODMON YES (1) YES

TEMPCOMP YES YES (2)

SIZE (mm) 1.79 x 1.72 4 x 4 5 x 5

NOTES:

1. BIASMON and MODMON current sinks are common on pin 4.

2. RTCSTART = 0 Ω (internally bonded) RTCSLOPE can be used on pin 28.

TOP VIEW

BOTTOM VIEW

0.1 5

XM ZY0.08

0.05 Z

0.20 Z

0.45 ± 0.0 3

0.45 ± 0.03

XM ZY0.0 8

DETAIL "A"

0.40 ± 0.03

0.30 ± 0.03

XM ZY0.08

XM ZY0.0 8

DETAIL "B" (20X) DETAIL "C" (3X)

0.45 ± 0.0 3

0. 45 ± 0.03

XM ZY0.0 8

MZ0.08 XY

4.00 ± 0.10

4.0 0 ± 0.1 0

0.6 7 ± 0.0 25 0.0 75 ± 0.0 25

0.8 0 MAX

"B"

0.5 0 ± 0.1 00.5 0 TYP.

3.1 5

3.2 0 "C"

3.20

0.50 ± 0.100.50 TYP.

3.15

2.2 0

2.20

C.L( PKG. )

C.L(PKG.)

C0.2

" A" (PI N 1 CORNER)

( PIN 1 C ORNER)

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General Information:

Telephone: (949) 579-3000

Headquarters - Newport Beach

4000 MacArthur Blvd., East Tower

Newport Beach, CA 92660

Information in this document is provided in connection with Mindspeed Technologies® ("Mindspeed®") products.

These materials are provided by Mindspeed as a service to its customers and may be used for informational

purposes only. Except as provided in Mindspeed’s Terms and Conditions of Sale for such products or in any

separate agreement related to this document, Mindspeed assumes no liability whatsoever. Mindspeed assumes

no responsibility for errors or omissions in these materials. Mindspeed may make changes to specifications and

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