Telegesis
TG-ETRX35X-PM-010-110
ETRX351 and ETRX357 Product Manual 1.20
©2015 Silicon Labs ETRX35x Product Manual
ETRX35x ZIGBEE MODULES
PRODUCT MANUAL
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 2 - ETRX35x Product Manual (Rev 1.20)
Table of Cont e nt s
1 INTRODUCTION ................................................................................................................. 5
1.1 Hardware Description ....................................................................................................... 5
2 PRODUCT APPROV ALS ................................................................................................... 6
2.1 FCC Approvals ................................................................................................................. 6
FCC Labelling Requirements ........................................................................................... 7
2.2 IC (Industry Canada) Approvals ....................................................................................... 7
2.3 European Certification (ETSI)........................................................................................... 8
2.4 ICASA Approvals ............................................................................................................. 8
2.5 Australia and New Zealand (C-Tick) ................................................................................. 8
2.6 Brazil ................................................................................................................................ 9
2.7 Declarations of Conformity ............................................................................................... 9
2.8 IEEE 802.15.4 .................................................................................................................. 9
2.9 The ZigBee Protocol ...................................................................................................... 10
3 MODULE PINOUT ............................................................................................................ 11
4 HARDW ARE DESCRIP TION ............................................................................................ 13
4.1 Hardware Interface ......................................................................................................... 13
5 FIRMWARE DESCRIPTIO N ............................................................................................. 14
5.1 Token Settings ............................................................................................................... 15
5.2 Custom Firmware ........................................................................................................... 15
5.3 Software Interface .......................................................................................................... 16
6 ABSOLUTE MAXIMUM RATINGS ................................................................................... 17
6.1 Environmental Characteristics ........................................................................................ 17
6.2 Recommended Operating Conditions............................................................................. 17
7 DC ELECTRIC AL CH ARACTERISTICS ........................................................................... 18
8 DIGITAL I/O SPECIFICATIONS ....................................................................................... 20
9 A/D CO NVERTER CHAR ACTERISTICS .......................................................................... 21
10 AC ELECTRICAL CHARACTERISTICS ........................................................................... 21
10.1 TX Power Characteristics ............................................................................................... 23
11 PHYSICAL DIMENSIONS ................................................................................................. 25
12 RECOMMENDED SOLDERING TEMPERATURE PRO F I L E ........................................... 27
13 PRODUCT L ABEL DR AWI NG ......................................................................................... 28
14 RECOMMENDED FOOTPRINT ........................................................................................ 29
14.1 Pad dimensions ............................................................................................................. 29
14.2 Recommended Placement ............................................................................................. 30
14.3 Example carrier board .................................................................................................... 32
15 REL IABI L I TY TE S TS ........................................................................................................ 33
16 APPLICATION NOTES ..................................................................................................... 33
16.1 Safety Precautions ......................................................................................................... 33
16.2 Design Eng in ee ring Notes .............................................................................................. 33
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 3 - ETRX35x Product Manual (Rev 1.20)
16.3 Storage Conditions ......................................................................................................... 34
17 PACKAGING .................................................................................................................... 34
17.1 Embossed Tape ............................................................................................................. 34
17.2 Component Orientation .................................................................................................. 35
17.3 Reel Dimensions ............................................................................................................ 35
17.4 Packaging - bag ............................................................................................................. 37
17.5 Packaging – carton ........................................................................................................ 37
18 ORDE RING IN FORMATION ............................................................................................. 38
19 ROHS DECLARATION ..................................................................................................... 39
20 DATA SHEET STATUS .................................................................................................... 39
21 REL ATED DOCUMENT S ................................................................................................. 39
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 4 - ETRX35x Product Manual (Rev 1.20)
The Teleges is ETRX 351 and ETRX 357 modules ar e low power
2.4GHz ZigBee modules, based on the latest Ember EM351 and
EM357 single chip ZigBeeTM solutions.
These 3rd generation modules have been designed to be
integrated into any device without the need for RF experience
and expertise. Utilizing the EmberZNet ZigBee stack, the
ETRX35x enables you to add powerful wireless networking
capability to your products and quickly bring them to market.
The module’s unique AT-style command line interface allows
designers to quickly integrate ZigBee technology without
complex software engineering. For custom application
development the ETRX35x series integrates with ease into
Ember’s InSight development environment.
Image not sho wn act ual size; enlar ge d t o sho w detai l.
Module Featur es
• Small form factor, SMT module 25mm x 19mm
• Side Castellations for easy soldering and optical
inspection
• 2 antenna options: Integrated chip antenna or U.FL
coaxial connector
• Industry’s first ARM® Cortex-M3 based fami ly of Zi gBee
modules
•
Industry standard JTAG Programming and real time
network level debugging via the Ember InSight Port
•
192kB (ETRX357) and 128kB (ETRX351) flash and
12kbytes of RAM
•
Lowest Deep Sleep Current of sub 1µA and multiple
sleep modes
• Wide supply voltage range (2.1 to 3.6V)
•
Optional 32.768kHz watch crystal can be added
externally
• M odule ships w ith standard T elegesis AT-style c ommand
interface ba sed on the ZigBee P RO feature set
• Can act as an End Device, Router or Coordinator
• 24 general-purpose I/O lines including analogue inputs
(all GPIOs of the EM35x are accessible)
•
Firmware upgrades via serial port or over the air
(password protected)
• Hardware supported encryption (AES-128)
• CE, FCC and IC compliance, FCC modular approval
• Operating temperature range: -40°C to +85°C
• Long range version with a link budget of up to 124dB
available in the same form factor
Radio Features
• Based on t he Ember EM351 or EM357 single chip Z igBee
solutions
• 2.4GHz ISM Band
• 250kbit/s over the air data rate
• 16 channels (IEEE802.15.4 Channel 11 to 26)
• +3dBm output power ( +8dBm in boost mode)
• High sensitivity of -100dBm (-102dBm in boost mode)
typically @ 1% packet error rate
• RX Current: 26mA, TX Current: 31mA at 3dBm
• Robust Wi-Fi and Bluetooth coexistence
Suggested Applications
• AMR – ZigBee Smart Energy applications
• Wireless Alarms and Security
• Home/Building Automation
• Wireless Sensor Networks
• M2M Industrial Controls
• Lighting and ventilation control
• Remote monitoring
• Environmental monitoring and control
Development K it
• New Development kit containing everything required to
set up a mesh network quickly and evaluate range and
performance of the ETRX35x and its long-range version.
• AT-style software interface command dictionary can be
modified for high volu me custo mer s.
• Custom software development available upon request.
Example AT-Style Commands
AT+BCAST Send a Broadcast
AT+UCAST:<address> Send a Unicast
AT+EN Establish PAN network
AT+JN Join PAN
At power -up the last conf iguration is loaded from non-volatile
S-Registers, which can eliminate the need for an additional
host control ler.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 5 - ETRX35x Product Manual (Rev 1.20)
1 Introduction
This document describes the Telegesis ETRX351 and ETRX357 ZigBee modules which have been
designed to be easily integrated into another device and to provide a fast, simple and low cost
wireless mesh networking interface.
The Telegesis ETRX3 series modules are based on the Ember ZigBee platform consisting of the
single chip EM351 or EM357 combined with the ZigBee PRO compliant EmberZNet meshing stack.
Integration into a wide range of applications is made easy using a simple AT style command interface
and advanced hardware design.
The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series
ZigBee modules to be used without an additional host microcontroller saving even more integration
time and costs. In addition to the Telegesis AT Commandset, the E TRX351 and ETR X357 modules
can be used with custom-built firmware whilst representing an ideal platform for custom firmware
development in conjunction with the Ember development kits.
No RF experience or expertise is required to add thi s powerful wireless networking capability to your
products. The ETRX351 and ETR X357 offer fast integration opportunities and the shortest possibl e
time to market for your product.
1.1 Hardware Description
The main building blocks of the ETRX351 and ETRX357 are the single chip EM351 and EM357
SoCs from Ember, a 24MHz reference crystal and RF front-end circuitry optimized for best RF
performance. The modules are available with on-board antenna or alternatively a U.FL coaxial
connector for attaching external antennae. Modules with the U.FL connector are identified by the
“HR” suffix.
The integrated antenna is an Antenova Rufa, and details of the radiation pattern etc are available
from the Antenova website Fehler! Verweisquelle konnte nicht gefunden werden..
Module
Chip
Flash
ETRX351
EM351
128kB
ETRX351HR
EM351
128kB
ETRX357
EM357
192kB
ETRX357HR
EM357
192kB
Table 1: Memories
The ETRX351 and ETRX357 are used for ZigBee (www.zigbee.org) applications. In case it is desired
to develop custom firmware instead of using the pre-loaded AT-Command interface, the Ember
InSight toolchain, consisting of InSight Desktop™ together with a comprehensive integrated
development environment (IDE), is r equired. The E m ber development environment is currently not
suitable for developing an IEEE802.15.4-only application that does not use the ZigBee layer.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 6 - ETRX35x Product Manual (Rev 1.20)
2 Product Approvals
The ETRX351 and ETRX357 as well as the ETRX351HR and ETRX357HR have been designed to
meet all national regulations for world-wide use. In particular the following certifications have been
obtained:
2.1 FCC Approvals
The Telegesis ETRX351 and ETRX357 with integrated Antenna as w ell as the ETRX351HR and the
ETRX357HR including the antennas listed in Table 2 have been tested to comply with FCC CFR
Part 15 (USA) The devices meet the requirements for modular transmitter approval as detailed in
the FCC public notice DA00.1407.transmitter. FCC statement:
This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
Item
Part No.
Manufacturer
Type
Impedance
Gain
1
BT-Stubby (straight)
EAD Ltd. [6]
¼ Wave
50Ω
0dBi
2
BT-Stubby (right-
angle)
EAD Ltd. [6] ¼ Wave
50Ω
0dBi
3
WH-2400-U2.5
Wellhope Wireless [7]
½ Wave
50Ω
2.5dBi
4 Rufa (on board) Antenova Chip
50Ω
2.1dBi
(peak)
Table 2: Approved Antennae
While the applicant for a dev ice into which the E TRX351 (E TRX357) or ETRX351HR (ETRX357HR)
with an antenna listed in Table 2 is installed is not required to obtain a new authorization for the
module, this does not preclude the possibility that some other form of authorization or testing may
be required for the end product.
The FCC requires the user to be notified that any changes or modifications made to this device that
are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the
equipment.
When using the ETRX351HR and ETRX357HR with approved antennae, it is required to prevent
end-users from replacing them with non-approved ones. The module and associated antenna must
be installed to provide a separation distance of a t least 20cm from all persons and must not transmit
simultaneously with any other antenna or transmitter.
FCC ID: S4GEM35XA
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 7 - ETRX35x Product Manual (Rev 1.20)
FCC Labelling Requirements
W hen int egra ting the ETRX351, ETRX357, ETRX351HR or ETRX357HR into a product it must be
ensured that the FCC labelling requirements are met. This includes a clearly visible label on the
outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM35XA) as
well as the FCC notice shown on the previous page. This exterior label can use wording such as
“Contains Transmitter Module FCC ID: S4GEM35XA” or “Contains FCC ID:S4GEM35XA”
although any similar wording that expresses the same meaning may be used.
2.2 IC (Industry Canada) Approvals
The Telegesis ETRX351 and ETRX357 with integrated Antenna as w ell as the ETRX351HR and the
ETRX357HR modules have been approved by Industry Canada to operate with the antenna types
listed in Table 2 with the maximum permissible gain and required antenna impedance for each
antenna type indicated. Antenna types not included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly prohibited for use with this device.
IC-ID: 8735A-EM35XA
• This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
• Under Industry Canada regulations, this radio transmitter may only operate using an
antenna of a type and maximum (or lesser) gain approved for the transmitter by
Industry Canada. To reduce potential radio interference to other users, the antenna
type and its gain should be so chosen that the equivalent isotropically radiated
power (e.i.r.p.) is not more than that permitted for successful communication.
• This module complies with FCC and Industry Canada RF radiation exposure limits
set forth for general population. To maintain compliance, this module must not be co-
located or operating in conjunction with any other antenna or transmitter.
• This device has been designed to operate with the antennas listed in Table 2, and
having a maximum gain of 2.5 dBi. Antennas not included in this list or having a gain
greater than 2.5 dBi are strictly prohibited for use with this device. The required
antenna impedance is 50 ohms.
The labelling requirements for Industry Canada are similar to those of the FCC. Again a clearly
visibly label must be placed on the outside of the finished product stating something like “Contains
Transmitter Module, IC: 8735A-EM35XA”, although any similar wording that expresses the same
meaning may be used.
The integrator is responsible for the final product to comply to IC ICES-003 and FCC Part 15, Sub.
B – Unintentional Radiators.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 8 - ETRX35x Product Manual (Rev 1.20)
2.3 European Certification (ETSI)
The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to the following
standards:
• Radio: EN 300 328:V1.8.1
• EMC: EN 301 489-17:V2.2.1
• Safety: EN 60950-1:2006 / A12:2011
For this purpose the ETRX351HR and ETRX357HR have been tested with the antennae listed in
Table 2.
If the ETRX351, ETRX357, ETRX351HR or ETRX357HR module is incorporated into an OEM
product, the OEM product manufacturer must ensure compliance of the final product to the European
Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must be issued
for each of these standards and kept on file as described in Annex II of the R&TTE Direct ive. The
final product must not exceed the specified power ratings, antenna specifications and installation
requirements as specified in this user manual. If any of these specifications are exceeded in the
final product then a submission must be made to a notified body for compliance testing to all of the
required standards.
The ‘CE’ marking must be applied to a visible location on any OEM product. For more information
please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full responsibility
for learning and meeting the required guidelines for each country in their distribution market.
2.4 ICASA Ap p r o v a l s
The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in South
Africa.
2.5 Australia and New Zealand (C-Tick)
The ETRX351, ETRX357, ETRX351HR and ETRX357HR have been certified to be used in Australia
and New Zealand.
In order to have a C-Tick mark on an end product integrating an ETRX35x devic e, a company must
comply with a or b below.
a). have a company presence in Australia.
b). have a company/distributor/agent in Australia that will sponsor the importing of the end product.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 9 - ETRX35x Product Manual (Rev 1.20)
2.6 Brazil
The ETRX357 and ETRX357HR have been certified to be used in Brazil.
2.7 Declarations of Conformity
Telegesis (UK) Ltd has issued Declarations of Conformity for all ETRX3 series ZigBee RF M odul es,
which cover Radio Emissions, EMC and Safety. These documents are available from our website
or on request.
2.8 IEEE 802.15.4
IEEE 802.15.4 is a standard for low data-rate, wireless network s (raw bit-rate within a radio packet
of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life
applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 10 - ETRX35x Product Manual (Rev 1.20)
2.9 The ZigBee Protocol
The ZigBee Protocol is a set of standards for wireless connectivity for use b etween any dev ices over
short to medium distances. The specification was originally ratified in December 2004, paving the
way for companies to start making low-power networks a reality.
ZigBee uses the IEEE 802.15.4 radio speci fication running on the 2.4GHz band, plus three additional
layers for networking, security and applications. What makes the specification unique is its use of a
mesh network architecture which, in bucket chain style, passes data from one node to the next until
it lands at its destination. The network is self-healing and adapts its routing as link quality changes
or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers,
but can therefore be put into a low-power sleep state.
The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006,
adding new features and improvements to the only global wireless communication standard enabling
the development of easily deployable low-cost, low-power, monitoring and control products for
homes, commercial buildings and indus trial plant monitoring. In 2007 the ZigBee Alliance introduced
the PRO featureset which offer s advantages over earlier versions, including
• Truly self healing mesh networking
• Messages can now travel up to 30 hops
• Source-Routing for improved point to multipoint message transmission
• Improved security including Trust-Centre link keys
• New message types and options
The Telegesis AT-Commandset, which by default ships on all ETRX3 series products is based on
the ZigBee PRO featureset. For more information on the Telegesis AT-Commandset please refer to
the separate documentation at www.telegesis.com.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 11 - ETRX35x Product Manual (Rev 1.20)
3 Module Pi nout
Figure 1: ETRX3 series Module Pinout (top view)
The table below giv es details about the pin assignment for direct SMD soldering of the E TRX3 series
modules to the application board. For more information on the alternate functions please refer to
[2]. Also ref er to the Telegesis AT Commandset documentation and the Telegesis development kit
documentation to understand how the pre-programmed firmware makes use of the individual I/Os.
All GND pads are connected within the module, but for best RF performance all of them should be
grounded externally ideally to a ground plane.
“Important Note: If designers would like to keep open the option of using either standard or long
range modules in the same product please note the following. The ETRX35x series and the
ETRX35x-LRS series of modules are footprint compatible, but on the ETRX35x-LRS series pins PB0
and PC5 of the EM357 are used internally to control the front-end module and are not available to
the user.”
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 12 - ETRX35x Product Manual (Rev 1.20)
ETRX35x
Pad
Name
EM35x Pin
Default use
Alternate Functions
1
GND
GND
GND
2
PC5 {1}
11
TX_ACTIVE
3
PC6
13
I/O
OSC32B, nTX_ACTIVE
4
PC7
14
I/O
OSC32A, OSC32_EXT
5
PA7 {5}
18
I/O
TIM1C4
6
PB3 {2,3}
19
I/O, CTS
SC1nCTS, SC1SCLK, TIM2C3
7
nReset {6}
12
nReset
8
PB4 {2,3}
20
I/O, RTS
TIM2C4, SC1nRTS, SC1nSSEL
9
PA0
21
I/O
TIM2C 1, SC2MOSI
10
PA1
22
I/O
TIM2C3, SC2SDA, SC2MISO
11
PA2
24
I/O
TIM2C4, SC2SCL, SC2SCLK
12
PA3
25
I/O
SC2nSSEL, TRACECLK, TIM2C2
13
GND
GND
GND
14
PA4
26
I/O
ADC4, PTI_EN, TRACEDA TA
15
PA5 {4}
27
I/O
ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3
16
PA6 {5}
29
I/O
TIM1C3
17
PB1 {3}
30
TXD
SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1
18
PB2 {3}
31
RXD
SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2
19
GND
GND
GND
20
GND
GND
GND
21
JTCK
32
SWCLK
22
PC2
33
I/O
JTDO, SWO
23
PC3
34
I/O
JTDI
24
PC4
35
I/O
JTMS, SWDIO
25
PB0
36
I/O, IRQ
VREF, IRQA, TRACECLK, TIM1CLK, TIM2MSK
26
PC1
38
I/O
ADC3, SWO, TRACEDATA0
27
PC0 {5}
40
I/O
JRST, IRQD, TRACEDATA1
28
PB7 {5}
41
I/O
ADC2, IRQC, TIM1C2
29
PB6 {5}
42
I/O
ADC1, IRQB, TIM1C1
30
PB5
43
I/O
ADC0, TIM2CLK, TI M1 MSK
31
GND
GND
GND
32
Vcc
Vcc
Vcc
33
GND
GND
GND
Table 3: Pin Information
Notes:
{1} When the alternate function is selected, TX_ACTIVE becomes an output that indicates that the EM35x
radio circuit is in transmit mode. PC5 is not usable on the long range version of the ETRX35x as this
GPIO is used internally as TX_ACTIVE to control the external RF frontend.
{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively.
The device sends its data on TXD and receives on RXD.
{3} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See
the AT Command Manual.
{4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader
{5} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8)
{6} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET is
low
See also the table “Module pads and functions” in the ETRX357 Development Kit Product Manual.
Refer to Ember’s EM357 manual for details of the alternate functions and pin names.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 13 - ETRX35x Product Manual (Rev 1.20)
4 Hardware Description
24MHz
EM35x
I/O
UART
I / O
programming
5
JTAG
Vcc
Vreg
RESET
RESET
BALUN
integrated
antenna
U.FL socket
rf
terminal
selection,
filteri ng and
matching
circuitry
LDO
1V8
1,8Vdc
A/D
LDO
1V25
Figure 2: Hardware Diagram
The ETRX351, ETRX351HR, ETRX357 and ETRX357HR are based on the Ember EM351 and
EM357 respectively. The EM351 and EM357 are fully integrated 2.4GHz ZigBee transceivers with a
32-bit ARM® Cortex M3TM microprocessor, flash and RAM memory, and peripherals.
The industry standard serial wire and JTAG programming and debugging interfaces together with
the standard ARM sy stem debug components help to strea mline any custom software development.
In addition to this a numb er o f M A C functions are also implemented in hard ware to help maintaining
the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.
The new advanced power management features allow faster wakeup from sleep and new power
down modes allow ing this 3rd generation module to o ffer a longer ba ttery li fe than any 2nd generation
modules on the market.
The EM35x has fully integrated voltage regulators for both required 1.8V a nd 1.25V supply v oltages.
The voltages are monitored (brown-out detection) and the built in power-on-reset circuit eliminates
the need for any external monitoring circuitry. An optional 32.768 kHz watch crystal can be
connected externally to pads 3 and 4 in case more accurate timing is required. To utiliz e the external
watch crystal custom firmware is required.
4.1 Hardware Interf ac e
All GPIO pins of the EM351 or EM357 are accessible on the module’s pads. W hether signals ar e
used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.
When using the Telegesis AT Commandset please refer to the AT Commandset manual and the
development kit manual for this information and when developing custom firmware please refer to
the EM35x datasheet [2].
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 14 - ETRX35x Product Manual (Rev 1.20)
5 Firmware Description
The modules will be pre-loaded with a standalone bootloader which supports over-the-air
bootloading as well as serial bootloading of new firmware.
In order to enter the standalone bootloader using a har dware trigger pull PA5 to ground and power-
cycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure
not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A pull-up is not
required).
In addition to the standalone bootloader the modules also contain the current release of the
Telegesis AT-style command interface as described in the Telegesis AT command dictionary and
the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a unique
64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and responses
pass through the serial port of the ETRX35x as ASCII text, so a simple terminal application will
usually suffice. We provide Telegesis Terminal for interaction with the module but it is not an
essential feature.
The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing
stack which implements routers/coordinators as w ell as (sleepy) end devices. [End devices hav e no
routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and
receive messages via a parent router. In addition to classical sleepy and non-sleepy end devices
the module firmware also supports mobile (sleepy) end devices capable of changing their parent
quickly whenever they change their position within the network.]
A router is typically a mains powered device whilst a sleepy end device (SED) can be battery
powered.
The module is also abl e to act as a coordinator and Trust Centre through external host con trol. The
AT style command line supplies all the tools required to set up and manage a ZigBee network by
allowing easy access to the low-level functionality of the stack.
The Telegesis firmware uses the meshing and self healing EmberZNet PRO stack to overcome
many of the limitations of the tree network topology of the ZigBee 2006 stack by using the ZigBee
PRO featureset.
The Telegesis firmware allows low-level access to physical parameters such as channel and power
level. Parameters that define the functionality of the ETRX35x module and also allow standalone
functionality are saved in non-volatile memory organised in so-called S-Registers. The SPI and I2C
buses are not supported by the current firmware release, but can be used with custom firmware.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 15 - ETRX35x Product Manual (Rev 1.20)
5.1 Token Settings
The ETRX3 Series Modules’ tokens will be pre-programmed with the settings shown in the table
below.
Token
Description
TG Default
MFG_CIB_OBS
Option Bytes
<not written>
MFG_CUSTOM_VERSION
Optional Version Number
<not written>
MFG_CUSTOM_EUI_64
Custom EUI
<not written>
MFG_STRING
Device Specific String
TELEGESIS
MFG_BOARD_NAME
Hardware Identifier
<Order Code>
MFG_MANUF_ID
Manufacturer ID
0x1010
MFG_PHY_CONFIG
Default Power Settings
0xFF26
MFG_BOOTLOAD_AES_KEY
Bootloader Key
<not written>
MFG_EZSP_STORAGE
EZSP related
<not written>
MFG_CBKE_DATA
SE Securit y
<not written>
MFG_INSTALLATION_CODE
SE Installation
<not written>
MFG_OSC24M_BIAS_TRIM
Crystal Bia s
<not written>
Table 4. Manufacturing toke ns
5.2 Custom Firmware
For high volume customers the firmware can be customised on request. In addition to this the ETRX3
series of modules is an ideal platform for developing custom firmware. In order to develop custom
firmware the Ember Insight toolchain is required.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 16 - ETRX35x Product Manual (Rev 1.20)
5.3 Software Interface
Using the default firmware the ETRX35x is controlled using a simple AT-style command interface
and (mostly) non-volatile S-Registers. In order to get a full listing of all the available AT-Commands,
please refer to the AT command dictionary document which corresponds to the firmware revision
you intend to use.
In addition to the command dictionary there are user guides explaining the features of the firmware
in more detail. If you need to find out which firmware resides on your module simply type “ATI”
followed by a carriage re turn and y ou wi ll be prompted w ith the module’s manu facturing information.
The Development Kit manual describes how to upgrade the firmware either via a serial link or over
the air.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 17 - ETRX35x Product Manual (Rev 1.20)
6 Absolute Maximum Ratings
No.
Item
Symbol
Absolute Maximum Ratings
Unit
1
Supply voltage
VCC
-0.3 to +3.6
Vdc
2
Voltage on any Pad
Vin
-0.3 to VCC +0.3
Vdc
3
Voltag e on an y P ad pin (PA4 , PA5,
PB5, PB6, PB7, PC1), when used as an
input to the general purpose ADC with
the low voltag e range sele ct ed
Vin -0.3 to +2.0 Vdc
4
Module storage temperature range
Tstg
-40 to +105
°C
5
Reel storage temperature range
Tstrgreel
0 to 75
°C
6
Operating temperature range
Top
-40 to +85
°C
7
Input RF level
Pmax
15
dBm
8
Reflow temperature
TDeath
Please refer to chapter 12
°C
Table 5: Absolute Maximum Ratings
The absolute maximum ratings given abov e should under no circumstances be violated. Ex ceeding
one or more of the limiting values may cause permanent damage to the device.
Caution! ESD sensitive device. Precautions should be used when handling the device
in order to prevent permanent damage.
6.1 Environmental Characteristics
No.
Item
Symbol
Absolute Maximum Ratings
Unit
1
ESD on any pad according to
Human Body Model (HBM) circuit
description
VTHHBM ±2 kV
2
ESD on non-RF pads according to
Charged Device Model (CDM) circuit
description
VTHCDM ±400 V
3
ESD on RF terminal according to
Charged Device Model (CDM) circuit
description
VTHCDM ±225 V
4
Moisture Sensitivity Level
MSL
MSL3
Table 6: Absolute Maximum Ratings
6.2 Recommended Operating Conditions
No. Item
Condition /
Remark
Symbol Value Unit
Min
Typ
Max
1
Supply voltage
VCC
2.1
3.6
Vdc
2
RF Input Frequency
fC
2405
2480
MHz
3
RF Input Power
pIN
0
dBm
4
Operating temperature
range
Top -40 +85 °C
Table 7: Recommended Operating Conditions
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 18 - ETRX35x Product Manual (Rev 1.20)
7 DC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE (non-Boost) unless otherwise stated
No. Item
Condition /
Remark
Symbol Value Unit
Min
Typ
Max
1
Module supply voltage
VCC
2.1
3.6
Vdc
Deep Sleep Current
2
Quiescent curr ent,
internal RC oscillator
disabled
ISLEEP 0.4 µA
3
Quiescent current,
internal RC oscillator
enabled
ISLEEP 0.7 µA
4
Quiescent curr ent,
including
32.768kHz oscillator
ISLEEP 1.0 µA
5
Quiescent curr ent
including internal RC
oscillator and 32.768kHz
oscillator
ISLEEP 1.3 µA
Reset Current
6
Quiescent curr ent
nReset asserted
IRESET 1.2 2.0 mA
Processor and Peripheral Currents
7
ARM® CortexTM M3,
RAM and flash memory
25°C, 12MHz
Core clock
IMCU 6.0 mA
8
ARM® CortexTM M3,
RAM and flash memory
25°C, 24MHz
Core clock
IMCU 7.5 mA
9
ARM® CortexTM M3,
RAM and flash memory
sleep current
25°C, 12MHz
Core clock IMCU 3.0 mA
10
ARM® CortexTM M3,
RAM and flash memory
sleep current
25°C, 6MHz Core
clock IMCU 2.0 mA
11 Serial con trol ler curren t
Per serial
controlle r at max .
clock rate
ISC 0.2 mA
12
General purpo se timer
current
Per timer at max.
clock rate
ITIM 0.25 mA
13
General purpo se ADC
current
Max. Sample
rate, DMA
IADC 1.1 mA
RX Current
14
Radio receiver MAC and
Baseband
ARM® CortexTM
M3 sleeping.
IRX 22 mA
15
Receive current
consumption
Total, 12MHz
clock spe e d
IRX 25 mA
16
Receive curre nt
consumption
Total, 24MHz
clock spe e d
IRX 26.5 mA
17
Receive curre nt
consumption
BOOST MODE
Total, 12MHz
clock spe e d IRX 27 mA
18
Receive curre nt
consumption
BOOST MODE
Total, 24MHz
clock spe e d IRX 28.5 mA
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 19 - ETRX35x Product Manual (Rev 1.20)
TX Current
19
Transmit curr ent
consumption
at +3dBm module
output power
ITXVCC 31 mA
20
Transmit Current
consumption
BOOST MODE
at +8dBm module
output power ITXVCC 42 mA
21
Transmit curr ent
consumption
at +0dBm modu le
output power
ITXVCC 28.5 mA
22
Transmit curr ent
consumption
at min. module
output power
ITXVCC 23.5 mA
23 Wake time from deep
sleep
From wakeup
event to 1st
instruction
100 µs
24 Shutdown time
From last
instruct ion into
deep sleep
5 µs
Table 8: DC Electrical Characteristics
Please Note: The average current consumption during operation is dependent on the firmware and
the network load, therefore these figures are provided in the command dictionary of the respective
firmware.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 20 - ETRX35x Product Manual (Rev 1.20)
8 Digital I/O Specifications
The digital I/Os of the ETRX35x module
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated
No. Item
Condition /
Remark
Symbol Value Unit
Min
Typ
Max
1 Low Schmitt switching
threshold
Schmitt input
threshold going
from high to low
VSWIL 0.42 x VCC 0.5 x VCC Vdc
2 High Schmitt switching
threshold
Schmitt input
threshold going
from low to high
VSWIH 0.62 x VCC 0.8 x VCC Vdc
3
Input current for logic 0
IIL
-0.5
µA
4
Input current for logic 1
IIH
0.5
µA
5
Input Pull-up resistor
value
RIPU 24 29 34 kΩ
6
Input Pull-down resistor
value
RIPD 24 29 34 kΩ
7 Output voltage for logic 0
I
OL
= 4mA (8mA) for
standard (high
current) pads
VOL 0 0.18 x VCC V
8 Output voltage for logic 1
I
OH
= 4mA (8mA)for
standard (high
current) pads
VOH 0.82 x VCC VCC V
9 Output Source Current
Standard current
pad
IOHS 4 mA
10 Output Si nk curre nt
Standard current
pad
IOLS 4 mA
11
Output Source Current
High current pad (1)
IOHH
8
mA
12
Output Sink curre nt
High current pad (1)
IOLH
8
mA
13
Total output curren t
IOH + IOL
40
mA
Table 9. Digital I/O Specifications
Notes
1) High current pads are PA6, PA7, PB6, PB7, PC0
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 21 - ETRX35x Product Manual (Rev 1.20)
9 A/D Converter Characteristics
The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer
to section 10 of the EM35x datasheet.
No.
Item
1
A/D resolution
Up to 14 bits
2
A/D sample time for 7-bit conversion
5.33µs
3
A/D sample time for 14-bit conv ersion
682µs
4
Reference Voltage
1.2V
5
Max current drain from Vref pin
1mA
Table 10. A/D Converter Characteristics
10 AC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ω term inal loa d connected to the U.FL socket
No. Receiver Value Unit
Min
Typ
Max
1
Frequency range
2400
2500
MHz
2
Sensitivity for 1% Packet Error Rate (PER)
-100
-94
dBm
3
Sensitivity for 1% Packet Error Rate (PER) BOOST MODE
-102
-96
dBm
4
Saturation ( max imum inp ut lev el for corr ect operation)
0
dBm
5
High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
41 dB
6
Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
44 dB
7
2nd High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
53 dB
8
2nd Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
52 dB
9
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
40 dB
10
802.11g rejection centred at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
36 dB
11
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
-6 dBc
12
Relative frequency error
(2x40ppm required by [1])
-120 120 ppm
13
Relative tim ing error
(2x40ppm required by [1])
-120 120 ppm
14
Linear RSSI range
40
dB
15
Output power at highest power setting
NORMAL MODE
BOOST MODE
0
3
8 dBm
16
Output power at lowest power setting
-55
dBm
17
Error vector magnitude as per IE EE 802.1 5.4
5
15
%
18
Carrier frequency error
-40 (1)
40 (1)
ppm
19
PSD mask relative
3.5MHz distance from carrier
-20 dB
20
PSD mask absolute
3.5MHz distance from carrier
-30 dBm
Table 11. AC Electrical Characteristics
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 22 - ETRX35x Product Manual (Rev 1.20)
Notes
(1) Applies across the full ranges of rated temperature and supply voltage.
Please Note: For the relationship between EM35x power settings and module output pow er please
relate to chapter 10.1 of this document. When developing custom firmware the output power settings
described in this document relate directly to the EM35x power settings accessible via the Ember
stack API.
No.
Synthesiser Characteristics
Limit
Unit
Min
Typ
Max
22
Frequency range
2400
2500
MHz
23
Frequency resolution
11.7
kHz
24
Lock time from off state, with correct VCO DAC settings
100
µs
25
Relock time, channel change or Rx/Tx turnaround
100
µs
26
Phase noise at 100kHz offset
-75dBc/Hz
27
Phase noise at 1MHz offset
-100dBc/Hz
28
Phase noise at 4MH z offset
-108dBc/Hz
29
Phase noise at 10M Hz offset
-114dBc/Hz
Table 12: Synthesiser Characteristics
No.
Power On Reset (POR) Specifications
Limit
Unit
Min
Typ
Max
30
VCC POR release
0.62
0.95
1.2
Vdc
31
VCC POR assert
0.45
0.65
0.85
Vdc
Table 13: Power On Reset Specifications
No.
nRESET Spec ifications
Limit
Unit
Min
Typ
Max
32
Reset Filter Time constant
2.1
12
16
µs
33
Reset Pulse width to guarantee a reset
26
µs
34
Reset Pulse width guaranteed not to cause reset
0
1
µs
35
Input pull-up resistor value while the chip is not reset
24
29
34
kΩ
36
Input pull-up resistor value while the chip is reset
12
14.5
17
kΩ
Table 14: nReset Specifications
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 23 - ETRX35x Product Manual (Rev 1.20)
10.1 TX Power Characteristics
The diagrams below show the typical output power and module current in dependency on module
EM35x power setting. Pow er settings above 3dBm hav e Boos t Mode enabled. Please no te tha t th e
output power is independent o f the supply voltage as the radio is supplied by an internally regulated
voltage.
Figure 3: Output Power vs. Power Setting
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 24 - ETRX35x Product Manual (Rev 1.20)
Figure 4: Module Current vs. Power Setting
Transmit curren t A
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 25 - ETRX35x Product Manual (Rev 1.20)
11 Ph ysical Dimensions
Figure 5: ETRX3 Physical Dimensions
Symbol
Explanation
Typical Distance
Tolerances
L
Length of the module
25.0mm
±0.13mm
W
Width of the module
19.0mm
±0.13mm
H
Height of the module
3.8mm
±0.1mm
A1
Distance centre of pad PCB edge
0.9mm
±0.13mm
A2
Pitch
1.27mm
n/a
R1
Keep-out Zone from corner of PCB
17.5mm
n/a
R2
Keep-out Zone from corner of PCB
4.1mm
n/a
X1
Distance centre of Antenna connector
PCB edge
3.8mm
±0.13mm
X2
Distance centre of Antenna connector
PCB edge
2.8mm
±0.13mm
Table 15: ETRX3 Physical Dimensions
For ideal RF performance when using the on-board antenna, the antenna should be located at the
corner of the carrier PCB. There should be no co mponents, tracks or copper planes in the keep-out
area which should be as large as possible. When using the U.FL RF connector the keep-out area
does not have to be obeyed. Note: The modules’ transmit/receive range w ill depend on the antenna
used and also the housing of the finished product.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 26 - ETRX35x Product Manual (Rev 1.20)
Figure 6. Typical pad dimensions
Module weight: 2.9-3.0g depending on variant
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 27 - ETRX35x Product Manual (Rev 1.20)
12 Recomme nde d Soldering Temperature Profile
Recommended temperature profile
for reflow solde r i ng
Temp.[°C]
Time [s]
230°C -250°C max.
220°C
150°C – 200°C
90 ±30s
60 +60-20s
Figure 7. Recommended Reflow Profile
Use of “No -Clean” solder paste is recommended to avoid the requirement for a cleaning process.
Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent
and other residuals are remaining underneath the shielding can as well as in the gap between the
module and the host board.
Please Note:
Maximum number of reflow cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your PCB and re-flow).
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 28 - ETRX35x Product Manual (Rev 1.20)
13 Product La be l Drawing
Figure 8: Product Label
The label dimensions are 16.0mm x 14.0 mm. The label will withstand temperatures and chemicals
used during a typical manufacturing process.
Imprint
Description
Model:ETRX357
Module Order Code.
000001 Indication for the serial number.
Starting at 000000 for each batch incrementing with each module
090101
Production Date Code in the format YYMMDD, e.g. 090101
01
Indication for batch number
02
Indication for the production location (first character) and the hardware revision (second
character)
FCC ID: S4GEM35XA
The FCC ID
IC: 8735A-EM35XA
The IC ID
CE
The CE Mark
2D-Barcode
Information in the 2D-Barcode are the serial number [6 characters], the Part-Order code [12
characters filled with trailing spaces e.g. “ETRX357 “ instead of “ETRX357”], identifier for
the batch number [2 characters], the identifier for the hardware release [2 characters] and
the production date code in the format Year-Month-Day [6 characters], separated by a
semicolon.
Table 16: ETRX35x Label Details
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 29 - ETRX35x Product Manual (Rev 1.20)
14 Recomme nde d Foot print
14.1 Pad dimensions
In order to surface mount an ETRX3 series module, we recommend that you use pads which are
1mm wide and 1.2mm high. You must retain the keep-out zone shown in section 12, and ensure
that this keep-out area is free of components, cop per tracks and/or copper planes/layers.
You must also ensure that there is no exposed copper on your layout which may contact with the
underside of the ETRX3 series module.
For best RF performance it is required to provide good ground connections to the ground pads of
the module. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductance in the ground path.
Figure 9: Recommended Footprint
The land pattern dimensions above serve as a guideline.
W e recommend that you use the same pad dimensions for the solder paste screen as you have for
the copper pads. However these sizes and shapes may need to be varied depending on your
soldering processes and your individual production standards. We recommend a paste screen
thickness of 120μm to 150μm.
Figure 6 shows the typical pad dimensions of the module and Figure 10 - Figure 12 in s ect io n 14.2
show examples of how to align the module on its host PCB.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 30 - ETRX35x Product Manual (Rev 1.20)
Although the undersides of the ETR X3 series modules are fully coated, no exposed copper, such as
uncovered through-hole vias, planes or tracks on your board component layer, should be located
below the ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer
PCB containing an inner RF shielding ground plane, therefore there is no need to have an additional
copper plane directly under the ETRX3 series module.
14.2 Reco mm end ed Pla ce m ent
W hen placing the module please either locate the antenna in the corner as shown in Figure 10 so
that the recommended antenna keepout zone is being followed, or add a no copper zone as
indicated in Figure 12.
Figure 10. Typical placement
Figure 11. How to not place the Module
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 31 - ETRX35x Product Manual (Rev 1.20)
Figure 12. Adding a no copper / no component area
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 32 - ETRX35x Product Manual (Rev 1.20)
14.3 Example carrier board
Since the RF performance of the module with the on board antenna is strongly dependent on the
proper location of the module on its carrier board, Figure 13 shows the reference carrier board which
was used during testing by Telegesis.
Figure 13. Reference Board
For best performance it is recommended to locate the antenna towards the corner of the carrier
board and to respect the recommended keep-out areas as described in section 11.
Finally to provide a good reference ground to the on board antenna, the carrier board should have
a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice,
but degradation in radio performance could be the result.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 33 - ETRX35x Product Manual (Rev 1.20)
15 Reli a bility Test s
The measurements below have been conducted on random samples out of mass production and
passed after the module has been exposed to standard room temperature and humidity for 1 hour.
No
Item
Limit
Condition
1 Vibration test Electr ica l par amet er sho uld be
in specification
Freq.:40Hz,Amplitude:1.5mm
20min. / cycle,1hrs. each of X and Y axis
2 Shock test the same as the above
Dropped onto hard wood from height of
50cm for 3 times
3 Heat cycle test the same as the above
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycle s
4
Moisture test
the same as the above
+60°C, 90% RH, 300h
5
Low temp. test
the same as the above
-40°C, 300h
6
High temp. test
the same as the above
+85°C, 300h
Table 17: Reliability Tests
16 Applic a t ion Notes
16.1 Safety Precautions
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate the module’s operation when mounted on your products. Abide
by these specifications when using the products. These products may short-circuit. If electrical
shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit
occurs, then provide the following failsafe functions as a minimum:
(1) Ensure the safety of the whole system by installing a protection circuit and a protection
device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
16.2 Design Engineering Notes
(1) Heat is the major cause of shortening the life of the modules. Avoid assembly and use
of the target equipment in conditions where the product’s temperature may exceed the
maximum allowable.
(2) Failure to do so may result in degrading of the product’s functions and damage to the
product.
(3) If pulses or other transient loads (a large load applied in a short time) are applied to the
products, before use, check and evaluate their operation when assembled onto your
products.
(4) These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
performance and reliability under the said special conditions carefully, to determine
whether or not they can be used in such a manner.
(5) In liquid, such as water, salt water, oil, alkali, or organic solvent, or i n places where liquid
may splash.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 34 - ETRX35x Product Manual (Rev 1.20)
(6) In direct sunlight, outdoors, or in a dusty environment
(7) In an environment where condensation occurs.
(8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2,
H2S, NH3, a n d NOx)
(9) If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(10) Mechanical stress during assembly of the board and operation has to be avoided.
(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not
permitted.
16.3 Storage Conditions
(1) The module must not be stressed mechanically during storage.
(2) Do not store these products in the following conditions or the performance characteristics
of the product, such as RF performance, may well be adversely affected:
(3) Storage in salty air or in an environment w ith a hi gh concentration of corrosiv e gas, such
as Cl2, H2 S, NH3 , SO 2, or NOX
(4) Storage in direct sunlight
(5) Storage in an environment where the temperature may be outside the range of 5°C to
35°C range, or where the humidity may be outside the 45 to 85% range.
(6) Storage (before assembly of the end product) of the modules for more than one year
after the date of delivery at your company even if all the above conditions (1) to (3) have
been met, should be avoided.
17 Packaging
17.1 Embossed Tape
(1) Dimensions of t he t ape
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 35 - ETRX35x Product Manual (Rev 1.20)
(2) Cover tape peel force
Force direction
Speed = 300mm/m in.
Cover tape peel force
=0.098～0.68N ( 10～70g)
θ= 10deg
(3) Empty pockets
NB: Empty pockets in the populated area will be less than two per reel and those empty pockets
will not be consecutive.
17.2 Component Orientation
Top cover tape will not obstruct the car rier tape holes and will not extend beyond the edges of
the carrier tape
17.3 Reel Dimensions
(4) Quantity per reel: 600 pieces
(5) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on
the reel
(top view)
Component Orientation
Part No.
Direction
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 36 - ETRX35x Product Manual (Rev 1.20)
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 37 - ETRX35x Product Manual (Rev 1.20)
17.4 Packaging - bag
(6) Each reel will be packed in a hermetically-sealed bag containing desiccant and a
humidity indicator card
(7) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code
17.5 Packaging – carton
(8) Each reel and bag will be placed in a cardboard carton of nominal dimensions
343 x 338 x 68 mm.
(9) W eight of carton containing reel of 600 modules: 2.51kg approx.
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 38 - ETRX35x Product Manual (Rev 1.20)
18 Ordering Inf orma ti on
Ordering/Product Code
Description
ETRX351
ETRX357
Telegesis Wireless Mesh Networking Module with Ember
ZigBee Technology:
• Based on Ember EM351 or EM357
• Telegesis AT Style Command Interpreter based on
• EmberZNet meshing and self-healing
ZigBee PRO
stack
• Integrated 2.4GHz Antenna
ETRX351HR
ETRX357HR
Telegesis Wireless Mesh Networking Module with Ember
ZigBee Technology:
• Based on Ember EM351 or EM357
• Telegesis AT Style Command Interpreter based on
• EmberZNet meshing and self-healing
ZigBee PRO
stack
• U.FL coaxial Antenna Connector
ETRX3DVK
Telegesis Development Kit with:
• 3 x ETRX35xDV Development Boards
• 3 x USB cables
• 2 x ETRX35x on carrier boards
• 2 x ETRX35xHR on carrier boards
• 2 x ETRX35x-LR on carrier boards
• 2 x ETRX35xHR-LR on carrier boards
• 1 x ETRX2USB USB stick
• 2 x ½-wave antennae
• 2 x ¼-wave antennae
Notes:
• Customers’ PO’s must state the Ordering/Product Code.
• There is no “blank” version of the ETRX35x modules available. All Modules are pre-
programmed with the Telegesis AT style command
interpreter based on the EmberZNet
stack. (In case it is desired to program custom firmware the pre-pro gra mmed fi rmware ca n
simply be overwritten).
Not Recommended for New Design
ETRX351 and ETRX357
©2015 Silicon Labs - 39 - ETRX35x Product Manual (Rev 1.20)
19 RoHS Decl a ration
Declaration of environmental compatibility for supplied products:
Hereby we declare based on the declaration of our suppliers that this product does not contain any
of the substances which are banned by Directive 2011/65/EU (RoHS2) or if they do, contain a
maximum concentration of 0,1% by weight in homogeneous materials for:
• Lead and lead compounds
• Mercury and mercury compounds
• Chromium (VI)
• PBB (polybrominated biphenyl) categor y
• PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for:
• Cadmium and cadmium compounds
20 Data Sheet Status
Telegesis (UK) Ltd. reserves the right to chan ge t he specification without notice, in order to i mprove
the design and supply the bes t possible p roduct. Pl ease consult the m ost recently issued data sheet
before initiating or completing a design.
21 Relat e d Doc um e nts
[1] IEEE Standard 802.15.4 –2003 W ireless Medium Access Control (MAC) and Physical Layer
(PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[2] Datasheet EM35x, Silicon Labs. (www.silabs.com)
[3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors - Low
Profile 1.9mm or 2.4mm Mated Height
[4] The ZigBee specification (www.zigbee.org)
[5] Specification for Antenova Rufa Antenna (www.antenova.com)
[6] Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)
[7] Wellhope Communication Equipment (www.wellhope-wireless.com)
Not Recommended for New Design
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Disclaimer
Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or
intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes
without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included
information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted
hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of
Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant
personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass
destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.
Trademark Information
Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®,
EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®,
Gecko®, ISOmodem®, Micrium, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress®, Zentri and others are trademarks or registered
trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other
products or brand names mentioned herein are trademarks of their respective holders.
Not Recommended for New Design