Agilent HSMx-C1xx High Performance Chip LED Data Sheet HSMQ-C110, HSMQ-C150,HSMQ-C170, HSMQ-C190, HSMQ-C191, HSMR-C110, HSMR-C150, HSMR-C170, HSMR-C190, HSMR-C191 Description These small chip-type LEDs utilize high efficient and high brightness InGaN material to deliver competitively priced high performance blue and green. These 520 nm green and 470 nm blue are unique hues which provide color differentiation to a product. These ChipLEDs come in either top emitting packages (HSMx-C170, C190, C191, and C150) or in a side emitting package (HSMx-C110). The side emitting package is especially suitable for LCD backlighting application. The top emitting packages, with their wide viewing angle, are suitable for direct backlighting application or being used with light pipes. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel with 4000 units per reel for HSMx-C170, C190, and C191 packages, and 3000 units per reel for HSMx-C110 and C150 packages. All packages are compatible with IR soldering and binned by both color and intensity. Features * High brightness * Small size * Industrial standard footprint * Diffused optics * Top emitting or right angle emitting * Compatible with IR soldering * Compatible for use with light piping * Available in 8 mm tape on 7" diameter reel * Reel sealed in zip locked moisture barrier bags Applications * LCD backlighting * Push button backlighting * Front panel indicator * Symbol indicator * Microdisplays * Small message panel signage CAUTION: HSMQ-C1xx and HSMR-C1xx are Class 1 ESD sensitive per MIL-STD-1686. Please observe appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK LED DIE CATHODE MARK LED DIE 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 0.62 (0.024) 3.2 (0.126 ) 2.0 (0.079 ) POLARITY CLEAR EPOXY 1.5 (0.059) 1.4 (0.055) DIFFUSED EPOXY POLARITY 0.3 (0.012) PC BOARD PC BOARD 0.5 (0.020) 0.8 (0.031) 1.6 (0.063 ) 0.3 (0.012) CATHODE LINE 3.2 (0.126 ) 0.4 0.15 (0.016 0.006) 3.2 (0.126 ) 0.4 0.15 (0.016 0.006) 0.9 (0.035) 1.0 (0.039) SOLDERING TERMINAL CATHODE LINE SOLDERING TERMINAL HSMx-C110 HSMx-C170 CATHODE MARK LED DIE CATHODE MARK LED DIE 0.8 (0.031) 0.8 (0.031) 0.4 (0.016) 1.6 (0.063 ) 1.0 (0.039) 0.4 (0.016) 1.6 (0.063 ) 1.0 (0.039) POLARITY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY DIFFUSED EPOXY POLARITY PC BOARD PC BOARD 0.6 (0.023) 0.3 (0.012) 0.8 (0.031) 0.3 (0.012) CATHODE LINE CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 HSMx-C191 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 0.7 (0.028) MIN. Package Dimensions, continued CATHODE MARK LED DIE 1.6 (0.063) 0.8 (0.031) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) PC BOARD CATHODE LINE 0.5 (0.020) 0.50 0.20 (0.020 0.008) 0.50 0.20 (0.020 0.008) NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. SOLDERING TERMINAL HSMx-C150 Device Selection Guide Package Dimension (mm) [1], [2] Ingan Green Ingan Blue Package Description 1.6 (L) x 0.8 (W) x 0.6 (H) HSMQ-C191 HSMR-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.8 (H) HSMQ-C190 HSMR-C190 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.8 (H) HSMQ-C170 HSMR-C170 Untinted, Diffused 3.2 (L) x 1.0 (W) x 1.5 (H) HSMQ-C110 HSMR-C110 Untinted, Nondiffused 3.2 (L) x 1.6 (W) x 1.1 (H) HSMQ-C150 HSMR-C150 Untinted, Diffused Notes: 1. Dimensions in mm. 2. Tolerance 0.1 mm unless otherwise noted. Absolute Maximum Ratings at TA = 25C Parameter HSMQ-C110/C170/C190/C191/C150 HSMR-C110/C170/C190/C191/C150 Units DC Forward Current [1] 25 mA Power Dissipation 98 mW Reverse Voltage (IR = 100 A) 5 V LED Junction Temperature 95 C Operating Temperature Range -30 to +85 C Storage Temperature Range -40 to +85 C Soldering Temperature See IR soldering profile (Figure 7) Note: 1. Derate linearly as shown in Figure 4. 3 Electrical Characteristics at TA = 25C Part Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 A Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RJ-PIN (C/W) Typ. HSMQ-C110/C150 3.4 3.9 5 140 450 HSMR-C110/C150 3.4 3.9 5 140 450 HSMQ-C170/C190/C191 3.4 3.9 5 110 300 HSMR-C170/C190/C191 3.4 3.9 5 110 300 VF Tolerance: 0.1 V Optical Characteristics at TA = 25C Part Number Color Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength peak (nm) Typ. Color, Dominant Wavelength d[2] (nm) Typ. Viewing Angle 2 1/2 Degrees [3] Typ. Luminous Efficacy V (lm/w) Typ. HSMQ-C110 Green 40 150 520 527 130 500 HSMQ-C150/C170/ C190/C191 Green 40 145 520 527 140 500 HSMR-C110 Blue 16 60 469 473 130 88 HSMR-C150/C170/ C190/C191 Blue 16 55 469 473 140 88 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits [1] Blue Color Bins[1] Bin ID A B C D Dom. Wavelength (nm) Min. Max. 460.0 465.0 465.0 470.0 470.0 475.0 475.0 480.0 Tolerance: 1 nm InGaN Green Color Bins[1] Bin ID A B C D Dom. Wavelength (nm) Min. Max. 515.0 520.0 520.0 525.0 525.0 530.0 530.0 535.0 Tolerance: 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 4 Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 Bin ID N P Q R S T U V W X Y Tolerance: 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 100 RELATIVE INTENSITY - % 90 BLUE 80 GREEN 70 60 50 40 30 20 10 0 400 600 500 700 WAVELENGTH - nm 1.2 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF - FORWARD CURRENT - mA 100 10 BLUE 1 0.1 GREEN 0.8 0.6 BLUE 0.4 GREEN 0.2 0 2.0 2.5 3.0 3.5 4.0 VF - FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage. 5 1.0 0 5 10 15 20 IF - FORWARD CURRENT - mA Figure 3. Luminous intensity vs. forward current. 25 IF MAX - MAXIMUM FORWARD CURRENT - mA Figure 1. Relative intensity vs. wavelength. 30 25 20 15 RJ-A = 600C/W 10 RJ-A = 500C/W 5 0 0 10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C Figure 4. Maximum forward current vs. ambient temperature. RELATIVE INTENSITY - % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 50 70 90 30 50 70 90 ANGLE RELATIVE INTENSITY - % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 100 80 70 10 SEC. MAX. 60 TEMPERATURE RELATIVE INTENSITY - % 90 50 40 30 20 230C MAX. 4C/SEC. MAX. 140-160C -3C/SEC. MAX. 4C/SEC. MAX. 10 OVER 2 MIN. 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 TIME 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. 5.0 (0.200) Figure 7. Recommended reflow soldering profile. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 0.9 (0.035) 0.9 (0.035) 1.2 (0.047) 1.0 (0.039) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 8. Recommended soldering pattern for HSMx-C110. 6 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 9. Recommended soldering pattern for HSMx-C170. 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) USER FEED DIRECTION Figure 10. Recommended soldering pattern for HSMx-C190 and HSMx-C191. CATHODE SIDE 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) PRINTED LABEL 1.5 (0.059) Figure 11. Recommended soldering pattern for HSMx-C150. Figure 12. Reeling orientation. 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 20.20 MIN. (O 0.795 MIN.) O 13.1 0.5 (O 0.516 0.020) 3.0 0.5 (0.118 0.020) 59.60 1.00 (2.346 0.039) 178.40 1.00 (7.024 0.039) 4.0 0.5 (0.157 0.020) Figure 13. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 7 6 PS 5.0 0.5 (0.197 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C110 POSITION IN CARRIER TAPE DIM. A DIM. B DIM. C 0.10 ( 0.004) 0.10 ( 0.004) 0.10 ( 0.004) PART NUMBER DIM. A (SEE TABLE 1) HSMx-C191 SERIES 1.80 (0.071) 0.95 (0.037) 0.75 (0.030) HSMx-C190 SERIES 1.80 (0.071) 0.95 (0.037) 0.87 (0.034) HSMx-C170 SERIES HSMx-C110 SERIES 2.40 (0.094) 3.40 (0.134) 1.60 (0.063) 1.70 (0.067) 1.20 (0.047) 1.20 (0.047) HSMx-C150 SERIES 3.75 (0.148) 2.10 (0.083) 1.30 (0.051) R 1.0 0.05 (0.039 0.002) DIM. B (SEE TABLE 1) Figure 14. Tape dimensions. END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 15. Tape leader and trailer dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. For product information and a complete list of Agilent contacts and distributors, please go to our web site. www.agilent.com/semiconductors E-mail: SemiconductorSupport@agilent.com Data subject to change. Copyright (c) 2002 Agilent Technologies, Inc. Obsoletes 5988-1649EN April 6, 2002 5988-4832EN MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been open for more than 1 week Baking recommended condition: 60 5C for 20 hours.