Features
• High brightness
• Small size
• Industrial standard footprint
• Diffused optics
• Top emitting or right angle
emitting
• Compatible with IR soldering
• Compatible for use with light
piping
• Available in 8 mm tape on
7" diameter reel
• Reel sealed in zip locked moisture
barrier bags
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
Description
These small chip-type LEDs utilize
high efficient and high brightness
InGaN material to deliver
competitively priced high
performance blue and green. These
520 nm green and 470 nm blue are
unique hues which provide color
differentiation to a product.
These ChipLEDs come in either top
emitting packages (HSMx-C170,
C190, C191, and C150) or in a side
emitting package (HSMx-C110).
The side emitting package is
especially suitable for LCD
backlighting application. The top
emitting packages, with their wide
viewing angle, are suitable for
direct backlighting application or
being used with light pipes. In
order to facilitate pick and place
operation, these ChipLEDs are
shipped in tape and reel with 4000
units per reel for HSMx-C170,
C190, and C191 packages, and
3000 units per reel for
HSMx-C110 and C150 packages.
All packages are compatible with
IR soldering and binned by both
color and intensity.
Agilent HSMx-C1xx
High Performance Chip LED
Data Sheet
HSMQ-C110, HSMQ-C150,HSMQ-C170, HSMQ-C190,
HSMQ-C191, HSMR-C110, HSMR-C150, HSMR-C170,
HSMR-C190, HSMR-C191
CAUTION: HSMQ-C1xx and HSMR-C1xx are Class 1 ESD sensitive per MIL-STD-1686. Please observe
appropriate precautions during handling and processing. Refer to Agilent Technologies Application Note
AN-1142 for additional details.
2
Package Dimensions
3.2 (0.126 )
0.5 (0.020)
0.9 (0.035)
POLARITY
CATHODE
MARK
1.5 (0.059)
LED DIE
CLEAR
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.0 (0.039)
1.0 (0.039)
2.6 (0.102 )
1.6 (0.063 )
CATHODE LINE
HSMx-C110
3.2 (0.126 )
3.2 (0.126 )
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2.0 (0.079 )
0.3 (0.012)
0.4 ± 0.15
(0.016 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
1.4
(0.055)
0.62 (0.024)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.25 (0.049)
HSMx-C170
CATHODE LINE
HSMx-C190
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.8 (0.031)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
0.7 (0.028) MIN.
CATHODE LINE
HSMx-C191
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.6 (0.023)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
0.4 (0.016)
LED DIE
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
3
Package Dimensions, continued
Absolute Maximum Ratings at TA = 25˚C
HSMQ-C110/C170/C190/C191/C150
Parameter HSMR-C110/C170/C190/C191/C150 Units
DC Forward Current [1] 25 mA
Power Dissipation 98 mW
Reverse Voltage (IR = 100 µA) 5 V
LED Junction Temperature 95 ˚C
Operating Temperature Range –30 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See IR soldering profile (Figure 7)
Device Selection Guide
Package Dimension (mm) [1], [2] Ingan Green Ingan Blue Package Description
1.6 (L) x 0.8 (W) x 0.6 (H) HSMQ-C191 HSMR-C191 Untinted, Diffused
1.6 (L) x 0.8 (W) x 0.8 (H) HSMQ-C190 HSMR-C190 Untinted, Diffused
2.0 (L) x 1.25 (W) x 0.8 (H) HSMQ-C170 HSMR-C170 Untinted, Diffused
3.2 (L) x 1.0 (W) x 1.5 (H) HSMQ-C110 HSMR-C110 Untinted, Nondiffused
3.2 (L) x 1.6 (W) x 1.1 (H) HSMQ-C150 HSMR-C150 Untinted, Diffused
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Note:
1. Derate linearly as shown in Figure 4.
HSMx-C150
3.2 (0.126 )
0.5 (0.020)
0.50 ± 0.20
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.20
(0.020 ± 0.008)
2.0 (0.079)
0.8 (0.031)
LED DIE
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
CATHODE LINE
4
Optical Characteristics at TA = 25˚C
Luminous Color, Viewing Luminous
Intensity Peak Dominant Angle Efficacy
IV (mcd) Wavelength Wavelength 2 θ1/2 ηV
@ 20 mA[1] λpeak (nm) λd[2] (nm) Degrees[3] (lm/w)
Part Number Color Min. Typ. Typ. Typ. Typ. Typ.
HSMQ-C110 Green 40 150 520 527 130 500
HSMQ-C150/C170/ Green 40 145 520 527 140 500
C190/C191
HSMR-C110 Blue 16 60 469 473 130 88
HSMR-C150/C170/ Blue 16 55 469 473 140 88
C190/C191
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at TA = 25˚C
Forward Voltage Reverse Breakdown Capacitance C Thermal
VF (Volts) VR (Volts) (pF), VF = 0, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ–PIN (˚C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSMQ-C110/C150 3.4 3.9 5 140 450
HSMR-C110/C150 3.4 3.9 5 140 450
HSMQ-C170/C190/C191 3.4 3.9 5 110 300
HSMR-C170/C190/C191 3.4 3.9 5 110 300
VF Tolerance: ±0.1 V
Blue Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 460.0 465.0
B 465.0 470.0
C 470.0 475.0
D 475.0 480.0
Note:
1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent
representative for information on currently available bins.
Color Bin Limits[1]
InGaN Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 515.0 520.0
B 520.0 525.0
C 525.0 530.0
D 530.0 535.0
Tolerance: ±1 nm
Tolerance: ±1 nm
5
Figure 1. Relative intensity vs. wavelength.
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd) Intensity (mcd)
Bin ID Min. Max. Bin ID Min. Max.
A 0.11 0.18 N 28.50 45.00
B 0.18 0.29 P 45.00 71.50
C 0.29 0.45 Q 71.50 112.50
D 0.45 0.72 R 112.50 180.00
E 0.72 1.10 S 180.00 285.00
F 1.10 1.80 T 285.00 450.00
G 1.80 2.80 U 450.00 715.00
H 2.80 4.50 V 715.00 1125.00
J 4.50 7.20 W 1125.00 1800.00
K 7.20 11.20 X 1800.00 2850.00
L 11.20 18.00 Y 2850.00 4500.00
M 18.00 28.50
Tolerance: ±15%
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs.
ambient temperature.
100
10
1
0.12.0 2.5 3.0 3.5 4.0
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
GREENBLUE
05 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.2
0.8
10 25
1.2
GREEN
BLUE
0
020 60 80 90
5
IF MAX – MAXIMUM FORWARD CURRENT – mA
TA – AMBIENT TEMPERATURE – °C
40
15
30
10
20
RθJ-A = 600°C/W
RθJ-A = 500°C/W
25
10 30 50 70
WAVELENGTH – nm
RELATIVE INTENSITY – %
100
50
0600 700
BLUE GREEN
500400
90
80
70
60
40
30
20
10
6
Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. Figure 7. Recommended reflow soldering profile.
Figure 8. Recommended soldering pattern for HSMx-C110. Figure 9. Recommended soldering pattern for HSMx-C170.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
5.0 (0.200)
1.0 (0.039)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC. MAX.
Figure 5. Relative intensity vs. angle for HSMx-C110.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
20
40
-70 -50 -30 30 50 70 90-90 -10 10
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
20
40
-70 -50 -30 30 50 70 90-90 -10 10
7
Figure 12. Reeling orientation.
Figure 13. Reel dimensions.
Figure 11. Recommended soldering pattern
for HSMx-C150.
1.5 (0.059)
1.5
(0.059) 1.5
(0.059)
2.0
(0.079)
CATHODE SIDE
USER FEED DIRECTION
PRINTED LABEL
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS
178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
Figure 10. Recommended soldering pattern
for HSMx-C190 and HSMx-C191.
0.8 (0.031)
0.8
(0.031) 0.7
(0.028)
0.8
(0.031)
Figure 14. Tape dimensions.
Figure 15. Tape leader and trailer dimensions.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (± 0.004) DIM. B
± 0.10 (± 0.004)PART NUMBER DIM. C
± 0.10 (± 0.004)
HSMx-C170 SERIES 2.40 (0.094) 1.60 (0.063) 1.20 (0.047)
HSMx-C190 SERIES 1.80 (0.071) 0.95 (0.037) 0.87 (0.034)
HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)
HSMx-C191 SERIES 1.80 (0.071) 0.95 (0.037) 0.75 (0.030)
HSMx-C150 SERIES 3.75 (0.148) 2.10 (0.083) 1.30 (0.051)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)
www.agilent.com/semiconductors
E-mail: SemiconductorSupport@agilent.com
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-1649EN
April 6, 2002
5988-4832EN
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