Low-Cost, Multichemistry BatteryCharger Building Block 19-1772; Rev 4; 2/09 Applications Features o Input Current Limiting o 0.5% Output Voltage Accuracy Using Internal Reference (0C to +85C) o Programmable Battery Charge Current >4A o Analog Inputs Control Charge Current and Charge Voltage o Monitor Outputs for: Current Drawn from AC Input Source Charging Current AC Adapter Present o Up to 18.2V (max) Battery Voltage o 8V to 28V Input Voltage o > 95% Efficiency o 99.99% (max) Duty Cycle for Low-Dropout Operation o Charges Any Battery Chemistry: Li+, NiCd, NiMH, Lead Acid, etc. Notebook and Subnotebook Computers Personal Digital Assistants Handheld Terminals Ordering Information Pin Configuration PART TOP VIEW DCIN 1 28 IINP LDO 2 27 CSSP CLS 3 26 CSSN REF 4 25 BST CCS 5 MAX1772 TEMP RANGE PIN-PACKAGE MAX1772EEI -40C to +85C 28 QSOP MAX1772EEI+ -40C to +85C 28 QSOP +Denotes lead(Pb)-free/RoHS-compliant package. 24 DHI CCI 6 23 LX CCV 7 22 DLOV GND 8 21 DLO GND 9 20 PGND ICHG 10 19 CSIP ACIN 11 18 CSIN ACOK 12 17 BATT REFIN 13 16 CELLS ICTL 14 15 VCTL QSOP ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. MAX1772 General Description The MAX1772 is a highly-integrated, multichemistry battery-charger control IC that simplifies the construction of accurate and efficient chargers. The MAX1772 uses analog inputs to control charge current and voltage and can be programmed by the host or hardwired. High efficiency is achieved by a buck topology with synchronous rectification. Maximum current drawn from the AC adapter is programmable to avoid overloading the AC adapter when supplying the load and the battery charger simultaneously. This enables the user to reduce the cost of the AC adapter. The MAX1772 provides outputs that can be used to monitor the current drawn from the AC adapter, battery-charging current, and the presence of an AC adapter. The MAX1772 can charge two to four lithium-ion (Li+) series cells, easily providing 4A. When charging, the MAX1772 automatically transitions from regulating current to regulating voltage. It is available in a space-saving 28-pin QSOP package. MAX1772 Low-Cost, Multichemistry BatteryCharger Building Block ABSOLUTE MAXIMUM RATINGS DCIN, CSSP, CSSN to GND ...................................-0.3V to +30V BST to GND ............................................................-0.3V to +36V BST to LX..................................................................-0.3V to +6V DHI to LX ...................................................-0.3V to (VBST + 0.3V) LX to GND .................................................................-6V to +30V BATT, CSIP, CSIN to GND........................................-0.3V to 20V CSIP to CSIN or CSSP to CSSN or PGND to GND .............................................-0.3V to +0.3V CCI, CCS, CCV, DLO, ICHG, IINP, ACIN, REF to GND ...............................-0.3V to (VLDO + 0.3V) DLOV, VCTL, ICTL, REFIN, CELLS, CLS, LDO, ACOK to GND ....................................-0.3V to +6V DLOV to LDO.........................................................-0.3V to +0.3V DLO to PGND .........................................-0.3V to (VDLOV + 0.3V) LDO Short-Circuit Current ..................................................50mA Continuous Power Dissipation (TA = +70C) 28-Pin QSOP (derate 12.6mW/C above +70C).......1008mW Junction-to-Ambient Thermal Resistance (JA) (Note 1) .....................................................................79.3C/W Junction-to-Case Thermal Resistance ( JC) (Note 1) ........................................................................27C/W Operating Temperature Range ...........................-40C to +85C Junction Temperature ........................................................150C Storage Temperature Range .............................-60C to +150C Lead Temperature (soldering, 10s) .................................+300C Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VDCIN = VCSSP = VCSSN = 18V, VBATT = VCSIP = VCSIN = 12V, VREFIN = 3.0V, VVCTL = VICTL = 0.75 VREFIN, VCELLS = 2.0V, VACIN = 0V, CLS = REF, VBST - VLX = 4.5V, VGND = VPGND = 0V, CLDO = 1F, LDO = DLOV, CREF = 1F; pins CCI, CCS, and CCV are compensated per Figure 1a; TA = 0C to +85C, unless otherwise noted. Typical values are at TA = +25C.) PARAMETER SYMBOL CONDITIONS SUPPLY AND LDO REGULATOR VDCIN DCIN Input Voltage Range DCIN Quiescent Current 7.0 VDCIN rising IDCIN TYP 8 VDCIN falling DCIN Undervoltage Lockout Trip Point MIN 8.0V < VDCIN < 28V, no load LDO Load Regulation 0 < ILDO < 10mA LDO Undervoltage Lockout Trip Point VDCIN = 8.0V REF Output Voltage 0 < IREF < 500A REF Undervoltage Lockout Trip Point VREF falling UNITS 28 V 7.4 7.5 8.0V < VDCIN < 28V LDO Output Voltage MAX 7.85 V 2.7 6.0 mA 5.40 5.55 V 34 100 mV 3.20 4.00 5.15 V 4.072 4.096 4.120 V 3.1 3.9 V 50 100 150 mV 100 200 300 mV 2.007 2.048 2.089 V 20 5.25 TRIP POINTS BATT POWER_FAIL Threshold VCSSP falling BATT POWER_FAIL Threshold Hysteresis ACIN Threshold VACIN rising ACIN Threshold Hysteresis 0.5% of VREF 10 30 mV ACIN Input Bias Current VACIN = 2.048V -1 +1 A 1.6 REF V -1 +1 A 1.50 s CLS Input Range CLS Input Bias Current VCLS = 2.0V SWITCHING REGULATOR Minimum Off-Time 2 VBATT =16.8V 1.00 1.25 _______________________________________________________________________________________ Low-Cost, Multichemistry BatteryCharger Building Block (VDCIN = VCSSP = VCSSN = 18V, VBATT = VCSIP = VCSIN = 12V, VREFIN = 3.0V, VVCTL = VICTL = 0.75 VREFIN, VCELLS = 2.0V, VACIN = 0V, CLS = REF, VBST - VLX = 4.5V, VGND = VPGND = 0V, CLDO = 1F, LDO = DLOV, CREF = 1F; pins CCI, CCS, and CCV are compensated per Figure 1a; TA = 0C to +85C, unless otherwise noted. Typical values are at TA = +25C.) PARAMETER SYMBOL CONDITIONS Maximum On-Time MIN TYP MAX 5 10 15 UNITS ms 400 kHz Oscillator Frequency fOSC (Note 2) DLOV Supply Current IDLOV DLO low 5 10 A IBST DHI high 6 15 A 150 500 A 0.3 1.0 A BST Supply Current LX Input Bias Current VDCIN = 28V, VBATT = VLX = 20V LX Input Quiescent Current VDCIN = 0V, VBATT = VLX = 20V DHI Maximum Duty Cycle 99.0 99.9 % DHI On-Resistance High VBST - VLX = 4.5V, IDHI = +100mA 4 7 DHI On-Resistance Low VBST - VLX = 4.5V, IDHI = -100mA 1 2 DLO On-Resistance High VDLOV = 4.5V, IDLO = +100mA 4 7 DLO On-Resistance Low VDLOV = 4.5V, IDLO = -100mA 1 2 200 500 IBATT BATT Input Current CSIP/CSIN Input Current CSSP/CSSN Input Current VBATT = 19V, VDCIN = 0V VDCIN = 0V 1 VCSIP = VCSIN = 12V 0.1 VCSSP = VCSSN = VDCIN > 8.0V CSSP to CSSN Full-Scale Current-Sense Voltage 0.3 800 0 VBATT = 12V 5 800 VDCIN = 0V BATT/CSIP/CSIN Input Voltage Range CSIP to CSIN Full-Scale Current-Sense Voltage 5 VBATT = 2V to 19V, VDCIN > VBATT + 0.3V A A A 19 V 189 204 219 mV 189 204 219 mV 0.0625 0.1250 0.250 S ERROR AMPLIFIERS GMV Amplifier Transconductance VCTL = REFIN, VBATT = 16.8V, CELLS = LDO GMI Amplifier Transconductance ICTL = REFIN, VCSIP - VCSIN = 150.4mV 0.5 1 2 S GMS Amplifier Transconductance VCLS = 2.048V, VCSSP - VCSSN = 102.4mV 0.5 1 2 S CCI/CCS/CCV Clamp Voltage 0.25V < VCCI, VCCS, VCCV < 2.0V 150 300 600 mV CURRENT AND VOLTAGE SETTING Charging-Current Accuracy ICTL, VCTL, REFIN Input Bias Current ICTL Power-Down Mode Threshold Voltage ICTL = REFIN (see Equation 2) -8 +8 ICTL = REFIN/32 (see Equation 2) -55 +55 VVCTL = VICTL = VREFIN = 3V -1 +1 VDCIN = 0, VVCTL = VICTL = VREFIN = 5V -1 +1 REFIN /100 REFIN /55 REFIN /33 % A V _______________________________________________________________________________________ 3 MAX1772 ELECTRICAL CHARACTERISTICS (continued) MAX1772 Low-Cost, Multichemistry BatteryCharger Building Block ELECTRICAL CHARACTERISTICS (continued) (VDCIN = VCSSP = VCSSN = 18V, VBATT = VCSIP = VCSIN = 12V, VREFIN = 3.0V, VVCTL = VICTL = 0.75 VREFIN, VCELLS = 2.0V, VACIN = 0V, CLS = REF, VBST - VLX = 4.5V, VGND = VPGND = 0V, CLDO = 1F, LDO = DLOV, CREF = 1F; pins CCI, CCS, and CCV are compensated per Figure 1a; TA = 0C to +85C, unless otherwise noted. Typical values are at TA = +25C.) PARAMETER Battery-Regulation Voltage Accuracy SYMBOL CONDITIONS MIN IINP Transconductance IINP Current Accuracy CSSP - CSSN Accuracy UNITS -0.5 +0.5 VVCTL = VREFIN/20 (2, 3, or 4 cells) (see Equation 1) -0.5 +0.5 2.0 3.6 V 1.20 1.92 V 1.00 1.05 S % REFIN Undervoltage Lockout ICHG Accuracy MAX VVCTL = VREFIN (2, 3, or 4 cells) (see Equation 1) REFIN Range ICHG Transconductance TYP VICHG to (VCSIP - VCSIN); VCSIP VCSIN = 0.185V; VICHG = 0V, 3.0V 0.95 VCSIP - VCSIN = 0.185V -5 +5 VCSIP - VCSIN = 0.05V -10 +10 VIINP to (VCSSP - VCSSN); VCSSP VCSSN = 0.185V; VIINP = 0V, 3.0V (Note 3) 0.85 VCSSP - VCSSN = 0.185V -15 +15 -20 +20 VCSSP - VCSSN = 0.08V, VCLS = 1.6V -10 +10 VCSSP - VCSSN = 0.2V, CLS = REF -10 +10 8.0 28 V 0.2 V 0.4 VLDO - 0.5 V VLDO - 0.25 VLDO V -10 +10 A VCSSP - VCSSN = 0.05V CSSP + CSSN Input Voltage Range (Note 3) 1.00 1.15 % S % % LOGIC LEVELS CELLS Input Low Voltage CELLS Input Middle Voltage CELLS Input High Voltage CELLS Input Bias Current VCELLS = 0V or VLDO ACOK Sink Current VACOK = 0.4V 1 ACOK Leakage Current VACOK = 5.5V -1 4 _______________________________________________________________________________________ mA +1 A Low-Cost, Multichemistry BatteryCharger Building Block (VDCIN = VCSSP = VCSSN = 18V, VBATT = VCSIP = VCSIN = 12V, VREFIN = 3.0V, VVCTL = VICTL = 0.75 VREFIN, VCELLS = 2.0V, VACIN = 0V, CLS = REF, VBST - VLX = 4.5V, VGND = VPGND = 0V, CLDO = 1F, LDO = DLOV, CREF = 1F; pins CCI, CCS, and CCV are compensated per Figure 1a; TA = -40C to +85C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 28.0 V SUPPLY AND LDO REGULATOR DCIN Input Voltage Range VDCIN VDCIN falling DCIN Undervoltage Lockout Trip Point DCIN Quiescent Current 8.0 7 VDCIN rising IDCIN 8.0V < VDCIN < 28V 8.0V < VDCIN < 28V, no load LDO Output Voltage 7.85 V 6 mA 5.25 5.65 V 50 150 mV 100 300 mV 2.089 V TRIP POINTS VCSSP falling BATT POWER_FAIL Threshold BATT POWER_FAIL Threshold Hysteresis ACIN Threshold VACIN rising 2.007 ACIN Threshold Hysteresis 0.5% of REF 10 30 mV ACIN Input Bias Current VACIN = 2.048V -1 +1 A 1.6 REF V VCLS = 2.0V -1 +1 A VBATT = 16.8V 1 1.5 s CLS Input Range CLS Input Bias Current SWITCHING REGULATOR Minimum Off-Time Maximum On-Time 5 Oscillator Frequency fOSC (Note 1) DHI Maximum Duty Cycle ms kHz 99 IBATT BATT Input Current 15 400 CSIP/CSIN Input Current CSSP/CSSN Input Current VBATT = 19V, VDCIN = 0V 5 VBATT = 2V to 19V, VDCIN > VBATT + 0.3V 500 VDCIN = 0V 5 VCSIP = VCSIN = 12V 800 VDCIN = 0V 0.3 VCSSP = VCSSN = VDCIN > 8.0V 800 BATT/CSIP/CSIN Input Voltage Range CSIP to CSIN Full-Scale Current-Sense Voltage % A A A 0 19 V 189 219 mV 189 219 mV ICTL = REFIN (see Equation 2) -8 +8 ICTL = REFIN/32 (see Equation 2) -55 +55 VVCTL = VICTL = VREFIN = 3V -1 +1 VDCIN = 0V, VVCTL = VICTL = VREFIN = 5V -1 +1 VBATT = 12V CSSP to CSSN Full-Scale Current-Sense Voltage CURRENT AND VOLTAGE SETTING Charging Current Accuracy ICTL, VCTL, REFIN Input Bias Current % A _______________________________________________________________________________________ 5 MAX1772 ELECTRICAL CHARACTERISTICS MAX1772 Low-Cost, Multichemistry BatteryCharger Building Block ELECTRICAL CHARACTERISTICS (continued) (VDCIN = VCSSP = VCSSN = 18V, VBATT = VCSIP = VCSIN = 12V, VREFIN = 3.0V, VVCTL = VICTL = 0.75 VREFIN, VCELLS = 2.0V, VACIN = 0V, CLS = REF, VBST - VLX = 4.5V, VGND = VPGND = 0V, CLDO = 1F, LDO = DLOV, CREF = 1F; pins CCI, CCS, and CCV are compensated per Figure 1a; TA = -40C to +85C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MAX UNITS REFIN /100 REFIN /33 V VVCTL = VREFIN (2, 3, or 4 cells) (see Equation 1) -1 +1 VVCTL = VREFIN/20 (2, 3, or 4 cells) (see Equation 1) -1 +1 ICTL Power-Down Mode Threshold Voltage Battery Regulation Voltage Accuracy MIN TYP % REFIN Range 2.0 REFIN Undervoltage Lockout ICHG Accuracy IINP Current Accuracy CSSP - CSSN Accuracy 3.6 V 1.92 V VCSIP - VCSIN = 0.185V -5 +5 VCSIP - VCSIN = 0.05V -10 +10 -15 +15 -20 +20 VCSSP - VCSSN = 0.08V, VCLS = 1.6V -10 +10 VCSSP - VCSSN = 0.2V, CLS = REF -10 +10 8 28 V 0.2 V 0.4 VLDO - 0.5 V VLDO - 0.25 VLDO V -10 +10 VCSSP - VCSSN = 0.185V VCSSP - VCSSN = 0.05V CSSP + CSSN Input Voltage Range (Note 3) % % % LOGIC LEVELS CELLS Input Low Voltage CELLS Input Middle Voltage CELLS Input High Voltage CELLS Input Bias Current VCELLS = 0V or VLDO ACOK Sink Current VACOK = 0.4V 1 ACOK Leakage Current VACOK = 5.5V -1 Note 2: Guaranteed by design. Not production tested. Note 3: Tested under DC conditions. See text for more detail. 6 _______________________________________________________________________________________ A mA +1 A Low-Cost, Multichemistry BatteryCharger Building Block LOAD-TRANSIENT RESPONSE (BATTERY REMOVAL AND REINSERTION) LOAD-TRANSIENT RESPONSE (STEP-IN LOAD CURRENT) MAX1772 toc01 MAX1772 toc02 VBATT 20V/div VCCS 500mV/div VCCI 500mV/div CCI CCS IBATT 2A/div CCV VBATT 20V/div CCI VCCI 500mV/div VCCV 500mV/div ILOAD 2A/div 1ms/div 1ms/div BATTERY PRESENT VICTL = 3.30V CHARGING CURRENT = 2.0A VBATT = 16V LOAD STEP = 0 TO 3A ISOURCE LIMIT = 5A VICTL = 0.957V VCTL = 3.3V LDO LOAD REGULATION VVCTL = 0V VICTL = 3.3V VDCIN = 20.0V VLDO = 5.40V MAX1772 toc03 0.3 VDCIN 10V/div 0.2 LDO ERROR (%) VBATT (AC-COUPLED) 100mV/div MAX1772 toc04 0.4 LINE-TRANSIENT RESPONSE 0.1 0 -0.1 -0.2 -0.3 -0.4 0 2ms/div 1 2 3 4 5 6 7 8 9 10 LDO CURRENT (mA) VBATT = 16V VDCIN = 18.5V TO 27.5V ILOAD = 150mA _______________________________________________________________________________________ 7 MAX1772 Typical Operating Characteristics (Circuit of Figure 1a, VDCIN = 20V, TA = +25C, unless otherwise noted.) Typical Operating Characteristics (continued) (Circuit of Figure 1a, VDCIN = 20V, TA = +25C, unless otherwise noted.) REF VOLTAGE LOAD REGULATION 0.10 REF ERROR (%) 0.4 0.2 0 -0.2 0.05 0 -0.05 -0.4 -0.10 -0.6 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.8 -0.15 -1.0 -0.20 12 16 20 24 -0.4 -0.5 0 28 50 100 150 200 250 300 350 400 450 500 70 100 CELL = 4 CELL = 3 60 50 90 80 EFFICIENCY (%) EFFICIENCY (%) VVCTL = 0V VICTL = 3.3V VREFIN = 3.3V 10 35 60 EFFICIENCY vs. BATTERY CURRENT (CURRENT CONTROL LOOP) MAX1772 toc08 100 80 -15 TEMPERATURE (C) EFFICIENCY vs. BATTERY CURRENT (VOLTAGE CONTROL LOOP) 90 -40 REF CURRENT (A) DCIN (V) CELL = 2 40 MAX1772 toc09 8 CELL = 4 70 CELL = 3 CELL = 2 60 50 40 30 30 20 20 10 10 VVCTL = 0V VICTL = 3.3V VREFIN = 3.3V 0 0 0.1 1 10 100 BATT CURRENT (mA) 8 VICTL = 0V VVCTL = 0V NO LOAD VREF = 4.096V 0.4 REF VOLTAGE ERROR (%) 0.6 VVCTL = 0V VICTL = 3.3V CELL = 4 VREF = 4.096V 0.15 REF VOLTAGE ERROR vs. TEMPERATURE 0.5 MAX1772 toc06 MAX1772 toc05 VLDO = 5.40V 0.8 0.20 MAX1772 toc07 LDO LINE REGULATION 1.0 LDO ERROR (%) MAX1772 Low-Cost, Multichemistry BatteryCharger Building Block 1000 10,000 100 1000 BATT CURRENT (mA) _______________________________________________________________________________________ 10,000 85 Low-Cost, Multichemistry BatteryCharger Building Block OUTPUT V/I CHARACTERISTICS 0.035 CELL = 3 0.030 0.025 CELL = 2 0.020 0.015 CELL = 4 VREFIN = 3.3V NO LOAD 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.010 0.04 0.005 0.02 0 MAX1772 toc11 0.040 0 500 1000 1500 2000 2500 3000 3500 4000 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 BATT CURRENT (mA) VCTL/REFIN (%) CURRENT SETTING ERROR vs. ICTL ICHG ERROR vs. BATT LOAD CURRENT 4.0 MAX1772 toc12 5 VREFIN = 3.3V 4 VVCTL = 0V VICTL = 3.3V CELL = 4 3.5 MAX1772 toc13 0 3.0 ICHG ERROR (%) CURRENT SETTING ERROR (%) BATT VOLTAGE ERROR (%) CELL = 4 BATT VOLTAGE ERROR (%) VVCTL = 0V VICTL = 3.3V 0.045 BATT VOLTAGE ERROR vs. VCTL 0.20 MAX1772 toc10 0.050 3 2 2.5 2.0 1.5 1.0 1 VBATT > 2V 0 0.5 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 ICTL/REFIN (%) 0 500 1000 1500 2000 2500 3000 3500 4000 BATT LOAD CURRENT (mA) _______________________________________________________________________________________ 9 MAX1772 Typical Operating Characteristics (continued) (Circuit of Figure 1a, VDCIN = 20V, TA = +25C, unless otherwise noted.) Low-Cost, Multichemistry BatteryCharger Building Block MAX1772 Pin Description 10 PIN NAME FUNCTION 1 DCIN Charging Voltage Input 2 LDO Device Power Supply. Output of the 5.4V linear regulator supplied from DCIN. Bypass LDO with a 1F capacitor to GND. 3 CLS Source Current-Limit Input. Voltage input for setting the current limit of the input source. 4 REF 4.096V Voltage Reference. Bypass REF with a 1F capacitor to GND. 5 CCS Input Current Regulation Loop Compensation Point. Connect a 0.01F capacitor from CCS to GND. 6 CCI Output Current Regulation Loop Compensation Point. Connect a 0.01F capacitor from CCI to GND. 7 CCV Voltage Regulation Loop Compensation Point. Connect 1k resistor in series with a 0.1F capacitor to GND. 8, 9 GND Analog Ground 10 ICHG ICHG is a scaled-down replica of the battery output current being sensed. It is used to monitor the charging current and indicates when the chip changes from voltage mode to current mode. The transconductance of (CSIP - CSIN) to ICHG is 1S. Connect ICHG pin to GND if it is unused. 11 ACIN AC Detect Input. Detects when the AC adapter voltage is available for charging. 12 ACOK AC Detect Output. Open-drain output is high when ACIN is less than REF/2. 13 REFIN Reference Input. Allows the ICTL and VCTL pins to have ratiometric ranges for increased DAC accuracy. 14 ICTL Input for Setting Maximum Output Current. Range is REFIN/32 to REFIN. The device shuts down if this pin is forced below REFIN/55 (typ). 15 VCTL Input for Setting Maximum Output Voltage. Range is 0 to REFIN. 16 CELLS 17 BATT Battery Voltage Input 18 CSIN Output Current-Sense Negative Input 19 CSIP Output Current-Sense Positive Input. Connect a current-sense resistor from CSIP to CSIN. 20 PGND 21 DLO Low-Side Power MOSFET Driver Output. Connect DLO to a low-side nMOS gate. 22 DLOV Low-Side Driver Supply 23 LX Power Connection for the High-Side Power MOSFET Driver. Connect LX to a source of high-side nMOS. 24 DHI High-Side Power MOSFET Driver Output. Connect DHI to a high-side nMOS gate. 25 BST Power Connection for the High-Side Power MOSFET Driver. Connect a 0.1F capacitor from LX to BST. 26 CSSN Input Current-Sense for Charger (negative input) 27 CSSP Input Current-Sense for Charger (positive input). Connect a current-sense resistor from CSSP to CSSN. 28 IINP Trilevel Input for Setting Number of Cells. GND = 2 cells, LDO/2 = 3 cells, LDO = 4 cells. Power Ground IINP is a scaled-down replica of the input current being sensed. It is used to monitor the total system current. The transconductance of (CSSP - CSSN) to IINP is 1mS. Connect IINP pin to GND if it is unused. ______________________________________________________________________________________ Low-Cost, Multichemistry BatteryCharger Building Block The MAX1772 includes all of the functions necessary to charge Li+, NiMH, and NiCd batteries. A high-efficiency synchronous-rectified step-down DC-DC converter controls charging voltage and current. It also includes input source-current limiting and analog inputs for setting the charge current and charge voltage. The DC-DC converter uses external N-channel MOSFETs as the buck switch and synchronous rectifier to convert the input voltage to the required charging current and voltage. The typical application circuit shown in Figure 1a uses a microcontroller (C) to allow control of charging current or voltage, while Figure 1b shows a typical application with charging voltage and current fixed to specific values for the application. The voltage at ICTL and the value of RS2 set the charging current. The DCDC converter generates the control signals for the external MOSFETs to regulate the voltage and the current set by the VCTL, ICTL, and CELLS inputs. The MAX1772 features a voltage-regulation loop (CCV) and two current-regulation loops (CCI and CCS). The CCV voltage-regulation loop monitors BATT to ensure that its voltage never exceeds the voltage set by VCTL. The CCI battery current-regulation loop monitors current delivered to BATT to ensure that it never exceeds the current limit set by ICTL. A third loop (CCS) takes control and reduces the battery-charging current when the sum of the system load and the battery-charging current exceeds the charging source current limit set by CLS. Setting the Battery Regulation Voltage The MAX1772 uses a high-accuracy voltage regulator for charging voltage. The VCTL input adjusts the battery output voltage. VCTL is allowed to vary from 0 to REFIN ( 3.3V). The per-cell battery termination voltage is a function of the battery chemistry and construction; thus, consult the battery manufacturer to determine this voltage. The battery voltage is calculated by the equation: V V VBATT = CELLS x VREF + REF x VCTL VREFIN 10 (1) CELLS is the programming input for selecting cell count. Table 1 shows how CELLS is connected to charge 2, 3, or 4 cells. Use a voltage-divider from LDO to set the desired voltage at CELLS. The internal error amplifier (GMV) maintains voltage regulation (Figure 2). The voltage error amplifier is compensated at CCV. The component values shown in Figure 1 provide suitable performance for most appli- cations. Individual compensation of the voltage regulation and current-regulation loops allow for optimal compensation. Setting the Charging-Current Limit The ICTL input sets the maximum charging current. The current is set by current-sense resistor RS2, connected between CSIP and CSIN. The nominal differential voltage between CSIP and CSIN is 204mV; thus, for a 0.05 sense resistor, the maximum charging current is 4A. Battery-charging current is programmed with ICTL using the equation: ICHG = VREF V 1 x ICTL x RS2 VREFIN 20 (2) The input range for ICTL is REFIN/32 to REFIN ( 3.3V). The device shuts down if ICTL is forced below REFIN/55 (typical). The current at ICHG is a scaleddown replica of the battery output current being sensed across CSIP and CSIN. When choosing the current-sense resistor, note that the voltage drop across this resistor causes further power loss, reducing efficiency. However, adjusting ICTL to reduce the voltage across the current-sense resistor may degrade accuracy due to the input offset of the current-sense amplifier. The charging current-error amplifier (GMI) is compensated at CCI. A 0.01F capacitor at CCI provides suitable performance for most applications. Setting the Input Current Limit The total input current (from a wall cube or other DC source) is a function of the system supply current and the battery-charging current. The input current regulator limits the source current by reducing the charging current when the input current exceeds the set input current limit. System current will normally fluctuate as portions of the system are powered up or put to sleep. Without input current regulation, the input source must be able to supply the maximum system current and the maximum charger input current. By using the input current limiter, the current capability of the AC wall adapter may be lowered, reducing system cost. The MAX1772 limits the current drawn by the charger when the load current becomes high. The device limits the charging current, so the AC adapter voltage is not loaded down. An internal amplifier compares the voltage between CSSP and CSSN to the voltage at CLS. VCLS can be set by a resistor-divider between REF and GND. Connect CLS to REF for maximum input current limiting. ______________________________________________________________________________________ 11 MAX1772 Detailed Description MAX1772 Low-Cost, Multichemistry BatteryCharger Building Block VIN 8VDC TO 28VDC RS1 0.04 D1 TO EXTERNAL LOAD R14 4.7 C6 O.47F R6 59.0k C1 22F R15 4.7 C7 O.47F D4 CSSP R7 19.6k CSSN CELLS DCIN C5 1F LDO C13 1F R13 33 D3 D/A OUTPUT VCTL BST D/A OUTPUT ICTL DLOV VCC C15 0.1F REFIN R8 1M ACIN DIGITAL INPUT ACOK A/D INPUT ICHG C16 1.0F N1 DHI LX N2 DLO D2 MAX1772 L1 22H PGND R11 1 IINP A/D INPUT C14 0.1F C2 22F R9 15.4k C20 0.1F CSIP R10 12.4k CCV C18 0.1F R5 1k HOST RS2 0.05 C11 0.1F R12 1 C19 0.1F CSIN CCI C9 0.01F C10 0.01F GND REF AVDD/REF R20, R21, R22 10k BATT+ BATT CCS C3 22F CLS C4 22F C12 1F SMART BATTERY SCL SCL SDA SDA A/D INPUT TEMP GND BATT- PGND GND Figure 1a. C-Controlled Typical Application Circuit 12 ______________________________________________________________________________________ Low-Cost, Multichemistry BatteryCharger Building Block RS1 0.04 D1 TO EXTERNAL LOAD R14 4.7 C1 22F R15 4.7 C6 O.47F MAX1772 VIN 8VDC TO 28VDC C2 22F C7 O.47F 3.30V D4 3.30V R21 10k 910 R6 59.0k CSSP R7 19.6k R19 29.4k CSSN CELLS DCIN C5 1F 1.5k LDO C13 1F R13 33 D3 R22 10k R20 10k REFIN BST VCTL DLOV C15 0.1F ICTL R8 1M ACIN C16 1.0F N1 DHI ACOK LX ICHG N2 DLO D2 MAX1772 L1 22H PGND R11 1 IINP C14 0.1F R9 15.4k C20 0.1F CSIP R10 12.4k CCV C18 0.1F R5 1k RS2 0.05 C11 0.1F R12 1 C19 0.1F CSIN CCI C9 0.01F BATT+ BATT CCS C10 0.01F GND REF CLS C3 22F C4 22F BATTERY BATT- C12 1F Figure 1b. Stand-Alone Typical Application Circuit ______________________________________________________________________________________ 13 MAX1772 Low-Cost, Multichemistry BatteryCharger Building Block DCIN LDO 5.4V LINEAR REGULATOR 4.096V REFERENCE REF MAX1772 LOGIC BLOCK GND 1/55 REFIN GND ICTL ACIN SRDY ACOK REF/2 IINP CCS CLS GMS CSSP CSSN LEVEL SHIFTER CSIP CSIN LEVEL SHIFTER ICHG BST LEVEL SHIFTER DRIVER GMI DHI LX 204mV X ----REFIN ICTL CCI BATT LVC DC-DC CONVERTER R1 CELLS CELL SELECT LOGIC DLOV GMV DRIVER DLO CCV PGND VCTL 409mV X ----REFIN VOS Figure 2. Functional Diagram 14 ______________________________________________________________________________________ Low-Cost, Multichemistry BatteryCharger Building Block CELL CELL COUNT VCELLS < 0.20V 2 0.40V < VCELLS < VLDO-0.5V 3 VLDO - 0.25V < VCELLS < VLDO 4 VIINP = ISOURCE x RS1 x GIINP x R10 The input source current is the sum of the device current, the charger input current, and the load current. The device current is minimal (6mA) in comparison to the charge and load currents. The actual source current required is determined as follows: [ ] ISOURCE = ILOAD + (ICHARGE x VBATT ) / (VIN x ) (3) where is the efficiency of the DC-DC converter (85% to 95% typ). V CLS determines the reference voltage of the GMS error amplifier. Sense resistor RS1 sets the maximum allowable source current. Calculate the maximum current as follows: ISOURCE_MAX = VCLS / (20 x RS1) (4) Once the input current limit is reached, the charging current is tapered back until the input current is below the desired threshold. When choosing the current-sense resistor, note that the voltage drop across this resistor causes further power loss, reducing efficiency. AC Adapter Detection Connect the AC adapter voltage through a resistive divider to ACIN to detect when AC power is available, as shown in Figure 1. ACOK is an open-drain output and is high when ACIN is less than REF/2. Current Measurement Use ICHG to monitor the battery-charging current being sensed across CSIP and CSIN. The output voltage range is 0 to 3V. The voltage of ICHG is proportional to the output current by the equation: VICHG = IICHG x RS2 x GICHG x R9 Use IINP to monitor the system input current being sensed across CSSP and CSSN. The output voltage range is 0 to 3V. The voltage of IINP is proportional to the output current by the equation: ( 5) where IICHG is the battery-charging current, GICHG is the transconductance of ICHG (1mS typ), and R9 is the resistor connected between ICHG and ground. (6) where ISOURCE is the DC current being supplied by the AC adapter power, GIINP is the transconductance of IINP (1S typ), and R10 is the resistor connected between IINP and ground. In the typical application circuit, duty cycle affects the accuracy of V IINP (Figure 3). AC load current also affects accuracy (Figure 4). Connect IINP pin to ground if it is not used. LDO Regulator LDO provides a 5.4V supply derived from DCIN and can deliver up to 15mA of current. The MOSFET drivers are powered by DLOV and BST, which must be connected to LDO as shown in Figure 1. LDO also supplies the 4.096V reference (REF) and most of the control circuitry. Bypass LDO with a 1F capacitor. DC-to-DC Converter The MAX1772 employs a buck regulator with a bootstrapped NMOS high-side switch and a low-side NMOS synchronous rectifier. DC-DC Controller The control scheme is a constant off-time variable frequency, cycle-by-cycle current mode. The off-time is constant for a given BATT voltage. It varies with VBATT operation; a maximum on-time of 10ms allows the controller to achieve >99% duty cycle with continuous conduction. Figure 5 shows the controller functional diagram. MOSFET Drivers The low-side driver output DLO swings from 0 to DLOV. DLOV is usually connected through a filter to LDO. The high-side driver output DHI is bootstrapped off LX and swings from V LX to V BST. When the low-side driver turns on, BST rises to one diode voltage below DLOV. Filter DLOV with a resistor-capacitor (RC) circuit whose cutoff frequency is about 50kHz. The configuration in Figure 1 introduces a cutoff frequency of around 48kHz: f = 1/2RC = 1 / (2 33 0.1F) = 48kHz (7) Connect ICHG pin to ground if it is not used. ______________________________________________________________________________________ 15 MAX1772 Table 1. Cell-Count Programming Table MAX1772 Low-Cost, Multichemistry BatteryCharger Building Block 30 0 IINP ACCURACY (%) 20 AC ADAPTER RS1 AC LOAD 2A 1A -1 FREQUENCY MAX1772 IINP ACCURACY (%) VDCIN = 16V VBATT = 8.2V VDCIN = 16V VBATT = 12.3V 10 VDCIN = 18V VBATT = 16.4V -2 FREQ = 50kHz -3 FREQ = 125kHz -4 0 FREQ = 250kHz -5 -6 -10 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 10 20 30 40 50 60 70 80 DUTY CYCLE (%) IRS1 (A) Figure 4. IINP Accuracy vs. AC Load Duty Cycle Figure 3. IINP Accuracy vs. VDCIN/VBATT Dropout Operation MOSFETs and Schottky Diodes The MAX1772 has 99.99% duty-cycle capability with a 10ms maximum on-time and 1s off-time. This allows the charger to achieve dropout performance limited only by resistive losses in the DC-DC converter components (D1, N1, RS1, RS2) (Figure 1). The actual dropout voltage is limited to 100mV between CSSP and CSIN by the power-fail comparator. Schottky diode D1 provides power to the load when the AC adapter is inserted. This diode must be able to deliver the maximum current as set by RS1. The n-channel MOSFETs (N1, N2) are the switching devices for the buck controller. High-side switch N1 should have a current rating of at least 8A and have an on-resistance (RDS(ON)) of 50m or less. The driver for N1 is powered by BST; its current should be less than 10mA. Select a MOSFET with a low total gate charge (QGATE) and determine the required drive current by IGATE = QGATE f (where f is the DC-DC converter's 400kHz maximum switching frequency). The low-side switch (N2) should also have a current rating of at least 8A, have an RDS(ON) of 100m or less, and a total gate charge less than 10nC. N2 is used to provide the starting charge to the BST capacitor (C15). During normal operation, the current is carried by Schottky diode D2. Choose a Schottky diode capable of carrying the maximum charging current. D3 is a signal-level diode, such as the 1N4148. This diode provides the supply current to the high-side MOSFET driver. Compensation Each of the three regulation loops--the input current limit, the charging current limit, and charging voltage limit--can be compensated separately using the CCS, CCI, and CCV pins, respectively. The charge-current-loop error-amp output is brought out at CCI. Likewise, the source current error-amp output is brought out at CCS; 0.01F capacitors to ground at CCI and CCS compensate the current loops in most charger designs. Raising the value of these capacitors reduces the bandwidth of these loops. The voltage-regulating-loop error-amp output is brought out at CCV. Compensate this loop by connecting a series RC network from CCV to GND. Recommended values are 1k and 0.1F. The zero set by the series RC increases midfrequency gain to provide phase compensation. The pole at CCV is set by the capacitor and the voltage error-amp output impedance at low frequencies to integrate the DC error. Component Selection Table 2 lists the recommended components and refers to the circuit of Figure 1. The following sections describe how to select these components. 16 Inductor Selection Inductor L1 provides power to the battery while it is being charged. It must have a saturation current of at least 4A plus 1/2 of the current ripple (IL): ISAT = 4A + (1/2) IL ______________________________________________________________________________________ (8) Low-Cost, Multichemistry BatteryCharger Building Block MAX1772 10ms S RESET CSSP BST IMAX R 4.0V RS1 CSS MAX1772 Q DCIN LDO CSSN BST R Q DHI CCMP DHI CBST LX CHG Q S IMIN 0.25V DLO L1 DLO 1s CSIP ZCMP 0.1V CSI RS2 CSIN GMS LVC BATT COUT BATTERY GMI GMV SETV CONTROL SETI CLS CELL SELECT LOGIC CELLS CCS CCI CCV Figure 5. DC-to-DC Converter Functional Diagram ______________________________________________________________________________________ 17 MAX1772 Low-Cost, Multichemistry BatteryCharger Building Block The controller determines the constant off-time period, which is dependent on BATT voltage. This makes the ripple current independent of input and battery voltage, and it should be kept to less than 1A. Calculate IL with the following equation: IL = 21Vs L(H) Use the following step-by-step guide: 1) Place the high power connections first, with their grounds adjacent: * Minimize the current-sense resistor trace lengths, and ensure accurate current sensing with Kelvin connections. (9) * Minimize ground trace lengths in the high current paths. Higher inductor values decrease the ripple current. Smaller inductor values require high saturation current capabilities and degrade efficiency. Typically, a 22H inductor is ideal for all operating conditions. * Minimize other trace lengths in the high current paths. Current-Sense Input Filtering In normal circuit operation with typical components, the current-sense signals can have high-frequency transients that exceed 0.5V due to large current changes and parasitic component inductance. To achieve proper battery and input current compliance, the currentsense input signals should be filtered to remove large common-mode transients. The input current-limit sensing circuitry is the most sensitive case due to large current steps in the input filter capacitors (C6, C7) in Figure 1. Use 0.47F ceramic capacitors from CSSP and CSSN to ground. Smaller 0.1F ceramic capacitors (C18, C19) can be used on the CSIP and CSIN inputs to ground since the current into the battery is continuous. Place these capacitors next to the single-point ground directly under the MAX1772. Layout and Bypassing Bypass DCIN with a 1F to ground (Figure 1). D4 protects the MAX1772 when the DC power source input is reversed. A signal diode for D4 is adequate because DCIN only powers the LDO and the internal reference. Bypass LDO, BST, DLOV, and other pins as shown in Figure 1. Good PCB layout is required to achieve specified noise, efficiency, and stable performance. The PC board layout artist must be given explicit instructions--preferably, a pencil sketch showing the placement of the power switching components and high current routing. Refer to the PCB layout in the MAX1772 evaluation kit for examples. A ground plane is essential for optimum performance. In most applications, the circuit will be located on a multilayer board, and full use of the four or more copper layers is recommended. Use the top layer for high current connections, the bottom layer for quiet connections (REF, CCV, CCI, CCS, DCIN, and GND), and the inner layers for an uninterrupted ground plane. 18 * Use >5mm wide traces. * Connect C1 and C2 to high-side MOSFET (10mm max length). * LX node (MOSFETs, rectifier cathode, inductor (15mm max length)). Ideally, surface-mount power components are flush against one another with their ground terminals almost touching. These high-current grounds are then connected to each other with a wide, filled zone of top-layer copper, so they do not go through vias. The resulting top-layer subground plane is connected to the normal inner-layer ground plane at the output ground terminals, which ensures that the IC's analog ground is sensing at the supply's output terminals without interference from IR drops and ground noise. Other high current paths should also be minimized, but focusing primarily on short ground and current-sense connections eliminates about 90% of all PCB layout problems. 2) Place the IC and signal components. Keep the main switching node (LX node) away from sensitive analog components (current-sense traces and REF capacitor). Important: the IC must be no further than 10mm from the current-sense resistors. Keep the gate drive traces (DHI, DLO, and BST) shorter than 20mm, and route them away from the current-sense lines and REF. Place ceramic bypass capacitors close to the IC. The bulk capacitors can be placed further away. Place the current-sense input filter capacitors under the part, connected directly to the GND pin. 3) Use a single-point star ground placed directly below the part. Connect the input ground trace, power ground (subground plane), and normal ground to this node. ______________________________________________________________________________________ Low-Cost, Multichemistry BatteryCharger Building Block DESIGNATION C1, C2, C3, C4 C5 C6, C7 DESCRIPTION N1 n-channel MOSFET International Rectifier IRF7805 or Fairchild FDS6680 1F, 50V ceramic capacitor (1210) Murata GRM42-2X7R105K050 N2 n-channel MOSFET Fairchild FDS6612A RS1 0.04 1%, 1W resistor Dale WSL-2512-R040-F or IRC LR2512-01-R040-F RS2 0.05 1%, 1W resistor Dale WSL-2512-R050-F or IRC LR2512-01-R050-F 0.47F, 25V ceramic capacitors (1210) Murata GRM42-2X7R474K050 0.01F ceramic capacitors (0805) C12, C13 1F, 10V ceramic capacitors (0805) Taiyo Yuden LMK212BJ105MG C11, C14, C15, C16, C18, C19, C20 0.1F, 50V ceramic capacitors (0805) Taiyo Yuden UMK212BJ104MG or Murata GRM40-034X7R104M050 D1 Schottky diode (DPAK) STM-Microelectronics STPS8L30B or ON Semiconductor MBRD630CT or Toshiba U5FWK2C42 D3, D4 L1 DESCRIPTION 22F, 35V low-ESR tantalum capacitors AVX TPSE226M035R0300 or Sprague 593D226X0035E2W C9, C10 D2 DESIGNATION R5 1k 5% resistor (0805) R6 59.0k 1% resistor (0805) R7 19.6k 1% resistor (0805) R8 1M 5% resistor (0805) R9 15.4k 1% resistor (0805) R10 12.4k 1% resistor (0805) 30V, 3A Schottky diode Nihon EC31QS03L R11, R12 100mA Schottky diodes (SOT23) Central Semiconductor CMPSH-3 or Hitachi HRB0103A R14, R15 R13 MAX1772 Table 2. Component List 1 5% resistors (0805) 33 5% resistor (1206) 4.7 5% resistors (1206) R19 29.4k 1% resistor (0805) R20, R21, R22 10k 1% resistors (0805) 22H power inductor Sumida CDRH127-220 Package Information Chip Information PROCESS: BiCMOS For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 28 QSOP E28-1 21-0055 ______________________________________________________________________________________ 19 MAX1772 Low-Cost, Multichemistry BatteryCharger Building Block Revision History REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 0 4/07 Initial release -- 4 2/09 Minor edits. 14 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 20 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.