Pin 1. Input
2. Ground
3. Output
Tab/Case is Ground
1
1
1
TO
TO-252
TO-220
2
3
3
2
2
3
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
LM341 and LM78M05 Series 3-Terminal 500-mA Positive Voltage Regulators
1
1 Features
1• Output Current in Excess of 0.5 A
• No External Components
• Internal Thermal Overload Protection
• Internal Short Circuit Current-Limiting
• Output Transistor Safe-Area Compensation
• Available in 3-Pin TO-220, TO-252, and TO
packages
• Output Voltages of 5 V and 15 V
2 Applications
• Electronic Point-of-Sale
• Medical and Health Fitness Applications
• Printers
• Appliances and White Goods
• TVs and Set-Top Boxes
3 Description
The LM341 and LM78M05 three-pin positive voltage
regulators employ built-in current limiting, thermal
shutdown, and safe-operating area protection, which
makes them virtually immune to damage from output
overloads.
With adequate heat sinking, they can deliver in
excess of 0.5-A output current. Typical applications
would include local (on-card) regulators which can
eliminate the noise and degraded performance
associated with single-point regulation.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM341 TO-220 (3) 10.16 mm × 14.986 mm
LM78M05 TO-220 (3) 10.16 mm × 14.986 mm
TO-252 (3) 6.10 mm × 6.58 mm
TO (3) 9.14 mm × 9.14 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Available Pinouts Typical Application
2
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 Recommended Operating Conditions....................... 3
6.3 Thermal Information.................................................. 4
6.4 Electrical Characteristics: LM341 (5 V) and
LM78M05................................................................... 4
6.5 Electrical Characteristics: LM341 (12 V)................... 4
6.6 Electrical Characteristics: LM341 (15 V)................... 5
6.7 Typical Characteristics.............................................. 6
7 Detailed Description.............................................. 8
7.1 Overview................................................................... 8
7.2 Functional Block Diagram......................................... 9
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 10
8 Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application.................................................. 11
9 Power Supply Recommendations...................... 12
10 Layout................................................................... 13
10.1 Layout Guidelines ................................................. 13
10.2 Layout Example .................................................... 13
10.3 Thermal Considerations........................................ 13
11 Device and Documentation Support................. 16
11.1 Documentation Support ........................................ 16
11.2 Related Links ........................................................ 16
11.3 Receiving Notification of Documentation Updates 16
11.4 Community Resources.......................................... 16
11.5 Trademarks........................................................... 16
11.6 Electrostatic Discharge Caution............................ 16
11.7 Glossary................................................................ 16
12 Mechanical, Packaging, and Orderable
Information........................................................... 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (August 2005) to Revision F Page
• Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,
Recommended Operating Conditions table, Thermal Information table, Detailed Description section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Deleted parts marked as obsolete: LM78M12 and LM78M15................................................................................................ 1
• Changed package type names throughout............................................................................................................................. 1
• Deleted 12-V output voltage option from Features................................................................................................................. 1
• Changed RθJA values in Thermal Information table From: 60°C/W To: 22.6°C/W (NDE), From: 92°C/W To: 38°C/W
(NDP), and From: 120°C/W To: 162.4°C/W (NDT)................................................................................................................ 4
• Changed RθJC(top) values in Thermal Information table From: 5°C/W To: 17.8°C/W (NDE), From: 10°C/W To:
48.4°C/W (NDP), and From: 18°C/W To: 23.9°C/W (NDT).................................................................................................... 4
• Updated Thermal Considerations section ............................................................................................................................ 13
3
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
NDE Package
3-Pin TO-220
Top View
NDP Package
3-Pin TO-252
Top View
NDT Package
3-Pin TO
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
TO-220 TO-252 TO
GND 2/TAB 2/TAB 3 — Tab is GND
INPUT 1 1 1 I Input
OUTPUT 2 2 2 O Output
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input voltage VO= 5 V to 15 V 35 V
Power dissipation Internally limited
Lead temperature (Soldering, 10 s) TO package (NDT) 300 °C
TO-220 package (NDE) 260
Operating junction temperature –40 125 °C
Storage temperature, Tstg –65 150 °C
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Input voltage VOUT + 1.8 35 V
Output current 0.5 A
4
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.3 Thermal Information
THERMAL METRIC(1) LM341 LM78M05
UNITNDE (TO-220) NDP (TO-252) NDT (TO)
3 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 22.6 38 162.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.8 48.4 23.9 °C/W
RθJB Junction-to-board thermal resistance 6 17.7 — °C/W
ψJT Junction-to-top characterization parameter 3.3 6.7 — °C/W
ψJB Junction-to-board characterization parameter 6 17.9 — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.3 4.4 — °C/W
6.4 Electrical Characteristics: LM341 (5 V) and LM78M05
VIN = 10 V, CIN = 0.33 µF, CO= 0.1 µF, TJ= 25°C (unless otherwise noted). Limits are specified by production testing or
correlation techniques using standard Statistical Quality Control (SQC) methods.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage IL= 500 mA 4.8 5 5.2 V
IL= 5 mA to 500 mA, PD≤7.5 W,
VIN = 7.5 V to 20 V, TJ= –40°C to 125°C 4.75 5 5.25
VRLINE Line regulation VIN = 7.2 V to 25 V IL= 100 mA 50 mV
IL= 500 mA 100
VRLOAD Load regulation IL= 5 mA to 500 mA 100 mV
IQQuiescent current IL= 500 mA 4 10 mA
ΔIQQuiescent current change IL= 5 mA to 500 mA 0.5 mA
VIN = 7.5 V to 25 V, IL= 500 mA 1
VnOutput noise voltage f = 10 Hz to 100 kHz 40 µV
ΔVIN Ripple rejection f = 120 Hz, IL= 500 mA 78 dB
VIN Input voltage required to maintain
line regulation IL= 500 mA 7.2 V
ΔVOLong-term stability IL= 500 mA, TJ= –40°C to 125°C 20 mV/khrs
6.5 Electrical Characteristics: LM341 (12 V)
VIN = 19 V, CIN = 0.33 µF, CO= 0.1 µF, TJ= 25°C (unless otherwise noted). Limits are specified by production testing or
correlation techniques using standard Statistical Quality Control (SQC) methods.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage IL= 500 mA 11.5 12 12.5 V
IL= 5 mA to 500 mA, PD≤7.5 W, VIN = 14.8 V
to 27 V, TJ= –40°C to 125°C 11.4 12 12.6
VRLINE Line regulation VIN = 14.5 V to 30 V IL= 100 mA 120 mV
IL= 500 mA 240
VRLOAD Load regulation IL= 5 mA to 500 mA 240 mV
IQQuiescent current IL= 500 mA 4 10 mA
ΔIQQuiescent current change IL= 5 mA to 500 mA 0.5 mA
VIN = 14.8 V to 30 V, IL= 500 mA 1
VnOutput noise voltage f = 10 Hz to 100 kHz 75 µV
ΔVIN Ripple rejection f = 120 Hz, IL= 500 mA 71 dB
VIN Input voltage required to maintain
line regulation IL= 500 mA 14.5 V
ΔVOLong-term stability IL= 500 mA, TJ= –40°C to 125°C 48 mV/khrs
5
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
6.6 Electrical Characteristics: LM341 (15 V)
VIN = 23 V, CIN = 0.33 µF, CO= 0.1 µF, TJ= 25°C (unless otherwise noted). Limits are specified by production testing or
correlation techniques using standard Statistical Quality Control (SQC) methods.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage IL= 500 mA 14.4 15 15.6 V
IL= 5 mA to 500 mA, PD≤7.5 W, VIN = 18 V
to 30 V, TJ= –40°C to 125°C 14.25 15 15.75
VRLINE Line regulation VIN = 17.6 V to 30 V IL= 100 mA 150 mV
IL= 500 mA 300
VRLOAD Load regulation IL= 5 mA to 500 mA 300 mV
IQQuiescent current IL= 500 mA 4 10 mA
ΔIQQuiescent current change IL= 5 mA to 500 mA 0.5 mA
VIN = 18 V to 30 V, IL= 500 mA 1
VnOutput noise voltage f = 10 Hz to 100 kHz 90 µV
ΔVIN Ripple rejection f = 120 Hz, IL= 500 mA 69 dB
VIN Input voltage required to maintain
line regulation IL= 500 mA 17.6 V
ΔVOLong-term stability IL= 500 mA, TJ= –40°C to 125°C 60 mV/khrs
6
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
6.7 Typical Characteristics
Figure 1. Peak Output Current Figure 2. Ripple Rejection
Figure 3. Ripple Rejection Figure 4. Dropout Voltage
Normalized to 1 V TJ= 25°C
Figure 5. Output Voltage Figure 6. Quiescent Current
7
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
Typical Characteristics (continued)
Figure 7. Quiescent Current Figure 8. Output Impedance
Figure 9. Line Transient Response Figure 10. Load Transient Response
8
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
7 Detailed Description
7.1 Overview
The LM341 and LM78M05 devices are a family of fixed positive voltage regulators. They can accept up to 35 V
at the input and regulate it down to outputs of 5 V, 12 V, or 15 V. The devices are capable of supplying up to 500
mA of output current, although it is important to ensure there is adequate heat sinking to avoid exceeding thermal
limits. However, in the case of accidental overload the device has built in current limiting, thermal shutdown and
safe-operating area protection to prevent damage from occurring.
10
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
7.3 Feature Description
The LM341 and LM78M05 fixed voltage regulators have built-in thermal overload protection which prevents the
device from being damaged due to excessive junction temperature.
The regulators also contain internal short-circuit protection which limits the maximum output current, and safe-
area protection for the pass transistor which reduces the short-circuit current as the voltage across the pass
transistor is increased.
Although the internal power dissipation is automatically limited, the maximum junction temperature of the device
must be kept below 125°C to meet data sheet specifications. An adequate heat sink must be provided to assure
this limit is not exceeded under worst-case operating conditions (maximum input voltage and load current) if
reliable performance is to be obtained.
7.4 Device Functional Modes
7.4.1 Normal Operation
The device OUTPUT pin sources current necessary to make the voltage at the OUTPUT pin equal to the fixed
voltage level of the device.
7.4.2 Operation With Low Input Voltage
The device requires up to 2-V headroom (VI– VO) to operate in regulation. With less headroom, the device may
drop out of regulation in which the OUTPUT voltage would equal INPUT voltage minus dropout voltage.
7.4.3 Operation in Self Protection
When an overload occurs, the device shuts down Darlington NPN output stage or reduce the output current to
prevent device damage. The device automatically resets from the overload. The output may be reduced or
alternate between on and off until the overload is removed.
11
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM341 and LM78Mxx devices are fixed voltage regulators meaning no external feedback resistors are
required to set the output voltage. Input and output capacitors are also not required for the device to be stable.
However input capacitance helps filter noise from the supply and output capacitance improves the transient
response.
8.2 Typical Application
*Required if regulator input is more than 4 inches from input filter capacitor (or if no input filter capacitor is used).
**Optional for improved transient response.
Figure 11. Typical Application
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 1 as the input parameters.
Table 1. Design Parameters
PARAMETER VALUE
CIN 0.33 µF
COUT 0.1 µF
8.2.2 Detailed Design Procedure
8.2.2.1 Input Voltage
Regardless of the output voltage option being used (5 V, 12 V, 15 V), the input voltage must be at least 2 V
greater to ensure proper regulation (7 V, 14 V, 17 V).
12
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
8.2.2.2 Output Current
Depending on the input-output voltage differential, the output current must be limited to ensure maximum power
dissipation is not exceeded. The graph in Figure 1 shows the appropriate current limit for a variety of conditions.
8.2.2.3 Input Capacitor
If no power supply filter capacitor is used or if the device is placed more than four inches away from the capacitor
of the power supply, an additional capacitor placed at the input pin of the device helps bypass noise.
8.2.2.4 Output Capacitor
These devices are designed to be stable with no output capacitance and can be omitted from the design if
needed. However if large changes in load are expected, an output capacitor is recommended to improve the
transient response.
8.2.3 Application Curves
Figure 12. RθJA vs 2-oz Copper Area for PFM Figure 13. Maximum Allowable Power Dissipation
vs Ambient Temperature for PFM
Figure 14. Maximum Allowable Power Dissipation vs 2-oz Copper Area for PFM
9 Power Supply Recommendations
The LM341 and LM78M05 devices are designed to operate from an input voltage supply range between
VOUT + 2 V to 35 V. If the device is more than four inches from the power supply filter capacitors, an input bypass
capacitor 0.1-µF or greater of any type is recommended.
13
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
10 Layout
10.1 Layout Guidelines
Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.
TI recommends that the input terminal be bypassed to ground with a bypass capacitor. The optimum placement
is closest to the input terminal of the device and the system GND. Take care to minimize the loop area formed by
the bypass-capacitor connection, the input terminal, and the system GND. Traces carrying the load current must
be wide to reduce the amount of parasitic trace inductance. In cases when VIN shorts to ground, an external
diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and protect the IC.
This diode must be placed close to the corresponding IC pins to increase their effectiveness.
10.2 Layout Example
Figure 15. Layout Recommendation
10.3 Thermal Considerations
When an integrated circuit operates with appreciable current, its junction temperature is elevated. It is important
to quantify its thermal limits to achieve acceptable performance and reliability. This limit is determined by
summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the
operating environment. A one-dimension steady-state model of conduction heat transfer is demonstrated in
Figure 16. The heat generated at the device junction flows through the die to the die attach pad, through the lead
frame to the surrounding case material, to the printed-circuit board, and eventually to the ambient environment.
There are several variables that may affect the thermal resistance and in turn the need for a heat sink, which
includes the following.
Component variables (RθJC)
• Leadframe size and material
• Number of conduction pins
• Die size
• Die attach material
• Molding compound size and material
Application variables (RθCA)
• Mounting pad size, material, and location
• Placement of mounting pad
• PCB size and material
• Traces length and width
• Adjacent heat sources
• Volume of air
• Ambient temperature
• Shape of mounting pad
14
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
Thermal Considerations (continued)
The case temperature is measured at the point where the leads contact the mounting pad surface
Figure 16. Cross-Sectional View of Integrated Circuit Mounted on a Printed-Circuit Board
The LM341 and LM78M05 regulators have internal thermal shutdown to protect the device from overheating.
Under all possible operating conditions, the junction temperature of the LM341 and LM78M05 must be within the
range of 0°C to 125°C. A heat sink may be required depending on the maximum power dissipation and maximum
ambient temperature of the application. To determine if a heat sink is needed, the power dissipated by the
regulator (PD) is calculated using Equation 1.
IIN = IL+ IG(1)
PD= (VIN – VOUT)×IL+ (VIN × IG) (2)
Figure 17 shows the voltages and currents which are present in the circuit.
Figure 17. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX).
TR(MAX) = TJ(MAX) – TA(MAX)
where
• TJ(MAX) is the maximum allowable junction temperature (125°C)
• TA(MAX) is the maximum ambient temperature encountered in the application
Using the calculated values for TR(MAX) and PD, the maximum allowable value for the junction-to-ambient thermal
resistance (RθJA) can be calculated with Equation 3.
RθJA = TR(MAX) / PD(3)
As a design aid, Table 2 shows the value of the RθJA of TO-252 for different heat sink area. The copper patterns
that we used to measure these RθJA are shown at the end of AN–1028 Maximum Power Enhancement
Techniques for Power Packages (SNVA036). Figure 12 reflects the same test results as what are in the Table 2.
Figure 13 shows the maximum allowable power dissipation versus ambient temperature for the PFM device.
Figure 14 shows the maximum allowable power dissipation versus copper area (in2) for the TO-252 device. For
power enhancement techniques to be used with TO-252 package, see AN–1028 Maximum Power Enhancement
Techniques for Power Packages (SNVA036).
15
LM341
,
LM78M05
www.ti.com
SNVS090F –MAY 2004–REVISED DECEMBER 2016
Product Folder Links: LM341 LM78M05
Submit Documentation FeedbackCopyright © 2004–2016, Texas Instruments Incorporated
Thermal Considerations (continued)
(1) Tab of device is attached to topside copper.
Table 2. RθJA Different Heat Sink Area
LAYOUT COPPER AREA (in2)THERMAL RESISTANCE: RθJA
(°C/W)
TOP SIDE(1) BOTTOM SIDE TO-252
1 0.0123 0 103
2 0.066 0 87
3 0.3 0 60
4 0.53 0 54
5 0.76 0 52
6 1 0 47
7 0 0.2 84
8 0 0.4 70
9 0 0.6 63
10 0 0.8 57
11 0 1 57
12 0.066 0.066 89
13 0.175 0.175 72
14 0.284 0.284 61
15 0.392 0.392 55
16 0.5 0.5 53
16
LM341
,
LM78M05
SNVS090F –MAY 2004–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM341 LM78M05
Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
AN–1028 Maximum Power Enhancement Techniques for Power Packages (SNVA036)
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
LM341 Click here Click here Click here Click here Click here
LM78M05 Click here Click here Click here Click here Click here
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.7 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 29-Jun-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM341T-5.0 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM341T-5.0
LM78M05CT
LM341T-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0
LM78M05CT
LM78M05CDT NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM78M05
CDT
LM78M05CDT/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM78M05
CDT
LM78M05CDTX NRND TO-252 NDP 3 2500 TBD Call TI Call TI -40 to 125 LM78M05
CDT
LM78M05CDTX/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM78M05
CDT
LM78M05CT NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM341T-5.0
LM78M05CT
LM78M05CT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM341T-5.0
LM78M05CT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 29-Jun-2017
Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
www.ti.com
PACKAGE OUTLINE
C
10.42
9.40
6.73
6.35
6.22
5.97 1.27
0.88
5.46
4.96
2.285
4.57
1.02
0.64
3X 0.88
0.64
2.55 MAX
0.88
0.46
8
8
1.14
0.89
0.60
0.46
0.17
0.51 MIN
4.32 MIN
(2.345)
(2.5)
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-252.
0.25 C A B
TOP & BOTTOM
PKG
1
2
3
OPTIONAL
SEATING PLANE
4
3
2
1
SCALE 1.500
A
B
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
(4.57)
2X (1.3) 2X (2.15) (5.7)
(5.5)
(2.285)(4.38)
(R0.05) TYP
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
SYMM
PKG
1
3
4
SEE SOLDER MASK
DETAIL
EXPOSED
METAL
METAL EDGE
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED) SOLDER MASK DETAIL
EXPOSED
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
2X (2.15)
2X (1.3)
(4.57)
(4.38)
(1.32) TYP
(1.35) TYP
(0.26) (R0.05) TYP
16X (1.12)
16X (1.15)
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 8X
MECHANICAL DATA
NDE0003B
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
