
FX-700 YWWC
Page6
Typical Characteristics - Phase Noise and Gain Curve
Outline Drawing & Pad Layout
Table 5. Pin Out
Pin Symbol Function
1 E/D Enable Disable
2 GND Case and Electrical Ground
3 Output Output
4VDD Power Supply Voltage
Dimensions in mm
Reliability
VI quali cation includes aging at various extreme temperatures, shock and vibration, temperature cycling, and IR refl ow
simulation. The VC-801 family is capable of meeting the following qualifi cation tests:
Table 6. Environmental Compliance
Parameter Conditions
Mechanical Shock MIL-STD-883, Method 2002
Mechanical Vibration MIL-STD-883, Method 2007
Solderability MIL-STD-883, Method 2003
Gross and Fine Leak MIL-STD-883, Method 1014
Resistance to Solvents MIL-STD-883, Method 2015
Moisture Sensitivity Level MSL 1
Contact Pads Gold over Nickel
Table 7. ESD Ratings
Model Minimum Conditions
Human Body Model 1500V MIL-STD-883, Method 3015
Charged Device Model 1000V JESD22-C101
Although ESD protection circuitry has been designed into the VC-801 proper precautions should be taken when handling
and mounting. VI employs a human body model (HBM) and a charged device model (CDM) for ESD susceptibility testing
and design protection evaluation.
Table 8. Absolute Maximum Ratings
Parameter Symbol Ratings Unit
Storage Temperature TS-55 to 125 °C
Soldering Temp/Time TLS 260 / 30 °C / sec
Stresses in excess of the absolute maximum ratings can permanently damage the device. Functional operation is not
implied at these or any other conditions in excess of conditions represented in the operational sections of this datasheet.
Exposure to absolute maximum ratings for extended periods may adversely aff ect device reliability. Permanent damage is
also possible if E/D is applied before VDD.
2.54
1.4
1.2 2.2
V NNMNNN
. YYWW C
All dimensions in mm