MSP430 Hardware Tools
User's Guide
Literature Number: SLAU278V
May 2009–Revised May 2015
Contents
Preface ........................................................................................................................................ 9
1 Get Started Now!................................................................................................................ 13
1.1 Flash Emulation Tool (FET) Overview................................................................................... 14
1.2 Kit Contents, MSP-FET430PIF........................................................................................... 15
1.3 Kit Contents, eZ430-F2013 ............................................................................................... 15
1.4 Kit Contents, eZ430-T2012 ............................................................................................... 15
1.5 Kit Contents, eZ430-RF2500 ............................................................................................. 15
1.6 Kit Contents, eZ430-RF2500T............................................................................................ 15
1.7 Kit Contents, eZ430-RF2500-SEH....................................................................................... 15
1.8 Kit Contents, eZ430-Chronos-xxx........................................................................................ 16
1.9 Kit Contents, MSP-FET430UIF........................................................................................... 16
1.10 Kit Contents, MSP-FET.................................................................................................... 16
1.11 Kit Contents, MSP-FET430xx ............................................................................................ 16
1.12 Kit Contents, FET430F6137RF900 ...................................................................................... 17
1.13 Kit Contents, MSP-TS430xx.............................................................................................. 17
1.14 Kit Contents, EM430Fx1x7RF900 ....................................................................................... 19
1.15 Hardware Installation, MSP-FET430PIF ................................................................................ 19
1.16 Hardware Installation, MSP-FET430UIF ................................................................................ 20
1.17 Hardware Installation, MSP-FET......................................................................................... 20
1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529.......... 20
1.19 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900....... 21
1.20 Important MSP430 Documents on the Web............................................................................ 22
2 Design Considerations for In-Circuit Programming ................................................................ 24
2.1 Signal Connections for In-System Programming and Debugging ................................................... 25
2.2 External Power ............................................................................................................. 29
2.3 Bootstrap Loader (BSL) ................................................................................................... 29
A Frequently Asked Questions and Known Issues .................................................................... 31
A.1 Hardware FAQs ............................................................................................................ 32
A.2 Known Issues............................................................................................................... 34
B Hardware........................................................................................................................... 36
B.1 MSP-TS430D8.............................................................................................................. 38
B.2 MSP-TS430PW14.......................................................................................................... 41
B.3 MSP-TS430L092........................................................................................................... 44
B.4 MSP-TS430L092 Active Cable........................................................................................... 47
B.5 MSP-TS430PW24.......................................................................................................... 50
B.6 MSP-TS430DW28.......................................................................................................... 53
B.7 MSP-TS430PW28.......................................................................................................... 56
B.8 MSP-TS430PW28A........................................................................................................ 59
B.9 MSP-TS430RHB32A....................................................................................................... 62
B.10 MSP-TS430DA38 .......................................................................................................... 65
B.11 MSP-TS430QFN23x0...................................................................................................... 68
B.12 MSP-TS430RSB40......................................................................................................... 71
B.13 MSP-TS430RHA40A....................................................................................................... 74
B.14 MSP-TS430DL48........................................................................................................... 77
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B.15 MSP-TS430RGZ48B....................................................................................................... 80
B.16 MSP-TS430RGZ48C ...................................................................................................... 83
B.17 MSP-TS430PM64.......................................................................................................... 86
B.18 MSP-TS430PM64A ........................................................................................................ 89
B.19 MSP-TS430PM64D........................................................................................................ 92
B.20 MSP-TS430PM64F ........................................................................................................ 95
B.21 MSP-TS430RGC64B ...................................................................................................... 98
B.22 MSP-TS430RGC64C..................................................................................................... 101
B.23 MSP-TS430RGC64USB................................................................................................. 105
B.24 MSP-TS430PN80......................................................................................................... 109
B.25 MSP-TS430PN80A....................................................................................................... 112
B.26 MSP-TS430PN80USB ................................................................................................... 115
B.27 MSP-TS430PZ100........................................................................................................ 119
B.28 MSP-TS430PZ100A...................................................................................................... 122
B.29 MSP-TS430PZ100B...................................................................................................... 125
B.30 MSP-TS430PZ100C...................................................................................................... 128
B.31 MSP-TS430PZ100D...................................................................................................... 131
B.32 MSP-TS430PZ5x100..................................................................................................... 134
B.33 MSP-TS430PZ100USB.................................................................................................. 137
B.34 MSP-TS430PZ100AUSB ................................................................................................ 141
B.35 MSP-TS430PEU128...................................................................................................... 145
B.36 EM430F5137RF900...................................................................................................... 148
B.37 EM430F6137RF900...................................................................................................... 152
B.38 EM430F6147RF900...................................................................................................... 156
B.39 MSP-FET .................................................................................................................. 160
B.39.1 Features ......................................................................................................... 160
B.39.2 Release Notes .................................................................................................. 160
B.39.3 Schematics...................................................................................................... 163
B.39.4 Layout............................................................................................................ 168
B.39.5 LED Signals..................................................................................................... 168
B.39.6 JTAG Target Connector ....................................................................................... 169
B.39.7 Specifications ................................................................................................... 171
B.39.8 MSP-FET Revision History.................................................................................... 171
B.40 MSP-FET430PIF.......................................................................................................... 172
B.41 MSP-FET430UIF.......................................................................................................... 174
B.41.1 MSP-FET430UIF Revision History........................................................................... 179
C Hardware Installation Guide............................................................................................... 181
C.1 Hardware Installation..................................................................................................... 182
Revision History........................................................................................................................ 188
3
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List of Figures
2-1. Signal Connections for 4-Wire JTAG Communication................................................................. 26
2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,
MSP430G2xx, and MSP430F4xx Devices.............................................................................. 27
2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and
MSP430F6xx Devices ..................................................................................................... 28
B-1. MSP-TS430D8 Target Socket Module, Schematic .................................................................... 38
B-2. MSP-TS430D8 Target Socket Module, PCB ........................................................................... 39
B-3. MSP-TS430PW14 Target Socket Module, Schematic ................................................................ 41
B-4. MSP-TS430PW14 Target Socket Module, PCB ....................................................................... 42
B-5. MSP-TS430L092 Target Socket Module, Schematic.................................................................. 44
B-6. MSP-TS430L092 Target Socket Module, PCB......................................................................... 45
B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic.................................................. 47
B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB......................................................... 48
B-9. MSP-TS430PW24 Target Socket Module, Schematic ................................................................ 50
B-10. MSP-TS430PW24 Target Socket Module, PCB ....................................................................... 51
B-11. MSP-TS430DW28 Target Socket Module, Schematic ................................................................ 53
B-12. MSP-TS430DW28 Target Socket Module, PCB ....................................................................... 54
B-13. MSP-TS430PW28 Target Socket Module, Schematic ................................................................ 56
B-14. MSP-TS430PW28 Target Socket Module, PCB ....................................................................... 57
B-15. MSP-TS430PW28A Target Socket Module, Schematic .............................................................. 59
B-16. MSP-TS430PW28A Target Socket Module, PCB (Red).............................................................. 60
B-17. MSP-TS430RHB32A Target Socket Module, Schematic ............................................................. 62
B-18. MSP-TS430RHB32A Target Socket Module, PCB .................................................................... 63
B-19. MSP-TS430DA38 Target Socket Module, Schematic................................................................. 65
B-20. MSP-TS430DA38 Target Socket Module, PCB........................................................................ 66
B-21. MSP-TS430QFN23x0 Target Socket Module, Schematic............................................................ 68
B-22. MSP-TS430QFN23x0 Target Socket Module, PCB ................................................................... 69
B-23. MSP-TS430RSB40 Target Socket Module, Schematic............................................................... 71
B-24. MSP-TS430RSB40 Target Socket Module, PCB...................................................................... 72
B-25. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................. 74
B-26. MSP-TS430RHA40A Target Socket Module, PCB .................................................................... 75
B-27. MSP-TS430DL48 Target Socket Module, Schematic ................................................................. 77
B-28. MSP-TS430DL48 Target Socket Module, PCB ........................................................................ 78
B-29. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................. 80
B-30. MSP-TS430RGZ48B Target Socket Module, PCB .................................................................... 81
B-31. MSP-TS430RGZ48C Target Socket Module, Schematic............................................................. 83
B-32. MSP-TS430RGZ48C Target Socket Module, PCB.................................................................... 84
B-33. MSP-TS430PM64 Target Socket Module, Schematic................................................................. 86
B-34. MSP-TS430PM64 Target Socket Module, PCB........................................................................ 87
B-35. MSP-TS430PM64A Target Socket Module, Schematic............................................................... 89
B-36. MSP-TS430PM64A Target Socket Module, PCB...................................................................... 90
B-37. MSP-TS430PM64D Target Socket Module, Schematic............................................................... 92
B-38. MSP-TS430PM64D Target Socket Module, PCB...................................................................... 93
B-39. MSP-TS430PM64F Target Socket Module, Schematic............................................................... 95
B-40. MSP-TS430PM64F Target Socket Module, PCB...................................................................... 96
B-41. MSP-TS430RGC64B Target Socket Module, Schematic............................................................. 98
B-42. MSP-TS430RGC64B Target Socket Module, PCB.................................................................... 99
B-43. MSP-TS430RGC64C Target Socket Module, Schematic ........................................................... 102
4List of Figures SLAU278V–May 2009–Revised May 2015
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B-44. MSP-TS430RGC64C Target Socket Module, PCB .................................................................. 103
B-45. MSP-TS430RGC64USB Target Socket Module, Schematic........................................................ 105
B-46. MSP-TS430RGC64USB Target Socket Module, PCB............................................................... 106
B-47. MSP-TS430PN80 Target Socket Module, Schematic ............................................................... 109
B-48. MSP-TS430PN80 Target Socket Module, PCB ...................................................................... 110
B-49. MSP-TS430PN80A Target Socket Module, Schematic.............................................................. 112
B-50. MSP-TS430PN80A Target Socket Module, PCB..................................................................... 113
B-51. MSP-TS430PN80USB Target Socket Module, Schematic.......................................................... 115
B-52. MSP-TS430PN80USB Target Socket Module, PCB................................................................. 116
B-53. MSP-TS430PZ100 Target Socket Module, Schematic .............................................................. 119
B-54. MSP-TS430PZ100 Target Socket Module, PCB ..................................................................... 120
B-55. MSP-TS430PZ100A Target Socket Module, Schematic ............................................................ 122
B-56. MSP-TS430PZ100A Target Socket Module, PCB ................................................................... 123
B-57. MSP-TS430PZ100B Target Socket Module, Schematic ............................................................ 125
B-58. MSP-TS430PZ100B Target Socket Module, PCB ................................................................... 126
B-59. MSP-TS430PZ100C Target Socket Module, Schematic ............................................................ 128
B-60. MSP-TS430PZ100C Target Socket Module, PCB ................................................................... 129
B-61. MSP-TS430PZ100D Target Socket Module, Schematic ............................................................ 131
B-62. MSP-TS430PZ100D Target Socket Module, PCB ................................................................... 132
B-63. MSP-TS430PZ5x100 Target Socket Module, Schematic ........................................................... 134
B-64. MSP-TS430PZ5x100 Target Socket Module, PCB .................................................................. 135
B-65. MSP-TS430PZ100USB Target Socket Module, Schematic......................................................... 137
B-66. MSP-TS430PZ100USB Target Socket Module, PCB................................................................ 138
B-67. MSP-TS430PZ100AUSB Target Socket Module, Schematic....................................................... 141
B-68. MSP-TS430PZ100AUSB Target Socket Module, PCB.............................................................. 142
B-69. MSP-TS430PEU128 Target Socket Module, Schematic............................................................ 145
B-70. MSP-TS430PEU128 Target Socket Module, PCB ................................................................... 146
B-71. EM430F5137RF900 Target Board, Schematic ....................................................................... 148
B-72. EM430F5137RF900 Target board, PCB............................................................................... 149
B-73. EM430F6137RF900 Target Board, Schematic ....................................................................... 152
B-74. EM430F6137RF900 Target Board, PCB .............................................................................. 153
B-75. EM430F6147RF900 Target Board, Schematic ....................................................................... 156
B-76. EM430F6147RF900 Target Board, PCB .............................................................................. 157
B-77. MSP-FET Top View ...................................................................................................... 161
B-78. MSP-FET Bottom View .................................................................................................. 161
B-79. MSP-FET USB Debugger, Schematic (1 of 5)........................................................................ 163
B-80. MSP-FET USB Debugger, Schematic (2 of 5)........................................................................ 164
B-81. MSP-FET USB Debugger, Schematic (3 of 5)........................................................................ 165
B-82. MSP-FET USB Debugger, Schematic (4 of 5)........................................................................ 166
B-83. MSP-FET USB Debugger, Schematic (5 of 5)........................................................................ 167
B-84. MSP-FET USB Debugger, PCB (Top)................................................................................. 168
B-85. MSP-FET USB Debugger, PCB (Bottom) ............................................................................. 168
B-86. JTAG Connector Pinout.................................................................................................. 169
B-87. Pin States After Power-Up............................................................................................... 170
B-88. MSP-FET430PIF FET Interface Module, Schematic................................................................. 172
B-89. MSP-FET430PIF FET Interface Module, PCB........................................................................ 173
B-90. MSP-FET430UIF USB Interface, Schematic (1 of 4) ................................................................ 174
B-91. MSP-FET430UIF USB Interface, Schematic (2 of 4) ................................................................ 175
B-92. MSP-FET430UIF USB Interface, Schematic (3 of 4) ................................................................ 176
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B-93. MSP-FET430UIF USB Interface, Schematic (4 of 4) ................................................................ 177
B-94. MSP-FET430UIF USB Interface, PCB................................................................................. 178
C-1. Windows XP Hardware Wizard ......................................................................................... 182
C-2. Windows XP Driver Location Selection Folder........................................................................ 183
C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010 ................................... 184
C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430..................................... 185
C-5. Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432 .................................... 186
6List of Figures SLAU278V–May 2009–Revised May 2015
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List of Tables
1-1. Flash Emulation Tool (FET) Features and Device Compatibility..................................................... 14
1-2. Individual Kit Contents, MSP-TS430xx.................................................................................. 17
B-1. MSP-TS430D8 Bill of Materials .......................................................................................... 40
B-2. MSP-TS430PW14 Bill of Materials....................................................................................... 43
B-3. MSP-TS430L092 Bill of Materials........................................................................................ 46
B-4. MSP-TS430L092 JP1 Settings........................................................................................... 48
B-5. MSP-TS430L092 Active Cable Bill of Materials........................................................................ 49
B-6. MSP-TS430PW24 Bill of Materials....................................................................................... 52
B-7. MSP-TS430DW28 Bill of Materials ...................................................................................... 55
B-8. MSP-TS430PW28 Bill of Materials ...................................................................................... 58
B-9. MSP-TS430PW28A Bill of Materials..................................................................................... 61
B-10. MSP-TS430RHB32A Bill of Materials ................................................................................... 64
B-11. MSP-TS430DA38 Bill of Materials....................................................................................... 67
B-12. MSP-TS430QFN23x0 Bill of Materials .................................................................................. 70
B-13. MSP-TS430RSB40 Bill of Materials ..................................................................................... 73
B-14. MSP-TS430RHA40A Bill of Materials ................................................................................... 76
B-15. MSP-TS430DL48 Bill of Materials ....................................................................................... 79
B-16. MSP-TS430RGZ48B Bill of Materials ................................................................................... 82
B-17. MSP-TS430RGZ48C Bill of Materials ................................................................................... 85
B-18. MSP-TS430PM64 Bill of Materials....................................................................................... 88
B-19. MSP-TS430PM64A Bill of Materials..................................................................................... 91
B-20. MSP-TS430PM64D Bill of Materials..................................................................................... 94
B-21. MSP-TS430PM64F Bill of Materials (BOM) ............................................................................ 97
B-22. MSP-TS430RGC64B Bill of Materials.................................................................................. 100
B-23. MSP-TS430RGC64C Bill of Materials ................................................................................. 104
B-24. MSP-TS430RGC64USB Bill of Materials.............................................................................. 107
B-25. MSP-TS430PN80 Bill of Materials...................................................................................... 111
B-26. MSP-TS430PN80A Bill of Materials.................................................................................... 114
B-27. MSP-TS430PN80USB Bill of Materials................................................................................ 117
B-28. MSP-TS430PZ100 Bill of Materials .................................................................................... 121
B-29. MSP-TS430PZ100A Bill of Materials................................................................................... 124
B-30. MSP-TS430PZ100B Bill of Materials................................................................................... 127
B-31. MSP-TS430PZ100C Bill of Materials .................................................................................. 130
B-32. MSP-TS430PZ100D Bill of Materials .................................................................................. 133
B-33. MSP-TS430PZ5x100 Bill of Materials.................................................................................. 136
B-34. MSP-TS430PZ100USB Bill of Materials............................................................................... 139
B-35. MSP-TS430PZ100AUSB Bill of Materials............................................................................. 143
B-36. MSP-TS430PEU128 Bill of Materials .................................................................................. 147
B-37. EM430F5137RF900 Bill of Materials................................................................................... 150
B-38. EM430F6137RF900 Bill of Materials................................................................................... 154
B-39. EM430F6147RF900 Bill of Materials................................................................................... 158
B-40. UART Backchannel Implementation ................................................................................... 160
B-41. UART Backchannel Activation Commands............................................................................ 161
B-42. MSP Target BSL Activation Commands............................................................................... 162
B-43. MSP-FET LED Signals................................................................................................... 168
B-44. JTAG Connector Pin State by Operating Mode ...................................................................... 169
B-45. Specifications.............................................................................................................. 171
7
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B-46. MSP-FET Revision History.............................................................................................. 171
C-1. USB VIDs and PIDs Used in MSP430 Tools.......................................................................... 182
8List of Tables SLAU278V–May 2009–Revised May 2015
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Preface
SLAU278V–May 2009–Revised May 2015
Read This First
About This Manual
This manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET).
The FET is the program development tool for the MSP430™ ultra-low-power microcontroller. Both
available interface types, the parallel port interface and the USB interface, are described.
How to Use This Manual
Read and follow the instructions in Chapter 1. This chapter lists the contents of the FET, provides
instructions on installing the hardware and according software drivers. After you see how quick and easy it
is to use the development tools, TI recommends that you read all of this manual.
This manual describes the setup and operation of the FET but does not fully describe the MSP430™
microcontrollers or the development software systems. For details of these items, see the appropriate TI
documents listed in Section 1.20.
This manual applies to the following tools (and devices):
• MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices)
• MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices)
• MSP-FET (successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430
devices)
• eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all
MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices)
• eZ430-T2012 (three MSP430F2012 based target boards)
• eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274 and CC2500 target, for
all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21,
and MSP430G2x31 devices)
• eZ430-RF2500T (one MSP430F2274 and CC2500 target board including battery pack)
• eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274 and CC2500 target
and solar energy harvesting module)
• eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system
contained in a watch. Includes <1 GHz RF USB access point)
Stand-alone target-socket modules (without debug interface) named as MSP-TS430TSxx.
Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respective
target socket module MSP-TS430TSxx, where 'xx' is the same for both names. The following tools contain
also the USB debug interface (MSP-FET430UIF):
• FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages) (green PCB)
• FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages) (green
PCB)
These tools contain the most up-to-date materials available at the time of packaging. For the latest
materials (data sheets, user's guides, software, application information, and so on), visit the TI MSP430
web site at www.ti.com/msp430 or contact your local TI sales office.
9
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Information About Cautions and Warnings
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Information About Cautions and Warnings
This document may contain cautions and warnings.
CAUTION
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your
software or equipment.
WARNING
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection. Read each caution and warning
carefully.
Related Documentation From Texas Instruments
MSP430 development tools documentation:
Code Composer Studio for MSP430 User's Guide (literature number SLAU157)
Code Composer Studio v5.x Core Edition (CCS Mediawiki)
IAR Embedded Workbench for MSP430(tm) User's Guide (literature number SLAU138)
IAR Embedded Workbench KickStart installer (literature number SLAC050)
eZ430-F2013 Development Tool User's Guide (literature number SLAU176)
eZ430-RF2480 Demonstration Kit User's Guide (literature number SWRU151)
eZ430-RF2500 Development Tool User's Guide (literature number SLAU227)
eZ430-RF2500-SEH Development Tool User's Guide (literature number SLAU273)
eZ430-Chronos Development Tool User's Guide (literature number SLAU292)
Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide (literature number SLAU371)
MSP-EXP430F5529 Experimenter Board User's Guide (literature number SLAU330)
MSP-EXP430F5438 Experimenter Board User's Guide (literature number SLAU263)
MSP-EXP430G2 LaunchPad Experimenter Board User's Guide (literature number SLAU318)
MSP Gang Programmer (MSP-GANG) User's Guide (literature number SLAU358)
MSP430 Gang Programmer (MSP-GANG430) User's Guide (literature number SLAU101)
MSP430 device user's guides:
MSP430x1xx Family User's Guide (literature number SLAU049)
MSP430x2xx Family User's Guide (literature number SLAU144)
MSP430x3xx Family User's Guide (literature number SLAU012)
MSP430x4xx Family User's Guide (literature number SLAU056)
MSP430x5xx and MSP430x6xx Family User's Guide (literature number SLAU208)
CC430 Family User's Guide (literature number SLAU259)
10 Read This First SLAU278V–May 2009–Revised May 2015
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If You Need Assistance
MSP430FR57xx Family User's Guide (literature number SLAU272)
MSP430FR58xx and MSP430FR59xx Family User's Guide (literature number SLAU367)
If You Need Assistance
Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments
Product Information Center (PIC). Contact information for the PIC can be found on the TI web site at
www.ti.com/support. The Texas Instruments E2E Community support forums for the MSP430 provide
open interaction with peer engineers, TI engineers, and other experts. Additional device-specific
information can be found on the MSP430 web site.
11
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Chapter 1
SLAU278V–May 2009–Revised May 2015
Get Started Now!
This chapter lists the contents of the FET and provides instruction on installing the hardware.
Topic ........................................................................................................................... Page
1.1 Flash Emulation Tool (FET) Overview................................................................... 14
1.2 Kit Contents, MSP-FET430PIF.............................................................................. 15
1.3 Kit Contents, eZ430-F2013................................................................................... 15
1.4 Kit Contents, eZ430-T2012................................................................................... 15
1.5 Kit Contents, eZ430-RF2500 ................................................................................ 15
1.6 Kit Contents, eZ430-RF2500T............................................................................... 15
1.7 Kit Contents, eZ430-RF2500-SEH ......................................................................... 15
1.8 Kit Contents, eZ430-Chronos-xxx......................................................................... 16
1.9 Kit Contents, MSP-FET430UIF.............................................................................. 16
1.10 Kit Contents, MSP-FET ....................................................................................... 16
1.11 Kit Contents, MSP-FET430xx .............................................................................. 16
1.12 Kit Contents, FET430F6137RF900 ........................................................................ 17
1.13 Kit Contents, MSP-TS430xx................................................................................. 17
1.14 Kit Contents, EM430Fx1x7RF900.......................................................................... 19
1.15 Hardware Installation, MSP-FET430PIF ................................................................. 19
1.16 Hardware Installation, MSP-FET430UIF ................................................................. 20
1.17 Hardware Installation, MSP-FET........................................................................... 20
1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-
EXP430F5529..................................................................................................... 20
1.19 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900,
EM430Fx137RF900 ............................................................................................. 21
1.20 Important MSP430 Documents on the Web............................................................ 22
13
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Flash Emulation Tool (FET) Overview
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1.1 Flash Emulation Tool (FET) Overview
TI offers several flash emulation tools according to different requirements.
Table 1-1. Flash Emulation Tool (FET) Features and Device Compatibility(1)
eZ430-F2013
eZ430-RF2500
eZ430-RF2480
eZ430-RF2560
MSP-WDSxx Metawatch
eZ430-Chronos
MSP-FET430PIF
MSP-FET430UIF
MSP-FET
LaunchPad (MSP-EXP430G2)
MSP-EXP430FR5739
MSP-EXP430F5529
Supports all programmable MSP430
and CC430 devices (F1xx, F2xx, ✓ ✓ ✓
F4xx, F5xx, F6xx, G2xx, L092,
FR57xx, FR59xx, MSP430TCH5E)
Supports only F20xx, G2x01, ✓
G2x11, G2x21, G2x31
Supports MSP430F20xx, F21x2,
F22xx, G2x01, G2x11, G2x21, ✓
G2x31, G2x53
Supports MSP430F20xx, F21x2,
F22xx, G2x01, G2x11, G2x21, ✓ ✓
G2x31
Supports F5438, F5438A ✓
Supports BT5190, F5438A ✓ ✓
Supports only F552x ✓
Supports FR57xx, F5638, F6638 ✓
Supports only CC430F613x ✓
Allows fuse blow ✓ ✓
Adjustable target supply voltage ✓ ✓
Fixed 2.8-V target supply voltage ✓
Fixed 3.6-V target supply voltage ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
4-wire JTAG ✓ ✓ ✓
2-wire JTAG(2) ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
Application UART ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓
Supported by CCS for Windows ✓✓✓✓✓✓✓✓✓✓✓✓
Supported by CCS for Linux ✓ ✓
Supported by IAR ✓✓✓✓✓✓✓✓✓✓✓✓
(1) The MSP-FET430PIF is for legacy device support only. This emulation tool will not support any new devices released after 2011.
(2) The 2-wire JTAG debug interface is also referred to as Spy-Bi-Wire (SBW) interface.
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Kit Contents, MSP-FET430PIF
1.2 Kit Contents, MSP-FET430PIF
• One READ ME FIRST document
• One MSP-FET430PIF interface module
• One 25-conductor cable
• One 14-conductor cable
NOTE: This part is obsolete and is not recommended to use in new design.
1.3 Kit Contents, eZ430-F2013
• One QUICK START GUIDE document
• One eZ430-F2013 development tool including one MSP430F2013 target board
1.4 Kit Contents, eZ430-T2012
• Three MSP430F2012-based target boards
1.5 Kit Contents, eZ430-RF2500
• One QUICK START GUIDE document
• One eZ430-RF2500 CD-ROM
• One eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board
• One eZ430-RF2500T target board
• One AAA battery pack with expansion board (batteries included)
1.6 Kit Contents, eZ430-RF2500T
• One eZ430-RF2500T target board
• One AAA battery pack with expansion board (batteries included)
1.7 Kit Contents, eZ430-RF2500-SEH
• One MSP430 development tool CD containing documentation and development software
• One eZ430-RF USB debugging interface
• Two eZ430-RF2500T wireless target boards
• One SEH-01 solar energy harvester board
• One AAA battery pack with expansion board (batteries included)
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Kit Contents, eZ430-Chronos-xxx
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1.8 Kit Contents, eZ430-Chronos-xxx
'433, '868, '915
• One QUICK START GUIDE document
• One ez430-Chronos emulator
• One screwdriver
• Two spare screws
eZ430-Chronos-433:
– One 433-MHz eZ430-Chronos watch (battery included)
– One 433-MHz eZ430-Chronos access point
eZ430-Chronos-868:
– One 868-MHz eZ430-Chronos watch (battery included)
– One 868-MHz eZ430-Chronos access point
eZ430-Chronos-915:
– One 915-MHz eZ430-Chronos watch (battery included)
– One 915-MHz eZ430-Chronos access point
1.9 Kit Contents, MSP-FET430UIF
• One READ ME FIRST document
• One MSP-FET430UIF interface module
• One USB cable
• One 14-conductor cable
1.10 Kit Contents, MSP-FET
• One READ ME FIRST document
• One MSP-FET interface module
• One USB cable
• One 14-conductor cable
1.11 Kit Contents, MSP-FET430xx
• One READ ME FIRST document
• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end
of the case, and a 2×7-pin male connector on the other end of the case.
• One USB cable
• One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz.
• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)
• One 14-Pin JTAG conductor cable
• One small box containing two MSP430 device samples (See table for Sample Type)
• One target socket module. To determine the devices used for each board and a summary of the board,
see Table 1-2. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xx
kit; for example, the MSP-FET430U28A kit contains the MSP-TS430PW28A board.
Refer to the device data sheets for device specifications. Device errata can be found in the respective
device product folder on the web provided as a PDF document. Depending on the device, errata may also
be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
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Kit Contents, FET430F6137RF900
1.12 Kit Contents, FET430F6137RF900
• One READ ME FIRST document
• One legal notice
• One MSP-FET430UIF interface module
• Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137
device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB.
• Two CC430EM battery packs
• Four AAA batteries
• Two 868-MHz or 915-MHz antennas
• Two 32.768-kHz crystals
• 18 PCB 2x4-pin headers
• One USB cable
• One 14-pin JTAG conductor cable
1.13 Kit Contents, MSP-TS430xx
• One READ ME FIRST document
• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)
• One target socket module
• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)
• MSP430 device samples (see Table 1-2 for sample type)
Table 1-2. Individual Kit Contents, MSP-TS430xx
Part Number Socket Type Supported Devices Included Devices Headers and Comment
MSP-TS430D8 8-pin D 1 x MSP430G2210ID and Two PCB 1×4-pin headers (two
MSP430G2210, MSP430G2230
(green PCB) (TSSOP ZIF) 1 x MSP430G2230ID male and two female)
MSP430F20xx, MSP430G2x01,
MSP-TS430PW14 14-pin PW Four PCB 1×7-pin headers (two
MSP430G2x11, MSP430G2x21, 2 x MSP430F2013IPW
(green PCB) (TSSOP ZIF) male and two female)
MSP430G2x31
Four PCB 1×7-pin headers (two
male and two female). A "Micro-
MaTch" 10-pin female connector is
MSP-TS430L092 14-pin PW also present on the PCB which
MSP-TS430L092 2 x MSP430L092IPW
(green PCB) (TSSOP ZIF) connects the kit with an 'Active
Cable' PCB; this 'Active Cable'
PCB is connected by 14-pin JTAG
cable with the FET430UIF
MSP-TS430PW24 24-pin PW Four PCB 1×12-pin headers (two
MSP430AFE2xx 2 x MSP430AFE253IPW
(green PCB) (TSSOP ZIF) male and two female)
MSP430F11x1, MSP430F11x2,
MSP430F12x, MSP430F12x2,
MSP-TS430DW28 28-pin DW Four PCB 1×12-pin headers (two
MSP430F21xx 2 x MSP430F123IDW
(green PCB) (SSOP ZIF) male and two female)
Supports devices in 20- and 28-pin
DA packages
MSP430F11x1, MSP430F11x2,
MSP-TS430PW28 28-pin PW Four PCB 1×12-pin headers (two
MSP430F12x, MSP430F12x2, 2 x MSP430F2132IPW
(green PCB) (TSSOP ZIF) male and two female)
MSP430F21xx
MSP430F20xx, MSP430G2xxx in
MSP-TS430PW28A 28-pin PW Four PCB 1×12-pin headers (two
14-, 20-, and 28-pin PW packages, 2 x MSP430G2452IPW20
(red PCB) (TSSOP ZIF) male and two female)
MSP430TCH5E in PW package
MSP-TS430RHB32A 32-pin RHB Eight PCB 1×8-pin headers (four
MSP430i204x 2 x MSP430i2041TRHB
(red PCB) (QFN ZIF) male and four female)
2 x MSP430F2274IDA
MSP-TS430DA38 38-pin DA MSP430F22xx, MSP430G2x44, Four PCB 1×19-pin headers (two
2 x MSP430G2744IDA
(green PCB) (TSSOP ZIF) MSP430G2x55 male and two female)
2 x MSP430G2955IDA
MSP-TS430QFN23x0 40-pin RHA Eight PCB 1×10-pin headers (four
MSP430F23x0 2 x MSP430F2370IRHA
(green PCB) (QFN ZIF) male and four female)
MSP-TS430RSB40 40-pin RSB Eight PCB 1×10-pin headers (four
MSP430F51x1, MSP430F51x2 2 x MSP430F5172IRSB
(green PCB) (QFN ZIF) male and four female)
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Kit Contents, MSP-TS430xx
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Table 1-2. Individual Kit Contents, MSP-TS430xx (continued)
Part Number Socket Type Supported Devices Included Devices Headers and Comment
MSP-TS430RHA40A 40-pin RHA Eight PCB 1×10-pin headers (four
MSP430FR572x, MSP430FR573x 2 x MSP430FR5739IRHA
(red PCB) (QFN ZIF) male and four female)
MSP-TS430DL48 48-pin DL Four PCB 2×12-pin headers (two
MSP430F42x0 2 x MSP430F4270IDL
(green PCB) (TSSOP ZIF) male and two female)
MSP-TS430RGZ48B 48-pin RGZ Eight PCB 1×12-pin headers (four
MSP430F534x 2 x MSP430F5342IRGZ
(blue PCB) (QFN ZIF) male and four female)
MSP-TS430RGZ48C 48-pin RGZ MSP430FR58xx and Eight PCB 1×12-pin headers (four
2 x MSP430FR5969IRGZ
(black PCB) (QFN ZIF) MSP430FR59xx male and four female)
MSP430F13x, MSP430F14x,
MSP430F14x1, MSP430F15x,
MSP430F16x, MSP430F16x1, TS Kit:
MSP430F23x, MSP430F24x, 2 x MSP430F2618IPM;
MSP-TS430PM64 64-pin PM Eight PCB 1×16-pin headers (four
MSP430F24xx, MSP430F261x, FET Kit:
(green PCB) (QFP ZIF) male and four female)
MSP430F41x, MSP430F42x, 2 x MSP430F417IPM and
MSP430F42xA, MSP430FE42x, 2 x MSP430F169IPM
MSP430FE42xA, MSP430FE42x2,
MSP430FW42x
MSP-TS430PM64A 64-pin PM Eight PCB 1×16-pin headers (four
MSP430F41x2 2 x MSP430F4152IPM
(red PCB) (QFP ZIF) male and four female)
MSP-TS430PM64D 64-pin PM Eight PCB 1×16-pin headers (four
MSP430FR413x, MSP430FR203x 2 x MSP430FR4133IPM
(white PCB) (QFP ZIF) male and four female)
MSP-TS430PM64F 64-pin PM None. Free samples can Eight PCB 1×16-pin headers (four
MSP430FR6972
(purple PCB) (QFP ZIF) be ordered in TI Store. male and four female)
MSP-TS430RGC64B 64-pin RGC Eight PCB 1×16-pin headers (four
MSP430F530x 2 x MSP430F5310IRGC
(blue PCB) (QFN ZIF) male and four female)
MSP430F522x, MSP430F521x,
MSP-TS430RGC64C 64-pin RGC Eight PCB 1×16-pin headers (four
MSP430F523x, MSP430F524x, 2 x MSP430F5229IRGC
(black PCB) (QFN ZIF) male and four female)
MSP430F525x
2 x MSP430F5510IRGC
MSP-TS430RGC64USB 64-pin RGC MSP430F550x, MSP430F551x, Eight PCB 1×16-pin headers (four
or
(green PCB) (QFN ZIF) MSP430F552x male and four female)
2 x MSP430F5528IRGC
MSP430F241x, MSP430F261x,
MSP-TS430PN80 80-pin PN MSP430F43x, MSP430F43x1, Eight PCB 1×20-pin headers (four
2 x MSP430FG439IPN
(green PCB) (QFP ZIF) MSP430FG43x, MSP430F47x, male and four female)
MSP430FG47x
MSP-TS430PN80A 80-pin PN Eight PCB 1×20-pin headers (four
MSP430F532x 2 x MSP430F5329IPN
(red PCB) (QFP ZIF) male and four female)
MSP-TS430PN80USB 80-pin PN Eight PCB 1×20-pin headers (four
MSP430F552x, MSP430F551x 2 x MSP430F5529IPN
(green PCB) (QFP ZIF) male and four female)
MSP430F43x, MSP430F43x1,
MSP-TS430PZ100 100-pin PZ Eight PCB 1×25-pin headers (four
MSP430F44x, MSP430FG461x, 2 x MSP430FG4619IPZ
(green PCB) (QFP ZIF) male and four female)
MSP430F47xx
MSP-TS430PZ100A 100-pin PZ Eight PCB 1×25-pin headers (four
MSP430F471xx 2 x MSP430F47197IPZ
(red PCB) (QFP ZIF) male and four female)
MSP-TS430PZ100B 100-pin PZ Eight PCB 1×25-pin headers (four
MSP430F67xx 2 x MSP430F6733IPZ
(blue PCB) (QFP ZIF) male and four female)
MSP-TS430PZ100C 100-pin PZ MSP430F645x, MSP430F643x, Eight PCB 1×25-pin headers (four
2 x MSP430F6438IPZ
(black PCB) (QFP ZIF) MSP430F535x, MSP430F533x male and four female)
MSP-TS430PZ100D 100-pin PZ MSP430FR698x(1), Eight PCB 1×25-pin headers (four
2 x MSP430FR6989IPZ
(white PCB) (QFP ZIF) MSP430FR688x(1) male and four female)
MSP-TS430PZ5x100 100-pin PZ MSP430F543x, MSP430BT5190, Eight PCB 1×25-pin headers (four
2 x MSP430F5438IPZ
(green PCB) (QFP ZIF) MSP430SL5438A male and four female)
MSP-TS430PZ100USB 100-pin PZ MSP430F665x, MSP430F663x, Eight PCB 1×25-pin headers (four
2 x MSP430F6638IPZ
(green PCB) (QFP ZIF) MSP430F563x male and four female)
MSP-TS430PZ100AUSB 100-pin PZ None. Free samples can Eight PCB 1×25-pin headers (four
MSP430FG662x, MSP430FG642x
(blue PCB) (QFP ZIF) be ordered in TI Store. male and four female)
Four PCB 1x26-pin headers (two
MSP430F677x, MSP430F676x,
MSP-TS430PEU128 128-pin PEU male and two female) and four
MSP430F674x, MSP430F677x1, 2 x MSP430F67791IPEU
(green PCB) (QFP ZIF) PCB 1x38-pin headers (two male
MSP430F676x1, MSP430F674x1 and two female)
See the device data sheets for device specifications. Device errata can be found in the respective device
product folder on the web provided as a PDF document. Depending on the device, errata may also be
found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
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Kit Contents, EM430Fx1x7RF900
1.14 Kit Contents, EM430Fx1x7RF900
• One READ ME FIRST document
• One legal notice
• Two target socket module
MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which
is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present
on the PCB
MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which
is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present
on the PCB
MSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on which
is soldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also present
on the PCB
• Two CC430EM battery packs
• Four AAA batteries
• Two 868- or 915-MHz antennas
• Two 32.768-kHz crystals
• 18 PCB 2×4-pin headers
1.15 Hardware Installation, MSP-FET430PIF
Follow these steps to install the hardware for the MSP-FET430PIF tools:
1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The
necessary driver for accessing the PC parallel port is installed automatically during CCS or IAR
Embedded Workbench installation. Note that a restart is required after the CCS or IAR Embedded
Workbench installation for the driver to become active.
2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, such
as an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B.
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1.16 Hardware Installation, MSP-FET430UIF
Follow these steps to install the hardware for the MSP-FET430UIF tool:
1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE
installation installs drivers automatically.
2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET
should be recognized, as the USB device driver is installed automatically. If the driver has not been
installed yet, the install wizard starts. Follow the prompts and point the wizard to the driver files.
The default location for CCS is c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC or
c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, depending of firmware version of
the tool.
The default location for IAR Embedded Workbench is <Installation
Root>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART or <Installation
Root>\Embedded Workbench x.x\430\drivers\<Win_OS>, depending of firmware version of the tool.
The USB driver is installed automatically. Detailed driver installation instructions can be found in
Appendix C.
3. After connecting to a PC, the USB FET performs a self-test during which the red LED may flash for
approximately two seconds. If the self-test passes successfully, the green LED stays on.
4. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as an
MSP-TS430xxx target socket module.
5. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.
6. Compared to the parallel-port debug interface, the USB FET has additional features including JTAG
security fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 60 mA.
1.17 Hardware Installation, MSP-FET
Follow these steps to install the hardware for the MSP-FET tool:
1. Install the IDE (CCS or IAR) that you plan to use before connecting MSP-FET to PC. During IDE
installation, USB drivers are installed automatically. Make sure to use the latest IDE version, otherwise
the USB drivers might not be able to recognize the MSP-FET.
2. Connect the MSP-FET to a USB port on the PC with the provided USB cable.
3. The following procedure applies to operation under Windows:
(a) After connecting to the PC, the MSP-FET should be recognized automatically, as the USB device
driver has been already installed together with the IDE.
(b) If the driver has not been installed yet, the Found New Hardware wizard starts. Follow the
instructions and point the wizard to the driver files.
(c) The default location for CCS is c:\ti\ccsv6\ccs_base\emulation\drivers\msp430\USB_CDC.
(d) The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench
x.x\430\drivers\<Win_OS>.
4. After connecting to a PC, the MSP-FET performs a self-test. If the self-test passes successfully, the
green LED stays on. For a complete list of LED signals, please refer to the MSP-FET chapter in this
document.
5. Connect the MSP-FET to a target board, such as an MSP-TS430xxx target socket module, with the
14-conductor cable.
6. Make sure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.
1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-
EXP430F5529
To install the eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools, follow
steps 1 and 2 of Section 1.16
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Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900, EM430Fx137RF900
1.19 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430F6137RF900,
EM430Fx137RF900
Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:
1. Follow steps 1 and 2 of Section 1.16
2. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC.
Use the 14-conductor cable to connect the FET interface module to the supplied target socket module.
3. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.
4. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrations
of the target socket modules and their parts are found in Appendix B.
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Important MSP430 Documents on the Web
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1.20 Important MSP430 Documents on the Web
The primary sources of MSP430 information are the device-specific data sheet and user's guide. The
MSP430 web site (www.ti.com/msp430) contains the most recent version of these documents.
PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the
librarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) is
available, and the Texas Instruments E2E Community support forums for the MSP430 and Code
Composer Studio v5 provide additional help besides the product help and Welcome page.
PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker,
and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, the
latest information) are available in HTML format in the same directories. A IAR specific Wiki Page is also
available.
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Chapter 2
SLAU278V–May 2009–Revised May 2015
Design Considerations for In-Circuit Programming
This chapter presents signal requirements for in-circuit programming of the MSP430.
Topic ........................................................................................................................... Page
2.1 Signal Connections for In-System Programming and Debugging............................. 25
2.2 External Power................................................................................................... 29
2.3 Bootstrap Loader (BSL) ...................................................................................... 29
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Signal Connections for In-System Programming and Debugging
2.1 Signal Connections for In-System Programming and Debugging
MSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430
With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSP-
FET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. In
addition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers,
thus providing an easy way to program prototype boards, if desired.
Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target
device required to support in-system programming and debugging for 4-wire JTAG communication.
Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode is
supported on most MSP430 devices, except devices with low pin counts (for example, MSP430G2230).
The 2-wire JTAG mode is available on selected devices only. See the Code Composer Studio for MSP430
User's Guide (SLAU157) or IAR Embedded Workbench Version 3+ for MSP430 User's Guide (SLAU138)
for information on which interface method can be used on which device.
The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430
are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board
(through pin 2). In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCC-
sense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature
senses the local VCC present on the target board (that is, a battery or other local power supply) and
adjusts the output signals accordingly. If the target board is to be powered by a local VCC, then the
connection to pin 4 on the JTAG should be made, and not the connection to pin 2. This uses the VCC-
sense feature and prevents any contention that might occur if the local on-board VCC were connected to
the VCC supplied from the FET interface module, MSP-GANG or the MSP-GANG430. If the VCC-sense
feature is not necessary (that is, if the target board is to be powered from the FET interface module, MSP-
GANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAG header, and no connection
is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplying
VCC to the target board. If this flexibility is not required, the desired VCC connections may be hard-wired to
eliminate the jumper block. Pins 2 and 4 must not be connected at the same time.
Note that in 4-wire JTAG communication mode (see Figure 2-1), the connection of the target RST signal
to the JTAG connector is optional when using devices that support only 4-wire JTAG communication
mode. However, when using devices that support 2-wire JTAG communication mode in 4-wire JTAG
mode, the RST connection must be made. The MSP430 development tools and device programmers
perform a target reset by issuing a JTAG command to gain control over the device. However, if this is
unsuccessful, the RST signal of the JTAG connector may be used by the development tool or device
programmer as an additional way to assert a device reset.
25
SLAU278V–May 2009–Revised May 2015 Design Considerations for In-Circuit Programming
Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated
1
3
5
7
9
11
13
2
4
6
8
10
12
14
TDO/TDI
TDI/VPP
TMS
TCK
GND
TEST/VPP
JTAG
VCC TOOL
VCC TARGET
J1 (see Note A)
J2 (see Note A)
VCC
R1
47 k
(see Note B)
W
C2
10 µF
C3
0.1 µF
V /AV /DVCCCC CC
RST/NMI
TDO/TDI
TDI/VPP
TMS
TCK
TEST/VPP (see Note C)
V /AV /DV
SS SS SS
MSP430Fxxx
C1
10 nF/2.2 nF
(see Notes B and E)
RST (see Note D)
Important to connect
Signal Connections for In-System Programming and Debugging
www.ti.com
A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,
make connection J2.
B The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 family
user's guide for the recommended configuration.
C The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data
sheet to determine if this pin is available.
D The connection to the JTAG connector RST pin is optional when using a device that supports only 4-wire JTAG
communication mode, and it is not required for device programming or debugging. However, this connection is
required when using a device that supports 2-wire JTAG communication mode in 4-wire JTAG mode.
E When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 should
not exceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET).
Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
Figure 2-1. Signal Connections for 4-Wire JTAG Communication
26 Design Considerations for In-Circuit Programming SLAU278V–May 2009–Revised May 2015
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1
3
5
7
9
11
13
2
4
6
8
10
12
14
TEST/SBWTCK
MSP430Fxxx
RST/NMI/SBWTDIO
TDO/TDI
TCK
GND
TEST/VPP
JTAG
VCC TOOL
VCC TARGET
330Ω
R2
J1 (see Note A)
J2 (see Note A)
Important to connect
V /AV /DVCCCC CC
V /AV /DV
SS SS SS
R1
47 kΩ
C1
2.2 nF
(See Note B)
VCC
C2
10 µF
C3
0.1 µF
www.ti.com
Signal Connections for In-System Programming and Debugging
A If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,
make connection J2.
B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during
JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with
the device. The upper limit for C1 is 2.2 nF when using current TI tools.
Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
C R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the
TEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω)
and do not connect TEST/VPP to TEST/SBWTCK.
Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,
MSP430G2xx, and MSP430F4xx Devices
27
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1
3
5
7
9
11
13
2
4
6
8
10
12
14
TEST/SBWTCK
MSP430Fxxx
RST/NMI/SBWTDIO
TDO/TDI
TCK
GND
JTAG
R1
47 kΩ
VCC TOOL
VCC TARGET
C1
2.2 nF
(See Note B)
J1 (see Note A)
J2 (see Note A)
Important to connect
V /AV /DVCCCC CC
V /AV /DV
SS SS SS
VCC
C2
10 µF
C3
0.1 µF
Signal Connections for In-System Programming and Debugging
www.ti.com
A Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the
debug or programming adapter.
B The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during
JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with
the device. The upper limit for C1 is 2.2 nF when using current TI tools.
Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F5xx and
MSP430F6xx Devices
28 Design Considerations for In-Circuit Programming SLAU278V–May 2009–Revised May 2015
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External Power
2.2 External Power
The MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Note
that the target should not consume more than 60 mA, even as a peak current, as it may violate the USB
specification. For example, if the target board has a capacitor on VCC more than 10 µF, it may cause
inrush current during capacitor charging that may exceed 60 mA. In this case, the current should be
limited by the design of the target board, or an external power supply should be used.
The VCC for the target can be selected between 1.8 V and 3.6 V in steps of 0.1 V. Alternatively, the target
can be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pin
connector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically.
Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected;
not both at the same time.
When a target socket module is powered from an external supply, the external supply powers the device
on the target socket module and any user circuitry connected to the target socket module, and the FET
interface module continues to be powered from the PC through the parallel port. If the externally supplied
voltage differs from that of the FET interface module, the target socket module must be modified so that
the externally supplied voltage is routed to the FET interface module (so that it may adjust its output
voltage levels accordingly). See the target socket module schematics in Appendix B.
The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirement
of the MSP430, a standalone FET does not exceed the available current. However, if additional circuitry is
added to the tool, this current limit could be exceeded. In this case, external power can be supplied to the
tool through connections provided on the target socket modules. See the schematics and pictorials of the
target socket modules in Appendix B to locate the external power connectors. Note that the MSP-
FET430PIF is not recommended for new design.
2.3 Bootstrap Loader (BSL)
The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices,
these pins are shared with the device port pins, and this sharing of pins can complicate a design (or
sharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices
contain a program (a "bootstrap loader") that permits the flash memory to be erased and programmed
using a reduced set of signals. The MSP430 Programming Via the Bootstrap Loader User's Guide
(SLAU319) describes this interface. See the MSP430 web site for the application reports and a list of
MSP430 BSL tool developers.
TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggests
providing access to these signals by, for example, a header).
See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins.
29
SLAU278V–May 2009–Revised May 2015 Design Considerations for In-Circuit Programming
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Appendix A
SLAU278V–May 2009–Revised May 2015
Frequently Asked Questions and Known Issues
This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.
Topic ........................................................................................................................... Page
A.1 Hardware FAQs.................................................................................................. 32
A.2 Known Issues.................................................................................................... 34
31
SLAU278V–May 2009–Revised May 2015 Frequently Asked Questions and Known Issues
Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated
Hardware FAQs
www.ti.com
A.1 Hardware FAQs
1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information
Due to the large capacitive coupling introduced by the device socket between the adjacent signals
XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the
LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire
(2-wire) JTAG configuration and only to the period while a debug session is active.
Workarounds:
• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG
configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly.
• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down
menu (at top of Debug View). This prevents the debugger from accessing the MSP430 device
while the application is running. Note that, in this mode, a manual halt is required to see if a
breakpoint was hit. See the IDE documentation for more information on this feature.
• Use an external clock source to drive XIN directly.
2. With current interface hardware and software, there is a weakness when adapting target boards
that are powered externally. This leads to an accidental fuse check in the MSP430 device. This is
valid for PIF and UIF but is seen most often on the UIF. A solution is being developed.
Workarounds:
• Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the
RST line, which also resets the device internal fuse logic.
• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down
menu. This prevents the debugger from accessing the MCU while the application is running. Note
that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE
documentation for more information on this feature.
• Use an external clock source to drive XIN directly.
3. The 14-conductor cable that connects the FET interface module and the target socket module must
not exceed 8 inches (20 centimeters) in length.
4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the
USB FET.
5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket
module. See the schematic of the target socket module to populate the capacitor according to the data
sheet of the device.
6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed on
the target socket module. See the schematic of the target socket module to populate the capacitor
according to the data sheet of the device.
7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module.
For MSP430 devices that contain user-selectable loading capacitors, see the device and crystal data
sheets for the value of capacitance.
8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or
C-SPY (as any required clocking and timing is derived from the internal DCO and FLL).
9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:
For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.
For C-SPY: "Release JTAG On Go" must be selected.
10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider using
an MSP430 device that is a "superset" of the smaller device. A very powerful feature of the
MSP430 is that the family members are code and architecturally compatible, so code developed on
one device (for example, one without shared JTAG and port pins) ports effortlessly to another
(assuming an equivalent set of peripherals).
32 Frequently Asked Questions and Known Issues SLAU278V–May 2009–Revised May 2015
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Hardware FAQs
11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.
Customers should erase the information memory before its first use. Main memory of packaged
devices is blank when the device is delivered from TI.
12. The device current is higher then expected. The device current measurement may not be accurate
with the debugger connected to the device. For accurate measurement, disconnect the debugger.
Additionally some unused pins of the device should be terminated. See the Connection of Unused Pins
table in the device's family user's guide.
13. The following ZIF sockets are used in the FET tools and target socket modules:
• 8-pin device (D package): Yamaichi IC369-0082
• 14-pin device (PW package): Enplas OTS-14-065-01
• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146
• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02
• 28-pin device (DW package): Wells-CTI 652 D028
• 28-pin device (PW package): Enplas OTS-28-0.65-01
• 38-pin device (DA package): Yamaichi IC189-0382-037
• 40-pin device (RHA package): Enplas QFN-40B-0.5-01
• 40-pin device (RSB package): Enplas QFN-40B-0.4
• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001
• 48-pin device (DL package): Yamaichi IC51-0482-1163
• 64-pin device (PM package): Yamaichi IC51-0644-807
• 64-pin device (RGC package): Yamaichi QFN11T064-006
• 80-pin device (PN package): Yamaichi IC201-0804-014
• 100-pin device (PZ package): Yamaichi IC201-1004-008
• 128-pin device (PEU package): Yamaichi IC500-1284-009P
Enplas: www.enplas.com
Wells-CTI: www.wellscti.com
Yamaichi: www.yamaichi.us
33
SLAU278V–May 2009–Revised May 2015 Frequently Asked Questions and Known Issues
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Known Issues
www.ti.com
A.2 Known Issues
MSP-FET430UIF Current detection algorithm of the UIF firmware
Problem Description If high current is detected, the ICC monitor algorithm stays in a loop of frequently
switching on and off the target power supply. This power switching puts some MSP430
devices such as the MSP430F5438 in a state that requires a power cycle to return the
device to JTAG control.
A side issue is that if the UIF firmware has entered this switch on and switch off loop, it
is not possible to turn off the power supply to the target by calling MSP430_VCC(0). A
power cycle is required to remove the device from this state.
Solution IAR KickStart and Code Composer Essentials that have the MSP430.dll version
2.04.00.003 and higher do not show this problem. Update the software development tool
to this version or higher to update the MSP-FET430UIF firmware.
MSP-FET430PIF Some PCs do not supply 5 V through the parallel port
Problem Description Device identification problems with modern PCs, because the parallel port often does not
deliver 5 V as was common with earlier hardware.
1. When connected to a laptop, the test signal is clamped to 2.5 V.
2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter
through pin 4 (sense).
Solution Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the
VCC pads of the interface. The jumper on a the target socket must be switched to
external power.
34 Frequently Asked Questions and Known Issues SLAU278V–May 2009–Revised May 2015
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Copyright © 2009–2015, Texas Instruments Incorporated
Appendix B
SLAU278V–May 2009–Revised May 2015
Hardware
This appendix contains information relating to the FET hardware, including schematics, PCB pictorials,
and bills of materials (BOMs). All other tools, such as the eZ430 series, are described in separate product-
specific user's guides.
36 Hardware SLAU278V–May 2009–Revised May 2015
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www.ti.com
Appendix B
Topic ........................................................................................................................... Page
B.1 MSP-TS430D8.................................................................................................... 38
B.2 MSP-TS430PW14................................................................................................ 41
B.3 MSP-TS430L092................................................................................................. 44
B.4 MSP-TS430L092 Active Cable .............................................................................. 47
B.5 MSP-TS430PW24................................................................................................ 50
B.6 MSP-TS430DW28................................................................................................ 53
B.7 MSP-TS430PW28................................................................................................ 56
B.8 MSP-TS430PW28A.............................................................................................. 59
B.9 MSP-TS430RHB32A............................................................................................ 62
B.10 MSP-TS430DA38 ................................................................................................ 65
B.11 MSP-TS430QFN23x0........................................................................................... 68
B.12 MSP-TS430RSB40 .............................................................................................. 71
B.13 MSP-TS430RHA40A............................................................................................ 74
B.14 MSP-TS430DL48 ................................................................................................ 77
B.15 MSP-TS430RGZ48B............................................................................................ 80
B.16 MSP-TS430RGZ48C............................................................................................ 83
B.17 MSP-TS430PM64................................................................................................ 86
B.18 MSP-TS430PM64A.............................................................................................. 89
B.19 MSP-TS430PM64D.............................................................................................. 92
B.20 MSP-TS430PM64F .............................................................................................. 95
B.21 MSP-TS430RGC64B............................................................................................ 98
B.22 MSP-TS430RGC64C.......................................................................................... 101
B.23 MSP-TS430RGC64USB...................................................................................... 105
B.24 MSP-TS430PN80............................................................................................... 109
B.25 MSP-TS430PN80A ............................................................................................ 112
B.26 MSP-TS430PN80USB ........................................................................................ 115
B.27 MSP-TS430PZ100 ............................................................................................. 119
B.28 MSP-TS430PZ100A ........................................................................................... 122
B.29 MSP-TS430PZ100B ........................................................................................... 125
B.30 MSP-TS430PZ100C ........................................................................................... 128
B.31 MSP-TS430PZ100D ........................................................................................... 131
B.32 MSP-TS430PZ5x100.......................................................................................... 134
B.33 MSP-TS430PZ100USB....................................................................................... 137
B.34 MSP-TS430PZ100AUSB..................................................................................... 141
B.35 MSP-TS430PEU128........................................................................................... 145
B.36 EM430F5137RF900 ........................................................................................... 148
B.37 EM430F6137RF900 ........................................................................................... 152
B.38 EM430F6147RF900 ........................................................................................... 156
B.39 MSP-FET ......................................................................................................... 160
B.40 MSP-FET430PIF................................................................................................ 172
B.41 MSP-FET430UIF ............................................................................................... 174
37
SLAU278V–May 2009–Revised May 2015 Hardware
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GND
100nF
330R
10uF/10V
47K
2.2nF
GND
330R
GND
GND
green
FE4L FE4H
GND
Ext_PWR
Socket: YAMAICHI
Type: IC369-0082
Vcc
ext
int
to measure supply current DNP
1
3
5
7
9
11
13
2
4
6
12
14
8
10
SBW
C5
R3
C7
R5
C8
1
2
3
J3
1
2
J4
1
2
J6
1
2
3
J5
R2
D1
1
2
3
4
J1
5
6
7
8
J2
DVCC
1DVSS 8
P1.2/TA1/A2
2
P1.5/TA0/A5/SCLK
3
P1.6/TA1/A6/SDO/SCL
4
TST/SBWTCK 7
RST/SBWTDIO 6
P1.7/A7/SDI/SDA 5
U1
MSP-TS430D8
GND
VCC
RST/SBWTDIO
RST/SBWTDIO
RST/SBWTDIO
SBWTCK
VCC430
TST/SBWTCK
TST/SBWTCK
TST/SBWTCK
P1.5
P1.6 P1.7
P1.2
Date: 28.07.2011 11:03:35 Sheet: 1/1
REV:
TITLE:
Document Number:
MSP-TS430D8
+
1.0
MSP-TS430D8 Ta rget Socket Board
MSP-TS430D8
www.ti.com
B.1 MSP-TS430D8
Figure B-1. MSP-TS430D8 Target Socket Module, Schematic
38 Hardware SLAU278V–May 2009–Revised May 2015
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Jumper J4
Open to disconnect LED
D1
LED connected to P1.2
Orient Pin 1 of MSP430 device
14-pin connector for debugging
in Spy-Bi-Wire mode only
(4-Wire JTAG not available)
Jumper J6
Open to measure current
Jumper J5
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector J3
External power connector
Jumper J5 to “ext”
www.ti.com
MSP-TS430D8
Figure B-2. MSP-TS430D8 Target Socket Module, PCB
39
SLAU278V–May 2009–Revised May 2015 Hardware
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MSP-TS430D8
www.ti.com
Table B-1. MSP-TS430D8 Bill of Materials
No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
1 J4, J6 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
2 J5 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
3 SBW 1 10-pin connector, male, TH HRP10H-ND
4 J3 1 3-pin header, male, TH SAM1035-03-ND
5 C8 1 2.2nF, CSMD0805 Buerklin 53 D 292
6 C7 1 10uF, 10V, 1210ELKO 478-3875-1-ND
7 R5 1 47K, 0805 541-47000ATR-ND
8 C5 1 100nF, CSMD0805 311-1245-2-ND
9 R2, R3 2 330R, 0805 541-330ATR-ND DNP: headers enclosed with kit.
10 J1, J2 2 4-pin header, TH SAM1029-04-ND Keep vias free of solder.
10,1 J1, J2 1 4-pin socket, TH SAM1029-04-ND DNP: receptacles enclosed with kit.
11 U1 1 SO8 Socket: Type IC369-0082 Manuf.: Yamaichi
12 D1 1 red, LED 0603 DNP: enclosed with kit. Is supplied
13 MSP430 2 MSP430G2210, MSP430G2230 by TI
MSP-TS430D8 Rev.
14 PCB 1 50,0mmx44,5mm 1.0
40 Hardware SLAU278V–May 2009–Revised May 2015
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12pF
12pF
GND
100nF
330R
10uF/10V
47K
2.2nF
GND
330R
100nF
GND
GND
GND
green
Ext_PWR
Socket: ENPLAS
Type: OTS-14-065
Vcc ext
int
to measure supply current
DNP
DNP
DNP
DNP
DNP
JTAG ->
SBW ->
JTAG-Mode selection:
4-wire JTAG: Set jumpers J7 to J12 to position 2-3
2-wire "SpyBiWire": Set jumpers J7 to J12 to position 2-1
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
C2
C1
C5
R3
C7
R5
C8
1
2
3
J3
Q1 8
9
10
11
12
13
14
J2
1
2
3
4
5
6
7
J1
1
2
J4
1
2
J6
J5
1
2
3
R2
C3
J7
1
2
3
J8
1
2
3
J9
1
2
3
J10
1
2
3
J11
1
2
3
J12
1
2
3
1
2
3
4
5
6
78
9
10
14
13
12
11
D1
P1.0
P1.3
P1.2
P1.1
XOUT XOUT
GND
XIN
XIN
VCC
RST/SBWTDIO
RST/SBWTDIO
SBWTCK
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
VCC430
P1.4/TCK
P1.4/TCK
P1.5/TMS
P1.5/TMS
P1.6/TDI
P1.6/TDI
P1.7/TDO
P1.7/TDO
TDO/SBWTDIO
RST/NMI
TMS
TDI
Date: 7/16/2007 8:22:36 AM Sheet: 1/1
REV:
TITLE:
Document Number:
MSP-TS430PW14
+
2.0
MSP-TS430PW14 Target Socket Board
www.ti.com
MSP-TS430PW14
B.2 MSP-TS430PW14
Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic
41
SLAU278V–May 2009–Revised May 2015 Hardware
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Jumper J4
Open to disconnect LED
Orient Pin 1 of MSP430 device Jumper J6
Open to measure current
Connector J3
External power connector
Jumper J5 to "ext"
D1
LED connected to P1.0
Jumpers J7 to J12
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
Jumper J5
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
MSP-TS430PW14
www.ti.com
Figure B-4. MSP-TS430PW14 Target Socket Module, PCB
42 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430PW14
Table B-2. MSP-TS430PW14 Bill of Materials
No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C3, C5 1 100nF, SMD0805 478-3351-2-ND DNP: C3
4 C8 0 2.2nF, SMD0805 DNP
5 D1 1 green LED, SMD0603 475-1056-2-ND DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder
6 J1, J2 0 7-pin header, TH SAM1029-07-ND : Header
SAM1213-07-ND : Receptacle
J3, J5, J7, Place jumpers on headers J5, J7, J8,
7 J8, J9, J10, 8 3-pin header, male, TH SAM1035-03-ND J9, J10, J11, J12; Pos 1-2
J11, J12
8 J4, J6 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND Place on: J5, J7-J12; Pos 1-2
14-pin connector, male,
10 JTAG 1 HRP14H-ND
TH Micro Crystal MS1V-T1K
12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder
12.5pF
13 R2, R3 2 330 Ω, SMD0805 541-330ATR-ND
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: OTS-14-0.65-01 Manuf.: Enplas
17 PCB 1 56 x 53 mm 2 layers
For example, 3M
Adhesive Approximately 6mm width,
18 4 Bumpons Part No. SJ- Apply to corners at bottom side
plastic feet 2mm height 5302
19 MSP430 2 MSP430F2013IPW DNP: enclosed with kit, supplied by TI
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Connector J3
External power connector
Jumper JP3
Open to measure current
Jumper JP1
Write enable for EPROM
Orient pin 1 of
MSP430 device
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MSP-TS430L092
Settings of the MSP-TS430L092 Target Socket
Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is
recommended:
• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.
• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device
current consumption. For default operation, they should be closed.
Figure B-6. MSP-TS430L092 Target Socket Module, PCB
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MSP-TS430L092
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Table B-3. MSP-TS430L092 Bill of Materials
No. Per
Pos. Ref Des No. Description Digi-Key Part No. Comment
Board
1 C1, C2 2 330nF, SMD0603
2 C5 1 100n, SMD0603
3 C6 1 10u, SMD0805
4 C10 1 100n, SMD0603
5 EEPROM1 1 M95512 SO08 (SO8) ST Micro M95160R Digikey: 497-8688-1-ND
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
7 J1, J2 2 7-pin header, TH SAM1213-07-ND : Header
SAM1035-07-ND : Receptacle
8 J3 1 3-pin header, male, TH SAM1035-03-ND
9 J4, J5 2 FE4L, FE4H 4 pol. Stiftreihe DNP; Keep vias free of solder.
Reichelt: MicroMaTch-
11 J13 1 MICRO_STECKV_10 Connector: MM FL 10G
12 JP1, JP2,JP3 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
15 L1 1 33uH, SMD0806 LQH2MCN330K02L Farnell: 151-5557
16 LED1, LED4 2 LEDCHIPLED_0603 Farnell: 1686065
17 Q2 1 BC817-16LT1SMD BC817-16LT1SMD SOT23-BEC
18 R0, R6, R7 3 2K7, SMD0603
19 R1 1 1k, SMD0603
20 R2 1 47k, SMD0603
R4,R5, R8,
21 6 10k, SMD0603
R10, RC, RD
22 RA 1 3.9k, SMD0603
23 RB 1 6.8k, SMD0603
14 Pin Socket - IC189-0142-
24 U1 1 Manuf. Yamaichi
146 DNP: Enclosed with kit. Is
22 MSP430 2 MSP430L092PWR supplied by TI.
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Connector JTAG
For JTAG Tool
JP2
JP1
MSP-TS430L092 Active Cable
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Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:
• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.
Table B-4. MSP-TS430L092 JP1 Settings
Jumper 1 Jumper 2 Description
Off Off The active cable has no power and does not function.
The active cable receives power from target socket. For this option, the
Off On target socket must have its own power supply.
On Off The active cable receives power from the JTAG connector.
The JTAG connector powers the active cable and the target socket. For
On On this option, the target socket must not have its own power source, as this
would cause a not defined state.
• JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to
high and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.
Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB
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MSP-TS430L092 Active Cable
Table B-5. MSP-TS430L092 Active Cable Bill of Materials
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
C1, C3, C5,
1 4 100nF, SMD0603
C6
2 C2, C4 2 1uF, SMD0805
3 R1, R10 2 10K, SMD0603
4 R2 1 4K7, SMD0603
R5, R6, R7,
5 4 100, SMD0603
R9
6 R8 1 680k, SMD0603
7 R11, R15 2 1K, SMD0603
8 R12 0 SMD0603 DNP
9 R13 0 SMD0603 DNP
10 R14 1 0, SMD0603
11 IC1 1 SN74AUC1G04DBVR Manu: TI
12 IC2, IC3, IC4 3 SN74AUC2G125DCTR Manu: TI
Reichelt: MicroMaTch-
13 J2 1 MICRO_STECKV_10 Connector: MM FL 10G Put jumper on Position 1 and
14 JP1 1 2x2 Header JP2Q 2. Do not mix direction.
15 JP2 1 2-pin header, male, TH SAM1035-02-ND place jumper on header
16 JTAG 1 14-pin connector, male, TH HRP14H-ND
BC817-25LT1SMD, SOT23- Digi-Key: BC817-
17 Q1 1 BEC 25LT1GOSCT-ND
18 U1, U2 2 TLVH431IDBVR SOT23-5 Manu: TI
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Jumper JP2
Open to measure current
Orient Pin 1 of MSP430 device
D1
LED connected to P1.0
Jumper JP3
Open to disconnect LED
Connector J5
External power connector
Jumper JP1 to "ext"
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
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MSP-TS430PW24
Figure B-10. MSP-TS430PW24 Target Socket Module, PCB
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MSP-TS430PW24
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Table B-6. MSP-TS430PW24 Bill of Materials
No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C5 1 2.2nF, SMD0805
3 C3, C7 2 10uF, 10V, SMD0805
4 C4, C6, C8 3 100nF, SMD0805 478-3351-2-ND
5 D1 1 green LED, SMD0805 P516TR-ND DNP: Headers and receptacles
SAM1029-07-ND
6 J1, J2 0 12-pin header, TH enclosed with kit. Keep vias free of
SAM1213-07-ND solder. (Header and Receptacle)
J5, JP1,
JP4, JP5, Place jumper on 1-2 of JP4-JP9
7 8 3-pin header, male, TH SAM1035-03-ND
JP6, JP7, Place on 1-2 on JP1
JP8, JP9
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND see Pos 7 and 8
14-pin connector, male,
10 JTAG 1 HRP14H-ND
TH
11 Q1 0 Crystal DNP: keep vias free of solder
12 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND
R5, R6, R8,
13 2 0 Ohm, SMD0805 541-000ATR-ND DNP R5, R6
R9,
14 R4 1 47k Ohm, SMD0805 541-47000ATR-ND
Socket: OTS 24(28)-065-
15 U1 1 Manuf.: Enplas
02-00
16 PCB 1 68.5 x 61 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons
17 4 Apply to corners at bottom side
plastic feet 2mm height Part No. SJ-5302
18 MSP430 2 MSP430AFE2xx DNP: enclosed with kit, supplied by TI
52 Hardware SLAU278V–May 2009–Revised May 2015
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ML14
LED3
12pF
12pF
GND
GND
100nF
560R
ML10
JP1Q
JP1Q
10uF/10V
50K
10nF
0R
0R
0R
-
-
0R
-
U1
SOCK28DW
F123
FE14H
FE14L
0R
GND
remove R8 and add R9 (0 Ohm)
If external supply voltage:
remove R11 and add R10 (0 Ohm)
SMD-Footprint
Socket: Yamaichi
2.0
MSP-TS430DW28 Target Socket DW28
Type: IC189-0282-042
If external supply voltage:
R1, C1, C2
not assembled
not assembled
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
D1
C2
C1
C5
R3
BOOTST
12
34
56
78
910
1 2
J5
J4
1
2
C7
R5
C8
R6
R7
R8
R9
R10
R11
R1
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15
16
17
18
19
20
21
22
23
24
25
26
27
28
TST
1
VCC
2
P2.5
3
VSS
4
XOUT
5
XIN
6
RST
7
P2.0
8
P2.1
9
P2.2
10 P2.3 19
P2.4 20
P1.0 21
P1.1 22
P1.2 23
P1.3 24
P1.4 25
P1.5 26
P1.6 27
P1.7 28
P3.0
11
P3.1
12
P3.2
13
P3.3
14 P3.4 15
P3.5 16
P3.6 17
P3.7 18
U2
15
16
17
18
19
20
21
22
23
24
25
26
27
28
J2
J1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
R2
1
2
3
J3
Q1
QUARZ3
P1.0
P1.0
P1.3
P1.3
P1.2
P1.2
P1.1
P1.1
RST/NMI
RST/NMI
RST/NMI
RST/NMI
RST/NMI
TCK
TCK
TCK
TMS
TMS
TMS
TDI
TDI
TDI
TDO
TDO
TDO
XOUT
XOUT
VCC
GND
GND
GND
P2.3
P2.3
P2.4
P2.4
XIN
XIN
P2.5
P2.5
P2.2
P2.2
P2.1
P2.1
P2.0
P2.0
TST/VPP
TST/VPP
TST/VPP
P3.0
P3.0
P3.1
P3.1
P3.2
P3.2
P3.3
P3.3
P3.7
P3.7
P3.6
P3.6
P3.5
P3.5
P3.4
P3.4
VCC430
Ext_PWR
Date: 11/14/2006 1:26:04 PM Sheet: 1/1
REV:
TITLE:
Document Number:
MSP-TS430DW28
+
VCC430
www.ti.com
MSP-TS430DW28
B.6 MSP-TS430DW28
Figure B-11. MSP-TS430DW28 Target Socket Module, Schematic
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Jumper J4
Open to disconnect LED
Orient Pin 1 of
MSP430 device
Jumper J5
Open to measure current
Connector J3
External power connector
Remove R8 and jumper R9
D1
LED connected to P1.0
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
MSP-TS430DW28
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Figure B-12. MSP-TS430DW28 Target Socket Module, PCB
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MSP-TS430DW28
Table B-7. MSP-TS430DW28 Bill of Materials
No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
DNP: C1, C2, Cover holes while
1 C1, C2 0 12pF, SMD0805 soldering
2 C5 1 100nF, SMD0805
3 C7 1 10uF, 10V Tantal Elko B
4 C8 1 10nF SMD0805
5 D1 1 LED3 T1 3mm yellow RS: 228-4991
Micro Crystal MS1V-T1K
6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = DNP: Cover holes while soldering
12.5pF DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder.
7 J1, J2 2 14-pin header, TH male : Header
: Receptacle
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder.
7.1 2 14-pin header, TH female : Header
: Receptacle
8 J3 1 3-Pin Connector, male
9 J4, J5 2 2-Pin Connector, male With jumper
10 BOOTST 0 ML10, 10-Pin Conn., m RS: 482-115 DNP, Cover holes while soldering
11 JTAG 1 ML14, 14-Pin Conn., m RS: 482-121
R1, R2, R6,
12 R7, R8,R9, 4 0R, SMD0805 DNP: R1, R2, R9, R10
R10, R11
13 R3 1 560R, SMD0805
14 R5 1 47K, SMD0805 Yamaichi: IC189-0282-
15 U1 1 SOP28DW socket 042
16 U2 0 TSSOP DNP
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12pF
12pF
GND
GND
100nF
330R
10uF/10V -
0R
GND
GND
green
2.2nF
47k GND
0R 0R
330R
MSP430F12xx
If external supply voltage:
remove R11 and add R10 (0 Ohm)
3.1
MSP-TS430PW28:
OTS-28-0.65-01
Socket: Enplas
Vcc int
ext
Target Socket Board for MSP430's in PW28 package
DNP
DNP
DNP
DNP
DNP
DNP
DNP
JTAG ->
SBW ->
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2
DNP
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
C2
C1
C4
R1
12
34
56
78
910
BOOTST
C3
R2
R3
1
2
3
J5
JP1
1
2
3
JP2
1
2
1
2
JP3
D1
C5
R4
JP4
1
2
3
JP5
1
2
3
JP6
1
2
3
JP7
1
2
3
JP8
1
2
3
JP9
1
2
3
R5 R6
21
Q1
R7
J1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
J2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
U1
TST
1
VCC
2
P2.5
3
VSS
4
XOUT
5
XIN
6
RST
7
P2.0
8
P2.1
9
P2.2
10 P2.3 19
P2.4 20
P1.0 21
P1.1 22
P1.2 23
P1.3 24
P1.4 25
P1.5 26
P1.6 27
P1.7 28
P3.0
11
P3.1
12
P3.2
13
P3.3
14 P3.4 15
P3.5 16
P3.6 17
P3.7 18
P1.0
P1.0
RST/NMI
TMS
TDI
VCC
GND
GND
VCC430
VCC430
P2.0
P1.1
P1.1
P3.3
P3.2
P3.1
P3.0
P2.2
P2.2
XIN/P2.6
XIN/P2.6
XOUT/P2.7
XOUT/P2.7
P2.1
RST/SBWTDIO
RST/SBWTDIO
RST/SBWTDIO
P3.4
P3.5
P3.6
P3.7
P2.3
P2.4
P1.2
P1.3
P1.4/TCK
P1.4/TCK
P1.5/TMS
P1.5/TMS
P1.6/TDI
P1.6/TDI
P1.7/TDO
P1.7/TDO
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
P2.5
TCK/SBWTCK
TDO/SBWTDIO
XTLGND
Ext_PWR
+
MSP-TS430PW28
www.ti.com
B.7 MSP-TS430PW28
Figure B-13. MSP-TS430PW28 Target Socket Module, Schematic
56 Hardware SLAU278V–May 2009–Revised May 2015
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Jumper JP2
Open to measure current
Jumper JP3
Open to disconnect LED
D1
LED connected to P5.1
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Jumper JP4 to JP9:
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Connector J5
External power connector
Jumper JP1 to “ext”
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MSP-TS430PW28
Figure B-14. MSP-TS430PW28 Target Socket Module, PCB
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MSP-TS430PW28
www.ti.com
Table B-8. MSP-TS430PW28 Bill of Materials(1)
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
DNP: C1, C2 , Cover holes
1 C1, C2 0 12pF, SMD0805 while soldering
2 C3 1 10uF, 10V Tantal Elko B
3 C4 1 100nF, SMD0805
4 C5 0 2.2nF, SMD0805 DNP
5 D1 1 LED green SMD0603 Micro Crystal MS1V-T1K DNP: Cover holes and
6 Q1 0 QUARZ, Crystal 32.768kHz, C(Load) = neighboring holes while
12.5pF soldering
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
7 J1, J2 2 14-pin header, TH male : Header
: Receptacle
DNP: headers and
receptacles enclosed with
kit.Keep vias free of solder.
7.1 2 14-pin header, TH female : Header
: Receptacle
8 J5, IP1 1 3-Pin Connector , male
JP1, JP4,
JP5, JP6,
8a 7 3-Pin Connector , male Jumper on Pos 1-2
JP7, JP8,
JP9
9 JP2, JP3 2 2-Pin Connector , male with Jumper
DNP: Cover holes while
10 BOOTST 0 ML10, 10-Pin Conn. , m RS: 482-115 soldering
11 JTAG 1 ML14, 14-Pin Conn. , m RS: 482-121
12 R1, R7 2 330R, SMD0805
R2, R3, R5,
12 0 0R, SMD0805 DNP
R6
14 R4 1 47K, SMD0805
15 U1 1 SOP28PW socket Enplas: OTS-28-0.65-01
(1) PCB 66 x 79 mm, two layers; Rubber stand off, four pieces
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JTAG Mode selection:
4-wire JTAG: Set jumpers J4 to J9 to position 2-3
2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1
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MSP-TS430PW28A
B.8 MSP-TS430PW28A
Figure B-15. MSP-TS430PW28A Target Socket Module, Schematic
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Jumper JP2
Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P1.0
Connector J5
External power connector
Jumper JP1 to "ext"
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
MSP-TS430PW28A
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Figure B-16. MSP-TS430PW28A Target Socket Module, PCB (Red)
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MSP-TS430PW28A
Table B-9. MSP-TS430PW28A Bill of Materials
No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C5 1 2.2nF, SMD0805
3 C3 1 10uF, 10V, SMD0805
4 C4, C6, 2 100nF, SMD0805 478-3351-2-ND
5 D1 1 green LED, SMD0805 P516TR-ND DNP: Headers and receptacles
6 J1, J2 0 14-pin header, TH enclosed with kit. Keep vias free of
solder: (Header and Receptacle)
J5, JP1,
JP4, JP5, Place jumper on 1-2 of JP4-JP9 Place
7 8 3-pin header, male, TH SAM1035-03-ND
JP6, JP7, on 1-2 on JP1
JP8, JP9
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND see Pos 7 an 8
14-pin connector, male,
10 JTAG 1 HRP14H-ND
TH
11 BOOTST 0 DNP Keep vias free of solder
Micro Crystal MS3V
12 Q1 0 Crystal 32.768kHz, C(Load) = DNP: keep vias free of solder
12.5pF
13 R1, R7 2 330 Ω, SMD0805 541-330ATR-ND
R2, R3,R5,
14 0 0 Ohm, SMD0805 541-000ATR-ND DNP R2, R3,R5, R6
R6,
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: OTS-28-0.65-01 Manuf.: Enplas
17 PCB 1 63.5 x 64.8 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons
18 4 Apply to corners at bottom side
plastic feet 2mm height Part No. SJ-5302
19 MSP430 2 MSP430G2553IPW28 DNP: enclosed with kit, supplied by TI
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DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
GND
0R
330R
2.2nF
PWR3
GND
GND
0R
47K
470nF
100nF
100nF10uF
GND
GND
20k/0.1%
10k
10k
10k
10k
GND
AVSS
AVSS
10k
10k
10k
10k
GND
SAM1029-08-ND1-8
SAM1029-08-ND9-16
MSP430I2040TRHBQFN11T032-003
SAM1029-08-ND17-2417-24
SAM1029-08-ND25-32
1.0
for MSP430i2040
MSP430: Target-Socket MSP-TS430RHB32A
DNP
<- SBW
<- JTAG
Vcc
int
ext
Socket:
Yamaichi
QFN11T032-003
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
R1
R3
C8
J5
1
2
3
JP1
1
2
1
2
JP2
R4
1
2
3
JP4
1
2
3
JP9
1
2
3
JP8
1
2
3
JP7
1
2
3
JP6
1
2
3
JP5
R5
D1
C9
1
2
3
JP3
C14
C13C12
R2
R6
R8
R9
R10
R11
R12
R13
R14
1
2
3
4
5
6
7
8
J1
9
10
11
12
13
14
15
16
J2
A0.0+
1
A0.0-
2
A1.0+
3
A1.0-
4
A2.0+
5
A2.0-
6
A3.0+
7
A3.0-
8
VREF
9
AVSS
10
ROSC
11
DVSS
12
VCC
13
VCORE
14
P2.3/VMONIN 28
P2.2/TA1.2 27
P2.1/TA1.1 26
P2.0/TA1.0/CLKIN 25
P1.7/UCB0SDA/UCB0SIMO/TA1CLK 24
P1.6/UCB0SCL/UCB0SOMI/TA0.2 23
P1.5/UCB0CLK/TA0.1 22
P1.4/UCB0STE/TA0.0 21
P1.3/UCA0TXD/UCA0SIMO/TA0CLK/TDO/TDI 20
P1.2/UCA0RXD/UCA0SOMI/ACLK/TDI/TCLK 19
P1.1/UCA0CLK/SMCLK/TMS 18
P1.0/UCA0STE/MCLK/TCK 17
TEST/SBWTCK
16 RST/NMI/SBWTDIO
15
U1
P2.4/TA1.0 29
P2.5/TA0.0 30
P2.6/TA0.1 31
P2.7/TA0.2 32
17
18
19
20
21
22
23
24
J3
25
26
27
28
29
30
31
32
J4
TMS
TMS
TDI
TDI
TDO
TDO
TDO
VCC
GND
GND
P1.4
P1.4
DVCC
DVCC
DVCC
AVSS
M
M
I
I
O
O
RST/NMI RST/NMI
TCK
TCK
TCK
C
CTEST/SBWTCK
TEST/SBWTCK
VCORE
A0.0+
A0.0-
A1.0+
A1.0-
VREF
ROSC
RST
RST
RST
A2.0+
A2.0-
A3.0+
A3.0-
P1.5
P1.6
P1.7
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
MSP-TS430RHB32A
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B.9 MSP-TS430RHB32A
Figure B-17. MSP-TS430RHB32A Target Socket Module, Schematic
62 Hardware SLAU278V–May 2009–Revised May 2015
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Orient Pin 1 of MSP430 device
D1
LED connected to P1.4
Jumper JP1
Open to measure current
Connector J5
External power connector
Jumper JP3 to “ext”
Connector JTAG
For JTAG Tool
Jumper JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Jumper JP2
Open to disconnect LED
P1.4
14
1
2
GND
GND
VCC
123
123
158
916
17 2420
25 3230
Vcc
ext int
MSP-TS430RHB32A
Rev.: 1.0 RoHS
SBW
JTAG
1
Curr. Meas.
JTAG
R1
R3
C8
J5
JP1
JP2
R4
JP4
JP9
JP8
JP7
JP6
JP5
R5
D1
C9
JP3
C14
C13
C12
R2
R6
R8
R9
R10
R11
R12
R13
R14
J1
J2
U1
J3
J4
123
123
123
123
123
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MSP-TS430RHB32A
Figure B-18. MSP-TS430RHB32A Target Socket Module, PCB
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MSP-TS430RHB32A
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Table B-10. MSP-TS430RHB32A Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 PCB 1 76.9 x 67.6 mm MSP-TS430RHB32A Rev. 1 2 layers, red solder mask
2 D1 1 green LED, DIODE0805 P516TR-ND
3 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
4 JP3, JP4, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
JP5, JP6, (SBW)
JP7, JP8,
JP9
5 R1, R4 2 0R, 0805 541-0.0ATR-ND
6 C8 1 2.2nF, CSMD0805 490-1628-2-ND DNP
7 R6, R8, R9, 8 10k, 0805 311-10KARTR-ND DNP
R10, R11,
R12, R13,
R14
8 C12 1 10uF, CSMD0805 445-1371-2-ND
9 R2 1 20k/0.1%, 0805 P20KDACT-ND
10 R5 1 47K, 0805 311-47KARTR-ND
11 C13, C14 2 100nF, CSMD0805 311-1245-2-ND
12 R3 1 330R, 0805 541-330ATR-ND
13 C9 1 470nF, CSMD0805 445-1357-2-ND
14 J1, J2, J3, J4 1 8-pin header, TH SAM1029-08-ND DNP: headers and
receptacles, enclosed with
kit.
Keep vias free of solder.
15 J1, J2, J3, J4 1 8-pin receptable, TH SAM1213-08-ND DNP: headers and
receptacles, enclosed with
kit.
Keep vias free of solder.
16 JTAG 1 14-pin connector, male, TH HRP14H-ND
17 U1 1 Socket QFN11T032-003 Manuf.: Yamaichi
18 U1 1 MSP430i2041TRHB DNP: enclosed with kit.
Is supplied by TI
19 J5 1 3-pin header, male, TH SAM1035-03-ND
20 Rubber stand 4 Buerklin: 20H1724 apply to corners at bottom
off side
64 Hardware SLAU278V–May 2009–Revised May 2015
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12pF
12pF
GND
GND
100nF
560R
10uF/10V
47k
10nF
-
0R
GND
MSP430F2274IDA
GND 330R
GND
yellow
If external supply voltage:
remove R11 and add R10 (0 Ohm)
IC189-0382-037
Socket:
4-wire JTAG:
2-wire "SpyBiWire":
JTAG-Mode selection: Set jumpers JP4 to JP9 to position 2-3
Set jumpers JP4 to JP9 to position 2-1
JTAG ->
SBW ->
Yamaichi
DNP
DNP
DNP DNP
DNP
DNP
DNP
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
C2
C1
C5
R3
12
34
56
78
910
BOOTST
C7
R5
C8
R10
R11
1
2
3
J3
Q1
TEST/SBWTCK
1
P3.5 26
P3.6 27
P1.4/TCK 35
RST/SBWDAT
7
DVCC
2
DVSS
4
P4.7 24
P3.7 28
AVSS
15
AVCC
16
P3.0
11
P3.1
12
P3.2
13
P3.3
14
P4.0
17
P4.1
18
P4.2
19
P3.4 25
P2.5
3
P2.4 30
P2.3 29
P2.2
10 P2.1
9P2.0
8
P1.5/TMS 36
P1.6/TDI 37
P1.7/TDO 38
P2.7
5
P2.6
6
P4.6 23
P4.5 22
P4.4 21
P4.3 20
P1.0 31
P1.1 32
P1.2 33
P1.3 34
U1
JP1
1
2
3
JP2
1
2
1
2
JP3
1
2
3
JP4 JP5
1
2
3
JP6
1
2
3
JP7
1
2
3
JP8
1
2
3
R1
JP9
1
2
3
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
1
J1
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
20
J2
D1
P1.0
P1.0
RST/NMI
TMS
TDI
VCC
GND
GND
GND
VCC430
VCC430
VCC430
TCK/SBWTCK
TDO/SBWTDIO
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
P2.5
P2.0
P2.1
P3.0
P3.1
P3.2
P3.3
P4.0
P4.1
P4.2
P1.7/TDO
P1.7/TDO
P1.6/TDI
P1.6/TDI
P1.5/TMS
P1.5/TMS
P1.4/TCK
P1.4/TCK
P1.3
P1.2
P1.1
P1.1
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
P4.7
P4.6
P4.5
P4.4
P4.3
P2.7/XOUT
P2.7/XOUT
P2.6/XIN
P2.6/XIN
RST/SBWTDIO
RST/SBWTDIO
RST/SBWTDIO
P2.2
P2.2
Ext_PWR
Date: 6/18/2008 11:04:56 AM Sheet: 1/1
REV:
TITLE:
Document Number:
MSP-TS430DA38
+
1.3
MSP-TS430DA38:
Vcc int
ext
Target Socket Board for MSP430F2247IDA
www.ti.com
MSP-TS430DA38
B.10 MSP-TS430DA38
Figure B-19. MSP-TS430DA38 Target Socket Module, Schematic
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Orient pin 1 of MSP430 device
D1
LED connected to P1.0
Connector J3
External power connector
Jumper JP1 to "ext"
Jumper JP3
Open to disconnect LED
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
MSP-TS430DA38
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Figure B-20. MSP-TS430DA38 Target Socket Module, PCB
66 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430DA38
Table B-11. MSP-TS430DA38 Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 0 2.2nF, SMD0805 DNP
5 D1 1 green LED, SMD0603 475-1056-2-ND DNP: headers and
receptacles enclosed with
kit.Keep vias free of solder.
6 J1, J2 0 19-pin header, TH SAM1029-19-ND : Header
SAM1213-19-ND : Receptacle
"J3, JP1, Place jumpers on headers
JP4, JP5,
7 8 3-pin header, male, TH SAM1035-03-ND JP1, JP4,JP5, JP6, JP7, JP8,
JP6, JP7, JP9; Pos 1-2
JP8, JP9"
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 9 Jumper 15-38-1024-ND Place on: JP1 - JP9; Pos 1-2
10 JTAG 1 14-pin connector, male, TH HRP14H-ND DNP: Keep vias free of
11 BOOTST 0 10-pin connector, male, TH solder
Micro Crystal MS1V-T1K DNP: Keep vias free of
12 Q1 0 Crystal 32.768kHz, C(Load) = solder
12.5pF
13 R1, R3 2 330 Ω, SMD0805 541-330ATR-ND
14 R10, R11 0 0 Ω, SMD0805 541-000ATR-ND DNP
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC189-0382--037 Manuf.: Yamaichi
17 PCB 1 67 x 66 mm 2 layers
Adhesive for example, 3M Bumpons Apply to corners at bottom
18 4 ~6mm width, 2mm height
Plastic feet Part No. SJ-5302 side
DNP: enclosed with kit
19 MSP430 2 MSP430F2274IDA supplied by TI
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D1
LED connected to P1.0
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP3
Open to disconnect LED
Jumper JP2
Open to measure current
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Orient Pin 1 of MSP430 device
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MSP-TS430QFN23x0
Figure B-22. MSP-TS430QFN23x0 Target Socket Module, PCB
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MSP-TS430QFN23x0
www.ti.com
Table B-12. MSP-TS430QFN23x0 Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C3 1 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C4 1 100nF, SMD0805 478-3351-2-ND
4 C5 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 green LED, SMD0603 475-1056-2-ND DNP: headers and
receptacles enclosed with
kit.Keep vias free of solder.
6 J1, J2, J3, J4 0 10-pin header, TH SAM1034-10-ND : Header
SAM1212-10-ND : Receptacle
Place jumper on header JP1;
7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND Pos 1-2.
8 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3
10 JTAG 1 14-pin connector, male, TH HRP14H-ND DNP: Keep vias free of
11 BOOTST 0 10-pin connector, male, TH solder
Micro Crystal MS1V-T1K DNP: Keep vias free of
12 Q1 0 Crystal 32.768kHz, C(Load) = solder
12.5pF
13 R1 1 330 Ω, SMD0805 541-330ATR-ND
14 R2, R3 0 0 Ω, SMD0805 541-000ATR-ND DNP
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas
17 PCB 1 79 x 66 mm 2 layers
Adhesive for example, 3M Bumpons Apply to corners at bottom
18 4 ~6mm width, 2mm height
Plastic feet Part No. SJ-5302 side
DNP: enclosed with kit
19 MSP430 2 MSP430F2370IRHA supplied by TI
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Jumper JP2
Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P1.0
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector J5
External power connector
Jumper JP1 to "ext"
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
MSP-TS430RSB40
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Figure B-24. MSP-TS430RSB40 Target Socket Module, PCB
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MSP-TS430RSB40
Table B-13. MSP-TS430RSB40 Bill of Materials
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
C3, C7, C10,
2 3 10uF, 10V, SMD 0805 445-1371-1-ND DNP C12
C12
C4, C6, C8,
3 3 100nF, SMD0805 311-1245-2-ND DNP C11
C11
4 C5 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805
6 D1 1 green LED, SMD0805 P516TR-ND DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
7 J1, J2, J3, J4 4 10-pin header, TH : Header
: Receptacle
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
7.1 4 10-pin header, TH : Header
: Receptacle
JP1, JP4,JP5, Jumper: 1-2 on JP1, JP10; 2-3
8 JP6, JP7, JP8, 9 3-pin header, male, TH SAM1035-03-ND on JP4-JP9
JP9, J5, JP10
9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP. Keep vias free of solder
QFN-40B-0.4_
12 U1 1 Enplas
ENPLAS_SOCKET Micro Crystal MS3V-T1R DNP: Q1. Keep vias free of
13 Q1 0 Crystal 32.768kHz, C(Load) = 12.5pF solder
Place on: JP1, JP2, JP3, JP4,
15 10 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9, JP10
16 R1,R7 2 330R SMD0805
R2, R3, R5,
17 R6, R8, R9, 3 0R SMD0805 DNP R2, R3, R5, R6
R10
18 R4 1 47k SMD0805 DNP: enclosed with kit. Is
19 MSP430 2 MSP430F5132 supplied by TI
Rubber stand select appropriate; for example,
20 4 apply to corners at bottom side
off Buerklin: 20H1724
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Jumper JP2
Open to measure current
Connector J5
External power connector
Jumper JP1 to "ext"
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
D1
LED connected to P1.0
Jumper JP3
Open to disconnect LED
Orient Pin 1 of MSP430 device
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
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MSP-TS430RHA40A
Figure B-26. MSP-TS430RHA40A Target Socket Module, PCB
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MSP-TS430RHA40A
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Table B-14. MSP-TS430RHA40A Bill of Materials
No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
2 C5 0 2.2nF, SMD0805 DNP C12
3 C3, C7 2 10uF, 10V, SMD0805 5 DNP C11
4 C4, C6 2 100nF, SMD0805 478-3351-2-ND
5 C9 1 470nF, SMD0805
6 D1 1 green LED, SMD0805 P516TR-ND DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
J1, J2, J3,
7 4 10-pin header, TH
J4 : Header
: Receptacle
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
7.1 4 10-pin header, TH : Header
: Receptacle
J5, JP1,
JP4, JP5, Place jumper on 1-2 of JP4-JP9; Place
8 8 3-pin header, male, TH SAM1035-03-ND
JP6, JP7, on 1-2 on JP1
JP8, JP9
9 JP2, JP3 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10 9 Jumper 15-38-1024-ND see Pos 8 an 9
14-pin connector, male,
11 JTAG 1 HRP14H-ND
TH
10-pin connector, male,
12 BOOTST 0 DNP. Keep vias free of solder
TH
13 U1 1 Socket: QFN-40B-0.5-01 Manuf.: Enplas
Micro Crystal MS3V-T1R
14 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1. Keep vias free of solder
12.5pF
15 R1,R7 2 330R SMD0805 541-330ATR-ND
R2, R3, R5,
16 2 0 Ohm, SMD0805 541-000ATR-ND DNP:R2, R3, R5, R6
R6, R8, R9,
17 R4 1 47k SMD0805
18 PCB 1 79 x 66 mm 2 layers
select appropriate; for
Rubber
19 4 example, Buerklin: apply to corners at bottom side
stand off 20H1724
20 MSP430 2 MSP430N5736IRHA DNP: enclosed with kit. Is supplied by TI
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ML14
LED3
12pF
12pF
GND
GND
100nF
560R
ML10
JP1Q
JP1Q
10uF/10V
47K
10nF
0R
0R
GND
0R
0R
10uF/10V
GND
IC51-1387.KS-15186
100nF
1.3
MSP-TS430DL48 Target Socket DL48
Q1, C1, C2
not assembled
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
D1
C2
C1
C5
R3
BOOTST
12
34
56
78
910
1 2
J5
J4
1
2
C7
R5
C8
R6
R7
1
2
3
J3
Q1
QUARZ3
J2
1
3
5
2
4
6
7
9
8
10
11
13
15
12
14
16
17
19
18
20
21
23
22
24
1
3
5
2
4
6
7
9
8
10
11
13
15
12
14
16
17
19
18
20
21
23
22
24
J1
R12
R4
JP1
1
2
3
1
2
3
JP2
C4
U1
TDO/TDI
1
TDI/TCLK
2
TMS
3
TCK
4
RST/NMI
5
DVCC
6
DVSS
7
XIN
8
XOUT
9
AVSS
10
AVCC
11
VREF+
12
P6.0
13
P6.1
14
P6.2
15
P6.3
16
P6.4
17
P6.5
18
P6.6
19
P6.7
20
P2.5 39
P2.4 40
P2.3 41
P2.2 42
P2.1 43
P2.0 44
COM0 45
P5.2 46
P5.3 47
P5.4 48
LCDREF 29
LCDCAP 30
P5.1 31
P5.0 32
P5.5 33
P5.6 34
P5.7 35
S5 36
P2.7 37
P2.6 38
P1.7
21
P1.6
22
P1.5
23
P1.4
24
P1.0 28
P1.1 27
P1.2 26
P1.3 25
C3
P1.0
P1.0
RST/NMI
RST/NMI
RST/NMI
TCK
TCK
TCK
TMS
TMS
TDI
TDI
TDO
TDO
XOUT XOUT
GND
GND
GND
XIN
XIN
BSL_TX
VCC
BSL_RX
Ext_PWR
Date: 11/14/2006 1:24:44 PM Sheet: 1/1
REV:
TITLE:
Document Number:
MSP-TS430DL48
+
+
Vcc ext
int
int
ext
Vcc
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MSP-TS430DL48
B.14 MSP-TS430DL48
Figure B-27. MSP-TS430DL48 Target Socket Module, Schematic
77
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Jumper J4
Open to disconnect LED
D1
LED connected to P1.0
Orient pin 1 of MSP430 device
Jumper J5
Open to measure current
Connector J3
External power connector
Jumper JP2 to "ext"
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP2
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
MSP-TS430DL48
www.ti.com
Figure B-28. MSP-TS430DL48 Target Socket Module, PCB
78 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430DL48
Table B-15. MSP-TS430DL48 Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C4, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C3, C5 2 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
6 J1, J2 0 24-pin header, TH SAM1034-12-ND : Header
SAM1212-12-ND : Receptacle
Place jumper on header JP1;
7 J3, JP1, JP2 2 3-pin header, male, TH SAM1035-03-ND Pos 1-2. DNP: JP2
8 J4, J5 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 3 Jumper 15-38-1024-ND Place on: JP1, J4, J5
10 JTAG 1 14-pin connector, male, TH HRP14H-ND DNP: Keep vias free of
11 BOOTST 0 10-pin connector, male, TH solder
Micro Crystal MS1V-T1K DNP: Keep vias free of
12 Q1 0 Crystal 32.768kHz, C(Load) = solder
12.5pF
13 R3 1 560 Ω, SMD0805 541-560ATR-ND
R4, R6, R7,
14 2 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R7
R12
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC51-1387 KS-15186 Manuf.: Yamaichi
17 PCB 1 58 x 66 mm 2 layers
Adhesive for example, 3M Bumpons Apply to corners at bottom
18 4 ~6mm width, 2mm height
Plastic feet Part No. SJ-5302 side
DNP: Enclosed with kit
19 MSP430 2 MSP430F4270IDL supplied by TI
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Jumper JP2
Open to disconnect LED
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
D1
LED connected to P1.0
Jumper JP1
Open to measure current
Orient Pin 1 of MSP430 device
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
www.ti.com
MSP-TS430RGZ48B
Figure B-30. MSP-TS430RGZ48B Target Socket Module, PCB
81
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MSP-TS430RGZ48B
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Table B-16. MSP-TS430RGZ48B Bill of Materials
No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
3 C6, C7, C12 3 10uF, 6.3V, SMD0805
C5, C11,
4 4 100nF, SMD0805 311-1245-2-ND
C13, C14
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 D1 1 green LED, SMD0805 P516TR-ND
SAM1029-12-ND DNP: Headers and receptacles
J1, J2, J3,
8 0 12-pin header, TH (Header) SAM1213-12- enclosed with kit. Keep vias free of
J4 ND (Receptacle) solder:
9 J5 1 3-pin header, male, TH
JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,
JP6, JP7,
10 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers on
JP8, JP9, pins 1-2 on JP3,
JP10
11 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
12 9 Jumper 15-38-1024-ND See Pos. 10and Pos. 11
14-pin connector, male,
13 JTAG 1 HRP14H-ND
TH
10-pin connector, male,
14 BOOTST 0 "DNP Keep vias free of solder"
TH Micro Crystal MS3V-T1R
15 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pF
Q2: 4MHz Buerklin:
16 Q2 0 Crystal DNP: Q2 Keep vias free of solder
78D134
http://www.ettinger.de/Art_
Insulating
17 0 Insulating disk to Q2 Detail.cfm?ART_ARTNUM
disk to Q2 =70.08.121
18 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R8,
19 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
R9,R10,
R11, R12
20 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Socket: QFN11T048-
21 U1 1 Manuf.: Yamaichi
008_A101121_RGZ48
22 PCB 1 81 x 76 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons
23 4 Apply to corners at bottom side
plastic feet 2mm height Part No. SJ-5302
24 MSP430 2 MSP430F5342IRGZ DNP: enclosed with kit, supplied by TI
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DNP
DNP
DNP
GND
GND
100nF
330R
-0R
GND
GND
1.1nF
47k GND
0R 0R
0R
QUARZ5
1uF/10V
100nF1uF/10V
green
DNP
yellow (DNP)
DNP
red (DNP)
0R
GND
DNP
DNP
0R0R
QUARZ5
EVQ11
0R
DNP
DNP
If external supply voltage:
remove R3 and add R2 (0 Ohm)
1.2
Ext_PWR
MSP-TS430RGZ48C
Vcc int
ext
Target Socket Board for MSP430FR58xx, FR59xx IRGZ
DNP
DNP
DNP
DNP
DNP
JTAG ->
SBW ->
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2
connection by via
DNP
DNP
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
C2
C1
C4
R1
1 2
3 4
5 6
7 8
9 10
BOOTST
R2R3
1
2
3
J2
J1
1
2
3
JP1
1
2
1
2
JP9
C5
R4
1
2
3
JP3
1
2
3
JP4
1
2
3
JP5
1
2
3
JP6
1
2
3
JP7
1
2
3
JP8
R5 R6
R7
Q1
C3
C6C7
D1
R10
1
2
JP10
D2
R11
1
2
JP11
D3
R12
JP2
1
2
C8
C9
R8R9
Q2
SV4
1
2
3
4
5
6
7
8
9
10
11
12
SV1
1
2
3
4
5
6
7
8
9
10
11
12
SV2
1
2
3
4
5
6
7
8
9
10
11
12
SV3
1
2
3
4
5
6
7
8
9
10
11
12
1_P1.0
1
2_P1.1
2
3_P1.2
3
4_P3.0
4
5_P3.1
5
6_P3.2
6
7_P3.3
7
8_P4.7
8
9_P1.3
9
10_P1.4
10
11_P1.5
11
12_PJ.0_TDO
12
13_PJ.1_TDI
13
14_PJ.2_TMS
14
15_PJ.3/TCK
15
16_P4.0
16
17_P4.1
17
18_P4.2
18
19_P4.3
19
20_P2.5
20
21_P2.6
21
22_TEST/SBWTCK
22
23_RST/SBWTDIO
23
24_P2.0
24
25_P2.1 25
26_P2.2 26
27_P3.4 27
28_P3.5 28
29_P3.6 29
30_P3.7 30
31_P1.6 31
32_P1.7 32
33_P4.4 33
34_P4.5 34
35_P4.6 35
36_DVSS 36
37_DVCC 37
38_P2.7 38
39_P2.3 39
40_P2.4 40
41_AVSS 41
42_HFXIN 42
43_HFXOUT 43
44_AVSS 44
45_LFXIN 45
46_LFXOUT 46
47_AVSS 47
48_AVCC 48
U1
SW1
R13
TP2TP1
SW2
R14
P1.0
P1.0
RST/NMI
TMS
TDI
VCC
GND
P1.1
P1.1
RST/SBWTDIO
RST/SBWTDIO
RST/SBWTDIO
TCK/SBWTCK
TDO/SBWTDIO
PJ.0/TDO
PJ.0/TDO
PJ.2/TMS
PJ.2/TMS
PJ.3/TCK
PJ.3/TCK
PJ.1/TDI
PJ.1/TDI
P1.2
P1.2
P2.0
P2.0
P2.1
P2.1
P1.3
P1.3
P1.4
P1.5
AVCC
AVCC
AVSS
AVSS
AVSS
AVSS
LFXOUT
LFXIN
LFGND HFGND
HFXOUT
HFXIN
P2.4
P2.3
P2.7
DVCC
DVCC
DVCC
DVCC
DVSS
DVSS
P4.6
P4.5
P4.4
P1.7
P1.6
P3.7
P3.6
P3.5
P3.4
P2.2
P2.6
P2.5
P4.3
P4.2
P4.1
P4.0
P4.7
P3.3
P3.2
P3.1
P3.0
TEST/SBWTCK1
TEST/SBWTCK1
TEST/SBWTCK
TEST/SBWTCK
www.ti.com
MSP-TS430RGZ48C
B.16 MSP-TS430RGZ48C
Figure B-31. MSP-TS430RGZ48C Target Socket Module, Schematic
83
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Jumper JP1
Open to measure current
Connector J2
External power connector
Jumper J1 to "ext"
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Switch SW1
Device reset
LEDs connected to
P1.0, P1.1, P1.2 via
JP9, JP10, JP11
(only D1 assembled)
Orient Pin 1 of MSP430 device
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper J1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Jumper JP2
Analog/digital power
Switch SW2
Connected to P1.3
HF ands LF oscillators with capacitors
and resistors to connect pinheads
1
Vcc
ext
int
Vcc
GND
GND
JTAG
SBW
5
10
1520
25
30
35
40 45
RESET
Ext.
Pwr.
PWR
DVCC
AVCC
TCK TMS TDI TDO
RST/SBWTDIO TEST/SBWTCK
GND
GND
P1.3
14
1
2
10
1
2
123
123
123
123
123
123
123
QFN11T048-008 A101121
Clamshell
MSP-TS430RGZ48C
Rev. 1.2 RoHS
Q2
Q1
P1.0
P1.1
P1.2
JTAG
C2
C1
C4
R1
BOOTST
R2
R3
J2
J1
JP1
JP9
C5
R4
JP3
JP4
JP5
JP6JP7
JP8
R5
R6
R7
C3
C6
C7
D1
R10
JP10 D2
R11
JP11
D3
R12
JP2
C8
C9 R8
R9
U1
SW1
R13
TP2
TP1
SW2
R14
MSP-TS430RGZ48C
www.ti.com
Figure B-32. MSP-TS430RGZ48C Target Socket Module, PCB
NOTE: LFOSC and HFOSC pins are swapped at SV1.
42_HFXIN (pin 42) →SV1 (pin 7)
43_HFXOUT (pin 43) →SV1 (pin 6)
45_LFXIN (pin 45) →SV1 (pin 10)
46_LFXOUT (pin 46) →SV1 (pin 9)
84 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430RGZ48C
Table B-17. MSP-TS430RGZ48C Bill of Materials
Number
Pos Ref Des Per Description Digi-Key Part Number Comment
Board
1 SV1, SV2, SV3, 4 12-pin header, TH DNP: headers and receptacles enclosed with kit.
SV4 Keep vias free of solder.
SAM1029-12-ND : Header
: Receptacle
1.1 SV1, SV2, SV3, 4 12-pin receptable, TH DNP: headers and receptacles enclosed with kit.
SV4 Keep vias free of solder.
: Header
SAM1213-12-ND : Receptacle
2 JP1, JP2, JP9 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
3 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP
4 J1, JP3, JP4, JP5, 7 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
JP6, JP7, JP8
5 J2 1 3-pin header, male, TH SAM1035-03-ND
6 JP1, JP2, JP9, J1, 10 Jumper 15-38-1024-ND Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,
JP3, JP4, JP5, JP6, JP7, JP8
JP7, JP8
7 R2, R3, R5, R6, R8, 9 DNP, 0805 DNP
R9, R10, R11, R14
8 R12, R13, R7 3 0R, 0805 541-000ATR-ND
9 C5 1 1.1nF, CSMD0805 490-1623-2-ND
10 C3, C7 2 1uF, 10V, CSMD0805 490-1702-2-ND
11 R4 1 47k, 0805 541-47000ATR-ND
12 C4, C6 2 100nF, CSMD0805 311-1245-2-ND
13 R1 1 330R, 0805 541-330ATR-ND
14 C1, C2, C8, C9 4 DNP, CSMD0805 DNP
15 SW1, SW2 2 EVQ-11L05R P8079STB-ND DNP
16 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
17 JTAG 1 14-pin connector, male, TH HRP14H-ND
18 Q1 1 DNP: MS3V-TR1 (32768kHz, depends on application Micro Crystal, DNP, enclosed in kit, keep vias free of
20ppm, 12.5pF) solder
19 Q2 1 DNP, Christal depends on application DNP, keep vias free of solder
20 U1 1 Socket: QFN11T048-008 Manuf.: Yamaichi
A101121-001
20.1 U1 1 MSP430FR5969IRGZ DNP: enclosed with kit. Is supplied by TI.
21 D1 1 green LED, DIODE0805 P516TR-ND
22 D3 1 red (DNP), DIODE0805 DNP
23 D2 1 yellow (DNP), DIODE0805 DNP
24 TP1, TP2 2 Testpoint DNP, keep pads free of solder
25 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side
26 PCB 1 79.6 x 91.0 mm MSP-TS430RGZ48C 2 layers, black solder mask
Rev. 1.2
85
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ML14
LED3
0R
12pF
12pF
12pF
12pF
GND
GND
0R
100nF
560R
ML10
JP1Q
JP1Q
10uF/6,3V
10uF/10V
47K 10nF
0R
0R
0R
-
-
0R
-
0R
0R
FE16-1-1
FE16-1-2
FE16-1-3
FE16-1-4
PWR3
GNDGND
-
MSP64PM
not assembled
not assembled
not assembled
not assembled
enhancement
reserved for
future
JTAG
1
3
5
7
9
11
13
2
4
6
12
14
8
10
D1
R2
C2
C1
C3
C4
R1
C5
R3
BOOTST
12
34
56
78
910
J7
1 2
J6
1
2
C6
C7
R5 C8
R6
R7
R8
R9
R10
R11
R12
R13
R14
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
J1
J2
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
J3
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
J4
J5
1
2
3
R4
Q1
LFXTCLK
XTCLK
U2
DVCC
2
3
4
5
6
7
XIN
XOUT
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
TDO
TDI
TMS
TCK
RST
59
60
61
AVSS
DVSS
AVCC
RST/NMI
TCK
TMS
TDI
TDO
VCC
Date: 3/14/2006 10:46:30 AM Sheet: 1/1
REV:
TITLE:
Document Number:
MSP-TS430PM64
+
+
1
MSP-TS430PM64 Target Socket PM64
Yamaichi
IC51-0644-807
Socket:
1.2
for F14x and F41x
Open J6 if LCD
is connected
If external supply voltage:
remove R8 and add R9 (0 Ohm)
If external supply voltage:
remove R11 and add R10 (0 Ohm)
For BSL usage add:
R6 R7 R13 R14
MSP430F14x : 0 0 open open
MSP430F41x : open open 0 0
MSP-TS430PM64
www.ti.com
B.17 MSP-TS430PM64
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be
made.
Figure B-33. MSP-TS430PM64 Target Socket Module, Schematic
86 Hardware SLAU278V–May 2009–Revised May 2015
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Connector J5
External power connection
Remove R8 and jumper R9
D1
LED connected to pin 12
Jumper J6
Open to disconnect LED
Jumper J7
Open to measure current
Orient Pin 1 of
MSP430 device
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
www.ti.com
MSP-TS430PM64
Figure B-34. MSP-TS430PM64 Target Socket Module, PCB
87
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MSP-TS430PM64
www.ti.com
Table B-18. MSP-TS430PM64 Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only recommendation.
1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.
2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND DNP: Headers and receptacles
enclosed with kit.Keep vias free
of solder.
7 J1, J2, J3, J4 0 16-pin header, TH SAM1029-16-ND : Header
SAM1213-16-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
11 2 Jumper 15-38-1024-ND Place on: J6, J7
12 JTAG 1 14-pin connector, male, TH HRP14H-ND
13 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
Q1: Micro Crystal MS1V-T1K
14 Q1, Q2 0 Crystal DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
15 R3 1 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R7, R8, DNP: R4, R6, R7, R9, R10,
16 3 0 Ω, SMD0805 541-000ATR-ND
R9, R10, R11, R11, R12, R13, R14
R12, R13, R14
17 R5 1 47k Ω, SMD0805 541-47000ATR-ND
18 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi
19 PCB 1 78 x 75 mm 2 layers
Rubber
20 4 select appropriate Apply to corners at bottom side
standoff MSP430F2619IPM DNP: Enclosed with kit supplied
21 MSP430 22 MSP430F417IPM by TI
88 Hardware SLAU278V–May 2009–Revised May 2015
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Copyright © 2009–2015, Texas Instruments Incorporated
0R
12pF
12pF
GND
GND
0R
100nF
330R
10uF/6.3V
0R 0R
0R 0R
PWR3
GND
47k
2.2nF
330R
GND
GND
100nF
GND
0R
0R
MSP-TS430PM64A Target Socket
DNP
Yamaichi
IC51-0644-807
Socket:
DNP
1.1
for F4152
Open JP1 if LCD
is connected
JTAG ->
SBW -> DNP
DNP
DNP
DNP DNP
DNP DNP
Vcc
ext
int
TEST/SBWTCK RST/SBWTDIO P7.0/TDO P7.1/TDI P7.2/TMS P7.3/TCK
ADD LCD-CAP!
DNP
DNP
JTAG
1
3
5
7
9
11
13
2
4
6
12
14
8
10
R2
C2
C1
R1
C5
R3
BOOTST
12
34
56
78
910
C6
R10 R11
R13 R14
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
J1
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
J2
J3
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
J4
J5
1
2
3
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
1
2
3
4
5
6
7
8
9
11
12
13
14
15
10
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
21
Q1
R4
C3
1
2
3
JP4 JP5
1
2
3
JP6
1
2
3
JP7
1
2
3
JP8
1
2
3
R6
JP9
1
2
3
1
2
JP1
JP2
1
2
JP3
1
2
3
D1
C4
R5
R7
RST/NMI
TMS
TDI
VCC
GND
XTLGND
TCK/SBWTCK
TDO/SBWTDIO
VCC430
VCC430
VCC430
P5.1
P5.1
AVCC
AVCC
AVSS AVSS P1.0
P1.1
XIN
XOUT
A
A
A
B
B
B
C
C
D
D
E
E
F
F
Date: 3/29/2011 3:07:02 PM Sheet: 1/1
REV:
TITLE:
Document Number:
MSP-TS430PM64A
+
TEST/SBWTCK
RST/SBWTDIO
If supplied locally: populate R10 (0R), remove R11
If supplied by interface: populate R11 (0R), remove R10
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MSP-TS430PM64A
B.18 MSP-TS430PM64A
Figure B-35. MSP-TS430PM64A Target Socket Module, Schematic
89
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Jumper JP2
Open to measure current
Jumper JP1
Open to disconnect LED
D1
LED connected to P5.1
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
MSP-TS430PM64A
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Figure B-36. MSP-TS430PM64A Target Socket Module, PCB
90 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430PM64A
Table B-19. MSP-TS430PM64A Bill of Materials
Pos. Ref Des No. per Board Description Digi-Key Part No. Comment
1 C1, C2, 0 12pF, SMD0805 DNP
2 C3 0 2.2nF, SMD0805 DNP
3 C6, 1 10uF, 10V, Tantal Size B 511-1463-2-ND
4 C4, C5 2 100nF, SMD0805 478-3351-2-ND
5 D1 1 green LED, SMD0805 P516TR-ND DNP: Headers and receptacles
enclosed with kit. Keep vias
free of solder.
6 J1, J2, J3, J4 0 16-pin header, TH SAM1029-16-ND : Header
SAM1213-16-ND : Receptacle
J5, JP3, JP4,
7 JP5, JP6, JP7, 8 3-pin header, male, TH SAM1035-03-ND
JP8, JP9
8 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 2 Jumper 15-38-1024-ND Place on: J6, J7
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
Micro Crystal MS1V-T1K
12 Q1 0 Crystal DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
13 R3, R6 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R5, DNP: R5, R7, R9, R10, R11,
14 R7, R9, R10, 2 0 Ω, SMD0805 541-000ATR-ND R13, R14
R11, R13, R14
15 R4 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC51-0644-807 Manuf.: Yamaichi
17 PCB 1 78 x 75 mm 4 layers
Rubber stand
18 4 select appropriate Apply to corners at bottom side
off DNP: Enclosed with kit
19 MSP430 2 MSP430F4152IPM supplied by TI
91
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DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
Socket: Yamaichi IC51-0644-807
12pF
12pF
100nF
330R
47K
1.1nF
QUARZ5
10uF/10V
0R
0R
LED_Green
330R
LED_Green
330R
LED_Green
EVQ11
EVQ11
MSP430FR413xIPM / MSP430FR203xIPM
0R
0R
100nF
100nF
100nF
100nF
Ext_PWR
Vcc ext
int
to measure supply current JTAG ->
SBW ->
JTAG-Mode selection:
4-wire JTAG: Set jumpers J4 to J9 to position 2-3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 2-1
DNP
DNP
BSLTX
BSLRX
MSP-TS430PM64D
Target Socket Board for MSP430FR413xIPM and MSP430FR203xIPM
1.0
Disconnect JP3 and
JP4 before BSL use.
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
C2
C1
C4
R1
R4
C5
1
2
3
J5
1
2
JP3
1
2
JP2
JP1
1
2
3
JP10
1
2
3
JP9
1
2
3
JP8
1
2
3
JP7
1
2
3
JP6
1
2
3
JP5
1
2
3
Q1
C3
12
34
56
78
910
BSL R10
R11
D1
R5
D2
R6
D3
SW1
SW2
P4.7/R13
1
P4.6/R23
2
P4.5/R33
3
P7.5/L5 59
DVSS
8
DVCC
9
TEST/SBWTCK1
11 RST/NMI/SBWTDIO
10
P1.0/UCA0TXD/UCA0SIMO/A0
24 P1.1/UCA0RXD/UCA0SOMI/A1
23 P1.2/UCA0CLK/A2
22 P1.3/UCA0STE/A3
21 P1.4/MCLK/TCK/A4
20 P1.5/TA0CLK/TMS/A5
19 P1.6/TA0.2/TDI/TCLK/A6
18 P1.7/TA0.1/TDO/A7
17
P7.1/L1 63
P7.2/L2 62
P7.3/L3 61
P7.4/L4 60
P7.0/L0 64
P4.4/LCDC2
4
P4.3/LCDC1
5
P4.2/XOUT
6
P4.1/XIN
7
P4.0/TA1.1
12
P8.3/TA1.2
13
P8.2/TA1CLK
14
P5.5/L37
27
P5.4/L36
28
P5.3/UCB0SOMI/UCB0SCL/L35
29
P5.2/UCB0SIMO/UCB0SDA/L34
30
P5.1/UCB0CLK/L33
31
P5.0/UCB0STE/L32
32
P3.0/L8 56
P3.1/L9 55
P3.2/L10 54
P3.3/L11 53
P3.4/L12 52
P3.5/L13 51
P3.6/L14 50
P3.7/L15 49
P6.0/L16 48
P6.1/L17 47
P6.2/L18 46
P6.3/L19 45
P6.4/L20 44
P6.5/L21 43
P2.0/L24 40
P2.1/L25 39
P2.2/L26 38
P2.3/L27 37
P2.4/L28 36
P2.5/L29 35
P2.6/L30 34
P2.7/L31 33
P8.1/A1CLK/A9
15
P8.0/SMCLK/A8
16
P5.6/L38
26 P5.7/L39
25
P6.6/L22 42
P6.7/L23 41
P7.6/L6 58
P7.7/L7 57
U1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
J1
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
J2
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
J3
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
J4
R2
R3
C6
C7
C8
C9
TP2TP1
1
2
JP4
XOUT
XOUT
GND
GND
GND
XIN
XIN
VCC
RST/SBWTDIO
RST/SBWTDIO
RST/SBWTDIO
TCK
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
VCC430
VCC430
P1.4/TCK
P1.4/TCK
P1.5/TMS
P1.5/TMS
P1.6/TDI
P1.6/TDI
P1.7/TDO
P1.7/TDO
TDO/SBWTDIO
RST/NMI
TMS
TDI
P1.0
P1.0
P1.0
P1.1
P1.1
P1.1
P1.2
P1.2
P1.3
P1.3
P4.7
P4.7
P4.6
P4.6 P4.5
P4.5 P4.4
P4.4 P4.3
P4.3
BSL Interface
1
2
3
4
5
6
1
2
3
4
5
6
Titel:
Datum: Seite 1/1
MSP-TS430PM64D
9/3/2014 3:08:18 PM
A3
I
H
G
F
E
D
C
B
A
ABCDEFGHI
File:
Rev.:
MSP-TS430PM64D
www.ti.com
B.19 MSP-TS430PM64D
Figure B-37. MSP-TS430PM64D Target Socket Module, Schematic
92 Hardware SLAU278V–May 2009–Revised May 2015
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P1.2
P1.1
P1.0
P1.3
RESET
VCC
int
ext
JTAG->
SBW->
MSP-TS430PM64D
Rev. 1.0 RoHS
Curr. Meas.
GND
GND
Disconnect JP3 and
JP4 before BSL use!
14
1
2
GND
GND
VCC
1 2 3
123
123
123
123
123
123
10
1
2
IC51-0644-807
Clamshell
1 16
5 10
32 17202530
33
48 35
40
45
49 6455 60
JTAG
C2
C1
C4
R1
R4 C5
J5
JP3
JP2 JP1
JP10
JP9
JP8
JP7
JP6
JP5
Q1
C3
BSL
R10
R11
D1
R5 D2
R6 D3
SW1 SW2
U1
J1
J2
J3
J4
R2
R3
C6
C7
C8
C9
TP2
TP1
JP4
Connector J5
External power connector
Jumper JP1 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Switch SW1
Device reset
Orient Pin 1 of
MSP430 device
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Jumper JP2
Open to measure current
Switch SW2
Connected to P1.3
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MSP-TS430PM64D
Figure B-38. MSP-TS430PM64D Target Socket Module, PCB
93
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MSP-TS430PM64D
www.ti.com
Table B-20. MSP-TS430PM64D Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 PCB 1 90x96 mm MSP-TS430PM64D Rev. 1.0 2 layers, 90x96mm, white solder
mask
2 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
3 D1 1 Green LED, HSMG-C170, 516-1434-1-ND Avago, Farnell 5790852
DIODE0805
4 D2, D3 2 LED, DIODE0805 DNP
5 JP2, JP3, 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
JP4
6 JP1, JP5, 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3 (JTAG)
JP6, JP7,
JP8, JP9,
JP10
7 R1 1 330R, 0805 541-330ATR-ND
8 R5, R6 2 330R, 0805 541-330ATR-ND DNP
9 R2, R3, 4 0R, 0805 541-0.0ATR-ND DNP
R10, R11
10 R4 1 47K, 0805 311-47KARTR-ND
11 C1, C2 2 12pF, CSMD0805 709-1169-2-ND
12 C3 1 10uF/10V, CSMD0805 445-1371-2-ND
13 C4 1 100nF, CSMD0805 311-1245-2-ND
14 C6, C7, 4 100nF, CSMD0805 311-1245-2-ND DNP
C8, C9
15 C5 1 1.1nF, CSMD0805 490-1623-2-ND
16 J1, J2, J3, 1 16-pin header, TH SAM1029-16-ND DNP: headers and receptacles,
J4 enclosed with kit. Keep vias free
of solder.
17 J1, J2, J3, 1 16-pin receptable, TH SAM1213-16-ND DNP: headers and receptacles,
J4 enclosed with kit. Keep vias free
of solder.
18 JTAG 1 14-pin connector, male, TH HRP14H-ND
19 U1 1 Socket IC51-0644-807 Manuf.: Yamaichi
20 U1 2 MSP430FR4133IPM DNP: enclosed with kit. Is
supplied by TI.
21 J5 1 3-pin header, male, TH SAM1035-03-ND
22 Q1 1 Microcrystal 32768Hz, MS3V-T1R
(32.768kHz, 20ppm, 12.5pF)
23 SW1, SW2 2 Panasonic EVQ11 P8079STB-ND DNP, Lacon: 1251459
24 Rubber 4 Buerklin: 20H1724 apply to corners at bottom side
stand off
94 Hardware SLAU278V–May 2009–Revised May 2015
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DNP
Socket:
Yamaichi C51-0644-807
I2C
UART
P1.7
P2.1
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
BSL Tool Select:
Open = BSL Connector
Closed = JTAG Connector
DNP
DNP
GND
GND
100nF
330R
0R0R
GND
GND
1.1nF
47k GND
0R 0R
QUARZ5
1uF/10V
100nF
1uF/10V
green
DNP
yellow (DNP)
DNP
red (DNP)
0R
GND
DNP
DNP
0R0R
QUARZ5
EVQ11
0R
DNP
DNP
100nF
GND
100nF
GND
4u7
GND
MSP430FR697XPM/RGC
SAM1129-16-ND
SAM1129-16-ND
SAM1129-16-ND
SAM1129-16-ND
10k 10k If external supply voltage:
remove R3 and add R2 (0 Ohm)
Ext_PWR
MSP-TS430PM64F
Vcc int
ext
DNP
DNP
DNP
JTAG ->
SBW ->
DNP
DNP
1.0
DNP
DNP DNP
connection by via
Target Socket Board for MSP430FR697x/687x devices
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
C9
C8
C4
R1
1 2
3 4
5 6
7 8
9 10
BSL
R2R3
1
2
3
J2
1
2
3
J1
1
2
JP1
1
2
JP9
C5
R4
1
2
3
JP3
1
2
3
JP4
1
2
3
JP5
1
2
3
JP6
1
2
3
JP7
1
2
3
JP8
R9 R8
Q2
C3
C11C7
D1
R10
1
2
JP10
D2
R11
1
2
JP11
D3
R12
1
2
JP2
C1
C2
R6R5
Q1
SW1
R13
TP2TP1
SW2
R14
C10
C6
C15
P4.3/UCA0SOMI/UCA0RXD/UCB1STE/S4
1
P1.4/UCB0CLK/UCA0STE/TA1.0/S3
2
P1.5/UCB0STE/UCA0CLK/TA0.0/S2
3
P1.6/UCB0SIMO/UCB0SDA/TA0.1/S1
4
P1.7/UCB0SOMI/UCB0SCL/TA0.2/S0
5
R33/LCDCAP
6
P6.0/R23
7
P6.1/R13/LCDREF
8
P6.2/COUT/R03
9
P6.3/COM0
10
P6.4/TB0.0/COM1/S30
11
P6.5/TB0.1/COM2/S29
12
P6.6/TB0.2/COM3/S28
13
P3.0/UCB1CLK/TA3.2/S27
14
P3.1/UCB1SIMO/UCB1SDA/TA3.3/S26
15
P3.2/UCB1SOMI/UCB1SCL/TA3.4/S25
16
DVSS1
17
DVCC1
18
TEST/SBWTCK
19
RST/NMI/SBWTDIO
20
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1
21
PJ.1/TDI/TCLK/MCLK/SRSCG0
22
PJ.2/TMS/ACLK/SROSCOFF
23
PJ.3/TCK/COUT/SRCPUOFF
24
P3.3/TA1.1/TB0CLK/S24
25
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S23
26
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S22
27
P3.6/UCA1CLK/TB0.2/S21
28
P3.7/UCA1STE/TB0.3/S20
29
P2.3/UCA0STE/TB0OUTH/S19
30
P2.2/UCA0CLK/TB0.4/RTCCLK/S18
31
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0/S17
32
P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK/S16 33
P7.0/TA0CLK/S15 34
P7.1/TA0.0/S14 35
P7.2/TA0.1/S13 36
P7.3/TA0.2/S12 37
P7.4/SMCLK/S11 38
DVSS2 39
DVCC2 40
P1.3/TA1.2/A3/C3 41
P1.2/TA1.1/TA0CLK/COUT/A2/C2 42
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+ 43
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREF- 44
P9.4/A12/C12 45
P9.5/A13/C13 46
P9.6/A14/C14 47
P9.7/A15/C15 48
AVCC1 49
AVSS1 50
PJ.4/LFXIN 51
PJ.5/LFXOUT 52
AVSS2 53
PJ.7/HFXOUT 54
PJ.6/HFXIN 55
AVSS3 56
P5.7/UCA1STE/TB0CLK/S10 57
P4.4/UCB1STE/TA1CLK/S9 58
P4.5/UCB1CLK/TA1.0/S8 59
P4.6/UCB1SIMO/UCB1SDA/TA1.1/S7 60
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S6 61
DVSS3 62
DVCC3 63
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK/S5 64
U1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
J3
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
J4
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
J5
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
J6
1
2
JP13
1
2
JP14
1
2
JP15
1
2
3
JP16
1
2
JP17
1
2
JP18
R7 R15
P1.0
P1.0
RST/NMI
TMS
TDI
VCC
GND
P1.1
P1.1
TCK/SBWTCK
TDO/SBWTDIO
PJ.0/TDO
PJ.0/TDO
PJ.2/TMS
PJ.2/TMS
PJ.3/TCK
PJ.3/TCK
PJ.1/TDI
PJ.1/TDI
P1.2
P1.2
P1.3
P1.3
AVCC
AVCC
AVSS
AVSS
AVSS
AVSS
HFXOUT
HFXIN
HFGND
LFXIN
LFXOUT
DVCC
DVCC
DVCC
DVCC
DVCC
DVCC
DVCC
DVCC
DVSS
DVSS
DVSS
DVSS
TEST/SBWTCK1
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
LCDCAP
LCDCAP
RST/SBWTDIO
RST/SBWTDIO
RST/SBWTDIO
STE
STE
RXD/SIMO
RXD/SIMO
TXD/SOMI/SDA
TXD/SOMI/SDA
SPICLK/SCL
SPICLK/SCL SPICLK/SCL1
SPICLK/SCL1
RXD/SIMO1
RXD/SIMO1
TXD/SOMI/SDA1
P1.6
P1.6
P2.0
P2.0
LFGND
1
2
3
4
5
6
1
2
3
4
5
6
Title:
Date: Page 1/1
MSP-TS430PM64F
10/20/2014 4:38:53 PM
A3
IHGFEDCBA
A B C D E F G H I
File:
Rev.:
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MSP-TS430PM64F
B.20 MSP-TS430PM64F
Figure B-39. MSP-TS430PM64F Target Socket Module, Schematic
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14 1
2
10 1
2
IC51-0644-807
Clamshell
1 5 10 15
202530
35
40
45
50 55 60
R1
C11
D1
R10
D2
R11
D3
U1
J3
J4
J5
J6
R7
R15
Jumper J1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Orient Pin 1 of MSP430 device
LEDs connected to
P1.0, P1.1, P1.2 via
JP9, JP10, JP11
(only D1 assembled)
Switch SW2
Connected to P1.3
Switch SW1
Device reset
Connector J2
External power connector
Jumper J1 to “ext”
HF and LF oscillators with
capacitors and resistors to
connect pinheads
Connector JTAG
For JTAG Tool
Connector BSL
For Bootstrap Loader
Jumper JP1, JP2
Open to measure
digital or analog current
Jumper JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
BSL Tool Select
Jumper JP13 to JP15
Open = BSL Connector
Close = JTAG Connector
Close JP17 and JP18
to enable BSL pullups
BSL Interface Select
Jumper J16
Close 1-2 for I2C
Close 2-3 for UART
Jumper Configuration UART BSL Configuration I2C BSL Configuration
JP17 and JP18 Open Close
JP16 Close 2-3 (UART) Close 1-2 (I2C)
This target board supports UART or I2C BSL configuration. To select the configuration to use, set the
jumpers as shown in the following table.
MSP-TS430PM64F
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Figure B-40. MSP-TS430PM64F Target Socket Module, PCB
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MSP-TS430PM64F
Table B-21. MSP-TS430PM64F Bill of Materials (BOM)
Number
Pos. Ref Des per Description DigiKey Part Number Comment
Board
1 PCB 1 90.0 x 92.5 mm MSP-TS430PM64F Rev. 1.0 2 layers, purple solder mask
JP1, JP2, JP9,
2 6 2-pin header, male, TH SAM1035-02-ND place jumper on header
JP13, JP14, JP15,
3 JP17, JP18 2 2-pin header, male, TH SAM1035-02-ND place jumper on header's pin1 only
4 JP10, JP11 2 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
5 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
JP3, JP4, JP5, JP6,
6 7 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
JP7, JP8, JP16
7 J2 1 3-pin header, male, TH SAM1035-03-ND
8 R2, R5, R6, R8, R9 5 0R, 0805 541-0.0ATR-ND DNP
9 R3, R12, R13 3 0R, 0805 541-0.0ATR-ND
10 C5 1 1.1nF, CSMD0805 490-1623-2-ND
11 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND
12 C15 1 4u7, CSMD0805 445-1370-1-ND DNP
13 R7, R15 1 10k, 0805 541-10KATR-ND
14 R4 1 47k, 0805 541-47KATR-ND
15 C4, C6, C10, C11 4 100nF, CSMD0805 490-1666-1-ND
16 R1 1 330R, 0805 541-330ATR-ND
17 R10, R11 2 330R, 0805 541-330ATR-ND DNP
18 R14 1 47k, 0805 541-47KATR-ND DNP
19 C1, C2, C8, C9 4 DNP, CSMD0805 DNP
20 SW2 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459
21 SW1 1 EVQ-11L05R P8079STB-ND DNP, Lacon: 1251459
DNP: headers enclosed with kit.
22 J3, J4, J5, J6 4 16-pin header, TH SAM1029-16-ND Keep vias free of solder.
DNP: receptacles enclosed with kit.
23 J3, J4, J5, J6 4 16-pin receptacle, TH SAM1213-16-ND Keep vias free of solder.
24 TP1, TP2 2 Testpoint DNP, keep pads free of solder
25 BSL 1 10-pin connector, male, TH HRP10H-ND
26 JTAG 1 14-pin connector, male, TH HRP14H-ND
27 U1 1 Socket:IC51-0644-807 Manuf. Yamaichi
DNP: enclosed with kit.
28 U1 2 MSP430FR6972IPMR Is supplied by TI.
DNP: MS3V-TR1 Micro Crystal, DNP, enclosed in kit,
29 Q1 1 depends on application
(32,768kHz/ 20ppm/12,5pF) keep vias free of solder
30 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder
green LED, HSMG-C170
31 D1 1 516-1434-1-ND Avago, Farnell 5790852
DIODE0805
32 D3 1 red (DNP), DIODE0805 DNP
33 D2 1 yellow (DNP), DIODE0805 DNP
34 Rubber stand off 4 Buerklin: 20H1724 apply to corners at bottom side
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Jumper JP2
Open to disconnect LED
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
D1
LED connected to P1.0
If the system should
be supplied via LDOI (J6),
close JP4 and set JP3 to "ext"
Orient Pin 1 of MSP430 device
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
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MSP-TS430RGC64B
Figure B-42. MSP-TS430RGC64B Target Socket Module, PCB
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MSP-TS430RGC64B
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Table B-22. MSP-TS430RGC64B Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
3 C6, C7, C10 3 10uF, 6.3V, SMD0805
C5, C11,
4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND
C15
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 C16 1 4.7uF, SMD0805
8 C17 1 220nF, SMD0805
9 D1 1 green LED, SMD0805 P516TR-ND
SAM1029-16-ND (Header) DNP: Headers and receptacles enclosed
10 J1, J2, J3, J4 0 16-pin header, TH SAM1213-16-ND with kit. Keep vias free of solder:
(Receptacle)
11 J5 , J6 2 3-pin header, male, TH
JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,
JP6, JP7,
12 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers on
JP8, JP9, pins 1-2 on JP3,
JP10
JP1, JP2,
13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP4
14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13
15 JTAG 1 14-pin connector, male, TH HRP14H-ND
16 BOOTST 0 10-pin connector, male, TH "DNP Keep vias free of solder"
Micro Crystal MS3V-T1R
17 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pF
Q2: 4MHz Buerklin:
18 Q2 0 Crystal DNP: Q2 Keep vias free of solder
78D134
http://www.ettinger.de/Art_
Insulating
19 0 Insulating disk to Q2 Detail.cfm?ART_ARTNUM
disk to Q2 =70.08.121
20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R8,
21 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
R9,R10, R11,
R12
22 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Socket: QFN11T064-006-
23 U1 1 Manuf.: Yamaichi
N-HSP
24 PCB 1 85 x 76 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons
25 4 Apply to corners at bottom side
plastic feet 2mm height Part No. SJ-5302
26 D3,D4
27 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI
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MSP-TS430RGC64C
B.22 MSP-TS430RGC64C
The MSP-TS430RGC64C target board has been designed with the option to operate with the target
device DVIO input voltage supplied via header J6 (see Figure B-43). This development platform does not
supply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper device
operation. For correct JTAG connection, programming, and debug operation, it is important to follow this
procedure:
1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully
discharged to 0 V.
2. Enable the 1.8-V external DVIO power supply.
3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSP-
FET430UIF JTAG debugger interface).
4. Connect the MSP-FET430UIF JTAG connector to the target board.
5. Start the debug session using IAR or CCS IDE.
For more information on debugging the MSP4and MSP430F525x, see the device-specific data sheets
(MSP430F522x: SLAS718; MSP430F525x: SLAS903) and Designing with MSP430F522x and
MSP430F521x Devices (SLAA558).
For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain,
short JP4 with the jumper.
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1.1
MSP-TS430RGC64C
TI Friesing
Tools
MSP430
11
12/14/10 S.G.
6
54321
A
B
C
D
A
B
C
D
Design:
Appr.:
Rev.:
Comment:
Drawing#: Revision:
Page:File: Size:
Title of Schematic
of Mentor Pads Logic V9
Date: Name:
6
54321
MSP-TS430RGC64C.sch
<-- SBW
<-- JTAG
ext
int
VCC
DVIO Power Circle
BSL
1P6.0/CB0/A0
2P6.1/CB1/A1
3P6.2/CB2/A2
4P6.3/CB3/A3
5P6.4/CB4/A4
6P6.5/CB5/A5
7P6.6/CB6/A6
8P6.7/CB7/A7
9P5.0/A8/VEREF+
10 P5.1/A9/VEREF-
11 AVCC
12 P5.4/XIN
13 P5.5/XOUT
14 AVSS
15 DVCC
16 DVSS
17 VCORE
18 P1.0/TA0CLK/ACLK
19 P1.1/TA0.0
20 P1.2/TA0.1
21 P1.3/TA0.2
22 P1.4/TA0.3
23 P1.5/TA0.4
24 P1.6/TA1CLK/CBOUT
25 P1.7/TA1.0
26 P2.0/TA1.1
27 P2.1/TA1.2
28 P2.2/TA2CLK/SMCLK
29 P2.3/TA2.0
30 P2.4/TA2.1
31 P2.5/TA2.2
32 P2.6/RTCCLK/DMAE0
33
P2.7/UCB0STE/UCA0CLK
34
P3.0/UCB0SIMO/UCB0SDA
35
P3.1/UCB0SOMI/UCB0SCL
36
P3.2/UCB0CLK/UCA0STE
37
P3.3/UCA0TXD/UCA0SIMO
38
P3.4/UCA0RXD/UCA0SOMI
39
DVSS
40
DVIO
41
P4.0/PM_UCB1STE
42
P4.1/PM_UCB1SIMO
43
P4.2/PM_UCB1SOMI
44
P4.3/PM_UCB1CLK
45
P4.4/PM_UCA1TXD
46
P4.5/PM_UCA1RXD
47
P4.6/PM_NONE
48
P4.7/PM_NONE
49
P7.0/TB0.0
50
P7.1/TB0.1
51
P7.2/TB0.2
52
P7.3/TB0.3
53
P7.4/TB0.4
54
P7.5/TB0.5
55
BSLEN
56
RST/NMI
57
P5.2/XT2IN
58
P5.3/XT2OUT
59
TEST/SBWTCK
60
PJ.0/TDO
61
PJ.1/TDI/TCLK
62
PJ.2/TMS
63
PJ.3/TCK
64
RSTDVCC/SBWTDIO
65 THERMAL_1
66 THERMAL_2
67 THERMAL_3
68 THERMAL_4
69 THERMAL_5
70 THERMAL_6
71 THERMAL_7
72 THERMAL_8
U1
MSP430F5229
12
34
56
78
910
1112
1314
JTAG
1 2
3 4
5 6
7 8
9 10
BOOTST
CN-ML10
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
J1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
J2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
J3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
J4
1
2
3
JP5
PINHEAD_1X3
1
2
3
JP6
PINHEAD_1X3
1
2
3
JP7
PINHEAD_1X3
1
2
3
JP8
PINHEAD_1X3
1
2
3
JP9
PINHEAD_1X3
1
2
3
JP10
PINHEAD_1X3
1
2
3
J5
PINHEAD_1X3
R7
330R
1
2
3
JP3
C10
10uF
C14
100nF
C5
10uF
C6
100nF
R1
0R
R2
0R
R6
0R R8
0R
C1 12pF
C2
12pF
C7
10uF
C13
100nF
1
2
JP2
R3
330R
1 2
D1
??? R4
0R
C9
470nF
R5
47K
C8
2.2nF
R11
0R
R12
0R
C16
4.7uF
C3
tbd
C4
tbd
R9
0R
R10
0R
C15
100nF
1
2
3
J6
PINHEAD_1X3
1
2
JP4
PINHEAD_1X2
D3
Q2
QUARZ_4PIN
26MHz/ASX53
Q1
1
2
JP1
PINHEAD_1X2
SHC1
SHORTCUT2
GND
GND
GND
GND
XTLGND
VCORE
GND
GND
DVCC
DVCC
GND
XTLGND2
GND
GND
DVCC
GND
RST/NMI
TCK
TMS
TDI
TDO
RSTDVCC_SBWTDIO
TDO
RST/NMI
TCK
C
TCK
M
TMS
I
TDI
O
TDO
DVCC
P1.2/TA0.1
P1.1/TA0.0
TEST/SBWTCK
C
M
I
O
DVCC
P1.1/TA0.0
P1.2/TA0.1
RSTDVCC_SBWTDIO
TEST/SBWTCK
AVSS
MSP-TS430RGC64C
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Figure B-43. MSP-TS430RGC64C Target Socket Module, Schematic
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Connector J5
External power connector for DVCC
Set jumper JP3 to "ext"
IMPORTANT NOTE:
Rev1.0 of the board does not have
connection from pin 4 of BOOTST to
pin 64 of MCU. To use BSL, these pins
should be connected by a wire.
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Orient Pin 1 of MSP430 device
Jumper JP4
For F524x devices, close.
For F522x, F523x, and F525x devices,
close only if one power supply is used
for VCC and DVIO, and if VCC is not
higher then 1.98 V. Otherwise, supply
DVIO over J6.
Do not close if VCC > 1.98 V, as it may
damage the chip.
Connector J6
External power connector
to supply DVIO
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
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MSP-TS430RGC64C
Figure B-44. MSP-TS430RGC64C Target Socket Module, PCB
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MSP-TS430RGC64C
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Table B-23. MSP-TS430RGC64C Bill of Materials
Item Qty Reference Value Description Comment Supplier No.
1 0 C1, C2 12pF CAP, SMD, Ceramic, 0805 DNP C1 C2
2 0 C3, C4 tbd CAP, SMD, Ceramic, 0805 DNP C3 C4
4 3 C5, C7, C10 10uF CAP, SMD, Ceramic, 0805
5 5 C8 C6 C13-15 100nF CAP, SMD, Ceramic, 0805 Digi-Key: 311-1245-2-ND
5 5 C8 2.2nF CAP, SMD, Ceramic, 0805
6 1 C9 470nF CAP, SMD, Ceramic, 0805 Digi-Key: 478-1403-2-ND
7 1 C16 4.7uF CAP, SMD, Ceramic, 0805
8 1 D1 Green LED LED, SMD, 0805
DNP: headers and
receptacles enclosed with
Pin header 1x16: Grid: 100mil
9 4 J1-J4 16-pin header kit. Keep vias free of solder.
(2.54 mm) : Header SAM1029-16-ND
: Receptacle SAM1213-16-ND
Pin header 1x3: Grid: 100mil (2.54
10 2 J5, J6 3-pin header, male, TH SAM1035-03-ND
mm)
JP5, JP6, JP7, Pinheader 1x3: Grid: 100mil (2.54
11 3-pin header, male, TH place jumpers on pins 2-3 SAM1035-03-ND
JP8, JP9, JP10 mm)
Pin header 1x3: Grid: 100mil (2.54
12 JP3 3-pin header, male, TH place jumper on pins 1-2 SAM1035-03-ND
mm)
Pin header 1x2; Grid: 100mil (2.54
13 JP1, JP2, JP4 2-pin header, male, TH place jumper on header SAM1035-02-ND
mm)
Place on: JP1, JP2, JP3,
14 10 Jumper JP4, JP5, JP6, JP7, JP8, 15-38-1024-ND
JP9, JP10
Header, THD, Male 2x7 Pin,
15 1 JTAG 2x7Pin,Wanne HRP14H-ND
Wanne, 100mil spacing
Header, THD, Male 2x5 Pin,
16 0 BOOTST 2x5Pin,Wanne DNP
Wanne, 100mil spacing
17 1 Q1 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz Only Kit.
18 0 Q2 26MHz/ASX53 CRYSTAL, SMD, 5x3MM, 26MHz 300-8219-1-ND
19 1 D3 LL103A DIODE, SMD, SOD123, Schottky Buerklin: 24S3406
20 2 R3, R7 330 Ohm, SMD0805 541-330ATR-ND
21 1 R5 47k Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-47000ATR-ND
R1, R2, R4, R6, DNP: R6, R8, R9, R10,
22 R8, R9, R10, 0 Ohm, SMD0805 RES, SMD, 0805, 1/8W, x% 541-000ATR-ND
R11,R12
R11, R12
23 1 U1 Socket: QFN11T064-006-N-HSP Manuf.: Yamaichi
IC, MCU, SMD, 9.15x9.15mm
24 2 MSP430 MSP430F5229IRGCR Thermal Pad with Socket
apply to corners at bottom
25 4 Rubber stand off Rubber stand off Buerklin: 20H1724
side
26 1 PCB 84 x 76 mm 84 x 76 mm
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MSP-TS430RGC64USB
B.23 MSP-TS430RGC64USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
Figure B-45. MSP-TS430RGC64USB Target Socket Module, Schematic
105
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Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
USB1
USB connector
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Jumper JP1
Open to measure current
MSP-TS430RGC64USB
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Figure B-46. MSP-TS430RGC64USB Target Socket Module, PCB
106 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430RGC64USB
Table B-24. MSP-TS430RGC64USB Bill of Materials
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
C5, C11, C13,
3 4 100nF, SMD0805 311-1245-2-ND
C14
3.1 C10, C12 0 10uF, SMD0805 DNP: C10, C12
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
7 J1, J2, J3, J4 4 16-pin header, TH SAM1029-16-ND : Header
SAM1213-16-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
JP5, JP6, JP7,
9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
JP10
10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
Place on: JP1, JP2, JP3, JP4,
12 10 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
Q1: Micro Crystal MS1V-T1K DNP: Q1
14 Q1 0 Crystal 32.768kHz, C(Load) = 12.5pF Keep vias free of solder
15 Q2 1 Crystal Q2: 4MHz Buerklin: 78D134
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 1 1M Ω, SMD0805
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: QFN11T064-006 Manuf.: Yamaichi
20 PCB 1 79 x 77 mm 2 layers
Rubber stand
21 4 Buerklin: 20H1724 Apply to corners at bottom side
off DNP: enclosed with kit. Is
22 MSP430 2 MSP430F5509 RGC supplied by TI
http://www.ettinger.de/Art_Deta
Insulating disk
23 1 Insulating disk to Q2 il.cfm?ART_ARTNUM=70.08.1
to Q2 21
27 C33 1 220n SMD0603 Buerklin: 53D2074
28 C35 1 10p SMD0603 Buerklin: 56D102
29 C36 1 10p SMD0603 Buerklin: 56D102
30 C38 1 220n SMD0603 Buerklin: 53D2074
31 C39 1 4u7 SMD0603 Buerklin: 53D2086
32 C40 1 0.1u SMD0603 Buerklin: 53D2068
33 D2, D3, D4 3 LL103A Buerklin: 24S3406
34 IC7 1 TPD4E004 Manu: TI
36 LED 0 JP3QE SAM1032-03-ND DNP
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Table B-24. MSP-TS430RGC64USB Bill of Materials (continued)
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP
38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP
39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP
40 R13, R15, R16 0 470R Buerklin: 07E564 DNP
41 R33 1 1k4 / 1k5 Buerklin: 07E612
42 R34 1 27R Buerklin: 07E444
43 R35 1 27R Buerklin: 07E444
44 R36 1 33k Buerklin: 07E740
45 S1 0 PB P12225STB-ND DNP
46 S2 0 PB P12225STB-ND DNP
46 S3 1 PB P12225STB-ND
47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885
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MSP-TS430PN80
B.24 MSP-TS430PN80
NOTE: For MSP430F47x and MSP430FG47x devices:
Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).
Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).
For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1.
Figure B-47. MSP-TS430PN80 Target Socket Module, Schematic
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Connector J5
External power connector
Jumper JP1 to "ext"
D1
LED connected to pin 12
Jumper J6
Open to disconnect LED
Orient Pin 1 of
MSP430 device
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Jumper JP2
Open to measure current
MSP-TS430PN80
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Figure B-48. MSP-TS430PN80 Target Socket Module, PCB
110 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430PN80
Table B-25. MSP-TS430PN80 Bill of Materials
Pos. Ref Des No. per Board Description Digi-Key Part No. Comment
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
DNP: Only recommendation.
1.1 C3, C4 0 47pF, SMD0805 Check your crystal spec.
2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 D1 1 green LED, SMD0603 475-1056-2-ND DNP: Headers and receptacles
enclosed with kit.Keep vias
free of solder.
6 J1, J2, J3, J4 0 25-pin header, TH SAM1029-20-ND : Header
SAM1213-20-ND : Receptacle
7 J5, JP1 2 3-pin header, male, TH SAM1035-03-ND
8 J6, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
9 3 Jumper 15-38-1024-ND Place on: J6, JP2, JP1/Pos1-2
10 JTAG 1 14-pin connector, male, TH HRP14H-ND
11 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
Q1: Micro Crystal MS1V-T1K
12 Q1, Q2 0 Crystal DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
13 R3 1 560 Ω, SMD0805 541-560ATR-ND
R1, R2, R4, DNP: R4, R6, R7, R10, R11,
14 R6, R7, R10, 2 0 Ω, SMD0805 541-000ATR-ND R12
R11, R12
15 R5 1 47k Ω, SMD0805 541-47000ATR-ND
16 U1 1 Socket: IC201-0804-014 Manuf.: Yamaichi
17 PCB 1 77 x 77 mm 2 layers
Adhesive for example, 3M Bumpons Part
18 4 ~6mm width, 2mm height Apply to corners at bottom side
Plastic feet No. SJ-5302 DNP: Enclosed with kit
19 MSP430 2 MSP430FG439IPN supplied by TI
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Connector J5
External power connector
Jumper JP3 to "ext"
Orient Pin 1 of
MSP430 device
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Connector J6
If the system is supplied via LDOI,
close JP4 and set JP3 to external
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
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MSP-TS430PN80A
Figure B-50. MSP-TS430PN80A Target Socket Module, PCB
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MSP-TS430PN80A
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Table B-26. MSP-TS430PN80A Bill of Materials
No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
2 C3, C4 0 47pF, SMD0805 DNP
C6, C7,
3 3 10uF, 6.3V, SMD0805 DNP C10
C10, C12
C5, C11,
4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND
C15
5 C8 1 2.2nF, SMD0805
6 C9 1 470nF, SMD0805 478-1403-2-ND
7 C16 1 4.7uF, SMD0805
8 C17 1 220nF, SMD0805
9 D1 1 green LED, SMD0805 P516TR-ND
SAM1029-20-ND DNP: Headers and receptacles
J1, J2, J3,
10 0 20-pin header, TH (Header) SAM1213-20- enclosed with kit. Keep vias free of
J4 ND (Receptacle) solder:
11 J5 , J6 2 3-pin header, male, TH
JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,
JP6, JP7,
12 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers on
JP8, JP9, pins 1-2 on JP3,
JP10
JP1, JP2,
13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP4
14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13
14-pin connector, male,
15 JTAG 1 HRP14H-ND
TH
10-pin connector, male,
16 BOOTST 0 "DNP Keep vias free of solder"
TH Micro Crystal MS3V-T1R
17 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder
12.5pF
Q2: 4MHz Buerklin:
18 Q2 0 Crystal DNP: Q2 Keep vias free of solder
78D134
http://www.ettinger.de/Art_
Insulating
19 0 Insulating disk to Q2 Detail.cfm?ART_ARTNUM
disk to Q2 =70.08.121
20 D3,D4 2 LL103A Buerklin: 24S3406
21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R8,
22 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12
R9,R10,
R11, R12
23 R5 1 47k Ω, SMD0805 541-47000ATR-ND
24 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi
25 PCB 1 77 x 91 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons
26 4 Apply to corners at bottom side
plastic feet 2mm height Part No. SJ-5302
27 MSP430 2 MSP430F5329IPN DNP: enclosed with kit, supplied by TI
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MSP-TS430PN80USB
B.26 MSP-TS430PN80USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
NOTE: R11 should be populated.
Figure B-51. MSP-TS430PN80USB Target Socket Module, Schematic
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Jumper JP3
1-2 (int): Power supply via JTAG debug interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP3 to "ext"
USB Connector
Button S3
BSL invoke
Jumper JP4
Close for USB bus powered device
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Jumper JP1
Open to measure current
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector JTAG
For JTAG Tool
Orient Pin 1 of MSP430 device
MSP-TS430PN80USB
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Figure B-52. MSP-TS430PN80USB Target Socket Module, PCB
116 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430PN80USB
Table B-27. MSP-TS430PN80USB Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
C5, C11,
3 4 100nF, SMD0805 311-1245-2-ND
C13, C14
3.1 C10, C12 0 10uF, SMD0805 311-1245-2-ND DNP: C10, C12
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND DNP: headers and
7 J1, J2, J3, J4 4 20-pin header, TH SAM1029-20-ND receptacles enclosed with kit.
Keep vias free of solder.
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
7.1 4 20-pin header, TH SAM1213-20-ND : Header
: Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
JP5, JP6,
JP7,
9 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
JP8,JP9,
JP10
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP4 1 SAM1035-02-ND Place jumper only on one pin
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
Place on: JP1, JP2, JP3,
12 10 Jumper 15-38-1024-ND JP4, JP5, JP6, JP7, JP8,
JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
Micro Crystal MS1V-T1K DNP: Q1 Keep vias free of
14 Q1 0 Crystal 32.768kHz, C(Load) = solder
12.5pF
15 Q2 1 Crystal "Q2: 4MHzBuerklin: 78D134"
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
17 R6, R8, R9, 2 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R9, R12
R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 0 1M Ω, SMD0805 DNP
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket:IC201-0804-014 Manuf.: Yamaichi
20 PCB 1 79 x 77 mm 2 layers
Rubber Apply to corners at bottom
21 4 Buerklin: 20H1724
standoff side
DNP: Enclosed with kit
22 MSP430 2 MSP430F5529 supplied by TI
http://www.ettinger.de/Art_De
Insulating
23 1 Insulating disk to Q2 tail.cfm?ART_ARTNUM=70.0
disk to Q2 8.121
27 C33 1 220n Buerklin: 53D2074
28 C35 1 10p Buerklin: 56D102
29 C36 1 10p Buerklin: 56D102
30 C38 1 220n Buerklin: 53D2074
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Table B-27. MSP-TS430PN80USB Bill of Materials (continued)
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
31 C39 1 4u7 Buerklin: 53D2086
32 C40 1 0.1u Buerklin: 53D2068
33 D2, D3, D4 3 LL103A Buerklin: 24S3406
34 IC7 1 TPD4E004 Manu: TI
36 LED 0 JP3QE SAM1032-03-ND DNP
37 LED1 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP
38 LED2 0 LEDCHIPLED_0603 FARNELL: 852-9868 DNP
39 LED3 0 LEDCHIPLED_0603 FARNELL: 852-9841 DNP
R13, R15,
40 0 470R Buerklin: 07E564 DNP
R16
41 R33 1 1k4 Buerklin: 07E612
42 R34 1 27R Buerklin: 07E444
43 R35 1 27R Buerklin: 07E444
44 R36 1 33k Buerklin: 07E740
45 S1 0 PB P12225STB-ND DNP
46 S2 0 PB P12225STB-ND DNP
46 S3 1 PB P12225STB-ND
47 USB1 1 USB_RECEPTACLE FARNELL: 117-7885
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MSP-TS430PZ100
B.27 MSP-TS430PZ100
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be
made.
Figure B-53. MSP-TS430PZ100 Target Socket Module, Schematic
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Connector J5
External power connection
Remove R8 and jumper R9
D1
LED connected to pin 12
Jumper J6
Open to disconnect LED
Orient Pin 1 of MSP430 device
Jumper J7
Open to measure current
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
MSP-TS430PZ100
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Figure B-54. MSP-TS430PZ100 Target Socket Module, PCB
120 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430PZ100
Table B-28. MSP-TS430PZ100 Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only recommendation.
1b C3, C4 0 47pF, SMD0805 Check your crystal spec.
2 C6, C7 1 10uF, 10V, Tantal Size B 511-1463-2-ND DNP: C6
3 C5 1 100nF, SMD0805 478-3351-2-ND
4 C8 1 10nF, SMD0805 478-1383-2-ND
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 yellow LED, TH, 3mm, T1 511-1251-ND DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
7 J1, J2, J3, J4 0 25-pin header, TH SAM1029-25-ND : Header
SAM1213-25-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
9 J6, J7 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10 2 Jumper 15-38-1024-ND Place on: J6, J7
11 JTAG 1 14-pin connector, male, TH HRP14H-ND DNP: Keep vias free of
12 BOOTST 0 10-pin connector, male, TH solder
Q1: Micro Crystal MS1V-T1K DNP: Keep vias free of
13 Q1, Q2 0 Crystal 32.768kHz, C(Load) = solder
12.5pF
14 R3 1 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
15 R8, R9, R10, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R4, R9, R10, R12
R11, R12
16 R5 1 47k Ω, SMD0805 541-47000ATR-ND
Socket: IC201-1004-008 or
17 U1 1 Manuf.: Yamaichi
IC357-1004-53N
18 PCB 1 82 x 90 mm 2 layers
Adhesive for example, 3M Bumpons Apply to corners at bottom
19 4 ~6mm width, 2mm height
Plastic feet Part No. SJ-5302 side
DNP: enclosed with kit
20 MSP430 2 MSP430FG4619IPZ supplied by TI
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Jumper JP1
Open to measure current
Jumper JP2
Open to disconnect LED
D1
LED connected to P5.1
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Orient Pin 1 of
MSP430 Device
Connector J5
External power connector
Jumper JP3 to "ext"
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
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MSP-TS430PZ100A
Figure B-56. MSP-TS430PZ100A Target Socket Module, PCB
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MSP-TS430PZ100A
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Table B-29. MSP-TS430PZ100A Bill of Materials
No. per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only recommendation.
1b C3, C4 0 47pF, SMD0805 Check your crystal spec.
2 C7, C9 2 10uF, 10V, Tantal Size B 511-1463-2-ND
3 C5, C11, C14 3 100nF, SMD0805 311-1245-2-ND
4 C8 1 10nF, SMD0805 478-1358-1-ND
5 C6 0 470nF, SMD0805 478-1403-2-ND DNP
6 D1 1 green LED, SMD0805 67-1553-1-ND DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
7 J1, J2, J3, J4 0 25-pin header, TH SAM1029-25-ND : Header
SAM1213-25-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND pPlace jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
12 3 Jumper 15-38-1024-ND Place on: JP1, JP2, JP3
13 JTAG 1 14-pin connector, male, TH HRP14H-ND DNP: Keep vias free of
14 BOOTST 0 10-pin connector, male, TH solder
Q1: Micro Crystal MS1V-T1K DNP: Keep vias free of
15 Q1, Q2 0 Crystal 32.768kHz, C(Load) = solder
12.5pF
16 R3 1 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R7, R8, DNP: R4, R6, R7, R8, R9,
17 2 0 Ω, SMD0805 541-000ATR-ND
R9, R10, R10, R11, R12
R11, R12
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
20 PCB 1 90 x 82 mm 4 layers
Rubber Apply to corners at bottom
21 4 Select appropriate
standoff side
DNP: Enclosed with kit
22 MSP430 2 MSP430F47197IPZ supplied by TI
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Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP1
Open to measure current
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
JP11, JP12, JP13
Connect 1-2 to connect
AUXVCCx with DVCC
or drive AUXVCCx externally
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
MSP-TS430PZ100B
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Figure B-58. MSP-TS430PZ100B Target Socket Module, PCB
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MSP-TS430PZ100B
Table B-30. MSP-TS430PZ100B Bill of Materials
No. per
Position Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
C4, C5,
2 C6 , C7, 6 100nF, SMD0805 311-1245-2-ND
C8, C9
3 C10, C26 2 470 nF, SMD0805 478-1403-2-ND
4 C11, C12 1 10 uF / 6.3 V SMD0805 C12 DNP
C13, C14,
5 C16, C18, 6 4.7 uF SMD0805
C19, C29
6 D1 1 green LED, SMD0805 P516TR-ND
SAM1029-25-ND DNP: Headers and receptacles
J1, J2, J3,
7 0 25-pin header, TH (Header) SAM1213-25- enclosed with kit. Keep vias free of
J4 ND (Receptacle) solder:
8 J5 1 3-pin header, male, TH
JP3, JP5, place jumpers on pins 2-3 on JP5, JP6,
JP6, JP7,
9 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers on
JP8, JP9, pins 1-2 on JP3,
JP10
JP1, JP2,
10 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP4
JP11, JP12,
11 3 4-pin header, male, TH place jumper on header 1-2
JP13
12 13 Jumper 15-38-1024-ND See Pos. 9 and Pos. 10 and Pos. 11
14-pin connector, male,
15 JTAG 1 HRP14H-ND
TH
10-pin connector, male,
16 BOOTST 0 "DNP Keep vias free of solder"
TH
17 Q1 0 Crystal DNP: Q1 Keep vias free of solder
21 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
22 R6, R8, 2 0 Ohm, SMD0805 541-000ATR-ND DNP: R4, R6, R8, R10, R11
R10, R11
23 R5 1 47k Ω, SMD0805 541-47000ATR-ND
24 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
25 PCB 1 90 x 82 mm 2 layers
Adhesive Approximately 6mm width, for example, 3M Bumpons
26 4 Apply to corners at bottom side
plastic feet 2mm height Part No. SJ-5302
27 MSP430 2 MSP430F6733IPZ DNP: enclosed with kit, supplied by TI
127
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DNP DNP
DNP
DNP
DNP
DNP
0R
12pF
12pF
47pF
47pF
GND
0R
100nF
330R
10 /6.3uF V
10 /6.3uF V
2.2nF
PWR3
GND
GND
GND
GND
0R
330R
47K
100nF
100nF
P TR ND516 -
470nF
100nF
100nF
0R
0R
0R
0R
GND
VCC
100nF
GND
100nF
100nF
GND
100nF
LL A103
GND
4.7n
HCTC XTL_ _4
HCTC XTL_ _4
HCTC XTL_ _4
HCTC XTL_ _4
GND
0R
0R
GND
GND
GND
4.7uF
GND
100nF
220nF
GND
VCC
LL A103
1.1
MSP Ta rget Socket MSP TS PZ C430: - - 430 100
Socket:
Yamaichi
IC201-1004-008
LFXTCLK
<- SBW
<- JTAG
Vcc
int
ext
DNP
DNP
DNP
DNP
DNP
DNP
BSL Rx-
BSL Tx-
DNP
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
R2
C2
C1
C3
C4
R1
C5
R3
C6
C7
C8
1
2
3
J5
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
64
63
62
61
44
43
42
41
37
38
39
40
17
18
19
20
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
U1
QFP100PZ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
J1
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
J2
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
J3
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
J4
1
JP1
2
1
JP2
2
R4
1
2
3
JP5
1
2
3
JP6
1
2
3
JP7
1
2
3
JP8
1
2
3
JP9
1
2
3
JP10
R7
R5
C11
C12
D1
C9
C13
C10
R6
R8
R9
R12
1
2
3
JP3
C17
C18
C19
C14
D3
C16
1
2
3
JP11
4
21
Q G1 $1
43
Q G1 $2
2 1
Q G2 $1
4 3
Q G2 $2
1 2
3 4
5 6
7 8
9 10
BOOTST
R10
R11
C15
C20
C21
1
JP4
2
D4
1
2
3
J6
TMS
TMS
TDI
TDI
TDO
TDO
TDO
XOUT
VCC
GND
GND
GND
XIN
P1.0
DVCC1
DVCC1
DVCC1
DVCC1
DVCC1
DVCC1
AVCC
XT OUT2
AVSS
AVSS
AVSS
M
M
I
I
O
O
XT IN2
RST NMI/
RST NMI/
TCK
TCK
TCK
C
C
TEST SBWTCK/
TEST SBWTCK/
TEST SBWTCK/
RST
RST
RST
XTLGND2
XTLGND1
PU.0
PU.1
P1.6
P1.7
P8.0
P8.1
P8.2
VBAK
VBAT VBAT
VBAT
P1.1
P1.1
P1.2
P1.2
LDOI
LDOI
LDOO
LDOO
BSL Interface LDOI LDOO Interface/
+
+
Note If the system should be:
supplied via LDOI J close JP( 6) 4
and set JP to external3
MSP-TS430PZ100C
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B.30 MSP-TS430PZ100C
Figure B-59. MSP-TS430PZ100C Target Socket Module, Schematic
128 Hardware SLAU278V–May 2009–Revised May 2015
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If the system should
be supplied via LDOI (J6),
close JP4 and set JP3 to external
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Orient Pin 1 of MSP430 device
LDOI LDOO/
14
1
2
GND
GND
VCC
1 255 10 1 5 2 0
26 5030 3540 45
5175 55606570
76100 80859095
123
123
123
123
123
123
123 1 2 3 4
10
1
2
1 2 3
1
JTAG
SBW
Vcc
int
ext
GND
VBAT
DVCC
JTAG
R2
C2
C1
C3
C4
R1
C5
R3
+
C6
+
C7
C8
J5
U1
J1
J2
J3
J4
JP1
JP2
R4
JP5
JP6
JP7
JP8
JP9
JP10
R7
R5
C11
C12
D1
C9
C13
C10
R6
R8
R9
R12
JP3
C17
C18
C19
C14
D3
C16
JP11
Q1
Q2
BOOTST
R10
R11 C15
C20
C21
JP4
D4
J6
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP1
Open to measure current
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MSP-TS430PZ100C
Figure B-60. MSP-TS430PZ100C Target Socket Module, PCB
129
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MSP-TS430PZ100C
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Table B-31. MSP-TS430PZ100C Bill of Materials
Number
Pos. Ref Des Per Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805 DNP: C3, C4
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
C5, C11,
3 C13, C14, 6 100nF, SMD0805 311-1245-2-ND
C19, C20
C10, C12,
3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17
C18,17
4 C8 1 2.2nF, SMD0805 Buerklin 53 D 292
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND DNP: headers and receptacles enclosed
7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND with kit. Keep vias free of solder.
DNP: headers and receptacles enclosed
7.1 4 25-pin header, TH SAM1213-25-ND with kit. Keep vias free of solder.
8 J5, J6 2 3-pin header, male, TH SAM1035-03-ND
JP5, JP6,
JP7,
9 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
JP8,JP9,
JP10
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND place jumper on header
10.1 JP4 1 2-pin header, male, TH SAM1035-02-ND place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
Place on: JP1, JP2, JP3, JP4, JP5, JP6,
12 10 Jumper 15-38-1024-ND JP7, JP8, JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
DNP: Q1
15 Q1 0 Crystal Keep vias free of solder
16 Q2 1 Crystal DNP: Q2 Keep vias free of solder
17 R3, R7 2 330 Ohm, SMD0805 541-330ATR-ND
R1, R2, R4,
R6, R8, R9,
18 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11, R12
R10, R11,
R12
19 R5 1 47k Ohm, SMD0805 541-47000ATR-ND
20 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
21 PCB 1 79.5 x 99.5 mm MSP-TS430PZ100C Rev 1.0 2 layers
Rubber stand
22 4 Buerklin: 20H1724 apply to corners at bottom side
off
23 MSP430 2 MSP430F643x DNP: enclosed with kit. Is supplied by TI.
24 C16 1 4.7 nF SMD0603 Buerklin 53 D 2042
26 D3, D4 2 LL103A Buerklin: 24S3406
27 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and Pin 2
28 C15 1 4.7 uF, SMD0805 Buerklin 53 D 2430
29 C21 1 220nF, SMD0805 Buerklin 53 D 2381
130 Hardware SLAU278V–May 2009–Revised May 2015
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DNP
Socket:
Yamaichi IC201-1004-008
DNP
DNP
GND
GND
100nF
330R
-0R
GND
GND
1.1nF
47k GND
0R 0R
QUARZ5
1uF/10V
100nF1uF/10V
green
DNP
yellow (DNP)
DNP
red (DNP)
0R
GND
DNP
DNP
0R0R
QUARZ5
EVQ11
0R
DNP
DNP
MSP430FR698XPZ
FE25-1A1
FE25-1A2
FE25-1A3
FE25-1A4
100nF
GND
100nF
GND
1uF/10V 100nF
GND
GND
470nF
GND
0R
4u7
GND
If external supply voltage:
remove R3 and add R2 (0 Ohm)
Ext_PWR
MSP-TS430PZ100D
Vcc int
ext
Target Socket Board for MSP430FR698xPZ, FR688xPZ
DNP
DNP
DNP
DNP
DNP
JTAG ->
SBW ->
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP3 to JP8 to position 2-3
2-wire "SpyBiWire": Set jumpers JP3 to JP8 to position 1-2
connection by via DNP
DNP
Petersen
1099/1/001/01.1
1.2
DNP
DNP DNP
DNP
DNP
DNP DNP
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
C2
C1
C4
R1
1 2
3 4
5 6
7 8
9 10
BSL
R2R3
1
2
3
J2
1
2
3
J1
1
2
JP1
1
2
JP9
C5
R4
1
2
3
JP3
1
2
3
JP4
1
2
3
JP5
1
2
3
JP6
1
2
3
JP7
1
2
3
JP8
R5 R6
Q1
C3
C6C7
D1
R10
1
2
JP10
D2
R11
1
2
JP11
D3
R12
1
2
JP2
C8
C9
R8R9
Q2
SW1
R13
TP2TP1
SW2
R14
P4.3/UCA0SOMI/UCA0RXD/UCB1STE
1
P1.4/UCB0CLK/UCA0STE/TA1.0/S1
2
P1.5/UCB0STE/UCA0CLK/TA0.0/S0
3
P1.6/UCB0SIMO/USB0SDA/TA0.1
4
P1.7/UCB0SOMI/UCB0SCL/TA0.2
5
R33/LCDCAP
6
P6.0/R23
7
P6.1/R13/LCDREF
8
P6.2/COUT/R03
9
P6.3/COM0
10
P6.4/TB0.0/COM1
11
P6.5/TB0.1/COM2
12
P6.6/TB0.2/COM3
13
P2.4/TB0.3/COM4/S43
14
P2.5/TB0.4/COM5/S42
15
P2.6/TB0.5/COM6/S41
16
P2.7/TB0.6/COM7/S40
17
P10.2/TA1.0/SMCLK/S39
18
P5.0/TA1.1/MCLK/S38
19
P5.1/TA1.2/S37
20
P5.2/TA1.0/TA1CLK/ACLK/S36
21
P5.3/UCB1STE/S35
22
P3.0/UCB1CLK/S34
23
P3.1/UCB1SIMO/UCB1SDA/S33
24
P3.2/UCB1SOMI/UCB1SCL/S32
25
DVSS1
26
DVCC1
27
TEST/SBWTCK
28
XRST/NMI/SBWTDIO
29
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1
30
PJ.1/TDI/TCLK/MCLK/SRSCG0
31
PJ.2/TMS/ACLK/SROSCOFF
32
PJ.3/TCK/COUT/SRCPUOFF
33
P6.7/TA0CLK/S31
34
P7.5/TA0.2/S30
35
P7.6/TA0.1/S29
36
P10.1/TA0.0/S28
37
P7.7/TA1.2/TB0OUTH/S27
38
P3.3/TA1.1/TB0CLK/S26
39
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S25
40
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S24
41
P3.6/UCA1CLK/TB0.2/S23
42
P3.7/UCA1STE/TB0.3/S22
43
P8.0/RTCCLK/S21
44
P8.1/DMAE0/S20
45
P8.2/S19
46
P8.3/MCLK/S18
47
P2.3/UCA0STE/TB0OUTH
48
P2.2/UCA0CLK/TB0.4/RTCCLK
49
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0
50
P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK51
P7.0/TA0CLK/S17 52
P7.1/TA0.0/S16 53
P7.2/TA0.1/S15 54
P7.3/TA0.2/S14 55
P7.4/SMCLK/S13 56
DVSS2 57
DVCC2 58
P8.4/A7/C7 59
P8.5/A6/C6 60
P8.6/A5/C5 61
P8.7/A4/C4 62
P1.3/ESITEST4/TA1.2/A3/C3 63
P1.2/TA1.1/TA0CLK/COUT/A2/C2 64
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+
65
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREF
66
P9.0/ESICH0/ESITEST0/A8/C8 67
P9.1/ESICH1/ESITEST1/A9/C9 68
P9.2/ESICH2/ESITEST2/A10/C10 69
P9.3/ESICH3/ESITEST3/A11/C11 70
P9.4/ESICI0/A12/C12 71
P9.5/ESICI1/A13/C13 72
P9.6/ESICI2/A14/C14 73
P9.7/ESICI3/A15/C15 74
ESIVCC 75
ESIVSS 76
ESICI 77
ESICOM 78
AVCC1 79
AVSS3 80
PJ.7/HFXOUT 81
PJ.6/HFXIN 82
AVSS1 83
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK 100
DVCC3 99
DVSS3 98
P4.1/UCB1SOMI/UCB1SCL/ACLK/S2 97
P4.0/UCB1SIMO/UCB1SDA/MCLK/S3 96
P10.0/SMCLK/S4 95
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S5 94
P4.6/UCB1SIMO/UCB1SDA/TA1.1/S6 93
P4.5/UCB1CLK/TA1.0/S7 92
P4.4/UCB1STE/TA1CLK/S8 91
P5.7/UCA1STE/TB0CLK/S9 90
P5.6/UCA1CLK/S10 89
P5.5/UCA1SOMI/UCA1RXD/S11 88
P5.4/UCA1SIMO/UCA1TXD/S12 87
AVSS2 86
PJ.5/LFXOUT 85
PJ.4/LFXIN 84
IC1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
J3
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
J4
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
J5
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
J6
C10
C11
1
2
JP12
C12 C13
C14
R7
C15
P1.0
P1.0
RST/NMI
TMS
TDI
VCC
GND
P1.1
P1.1
TCK/SBWTCK
TDO/SBWTDIO
PJ.0/TDO
PJ.0/TDO
PJ.2/TMS
PJ.2/TMS
PJ.3/TCK
PJ.3/TCK
PJ.1/TDI
PJ.1/TDI
P1.2
P1.2
BSLTX
BSLTX
BSLRX
BSLRX
P1.3
P1.3
AVCC
AVCC
AVSS
AVSS
AVSS
AVSS
LFXOUT
LFXIN
LFGND HFGND
HFXIN
HFXOUT
DVCC
DVCC
DVCC
DVCC
DVCC
DVCC
DVCC
DVCC
DVCC
DVSS
DVSS
DVSS
DVSS
TEST/SBWTCK1
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
LCDCAP
LCDCAP
ESIVCC
ESIVCC
ESICOM
ESICOM
ESIVSS
RST/SBWTDIO
RST/SBWTDIO
RST/SBWTDIO
1
2
3
4
5
6
1
2
3
4
5
6
Titel:
Datum:
Bearb.:
Seite 1/1
MSP-TS430PZ100D
7/9/2013 5:23:25 PM
A3
IHGFEDCBA
A B C D E F G H I
File:
Dok:
Rev.:
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MSP-TS430PZ100D
B.31 MSP-TS430PZ100D
Figure B-61. MSP-TS430PZ100D Target Socket Module, Schematic
131
SLAU278V–May 2009–Revised May 2015 Hardware
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1
Vcc
ext
int
Vcc
GND
GND
JTAG
SBW
RESET
Ext.
Pwr.
PWR
DVCC
AVCC
TCK
TMS
TDI
TDO
RST/SBWTDIO
TEST/SBWTCK
GND
GND
P1.3
ESIVCC
14
1
2
10
1
2
1
1
1
1
1
1
1
125
510 15 20
2650 30354045
51
75 55
60
65
70
76 10080 85 90 95
MSP-TS430PZ100D
Rev. 1.2 RoHS
Q2 Q1
P1.0
P1.1
P1.2
JTAG
C2
C1
C4
R1
BSL
R2
R3
J2
J1
JP1
JP9
C5
R4
JP3
JP4
JP5
JP6
JP7
JP8
R5
R6
C3
C6
C7
D1
R10 JP10
D2
R11 JP11
D3
R12
JP2
C8
C9
R8
R9
SW1
R13
TP2
TP1
SW2
R14
IC1
J3
J4
J5
J6
C10
C11
JP12
C12
C13
C14
R7
C15
Orient Pin 1 of MSP430 device
LEDs connected to
P1.0, P1.1, P1.2 via
JP9, JP10, JP11
(only D1 assembled)
Switch SW2
Connected to P1.3
Jumper JP1
Open to measure current
Connector J2
External power connector
Jumper J1 to “ext”
Connector BSL
For Bootstrap Loader Tool
Connector JTAG
For JTAG Tool
Jumper JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper J1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Switch SW1
Device reset
HF and LF oscillators with
capacitors and resistors
to connect pinheads
MSP-TS430PZ100D
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Figure B-62. MSP-TS430PZ100D Target Socket Module, PCB
132 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430PZ100D
Table B-32. MSP-TS430PZ100D Bill of Materials
Number
Pos. Ref Des Per Description Digi-Key Part No. Comment
Board
1 PCB 1 90.0 x 100.0 mm MSP-TS430PZ100D 2 layers, white solder mask
Rev 1.2
2 JP1, JP2, 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
JP9
3 JP10, JP11, 3 2-pin header, male, TH SAM1035-02-ND DNP, keep pads free of solder
JP12
4 J1 1 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 1-2
5 JP3, JP4, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
JP5, JP6,
JP7, JP8
6 J2 1 3-pin header, male, TH SAM1035-03-ND
7 R2, R3, R5, 6 0R, 0805 541-0.0ATR-ND DNP
R6, R8, R9
8 R7, R12, R13 3 0R, 0805 541-0.0ATR-ND
9 C5 1 1.1nF, CSMD0805 490-1623-2-ND
10 C3, C7 2 1uF/10V, CSMD0805 490-1702-2-ND
11 C12 1 1uF/10V, CSMD0805 490-1702-2-ND DNP
12 R4 1 47k, 0805 541-47KATR-ND
13 C4, C6, C10, 4 100nF, CSMD0805 490-1666-1-ND
C11
14 C13 1 100nF, CSMD0805 490-1666-1-ND DNP
15 C15 1 4u7, CSMD0805 445-1370-1-ND DNP
16 R1 1 330R, 0805 541-330ATR-ND
17 C14 1 470nF, CSMD0805 587-1290-2-ND DNP
18 R10, R11 2 330R, 0805 541-330ATR-ND DNP
19 R14 1 47k, 0805 541-47KATR-ND DNP
20 C1, C2, C8, 4 DNP, CSMD0805 DNP
C9
21 SW2 1 EVQ-11L05R P8079STB-ND DNP
22 SW1 1 EVQ-11L05R P8079STB-ND DNP
23 J3, J4, J5, J6 4 25-pin header, TH DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
SAM1029-25-ND : Header
24 J3, J4, J5, J6 4 25-pin receptacle, TH DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
SAM1213-25-ND : Receptacle
25 TP1, TP2 2 Testpoint DNP, keep pads free of solder
26 BSL 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
27 JTAG 1 14-pin connector, male, TH HRP14H-ND
28 IC1 1 Socket: IC201-1004-008 Manuf. Yamaichi
29 IC1 1 MSP430FR6989 DNP: enclosed with kit. Is supplied by TI
30 Q1 1 DNP: MS3V-TR1 depends on application Micro Crystal, DNP, enclosed in kit, keep
(32768kHz/20ppm/12,5pF) vias free of solder
31 Q2 1 DNP, Crystal depends on application DNP, keep vias free of solder
32 D1 1 green LED, DIODE0805 P516TR-ND
33 D3 1 red (DNP), DIODE0805 DNP
34 D2 1 yellow (DNP), DIODE0805 DNP
35 Rubber 4 Buerklin: 20H1724 apply to corners at bottom side
stand off
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Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP1
Open to measure current
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Orient Pin 1 ofMSP430 device
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MSP-TS430PZ5x100
Figure B-64. MSP-TS430PZ5x100 Target Socket Module, PCB
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MSP-TS430PZ5x100
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Table B-33. MSP-TS430PZ5x100 Bill of Materials
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP
DNP: Only recommendation.
1b C3, C4 47pF, SMD0805 Check your crystal spec.
2 C6, C7 2 10uF, 10V, Tantal Size B 511-1463-2-ND
C5, C10, C11,
3 4 100nF, SMD0805 311-1245-2-ND DNP: C12, C14
C12, C13, C14
4 C8 0 2.2nF, SMD0805 DNP
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 67-1553-1-ND DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
7 J1, J2, J3, J4 0 25-pin header, TH SAM1029-25-ND : Header
SAM1213-25-ND : Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
JP5, JP6, JP7,
9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 2-3
JP10
10 JP1, JP2 2 2-pin header, male, TH SAM1035-02-ND Place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND Place jumper on pins 1-2
Place on JP1, JP2, JP3, JP5,
12 9 Jumper 15-38-1024-ND JP6, JP7, JP8, JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
14 BOOTST 0 10-pin connector, male, TH DNP: Keep vias free of solder
Q1: Micro Crystal MS1V-T1K
15 Q1, Q2 0 Crystal DNP: Keep vias free of solder
32.768kHz, C(Load) = 12.5pF
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4, DNP: R6, R8, R9, R10, R11,
17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND R12
R10, R11, R12
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
20 PCB 1 90 x 82 mm 2 layers
Rubber
21 4 Select appropriate Apply to corners at bottom side
standoff DNP: Enclosed with kit
22 MSP430 2 MSP430F5438IPZ supplied by TI
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MSP-TS430PZ100USB
B.33 MSP-TS430PZ100USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
Figure B-65. MSP-TS430PZ100USB Target Socket Module, Schematic
137
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Jumpers LED 1, 2, 3
Open to disconnect LED1, D2, D3LE LE
LED1, D2, D3
LEDs connected to P8.0,
LE LE
P8.1, P8.2
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
USB1
USB connector
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Jumper JP1
Open to measure current
MSP-TS430PZ100USB
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Figure B-66. MSP-TS430PZ100USB Target Socket Module, PCB
138 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430PZ100USB
Table B-34. MSP-TS430PZ100USB Bill of Materials
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 C1, C2 0 12pF, SMD0805 DNP: C1, C2
1.1 C3, C4 2 47pF, SMD0805
2 C6, C7 2 10uF, 6.3V, Tantal Size B 511-1463-2-ND
C5, C11, C13,
3 5 100nF, SMD0805 311-1245-2-ND
C14, C19
C10, C12,
3.1 0 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17
C18, C17
4 C8 1 2.2nF, SMD0805
5 C9 1 470nF, SMD0805 478-1403-2-ND
6 D1 1 green LED, SMD0805 P516TR-ND DNP: headers and receptacles
enclosed with kit. Keep vias
7 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND free of solder.
: Header
: Receptacle
DNP: headers and receptacles
enclosed with kit. Keep vias
7.1 4 25-pin header, TH SAM1213-25-ND free of solder.
: Header
: Receptacle
8 J5 1 3-pin header, male, TH SAM1035-03-ND
JP5, JP6, JP7,
9 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
JP10
10 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
11 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
Place on: JP1, JP2, JP3, JP4,
12 10 Jumper 15-38-1024-ND JP5, JP6, JP7, JP8, JP9, JP10
13 JTAG 1 14-pin connector, male, TH HRP14H-ND
Micro Crystal MS1V-T1K DNP: Q1. Keep vias free of
14 Q1 0 Crystal 32.768kHz, C(Load) = 12.5pF solder
15 Q2 1 Crystal Q2: 4MHz, Buerklin: 78D134
16 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND
R1, R2, R4,
17 R6, R8, R9, 3 0 Ω, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R12
R12
18 R10 1 100 Ω, SMD0805 Buerklin: 07E500
18 R11 1 1M Ω, SMD0603 not existing in Rev 1.0
18 R5 1 47k Ω, SMD0805 541-47000ATR-ND
19 U1 1 Socket:IC201-1004-008 Manuf.: Yamaichi
20 PCB 1 79 x 77 mm 2 layers
Rubber stand
21 4 Buerklin: 20H1724 apply to corners at bottom side
off DNP: enclosed with kit. Is
22 MSP430 2 MSP430F6638IPZ supplied by TI
http://www.ettinger.de/Art_Deta
Insulating disk
23 1 Insulating disk to Q2 il.cfm?ART_ARTNUM=70.08.1
to Q2 21
24 C16 1 4.7 nF SMD0603
27 C33 1 220n SMD0603 Buerklin: 53D2074
28 C35, C36 2 10p SMD0603 Buerklin: 56D102
30 C38 1 220n SMD0603 Buerklin: 53D2074
31 C39 1 4u7 SMD0603 Buerklin: 53D2086
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MSP-TS430PZ100USB
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Table B-34. MSP-TS430PZ100USB Bill of Materials (continued)
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
32 C40 1 0.1u SMD0603 Buerklin: 53D2068
33 D2, D3, D4 3 LL103A Buerklin: 24S3406
34 IC7 1 TPD4E004 Manu: TI
35 LED 0 JP3QE SAM1032-03-ND DNP
LED1, LED2,
36 0 LEDCHIPLED_0603 FARNELL: 852-9833 DNP
LED3
37 R13, R15, R16 0 470R SMD0603 Buerklin: 07E564 DNP
38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612
39 R34 1 27R SMD0603 Buerklin: 07E444
40 R35 1 27R SMD0603 Buerklin: 07E444
41 R36 1 33k SMD0603 Buerklin: 07E740
42 S1, S2, S3 1 PB P12225STB-ND DNP S1 and S2. (Only S3)
43 USB1 1 USB_RECEPTACLE FARNELL: 117-7885
44 JP11 1 4-pin header, male, TH SAM1035-04-ND place jumper only on Pin 1
140 Hardware SLAU278V–May 2009–Revised May 2015
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0R
12pF
12pF
47pF
47pF
GND
0R
100nF
330R
10uF/6,3V
10uF/6,3V
2.2nF
PWR3
GND
GND
GND
GND
0R
47K
100nF
100nF
470nF
100nF
100nF
0R
0R
0R
0R
GND
GND GND GND
GND
1k4
10p 10p
27R
27R
33k
4u7
GND
LL103A
TPD4E004
0.1u
220n
220n
GND
GND
VCC
GND GND
470R
GND
470R
GND
470R
100nF
GND
100nF
100nF
GND
100R
100nF
LL103A
1M
GND
4.7n
HCTC_XTL_4
HCTC_XTL_4
MSP430FG6626IPZ
0R
22nF
QUARZ5
DNP
1.1
for MSP430FG6626IPZ device
Target socket board MSP-TS430PZ100AUSB
Socket:
Yamaichi
IC357-1004-053N
DNP
<- SBW
<- JTAG
Vcc
int
ext
GND
DNP
DNP
DNP
DNP
DNP
DNP
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
R2
C2
C1
C3
C4
R1
C5
R3
C6
C7
C8
J5
1
2
3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
J1
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
J2
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
J3
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
J4
JP1
1
2
JP2
1
2
R4
1
2
3
JP5
1
2
3
JP6
1
2
3
JP7
1
2
3
JP8
1
2
3
JP9
1
2
3
JP10
R5
C11
C12 D1
C9
C13
C10
R6
R8
R9
R12
1
2
3
JP3
USB1
VBUS
1
GND
4
D-
2
D+
3
SHIELD
5
SHIELD1
6
R33
C35 C36
R34
R35
R36
C39
D2
IC7
IO1
1
IO2
2
GND
3
VCC 6
IO4 5
IO3 4
C40
C33
C38 JP4
1
2
LED3
S1
1 2
S2
1 2
R13
LED1
R15
LED2
R16
LED-1
1
2
LED-2
3
4
LED-3
5
6
C17
C18
C19
R10
S3
1 2
C14
D4
R11
C16
JP11
1
2
3
4
Q2G$1
2 1
Q2G$2
4 3
P6.4/CB4/AD0+/OA0O
1
P6.5/CB5/AD0-/OA0N
2
P6.6/CB6/AD1+/GSW0A
3
P6.7/CB7/AD1-/GSW0B
4
P7.4/CB8/AD2+/OA1O
5
P7.5/CB9/AD2-/OA1N
6
P7.6/CB10/AD3+/GSW1A
7
P7.7/CB11/AD3-/GSW1B
8
P5.0/VREF+/VEREF+
9
P5.1//A4/DAC0
10
P5.6/A5/DAC1
11
NR
12
AVSS1
13
XOUT
14
XIN
15
AVCC
16
CPCAP
17
P2.0/P2MAP0/DAC0
18
P2.1/P2MAP1/DAC1
19
P2.2/P2MAP2
20
P2.3/P2MAP3
21
P2.4/P2MAP4/R03
22
P2.5/P2MAP5
23
P2.6/P2MAP6/LCDREF/R13
24
P2.7/P2MAP7/R23
25
DVCC1
26
DVSS1
27
VCORE
28
LCDCAP/R33
29
COM0
30
P5.3/COM1/S42
31
P5.4/COM2/S41
32
P5.5/COM3/S40
33
P1.0/TA0CLK/ACLK/S39
34
P1.1/TA0.0/S38
35
P1.2/TA0.1/S37
36
P1.3/TA0.2/S36
37
P1.4/TA0.3/S35
38
P1.5/TA0.4/S34
39
P1.6/TA0.1/S33
40
P1.7/TA0.2/S32
41
P3.0/TA1CLK/CBOUT/S31
42
P3.1/TA1.0/S30
43
P3.2/TA1.1/S29
44
P3.3/TA1.2/S28
45
P3.4/TA2CLK/SMCLK/S27
46
P3.5/TA2.0/S26
47
P3.6/TA2.1/S25
48
P3.7/TA2.2/S24
49
P4.0/TB0.0/S23
50
P4.1/TB0.1/S22 51
P4.2/TB0.2/S21 52
P4.3/TB0.3/S20 53
P4.4/TB0.4/S19 54
P4.5/TB0.5/S18 55
P4.6/TB0.6/S17 56
P4.7/TB0OUTH/SVMOUT/S16 57
P8.0/TB0CLK/S15 58
P8.1/UCB1STE/UCA1CLK/S14 59
P8.2/UCA1TXD/UCA1SIMO/S13 60
P8.3/UCA1RXD/UCA1SOMI/S12 61
P8.4/UCB1CLK/UCA1STE/S11 62
DVSS2 63
DVCC2 64
P8.5/UCB1SIMO/UCB1SDA/S10 65
P8.6/UCB1SOMI/UCB1SCL/S9 66
P8.7/S8 67
P9.0/S7 68
P9.1/S6 69
P9.2/S5 70
P9.3/S4 71
P9.4/S3 72
P9.5/S2 73
P9.6/S1 74
P9.7/S0 75
VSSU 76
PU.0/DP 77
PUR 78
PU.1/DM 79
VBUS 80
VUSB 81
V18 82
AVSS2 83
P7.2/XT2IN 84
P7.3/XT2OUT 85
VBAK 86
VBAT 87
P5.7/DMAE0/RTCCLK 88
DVCC3 89
DVSS3 90
TEST/SBWTCK 91
PJ.0/TDO 92
PJ.1/TDI/TCLK 93
PJ.2/TMS 94
PJ.3/TCK 95
RST/NMI/SBWTDIO 96
P6.0/CB0/A0 97
P6.1/CB1/A1 98
P6.2/CB2/A2/OA0IP0 99
P6.3/CB3/A3/OA1IP0 100
U1
R14
C15
TP2TP1
Q3
TMS
TMS
TDI
TDI
TDO
TDO
TDO
XIN
XIN
VCC
GND
GND
GND
GND
GND
GND
XOUT
XOUT
P1.0
P1.0
DVCC1
DVCC1
DVCC1
DVCC1
DVCC1
DVCC1
DVCC1
AVCC
AVCC
XT2OUT
AVSS
AVSS
AVSS
AVSS
M
M
I
I
O
O
XT2IN
RST/NMI RST/NMI
TCK
TCK
TCK
C
C
TEST/SBWTCK1
RST
RST
XTLGND2
XTLGND1
PU.0/DP
PU.0/DP
PU.0/DP
PUR
PUR
PUR
PU.1/DM
PU.1/DM
PU.1/DM
VBUS
VBUS
VBUS
D-
D+
VUSB
VUSB
VUSB
V18
V18
P1.6
P1.6
P1.7
P1.7
P8.0
P8.0
P8.1
P8.1
P8.2
P8.2
VBAK
VBAK
VBAT
VBAT
CPCAP
NR
NR
TEST/SBWTCK
USB Interface Miscellaneous
DNP
+
+
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MSP-TS430PZ100AUSB
B.34 MSP-TS430PZ100AUSB
The development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642x
flash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSP-
TS430PZ100AUSB kit. Free samples can be ordered from
www.ti.com/product/MSP430FG6626/samplebuy.
Figure B-67. MSP-TS430PZ100AUSB Target Socket Module, Schematic
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Jumpers LED 1, 2, 3
Open to disconnect LED1, D2, D3LE LE
LED1, D2, D3
LEDs connected to P8.0,
LE LE
P8.1, P8.2
Orient Pin 1 of MSP430 device
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP3
1-2 (int): Power supply fromJTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
USB1
USB connector
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Jumper JP1
Open to measure current
14
1
2
GND
GND
VCC
1 255 10 15 20
26 5030 35 40 45
5175 55606570
76100 80859095
123
123
123
123
123
123
123
1 2 3
1 2 3 4
+
+
J1
J2
U1
MSP-TS430PZ100AUSB
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Figure B-68. MSP-TS430PZ100AUSB Target Socket Module, PCB
142 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430PZ100AUSB
Table B-35. MSP-TS430PZ100AUSB Bill of Materials
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
1 PCB Rev. 1.1 1 99.65mm x 79.54mm 2 layers, red solder mask
2 C1, C2 2 12pF, SMD0805 DNP: C1, C2
C10, C12,
3 9 100nF, SMD0805 311-1245-2-ND DNP: C10, C12,C18, C17
C17, C18
4 C15 1 22nF, CSMD0805 311-1242-1-ND
5 C16 1 4.7 nF SMD0603 311-1250-1-ND
6 C3, C4 2 47pF, CSMD0805 709-1337-1-ND
7 C33, C38 2 220n SMD0603 Buerklin: 53D2074
8 C35, C36 2 10p SMD0603 Buerklin: 56D102
9 C39 1 4u7 SMD0603 Buerklin: 53D2086
10 C40 1 0.1u SMD0603 Buerklin: 53D2068
C5, C11, C13,
11 5 100nF, SMD0805 311-1245-2-ND
C14, C19
12 C6, C7 2 10uF/6.3V, Tantal Size B 511-1463-2-ND
13 C8 1 2.2nF, CSMD0805 709-1339-1-ND
14 C9 1 470nF, SMD0805 478-1403-2-ND
green LED, HSMG-C170
15 D1 1 516-1434-1-ND Avago, Farnell 5790852
DIODE0805
16 D2, D4 2 LL103A, SOD-80 Buerklin: 24S3406
17 IC7 1 TPD4E004DRYR 296-23618-1-ND Manu: TI
DNP: Headers enclosed in kit.
18 J1, J2, J3, J4 4 25-pin header, TH SAM1029-25-ND Keep vias free of solder.
DNP: Receptacles enclosed in
19 J1, J2, J3, J4 4 25-pin receptacle, TH SAM1213-25-ND kit. Keep vias free of solder.
20 J5 1 3-pin header, male, TH SAM1035-03-ND
21 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND place jumper on header
22 JP11 1 4-pin header, male, TH SAM1035-04-ND Place jumper on Pin 1 and 2
23 JP3 1 3-pin header, male, TH SAM1035-03-ND place jumper on pins 1-2
JP5, JP6, JP7,
24 JP8, JP9, 6 3-pin header, male, TH SAM1035-03-ND place jumpers on pins 2-3
JP10
Jumpers for
JP1, JP2, JP3,
25 JP4, JP5, JP6, 11 Jumper 15-38-1024-ND
JP7, JP8, JP9,
JP10, JP11
26 JTAG 1 14-pin connector, male, TH HRP14H-ND
27 LED 1 JP3QE SAM1032-03-ND DNP
LED1, LED2,
28 3 FARNELL: 852-9833 DNP
LED3 DNP: Free samples can be
29 MSP430 2 MSP430FG6626IPZ ordered in the TI Store
Q2: 4MHz
30 Q2 1 Crystal Buerklin: 78D134
MS3V-T1R (32.768kHz/
31 Q3 1 20ppm/12.5pF)
32 R1, R2, R4 3 0 Ohm, SMD0805 541-0.0ATR-ND
33 R10 1 100R, R0603 541-100GCT-ND
34 R11 1 1M, R0603 541-1.0MGCT-ND
35 R13, R15, R16 3 470R SMD0603 Buerklin: 07E564 DNP
36 R14 1 0 Ohm, SMD0805 541-0.0ATR-ND
37 R3 1 330 Ohm, SMD0805 541-330ATR-ND
143
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MSP-TS430PZ100AUSB
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Table B-35. MSP-TS430PZ100AUSB Bill of Materials (continued)
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
38 R33 1 1k4 / 1k5 SMD0603 Buerklin: 07E612
39 R34, R35 2 27R SMD0603 Buerklin: 07E444
40 R36 1 33k SMD0603 Buerklin: 07E740
41 R5 1 47k Ohm, SMD0805 541-47000ATR-ND
R6, R8, R9,
42 4 0 Ohm, SMD0805 541-000ATR-ND DNP
R12
43 S1, S2 1 PB P12225STB-ND DNP
44 S3 1 PB P12225STB-ND
45 TP1, TP2 2 Test point DNP, Keep vias free of solder
46 U1 1 Socket: IC357-1004-53N Manuf.: Yamaichi
47 USB1 1 USB Receptacle FARNELL: 117-7885
Insulating disk
48 1 Insulating disk for Q2 ettinger.de 70.08.121
for Q2
Rubber stand
49 4 Buerklin: 20H1724 Apply to corners at bottom side
off
144 Hardware SLAU278V–May 2009–Revised May 2015
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0R
12pF
12pF
GND
GND
0R
100nF
330R
2.2nF
0R 0R
PWR3
GND
330R
47K
0R
0R
100nF
4.7uF
GND
GND
100nF
470nF
0R
QUARZ5
100nF
10uF/6,3V
10uF/6,3V
100nF 4.7uF
4.7uF 100nF
4.7uF
4.7uF
4.7uF
470nF
FE04-1
VCC
GND
GND
100nF
4.7uF
GND
GND
GND
GND
GND
VCC1
VCC1
VCC1
VCC1
VCC1
GND
GND
GND
GND
GND
GND
AVSS
AVSS
AVCCDVCC
GND
VCC
VCC
GND
MSP430: Target-Socket
MSP-TS430PEU128 for F6779
Petersen
1080/1/001/01.1
DNP
LFXTCLK
DNP
<- SBW
<- JTAG
DNP
Vcc
int
ext
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DVDSYS
1.1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
J1
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
J2
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
J3
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
J4
1
3
5
7
9
11
13
2
4
6
12
14
8
10
JTAG
R2
C2
C1
R1
C5
R3
1 2
3 4
5 6
7 8
9 10
BOOTST
C3
R10 R11
J5
1
2
3
1
2
JP1
JP2
1
2
1
2
3
JP5
1
2
3
JP6
1
2
3
JP7
1
2
3
JP8
1
2
3
JP9
1
2
3
JP10
R7
R5
D1
R6
R8
C6
C29
C7
C10
R4
Q1
JP12
1
2
3
4
1
2
3
4
JP11
JP13
1
2
3
4
C4
C11
C12
C8 C13
C14 C9
C16
C19
C18
C26
1
2
JP4
JP3
1
2
3
4
C15
C17
TP1 TP2
IC1
MSP430F677XIPEU#
XIN
1
XOUT
2
AUXVCC3
3
RTCCAP1
4
RTCCAP0
5
P1.5/SMCLK/CB0/A5
6
P1.4/MCLK/SDCLK/CB1/A4
7
P1.3/ADC10CLK/TACLK/RTCCLK/A3
8
P1.2/ACLK/TA3.1/A2
9
P1.1/TA2.1/VEREF+/A1
10
P1.0/TA1.1/TA0.0/VEREF-/A0
11
P2.4/PM_TA2.0
12
P2.5/PM_UCB0SOMI/PM_UCB0SCL
13
P2.6/PM_USB0SIMO/PM_UCB0SDA
14
P2.7/PM_UCB0CLK
15
P3.0/PM_UCA0RXD/PM_UCA0SOMI
16
P3.1/PM_UCA0TXD/PM_UCA0SIMO
17
P3.2/PM_UCA0CLK
18
P3.3/PM_UCA1CLK
19
P3.4/PM_UCA1RXD/PM_UCA1SOMI
20
P3.5/PM_UCA1TXD/PM_UCA1SIMO
21
COM0
22
COM1
23
P1.6/COM2
24
P1.7/COM3
25
P5.0/COM4
26
P5.1/COM5
27
P5.2/COM6
28
P5.3/COM7
29
LCDCAP/R33
30
P5.4/SDCLK/R23
31
P5.5/SD0DIO/LCDREF/R13
32
P5.6/SD1DIO/R03
33
P5.7/SD2DIO/CB2
34
P6.0/SD3DIO
35
P3.6/PM_UCA2RXD/PM_UCA2SOMI
36
P3.7/PM_UCA2TXD/PM_UCA2SIMO
37
P4.0/PM_UCA2CLK
38
P4.1/PM_UCA3RXD/PM_UCA3SOMI
39
P4.2/PM_UCA3TXD/PM_UCA3SIMO
40
P4.3/PM_UCA3CLK
41
P4.4/PM_UCB1SOMI/PM_UCB1SCL
42
P4.5/PM_UCB1SIMO/PM_UCB1SDA
43
P4.6/PM_UCB1CLK
44
P4.7/PM_TA3.0
45
P6.1/SD4DIO/S39
46
P6.2/SD5DIO/S38
47
P6.3/SD6DIO/S37
48
P6.4/S36
49
P6.5/S35
50
P6.6/S34
51
P6.7/S33
52
P7.0/S32
53
P7.1/S31
54
P7.2/S30
55
P7.3/S29
56
P7.4/S28
57
P7.5/S27
58
P7.6/S26
59
P7.7/S25
60
P8.0/S24
61
P8.1/S23
62
P8.2/S22
63
P8.3/S21
64
P8.4/S20 65
P8.5/S19 66
P8.6/S18 67
P8.7/S17 68
DVSYS 69
DVSS2 70
P9.0/S16 71
P9.1/S15 72
P9.2/S14 73
P9.3/S13 74
P9.4/S12 75
P9.5/S11 76
P9.6/S10 77
P9.7/S9 78
P10.0/S8 79
P10.1/S7 80
P10.2/S6 81
P10.3/S5 82
P10.4/S4 83
P10.5/S3 84
P10.6/S2 85
P10.7/S1 86
P11.0/S0 87
P11.1/TA3.1/CB3 88
P11.2/TA1.1 89
P11.3/TA2.1 90
P11.4/CBOUT 91
P11.5/TACLK/RTCCLK 92
P2.0/PM_TA0.0 93
P2.1/PM_TA0.1 94
P2.2/PM_TA0.2 95
P2.3/PM_TA1.0 96
TEST/SBWTCK 97
PJ.0/TDO 98
PJ.1/TDI/TCLK 99
PJ.2/TMS 100
PJ.3/TCK 101
~RST/NMI/SBWTDIO 102
SD0P0 103
SD0N0 104
SD1P0 105
SD1N0 106
SD2P0 107
SD2N0 108
SD3P0 109
SD3N0 110
VASYS2 111
AVSS2 112
VREF 113
SD4P0 114
SD4N0 115
SD5P0 116
SD5N0 117
SD6P0 118
SD6N0 119
AVSS1 120
AVCC 121
VASYS1 122
AUXVCC2 123
AUXVCC1 124
VDSYS 125
DVCC 126
DVSS1 127
VCORE 128
P1.0P1.0
P2.0 P2.0
P2.1 P2.1
SD0P0
SD0N0
SD1P0
SD1N0
SD2P0
SD2N0
SD3P0
SD3N0
SD4P0
SD4N0
SD5P0
SD5N0
SD6P0
SD6N0
VASYS1/2
VASYS1/2
VASYS1/2
VASYS1/2
TMS TMS
TDI
TDI
TDO
TDO
TDO
XOUT
GND
GND
XIN
DVCC
AVCC
DVDSYS
DVDSYS
DVDSYS
DVDSYS
AVSS
AVSS
PJ.2
PJ.2
PJ.1
PJ.1
PJ.0
PJ.0
RST/NMI
RST/NMI
TCK
TCK
TCK
PJ.3
PJ.3
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
TEST/SBWTCK
RST
RST
RST
RST
LCDCAP LCDCAP
VREF
VREF
VEREF+ VEREF+
VCORE
AUXVCC2
AUXVCC2
AUXVCC1
AUXVCC1
AUXVCC3
AUXVCC3
1
2
3
4
5
6
1
2
3
4
5
6
Titel:
Datum:
Bearb.:
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MSP-TS430PEU128
22.05.2012 09:37:33
A3
IHGFEDCBA
A B C D E F G H I
File:
Dok:
Rev.:
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MSP-TS430PEU128
B.35 MSP-TS430PEU128
Figure B-69. MSP-TS430PEU128 Target Socket Module, Schematic
145
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1
P1.0
SBW
JTAG
DVDSYS
ext
int
MSP-TS430PEU128
Rev. 1.1 RoHS
DVCC
AUXVCC
GND
AUXVCC1
AUXVCC2
AUXVCC3
GND
GND
RST/NMI
TCK
TDI
TDO
TEST/SBWTCK
TMS
1
25 5
10
15
20
30
35
6040 45 50 55 64
65 90
70 75 80 85 95 100
125 105110115120128
14
1
2
10
1
2GND
GND
VCC
123
123
123
123
123
123
1234
1234
1234
1
J1
J2
J3
J4
JTAG
R2
C2
C1
R1
C5
R3
BOOTST
C3
R10R11
J5
JP1
JP2
JP5
JP6
JP7
JP8
JP9
JP10 R7
R5
D1
R6
R8
C6
C29
C7
C10
R4
JP12
JP11
JP13
C4
C11
C12
C8
C13
C14
C9
C16
C19
C18
C26
JP4
JP3
C15
C17
TP1
TP2
IC1
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP1
Open to measure current
Orient Pin 1 of
MSP430 device
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
JP11, JP12, JP13
Connect 1-2 to connect AUXVCCx with DVCC or
drive AUXVCCx externally
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External power supply
MSP-TS430PEU128
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Figure B-70. MSP-TS430PEU128 Target Socket Module, PCB
NOTE: The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:
• R7 value is changed to 0 Ωinstead of 330 Ω.
• JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2.
• JP5 pin 2 is connected to IC1 pin 97.
• BOOTST pin 7 is connected to IC1 pin 97.
146 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-TS430PEU128
Table B-36. MSP-TS430PEU128 Bill of Materials
No. Per
Pos. Ref Des Description Digi-Key Part No. Comment
Board
94x119.4mm, 4 layers MSP-TS430PEU128 4 layers, green solder mask
1 PCB 1 Rev. 1.1
2 D1 1 green LED, DIODE0805 516-1434-1-ND
3 JP1, JP2, JP4 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header
JP5, JP6, JP7, JP8, 3-pin header, male, TH SAM1035-03-ND Place jumpers on pins 1-2 (SBW)
4 6
JP9, JP10
5 JP11, JP12, JP13 3 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2 (AVCC=VCC)
6 JP3 1 4-pin header, male, TH SAM1035-04-ND Place jumpers on pins 1-2
JP1, JP2, JP3, JP4, Jumper WM4592-ND
JP5, JP6, JP7, JP8,
7 13
JP9, JP10, JP11,
JP12, JP13
8 R1, R2, R4, R6, R8 5 0R, 0805 541-0.0ATR-ND
9 R10, R11 2 0R, 0805 541-0.0ATR-ND DNP
10 C3 1 2.2nF, CSMD0805 490-1628-2-ND DNP
C13, C14, C16, C17, 4.7uF, 6.3V, CSMD0805 587-1302-2-ND
11 7
C18, C19, C29
12 C11 1 10uF, 6.3V, CSMD0805 445-1372-2-ND
13 C12 1 10uF, 6.3V, CSMD0805 445-1372-2-ND DNP
14 C1, C2 2 12pF, CSMD0805 490-5531-2-ND DNP
15 R5 1 47K, 0805 311-47KARTR-ND
C4, C5, C6, C7, C8, 100nF, CSMD0805 311-1245-2-ND
16 6
C15
17 C9 1 100nF, CSMD0805 311-1245-2-ND DNP
18 R3, R7 2 330R, 0805 541-330ATR-ND
19 C10, C26 2 470nF, CSMD0805 587-1282-2-ND
20 BOOTST 1 10-pin connector, male, TH HRP10H-ND DNP, keep vias free of solder
21 JTAG 1 14-pin connector, male, TH HRP14H-ND
22 IC1 Socket 1 Socket: IC500-1284-009P Manuf. Yamaichi
23 IC1 2 MSP430F67791IPEU DNP: enclosed with kit. Is supplied by TI
24 J5 1 3-pin header, male, TH SAM1035-03-ND
Crystal: MS3V-T1R 32.768kHz DNP: Crystal enclosed with kit. Keep vias free
25 Q1 1 12.5pF ±20ppm of solder
26 TP1, TP2 2 Test point DNP, keep vias free of solder
26-pin header, TH SAM1029-26-ND DNP: Headers enclosed with kit. Keep vias free
27 J2,J4 2 of solder.
26-pin receptable, TH SAM1213-26-ND DNP: Receptacles enclosed with kit. Keep vias
28 J2,J4 2 free of solder.
38-pin header, TH SAM1029-38-ND DNP: Headers enclosed with kit. Keep vias free
29 J1, J3 2 of solder.
38-pin receptable, TH SAM1213-38-ND DNP: Receptacles enclosed with kit. Keep vias
30 J1, J3 2 free of solder.
31 Rubber feet 4 Rubber feet Buerklin: 20H1724 apply to bottom side corners
147
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JTAG connector
External power connector
CON12 GND
GND
VCC
Open to disconnect LEDs
jumper JP5/JP10
LED D2 (red) connected to
P3.6 via JP10
LED D1 (green) connected
to P1.0 via JP5
RF - Crystal Q1 26 MHz
RF - Signal SMA
Reset button S1
Push-button S2
connected to P1.7
Jumper JP1
Close JTAG
position to
debug in
JTAG mode
Jumper JP2
Close EXT for external supply
Close INT for JTAG supply
Close SBW position
to debug in
Spy-Bi-Wire mode
Jumper JP1
Spy-Bi-Wire mode
Footprint for 32kHz crystal
Use 0 resistor for R431/R441
to make XIN/XOUT available
on connector port5
Ω
Open to measure current
jumper JP3
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EM430F5137RF900
Figure B-72. EM430F5137RF900 Target board, PCB
The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensure
correct battery insertion regarding the polarity as indicated in battery holder.
149
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EM430F5137RF900
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Table B-37. EM430F5137RF900 Bill of Materials
No. per Manufacturer's Part
Item Reference Description Value Manufacturer Comment
Board Number
( CUSTOMER SUPPLY ) AKER
1 Q1 1 26M ASX-531(CS)
CRYSTAL, SMT, 4P, 26MHz ELECTRONIC
C1-C5, C082,
C222, C271, CAPACITOR, SMT, 0402, CER,
2 C281, C311, 14 0.1uF 0402YC104KAT2A AVX
16V, 10%, 0.1uF
C321, C341,
C412, C452 CAPACITOR, SMT, 0603,
3 C071 1 CERAMIC, 0.47uF, 16V, 10%, 0.47uF 0603YD474KAT2A AVX
X5R
4 R401 1 RES0402, 47.0K 47kΩCRCW04024702F100 DALE
HEADER, THU, MALE, 14P,
5 CON11 1 09 18 514 6323 HARTING
2X7, 25.4x9.2x9.45mm
HEADER, THU, MALE, 10P,
6 CON10 0 09 18 510 6323 HARTING DNP
2X5, 20.32x9.2x9.45mm
7 D1 1 LED, SMT, 0603, GREEN, 2.1V active APT1608MGC KINGBRIGHT
8 D2 1 LED, SMT, 0603, RED, 2.0V active APT1608EC KINGBRIGHT
UNINSTALLED CRYSTAL, SMT, MICRO
9 Q3 0 32.768k MS1V-T1K (UN) DNP
3P, MS1V (Customer Supply) CRYSTAL
HEADER, THU, MALE, 3P, 1x3,
10 CON12 1 22-03-5035 MOLEX
9.9x4.9x5.9mm
11 C251, C261 2 50V, 5%, 27pF 27pF GRM36COG270J50 MURATA
FERRITE, SMT, 0402, 1.0kΩ,
12 L341 1 1kΩBLM15HG102SN1D MURATA
250mA
CAPACITOR, SMT, 0402,
13 C293 1 CERAMIC, 100pF, 50V, 0.25pF, 100pF GRM1555C1H101JZ01 MURATA
C0G(NP0)
INDUCTOR, SMT, 0402, 2.2nH, 0.0022u
14 L304 1 LQP15MN2N2B02 MURATA
0.1nH, 220mA, 500MHz H
INDUCTOR, SMT, 0402, 15nH,
15 L303, L305 2 0.015uH LQW15AN15NG00 MURATA
2%, 450mA, 250MHz
INDUCTOR, SMT, 0402, 18nH,
16 L292, L302 2 0.018uH LQW15AN18NG00 MURATA
2%, 370mA, 250MHz
CAPACITOR, SMT, 0402,
17 C291 1 CERAMIC, 1pF, 50V, 0.05pF, 1pF GRM1555C1H1R0WZ01 MURATA
C0G(NP0)
CAPACITOR, SMT, 0402,
18 C303 1 CERAMIC, 8.2pF, 50V, 0.05pF, 8.2pF GRM1555C1H8R2WZ01 MURATA
C0G(NP0)
CAPACITOR, SMT, 0402,
C292, C301-
19 4 CERAMIC, 1.5pF, 50V, 0.05pF, 1.5pF GRM1555C1H1R5WZ01 MURATA
C302, C304 C0G(NP0)
INDUCTOR, SMT, 0402, 12nH,
20 L291, L301 2 0.012uH LQW15AN12NG00 MURATA
2%, 500mA, 250MHz
C282, C312, CAPACITOR, SMT, 0402,
21 C351, C361, 5 CERAMIC, 2pF, 50V, 0.1pF, 2.0pF GRM1555C1H2R0BZ01 Murata
C371 C0G
INDUCTOR, SMT, 0402, 6.2nH,
22 L1 1 6.2nH LQP15MN6N2B02 Murata
0.1nH, 130mA, 500MHz
ULTRA-SMALL TACTILE
23 S1-S2 2 SWITCH, SMT, 2P, SPST-NO, B3U-1000P OMRON
1.2x3x2.5mm, 0.05A, 12V
R4-R5, R051, UNINSTALLED
24 R061, R431, 0 RESISTOR/JUMPER, SMT, 0ΩERJ-2GE0R00X PANASONIC DNP
R441 0402, 0 Ω, 5%, 1/16W
RESISTOR/JUMPER, SMT,
24a R7 1 0ΩERJ-2GE0R00X PANASONIC
0402, 0 Ω, 5%, 1/16W
150 Hardware SLAU278V–May 2009–Revised May 2015
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EM430F5137RF900
Table B-37. EM430F5137RF900 Bill of Materials (continued)
No. per Manufacturer's Part
Item Reference Description Value Manufacturer Comment
Board Number
RESISTOR, SMT, 0402, THICK
25 R2-R3, R6 3 330ΩERJ-2GEJ331 PANASONIC
FILM, 5%, 1/16W, 330
CAPACITOR, SMT, 0402, CER,
26 C431, C441 0 12pF ECJ-0EC1H120J PANASONIC
12pF, 50V, 5%, NPO
CAPACITOR, SMT, 0402, CER,
27 C401 1 0.0022uF ECJ-0EB1H222K PANASONIC
2200pF, 50V, 10%, X7R
RESISTOR, SMT, THICK FILM,
28 R331 1 56kΩERJ-2GEJ563 PANASONIC
56K, 1/16W, 5%
CAPACITOR, SMT, 0603,
C081, C221,
29 4 CERAMIC, 10uF, 6.3V, 20%, 10uF ECJ-1VB0J106M PANASONIC
C411, C451 X5R
RESISTOR/JUMPER, SMT,
30 R1 1 0ΩERJ-2GE0R00X PANASONIC
0402, 0 Ω, 5%, 1/16W
UNINSTALLED CAP CERAMIC
31 C041 0 4.7uF ECJ-1VB0J475K Panasonic DNP
4.7UF 6.3V X5R 0603
32 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER
33 Q2 0 Crystal, SMT, 32.768 kHz 32.768k MS3V-T1R Micro Crystal DNP
DUT, SMT, PQFP, RGZ-48,
34 U1 1 0.5mmLS, 7.15x7.15x1mm, CC430F5137 TI
THRM.PAD
35 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH
36 CON1-CON9 0 Pin Connector 2x4pin 61300821121 WUERTH DNP
37 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH
JP3, JP5,
38 3 Pin Connector 1x2pin 61300211121 WUERTH
JP10
38a JP7, CON13 0 Pin Connector 1x2pin 61300211121 WUERTH DNP
39 JP4 1 Pin Connector 2x2pin 61300421121 WUERTH DNP
40 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH
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CON12
External power connector
Jumper JP2 to "EXT"
Jumpers JP5, JP10
Open to disconnect LEDs
D2
LED (red) connected to P3.6 via JP10
D1
LED (green) connected to P1.0 via JP5
Crystal Q1
RF - 26 MHz
X1
RF - Signal SMA
Button S1
Reset
Push-button S2
Connected to P1.7
Q2/Q3
Footprint for 32-kHz crystal
Jumper JP3
Open to measure current
GND
GND
VCC
C392
C422
L451
Jumper JP1 in Spy-Bi-Wire mode
Jumper JP2
Close INT for power supply via JTAG interface
Close EXT to external power supply (CON12)
Jumper JP1
Close SBW position to debug in Spy-Bi-Wire mode
Close JTAG position to debug in 4-wire JTAG mode
R541 and R551
Use 0- resistor to make P5.0 and P5.1
available on connector Port 5
W
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
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EM430F6137RF900
Figure B-74. EM430F6137RF900 Target Board, PCB
The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensure
correct battery insertion regarding the polarity as indicated in battery holder.
153
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EM430F6137RF900
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Table B-38. EM430F6137RF900 Bill of Materials
No. per
Pos. Ref Des Description Part No. Manufacturer
Board
( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, AKER
1 Q1 1 ASX-531(CS)
26MHz ELECTRONIC
C1-C5, C112,
C252, C381, CAPACITOR, SMT, 0402, CER, 16V, 10%,
2 C391, C421, 14 0402YC104KAT2A AVX
0.1uF
C431, C451,
C522, C562 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,
3 C101 1 0603YD474KAT2A AVX
16V, 10%, X5R
4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE
HEADER, THU, MALE, 14P, 2X7,
5 CON11 1 09 18 514 6323 HARTING
25.4x9.2x9.45mm, 90deg
7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT
8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT
10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX
11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA
12 L451 1 FERRITE, SMT, 0402, 1.0kΩ, 250mA BLM15HG102SN1D MURATA
CAPACITOR, SMT, 0402, CERAMIC, 100pF,
13 C403 1 GRM1555C1H101JZ01 MURATA
50V, ±0.25pF, C0G(NP0)
INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,
14 L414 1 LQW15AN2N2C10 MURATA
1000mA, 250MHz
INDUCTOR, SMT, 0402, 15nH, ±5%, 460mA,
15 L413, L415 2 LQW15AN15NJ00 MURATA
250MHz
INDUCTOR, SMT, 0402, 18nH, ±5%, 370mA,
16 L402, L412 2 LQW15AN18NJ00 MURATA
250MHz
CAPACITOR, SMT, 0402, CER, 1pF, 50V,
17 C401 1 GJM1555C1H1R0CB01D MURATA
±0.25pF, NP0
CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,
18 C413 1 GRM1555C1H8R2CZ01 MURATA
50V, ±0.25pF, C0G(NP0)
C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,
19 4 GRM1555C1H1R5CZ01 MURATA
C412, C414 50V, ±0.25pF, C0G(NP0)
INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,
20 L401, L411 2 LQW15AN12NJ00 MURATA
250MHz
C46-C48, C392, CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,
21 5 GRM1555C1H2R0CZ01 Murata
C422 50V, ±0.25pF, C0G(NP0)
INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH, 700mA,
22 L1 1 LQW15AN6N2D00 Murata
250MHz
ULTRA-SMALL TACTILE SWITCH, SMT, 2P,
23 S1-S2 2 B3U-1000P OMRON
SPST-NO, 1.2x3x2.5mm, 0.05A, 12V
RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
24 R7 1 ERJ-2GE0R00X (UN) PANASONIC
1/16W
RESISTOR, SMT, 0402, THICK FILM, 5%,
25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC
1/16W, 330
CAPACITOR, SMT, 0402, CER, 2200pF, 50V,
27 C511 1 ECJ-0EB1H222K PANASONIC
10%, X7R
C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 10uF,
28 4 ECJ-1VB0J106M PANASONIC
C521, C561 6.3V, 20%, X5R
28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC
29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC
RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
30 R1 1 ERJ-2GE0R00X PANASONIC
1/16W
31 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER
DUT, SMT, PQFP, RGC-64, 0.5mmLS,
33 U1 1 CC430F6137 TI
9.15x9.15x1mm, THRM.PAD
34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH
154 Hardware SLAU278V–May 2009–Revised May 2015
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EM430F6137RF900
Table B-38. EM430F6137RF900 Bill of Materials (continued)
No. per
Pos. Ref Des Description Part No. Manufacturer
Board
35 JP2 1 Pin Connector 1x3pin 61300311121 WUERTH
36a JP3, JP5, JP10 3 Pin Connector 1x2pin 61300211121 WUERTH
38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH
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Orient pin 1 of MSP430 device
D1
LED (green) connected to P1.0 via JP5
Jumpers JP5 and JP10
Open to disconnect LEDs
D2
LED (red) connected to P3.6 via JP10
Jumpers JP6 and JP8
Close 1-2 for Bypass mode
Close 2-3 for TPS mode
Jumper JP9
TPS status
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootstrap Loader Tool
TPS62730
Jumper JP2
Close INT: Power supply via JTAG interface
Close EXT: External power supply
Button S2
Connected to P1.7
32-kHz crystal
R554 and R551
Use 0- resistor to make P5.0 and P5.1
available on connector Port 5
W
Button S1
Reset
Jumper JP3
Open to measure current
CON12
External poser connector
Jumper JP2 to "EXT"
Crystal Q1
RF - 26 MHz
SMA1
RF - Signal SMA
Jumper JP1
Close JTAG position to debug in JTAG mode
Close SBW position to debug in Spy-BI-Wire mode
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EM430F6147RF900
Figure B-76. EM430F6147RF900 Target Board, PCB
The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensure
correct battery insertion regarding the polarity as indicated in battery holder.
157
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EM430F6147RF900
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Table B-39. EM430F6147RF900 Bill of Materials
No. per
Pos. Ref Des Description Part No. Manufacturer
Board
( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P, AKER
1 Q1 1 ASX-531(CS)
26MHz ELECTRONIC
C1-5 C112
C252 C381 CAPACITOR, SMT, 0402, CER, 16V, 10%,
2 C391 C421 14 0402YC104KAT2A AVX
0.1uF
C431 C451
C522 C562 CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,
3 C101 1 0603YD474KAT2A AVX
16V, 10%, X5R
4 R511 1 RES0402, 47.0K CRCW04024702F100 DALE
HEADER, THU, MALE, 14P, 2X7,
5 CON11 1 09 18 514 6323 HARTING
25.4x9.2x9.45mm, 90deg
7 D1 1 LED, SMT, 0603, GREEN, 2.1V APT1608MGC KINGBRIGHT
8 D2 1 LED, SMT, 0603, RED, 2.0V APT1608EC KINGBRIGHT
10 CON12 1 HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm 22-03-5035 MOLEX
11 C361, C371 2 50V, ±5%, 27pF GRM36COG270J50 MURATA
12 L451 1 Inductor, SMD, 0402, 12nH, 5%, 370mA LQW15AN12NJ00 MURATA
CAPACITOR, SMT, 0402, CERAMIC, 100pF,
13 C403 1 GRM1555C1H101JZ01 MURATA
50V, ±0.25pF, C0G(NP0)
INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,
14 L414 1 LQW15AN2N2C10 MURATA
1000mA, 250MHz
Inductor, SMD, 0402, 15nH, 5%, 370mA,
15 L413 1 LQW15AN15NJ00 MURATA
250MHz
INDUCTOR,SMT,0402,15nH,±5%,460mA,250M
15 L415 1 LQW15AN15NJ00 MURATA
Hz
Inductor, SMD, 0402, 18nH, 5%, 460mA,
16 L402, L412 2 LQW15AN18NJ00 MURATA
250MHz
CAPACITOR, SMT, 0402, CER, 1pF, 50V,
17 C401 1 GJM1555C1H1R0CB01D MURATA
±0.25pF, NP0
CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,
18 C413 1 GRM1555C1H8R2CZ01 MURATA
50V, ±0.25pF, C0G(NP0)
C402, C411- CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,
19 4 GRM1555C1H1R5CZ01 MURATA
C412, C414 50V, ±0.25pF, C0G(NP0)
INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,
20 L1, L401, L411 3 LQW15AN12NJ00 MURATA
250MHz
CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,
21 C46-C48, C392 4 GRM1555C1H2R0CZ01 MURATA
50V, ±0.25pF, C0G(NP0)
Inductor, SMD, 0805, 2.2uH, 20%, 600mA,
22 L2 1 LQM21PN2R2MC0 MURATA
50MHz
ULTRA-SMALL TACTILE SWITCH, SMT, 2P,
23 S1-S2 2 B3U-1000P OMRON
SPST-NO, 1.2x3x2.5mm, 0.05A, 12V
R1, R7, R551, RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
24 4 ERJ-2GE0R00X (UN) PANASONIC
R554 1/16W
RESISTOR, SMT, 0402, THICK FILM, 5%,
25 R2-R3, R6 3 ERJ-2GEJ331 PANASONIC
1/16W, 330
CAPACITOR, SMT, 0402, CER, 2200pF, 50V,
27 C511 1 ECJ-0EB1H222K PANASONIC
10%, X7R
C111, C251, CAPACITOR, SMT, 0603, CERAMIC, 1uF, 6.3V,
28 4 ECJ-1VB0J105K PANASONIC
C521, C561 20%, X5R
28a C041 1 CAP CERAMIC 4.7UF 6.3V X5R 0603 ECJ-1VB0J475M PANASONIC
29 R441 1 RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602 PANASONIC
30 X1 1 SMA STRIGHT JACK, SMT 32K10A-40ML5 ROSENBERGER
DUT, SMT, PQFP, RGC-64, 0.5mmLS,
31 U1 1 CC430F6147 TI
9.15x9.15x1mm, THRM.PAD
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EM430F6147RF900
Table B-39. EM430F6147RF900 Bill of Materials (continued)
No. per
Pos. Ref Des Description Part No. Manufacturer
Board
IC, Step Down Converter with Bypass Mode for
33 U2 1 TPS62370 TI
Low Power Wireless
34 JP1 1 Pin Connector 2x4pin 61300821121 WUERTH
35 JP2, JP6, JP8 3 Pin Connector 1x3pin 61300311121 WUERTH
JP3, JP5, JP9,
36a 4 Pin Connector 1x2pin 61300211121 WUERTH
JP10
38 JP1a 1 Pin Connector 2x3pin 61300621121 WUERTH
38 C7 1 Capacitor, Ceramic, 1206, 16V, X5R, 20% GRM31CR61C226ME15L MURATA
38 C8-9 2 CAP, SMD, Ceramic, 0402, 2.2uF, X5R GRM155R60J225ME15D MURATA
CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,
38 C041 1 MURATA
X5R
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MSP-FET
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B.39 MSP-FET
The MSP-FET is a powerful flash emulation tool to quickly begin application development on MSP430
microcontrollers.
The MSP-FET provides a USB interface to program and debug the MSP430 devices in-system through
the JTAG interface or the pin-saving Spy-Bi-Wire (2-wire JTAG) protocol. Furthermore, the USB interface
can be used for UART backchannel and MSP target BSL communication. UART and I2C BSL
communication modes are supported.
The MSP-FET development tool supports development with all MSP430 devices and is designed for use
with PCBs that contain MSP430 devices; for example, the MSP430 target socket boards.
B.39.1 Features
• USB debugging interface to connect a MSP430 MCU to a PC for real-time in-system programming and
debugging
• Software configurable supply voltage between 1.8 V and 3.6 V at 100 mA
• Supports JTAG Security Fuse blow to protect code
• Supports all MSP430 boards with JTAG header
• Supports both JTAG and Spy-Bi-Wire (2-wire JTAG) debug protocols
B.39.2 Release Notes
The MSP-FET is supported by MSP Debug Stack (MSPDS) revision 3.4.0.20 and higher. Observe the
following MSPDS-specific MSP-FET limitations.
B.39.2.1 MSPDS 3.4.0.20 Limitations
• EEM access to F149 and L092 devices is possible only when JTAG speed is set to slow.
• Poly Fuse Blow in Spy-Bi-Wire mode is in beta state and is not officially supported.
• The UART backchannel function is not implemented (even though an additional COM port is shown on
the PC).
B.39.2.2 MSPDS UART Backchannel Implementation
In MSPDS v3.4.1.0 and later, the UART backchannel function is implemented and supported for the MSP-
FET. The baud rates that are supported depend on the target configuration and the debug settings.
Table B-40 shows which baud rates are supported with certain configuration combinations.
A green cell with ✓means that the corresponding baud rate is supported without any data loss with the
specified combination of settings.
A red cell with ✗means that the corresponding baud rate is not supported (data loss is expected) with the
specified combination of settings.
Table B-40. UART Backchannel Implementation
Target MCLK 1 MHz 1 MHz 8 MHz 8 MHz 1 MHz 1 MHz 8 MHz 8 MHz
Frequency:
Debugger: Active Active Active Active Inactive Inactive Inactive Inactive
Flow Control: No Yes No Yes No Yes No Yes
4800 baud ✓✓✓✓✓✓✓✓
9600 baud ✓✓✓✓✓✓✓✓
19200 baud ✓✓✓✓✓✓✓✓
28800 baud ✗ ✓ ✓ ✓ ✓ ✓ ✓ ✓
38400 baud ✗ ✓ ✗ ✓ ✗ ✓ ✓ ✓
57200 baud ✗ ✓ ✗ ✓ ✗ ✓ ✗ ✓
115200 baud ✗ ✗ ✗ ✓ ✗ ✗ ✗ ✓
160 Hardware SLAU278V–May 2009–Revised May 2015
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MSP-FET
Figure B-77. MSP-FET Top View
Figure B-78. MSP-FET Bottom View
B.39.2.3 MSPDS UART Backchannel Activation Commands
The MSP-FET supports two different backchannel UART modes, one with flow control and one without.
The different modes can be selected by opening the corresponding COM port with a dedicated baud rate.
See Table B-41 for the specific baud rates for each command.
NOTE: The baud rates used by these commands cannot be used for communication.
If none of the specified commands are transferred before setting the communication baud rate,
communication starts with these default settings: 3.3-V target VCC, no flow control mechanism.
Table B-41. UART Backchannel Activation Commands
Baud Rate Command
9620 Set all backchannel UART pins to high impedance – no current flow into target device
9621 Configure backchannel UART communication without handshake (default start behavior)
9622 Configure backchannel UART communication with handshake
9623 Voltage configuration command.
When this command is received, target VCC is set to 3300 mV. After target VCC is configured, it is switched
through to the target device.
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MSP-FET
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B.39.2.4 MSPDS MSP Target BSL Activation Commands
The MSP-FET can be used for communication with the target device BSL through the I2C and UART
protocols. The activation of the different protocols is equivalent to the MSP-FET backchannel UART. See
Table B-42 for command details. In MSP-FET BSL communication mode, flow control is not available,
because this is not supported by the MSP target device BSL.
UART BSL: The MSP-FET BSL UART mode supports the following baud rates: 9600, 14400, 19200,
28800, 38400, 56000, 57600, and 115200. For the BSL UART, 8 + 1 + even parity is used.
I2C BSL: The MSP-FET is always the I2C master, and the target device BSL is always the I2C slave. 7-bit
I2C addressing mode is used with a fixed I2C slave address of 0x48.
NOTE: If the MSP-FET is configured to support BSL communication, debugger functionality is
disabled. To switch to debugger mode, either perform a power cycle (unplug the USB cable)
or configure the baud rate to 8001.
Table B-42. MSP Target BSL Activation Commands
Baud Rate Command
9620 Set all UART or I2C pins to high impedance – no current flow into target device
9601 BSL entry sequence and power up 3.3 V (UART BSL)
100000 or 100001 BSL entry sequence and power up 3.3 V (I2C BSL)
400000 or 400001 BSL entry sequence and power up 3.3 V (I2C BSL)
9623 Power up 3.3 V
8001 Activate debugger
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MSP-FET Rev 1.2
1
3/12/2014
3/12/2014
C
4
A B C D
Date
E
Sheet of
F
4
2
1
Title
3
1
A B C D E
Size Number
F
2
3
Rev
1
A
5
General power supply
Additional supply
LED
USB interface Host MCU
DVCC1
DVCC3
DVCC2
AVCC1
Debug i/f
USB BSL activation
VBUS bypass
1P6.4/CB4/A4
2P6.5/CB5/A5
3P6.6/CB6/A6/DAC0
4P6.7/CB7/A7/DAC1
5P7.4/CB8/A12
6P7.5/CB9/A13
7P7.6/CB10/A14/DAC0
8P7.7/CB11/A15/DAC1
9P5.0/VREF+/VEREF+
10 P5.1/VREF-/VEREF-
11 AVCC1
12 AVSS1
13 XIN
14 XOUT
15 AVSS2
16 P5.6/ADC12CLK/DMAE0
17 P2.0/P2MAP0
18 P2.1/P2MAP1
19 P2.2/P2MAP2
20 P2.3/P2MAP3
21 P2.4/P2MAP4
22 P2.5/P2MAP5
23 P2.6/P2MAP6/R03
24 P2.7/P2MAP7/LCDREF/
25 DVCC1
26 DVSS1
27 VCORE(2)
28 P5.2/R23
29 LCDCAP/R33
30 COM0
31 P5.3/COM1/S42
32 P5.4/COM2/S41
33 P5.5/COM3/S40
34 P1.0/TA0CLK/ACLK/S3
35 P1.1/TA0.0/S38
36 P1.2/TA0.1/S37
37 P1.3/TA0.2/S36
38 P1.4/TA0.3/S35
39 P1.5/TA0.4/S34
40 P1.6/TA0.1/S33
41 P1.7/TA0.2/S32
42 P3.0/TA1CLK/CBOUT/S
43 P3.1/TA1.0/S30
44 P3.2/TA1.1/S29
45 P3.3/TA1.2/S28
46 P3.4/TA2CLK/SMCLK/S
47 P3.5/TA2.0/S26
48 P3.6/TA2.1/S25
49 P3.7/TA2.2/S24
50 P4.0/TB0.0/S23
51
P4.1/TB0.1/S22
52
P4.2/TB0.2/S21
53
P4.3/TB0.3/S20
54
P4.4/TB0.4/S19
55
P4.5/TB0.5/S18
56
P4.6/TB0.6/S17
57
P4.7/TB0OUTH/SVMOUT
58
P8.0/TB0CLK/S15
59
P8.1/UCB1STE
60
P8.2/UCA1TXD
61
P8.3/UCA1RXD
62
P8.4/UCB1CLK/UCA1ST
63
DVSS2
64
DVCC2
65
P8.5/UCB1SIMO
66
P8.6/UCB1SOMI
67
P8.7/S8
68
P9.0/S7
69
P9.1/S6
70
P9.2/S5
71
P9.3/S4
72
P9.4/S3
73
P9.5/S2
74
P9.6/S1
75
P9.7/S0
76
VSSU
77
PU.0/DP
78
PUR
79
PU.1/DM
80
VBUS
81
VUSB
82
V18
83
AVSS3
84
P7.2/XT2IN
85
P7.3/XT2OUT
86
VBAK
87
VBAT
88
P5.7/RTCCLK
89
DVCC3
90
DVSS3
91
TEST/SBWTCK
92
PJ.0/TDO
93
PJ.1/TDI/TCLK
94
PJ.2/TMS
95
PJ.3/TCK
96
RST/NMI/SBWTDIO
97
P6.0/CB0/A0
98
P6.1/CB1/A1
99
P6.2/CB2/A2
100
P6.3/CB3/A3
U1
MSP430F6638IPZR
C6
100n
+C5
10uF/6.3V
C7
100n
C9
100n
C11
100n
R10R
C15
68p
C16
470n
C17
220n
C18
4.7n
D1 D2
R47 470R
R500R
1IO1
2IO2
3GND 4
IO3
5
IO4
6
VCC
U5
TPD4E004DRYR
R21k4
C14
4.7u, dnp
C23
100n
R6033k
C31
10p
C33
10p
R61
1M
R62
100R
J5
C8
220n
13
2
P1
R170R
A C
D7
B0530W-7-F
R76
27k
C70
4.7u, dnp
C71
100n
R85
0R, dnp
C55
1n
R3 27R
R45 27R
R46 470R
+C12
10uF/6.3V
1
2
3
4
5
6
711
10
J1
R28
4k7
R30
4k7
1
1
11
1
1
1
111
1 1
1
1 1 1
1 1 1 1
1
1
VCC_DT_REF
VCC_DCDC_REF
VCC_DT2TRGT_CTRL
VCC_SUPPLY2TRGT_CTRL
LED1
TDIOFF_CTRL
PWM_SETVF
FPGA_TCK
FPGA_TDI
FPGA_TMS
FPGA_TDO
FPGA_TRST
VF2TEST_CTRL
VF2TDI_CTRL
AVCC_POD
VCC_POD33
VCC_POD33
VCC_POD33
VREF+
VCORE
VBAK
MCU_DMAE0
DCDC_PULSE
MCU_P2.2
MCU_P2.3
MCU_P2.4
MCU_P2.5
MCU_P2.6
MCU_P2.7
MCU_P1.0
MCU_P1.1
MCU_P1.2
MCU_P1.3
MCU_P1.4
MCU_P1.5
MCU_P1.6
MCU_P1.7
MCU_P3.0
MCU_P3.1
MCU_P3.2
MCU_P3.3
MCU_P3.4
MCU_P3.5
MCU_P3.6
MCU_P3.7
MCU_P4.0
MCU_P4.1
MCU_P4.2
MCU_P4.3
MCU_P4.4
MCU_P4.5
MCU_P4.6
MCU_P4.7
MCU_P8.1
MCU_P8.2
MCU_P8.3
PUR
PU.1/DM
PU.0/DP
VBUS
VUSB
AVCC_POD
VCC_POD33
VCC_POD33
VCC_POD33
AVCC_POD VCC_POD33
VREF+
VCORE
V18
V18
VBAK
HOST_TEST
HOST_RST
FPGA_RESET
LED0
LED1
PUR
VUSB
PU.1/DM
PU.0/DP
DCDC_RST
HOST_SCL
HOST_SDA
DCDC_IO0
LED0
A_VBUS5
VBUS
A_VCC_SUPPLY_HOST
DCDC_TEST
A_VF
MCU_P9.5
DCDC_IO1
HOST_TCK
HOST_TMS
HOST_TDI
HOST_TDO
VCC_POD33
HOST_RST
VCC_POD33
GND1
VBUS5
MCU_P2.1
GND1 GND1
VCC_DT2SUPPLY_CTRL
A_VCC_DT
A_VCC_DT_BSR
A_VCC_SENSE0_TRGT
VCC_POD33
VCC_DT_SENSE
www.ti.com
MSP-FET
B.39.3 Schematics
Figure B-79. MSP-FET USB Debugger, Schematic (1 of 5)
163
SLAU278V–May 2009–Revised May 2015 Hardware
Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated
MSP-FET Rev 1.2
3/12/2014
5
1A
2
Rev
3
2
F
NumberSize
EDCBA
1
3
Title
1
2
4
F
ofSheet
E
Date
DCBA
4
C
3/12/2014
VCC_PUMP VCC_JTAG
FPGA
1GND
2GAA2/IO51RSB1
3IO52RSB1
4GAB2/IO53RSB1
5IO95RSB1
6GAC2/IO94RSB1
7IO93RSB1
8IO92RSB1
9GND
10 GFB1/IO87RSB1
11 GFB0/IO86RSB1
12 VCOMPLF
13 GFA0/IO85RSB1
14 VCCPLF
15 GFA1/IO84RSB1
16 GFA2/IO83RSB1
17 VCC
18 VCCIB1
19 GEC1/IO77RSB1
20 GEB1/IO75RSB1
21 GEB0/IO74RSB1
22 GEA1/IO73RSB1
23 GEA0/IO72RSB1
24 VMV1
25 GNDQ
26 GEA2/IO71RSB1
27 FF/GEB2/IO70RSB1
28 GEC2/IO69RSB1
29 IO68RSB1
30 IO67RSB1
31 IO66RSB1
32 IO65RSB1
33 IO64RSB1
34 IO63RSB1
35 IO62RSB1
36 IO61RSB1
37 VCC
38 GND
39 VCCIB1
40 IO60RSB1
41 IO59RSB1
42 IO58RSB1
43 IO57RSB1
44 GDC2/IO56RSB1
45 GDB2/IO55RSB1
46 GDA2/IO54RSB1
47 TCK
48 TDI
49 TMS
50 VMV1
51
GND
52
VPUMP
53
NC
54
TDO
55
TRST
56
VJTAG
57
GDA1/IO49RSB0
58
GDC0/IO46RSB0
59
GDC1/IO45RSB0
60
GCC2/IO43RSB0
61
GCB2/IO42RSB0
62
GCA0/IO40RSB0
63
GCA1/IO39RSB0
64
GCC0/IO36RSB0
65
GCC1/IO35RSB0
66
VCCIB0
67
GND
68
VCC
69
IO31RSB0
70
GBC2/IO29RSB0
71
GBB2/IO27RSB0
72
IO26RSB0
73
GBA2/IO25RSB0
74
VMV0
75
GNDQ
76
GBA1/IO24RSB0
77
GBA0/IO23RSB0
78
GBB1/IO22RSB0
79
GBB0/IO21RSB0
80
GBC1/IO20RSB0
81
GBC0/IO19RSB0
82
IO18RSB0
83
IO17RSB0
84
IO15RSB0
85
IO13RSB0
86
IO11RSB0
87
VCCIB0
88
GND
89
VCC
90
IO10RSB0
91
IO09RSB0
92
IO08RSB0
93
GAC1/IO07RSB0
94
GAC0/IO06RSB0
95
GAB1/IO05RSB0
96
GAB0/IO04RSB0
97
GAA1/IO03RSB0
98
GAA0/IO02RSB0
99
IO01RSB0
100
IO00RSB0
U2
A3PN125-VQG100
R4
1k
R5
1k
1 2
L3
33n
+C19
10uF/6.3V
C20
100n
C21
10n
C22
100n
C34
10n
C35
100n
C36
10n
C37
100n
C38
10n
C39
100n
C40
10n
C41
100n
C42
10n
C43
100n
C44
10n
C45
100n
C46
10n
C47
100n
C48
10n
C49
100n
C50
10n
C51
100n
C52
10n
R44 27R
1
111
1
1 1 1
1
1
1
1
1
1
111
VCC_PLF
VCC_POD15
VCC_POD15
VCC_POD15
VCC_POD15
VCC_POD33
VCC_POD33
VCC_POD33
VCC_POD33
VCC_POD33
VCC_POD33
VCC_POD33
VCC_POD33
VCC_POD33
FPGA_TCK
FPGA_TDI
FPGA_TMS
FPGA_TRST
MCU_DMAE0
MCU_P2.2
MCU_P2.3
MCU_P2.4
MCU_P2.5
MCU_P2.6
MCU_P1.0
MCU_P1.1
MCU_P1.2
MCU_P1.3
MCU_P1.4
MCU_P1.5
MCU_P1.6
MCU_P1.7
MCU_P3.0
MCU_P3.1
MCU_P3.2
MCU_P3.3
MCU_P3.4
MCU_P3.5
MCU_P3.6
MCU_P3.7
MCU_P4.0
MCU_P4.1
MCU_P4.2
MCU_P4.3
MCU_P4.4
MCU_P4.5
MCU_P4.6
MCU_P4.7
MCU_P8.1
MCU_P8.2
MCU_P8.3
FPGA_IO_TCK
FPGA_DIR_CTRL_TCK
FPGA_IO_TMS
FPGA_DIR_CTRL_TMS
FPGA_IO_TDI
FPGA_DIR_CTRL_TDI
FPGA_IO_TDO
FPGA_DIR_CTRL_TDO
MCU_P2.7
FPGA_DIR_CTRL_RST
FPGA_IO_TEST
FPGA_DIR_CTRL_TEST
FPGA_IO_UART_TXD
FPGA_DIR_CTRL_UART_TXD
FPGA_IO_UART_RXD
FPGA_DIR_CTRL_UART_RXD
FPGA_IO_UART_CTS
FPGA_DIR_CTRL_UART_CTS
FPGA_IO_UART_RTS
FPGA_DIR_CTRL_UART_RTS
FPGA_TDO
FPGA_RESET
VCC_POD15
VCC_POD15
VCC_POD33
VCC_PLF VCC_POD33 VCC_POD33
FPGA_IO_RST
FPGA_TP0
FPGA_TP1
FPGA_TP2
MCU_P9.5
MCU_P2.1
MSP-FET
www.ti.com
Figure B-80. MSP-FET USB Debugger, Schematic (2 of 5)
164 Hardware SLAU278V–May 2009–Revised May 2015
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
3/12/2014
3/12/2014
C
4
A B C D
Date
E
Sheet of
F
4
2
1
3
1
A B C D E
Size Number
F
2
3
Rev
3
A
1
5
S/W controlled DCDC converter
DCDC MCU reference voltage DT level shifter supply
DCDC calibration switch
DCDC MCU
DCDC MCU debug i/f
DT current measurement shunt
DT current sense
MSP-FET Rev 1.2
Energy measurement method protected under U.S. Patent Application 13/329,073
and subsequent patent applications
1DVCC
2P1.0/TA0CLK
3P1.1/TA0.0
4P1.2/TA0.1
5P1.3/ADC10CLK
6P1.4/TA0.2
7P1.5/TA0.0 8
P1.6/TA0.1
9
P1.7/SDI
10
NMI-RST
11
TEST/SBWTCK
12
XOUT/P2.7
13
XIN/P2.6
14
DVSS
U4
MSP430G2452PW
MSP430G2452PW
1 2
L4
R53
R55
R56
R64
1
2
3
D4
R65
220k
C28
33p
R63
C53
100n
1NO1
2COM1
3NO2
4COM2
5IN2
6IN3
7GND 8
NO3
9
COM3
10
COM4
11
NO4
12
IN4
13
IN1
14
V+
U20
TS3A4751PWR
TS3A4751PWR
C13
1n, dnp
C56
4.7u
+
C57
2.2u
C63
100n
R19
1A1
2A2
3
C1,C2
D8
C66
1n
R200R
R23 180k
R25 150k
R15
220k
1G
2
S
3D
Q3
R26
27k, dnp
1IN
2GND
3EN 4
NR
5
OUT
U7
TPS73401DDCT
C54 1n
C26
2.2u
R24 160k
C24 1n
C62
10n
C29
4.7u
C10
1u
2
E
1
B
3
C
Q4
R6
220k
C1
33p
R7
220k
C65 100n
5IN-
4IN+
6
OUT
1
REF
2
GND
3
V+
U10
INA21XDCK
INA214AIDCKT
C67 10p
C68 1n
R4910R
R5410R
R57 0.2
C69 2.2u
C72 2.2u
C73 2.2u
1 1
DCDC_CAL0
DCDC_CAL2
DCDC_TEST
DCDC_RST
HOST_SDA
DCDC_CAL1
VCC_POD33
DCDC_PULSE
DCDC_IO0
VCC_DCDC_REF
A_VCC_SUPPLY
VBUS5
VCC_SUPPLY
A_VCC_SUPPLY
DCDC_CAL0
VCC_SUPPLY
VCC_DT
DCDC_CAL1
DCDC_CAL2
DCDC_RST
VCC_POD33
GND1
GND1
GND1 GND1
GND1
VBUS
GND1GND1GND1
DCDCGND
GND1
DCDCGND DCDCGNDDCDCGND
DCDCGND
DCDCGND
GND1
VCC_SUPPLY
GND1
GND1
VCC_DT_REF
GND1
DCDC_IO1
VCC_DT
HOST_SCL
VCC_DT_BSR
VCC_SUPPLY
A_VCC_SUPPLY_HOST
VCC_SUPPLY
VCC_POD33
VCC_DT_SENSE
VCC_DT
VCC_DT_BSR GND1
GND1GND1
www.ti.com
MSP-FET
Figure B-81. MSP-FET USB Debugger, Schematic (3 of 5)
165
SLAU278V–May 2009–Revised May 2015 Hardware
Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated
3/12/2014
5
1A
4
Rev
3
2
F
NumberSize
EDCBA
1
3
1
2
4
F
ofSheet
E
Date
DCBA
4
C
3/12/2014
VF = +5V ... 6.5V
Fuse blow step-up converter
Fuse voltage multiplexer / VCC_DT to level shifters
ESD protection
Target MCU connector
DT level shifters
MSP-FET Rev 1.2
S1
D1
IN2
GND S2
D2
IN1
VDD
U6
ADG821BRMZ-REEL7
D5
dnp
MMSZ5232B-7-F
R13 100R
R14
2k2
S1
D1
IN2
GND S2
D2
IN1
VDD
U9
ADG821BRMZ-REEL7
L2
33u
C30
330n
E
B
C
Q1
BC817-16LT1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
J6
R35 100R
1IO1
2IO2
3IO3
4IO4 5
IO5
6
IO6
7
IO7
8
IO8
9GND
U3
TPD8E003DQD
TPD8E003DQDR
1IO1
2IO2
3IO3
4IO4 5
IO5
6
IO6
7
IO7
8
IO8
9GND
U21
TPD8E003DQD
TPD8E003DQDR
R22
47k
R29
47k
R42
1k
D3
dnp
DDZ9692-7 1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U12
SN74LVC1T45DCKR
1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U13
SN74LVC1T45DCKR
1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U14
SN74LVC1T45DCKR
1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U15
SN74LVC1T45DCKR
1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U16
SN74LVC1T45DCKR
1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U17
SN74LVC1T45DCKR
1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U22
SN74LVC1T45DCKR
1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U26
SN74LVC1T45DCKR
1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U27
SN74LVC1T45DCKR
1VCCA
2GND
3A4
B
5
DIR
6
VCCB
U28
SN74LVC1T45DCKR
R27
47k
R31
47k
R84
47k, dnp
R86
47k
R87
47k
R88
47k
R89
47k
R90
47k
R91
47k
R92
47k
R93
47k
R94
47k
R95
47k
R96
47k
R97
47k
R98
47k
R99
47k
R100
47k
R101
47k
R102
47k
C77
100n
C78
100n
C79
100n
C80
100n
C82
100n
C83
100n
C84
100n
C85
100n
R32 100R
R33 100R
R34 100R
R37 100R
R38 100R
R39 100R
R40 100R
R41 100R
R43 100R
A C
D10
B0530W-7-F
A C
D6
DNP B0530W-7-F
+C74
100u/10V
R48
47k
R58
47k
R59
47k
1
1
11
1
11
11111
11111
VF
VF2TDI_CTRL
VF
VF2TEST_CTRL
TDIOFF_CTRL
VF
TC_TDI_FD
VF_TDI
VBUS VF
TC_TEST_FD
VF_TEST
TC_TEST_BSR
TC_TDI_BSR
TC_TDO_FD
VCC_SENSE0_TRGT
TC_TMS_FD
TC_TCK_FD
TC_UART_CTS_FD
TC_RST_FD
TC_UART_TXD_FD
TC_UART_RTS_FD
TC_UART_RXD_FD
VCC_SUPPLY_TRGT
TC_TDI_BSR
TC_TEST_BSR
VCC_SUPPLY_TRGT
TC_TDO_FD
TC_TCK_FD
TC_TEST_BSR
VCC_SENSE0_TRGT TC_TMS_FD
TC_TDI_BSR TC_UART_CTS_FD
TC_UART_RTS_FD
TC_UART_RXD_FD
TC_RST_FD
TC_UART_TXD_FD
VCC_JTAGLDO_TRGT
VCC_JTAGLDO_TRGT
VCC_DT2TRGT_CTRL
VCC_DT_TRGT
VCC_DT
GND1
PWM_SETVF
VCC_POD33
FPGA_IO_TCK
FPGA_DIR_CTRL_TCK
TC_TCK_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
FPGA_IO_TMS
FPGA_DIR_CTRL_TMS
TC_TMS_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
FPGA_IO_TDI
FPGA_DIR_CTRL_TDI
TC_TDI_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
FPGA_IO_TDO
FPGA_DIR_CTRL_TDO
TC_TDO_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
FPGA_IO_RST
FPGA_DIR_CTRL_RST
TC_RST_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
FPGA_IO_TEST
FPGA_DIR_CTRL_TEST
TC_TEST_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
FPGA_IO_UART_TXD
FPGA_DIR_CTRL_UART_TXD
TC_UART_TXD_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
FPGA_IO_UART_RXD
FPGA_DIR_CTRL_UART_RXD
TC_UART_RXD_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
FPGA_IO_UART_CTS
FPGA_DIR_CTRL_UART_CTS
TC_UART_CTS_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
FPGA_IO_UART_RTS
FPGA_DIR_CTRL_UART_RTS
TC_UART_RTS_FD
VCC_DT_TRGT
VCC_DT_TRGT
VCC_POD33
GND1
VCC_DT_TRGT
GND1 GND1
GND1 GND1
GND1
GND1
GND1
GND1
GND1 GND1
GND1
GND1
GND1
GND1
GND1
GND1
VCC_POD33
GND1
GND1
VF_TDI
VF_TEST
MSP-FET
www.ti.com
Figure B-82. MSP-FET USB Debugger, Schematic (4 of 5)
166 Hardware SLAU278V–May 2009–Revised May 2015
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
3/12/2014
3/12/2014
C
4
A B C D
Date
E
Sheet of
F
4
2
1
3
1
A B C D E
Size Number
F
2
3
Rev
5
A
1
5
MSP-FET power supply
Target power switch
Analog inputs to Host MCU
Test points
Common debug and test i/f
MSP-FET Rev 1.2
R80R
R11
150k
C3
33p
R51
240k
R52
150k
C27
33p
R12
270k
R36
150k
C4
33p
TP3
TP0 TP4
TP5
TP6
TP1
TP2
R10
150k
R21
47k
1
2
3
4
5
6
7
8
J4
HEADER_1X8_50MIL_A
1
2
3
4
5
6
7
8
J2
HEADER_1X8_50MIL_A
1
2
3
4
5
6
7
8
J3
HEADER_1X8_50MIL_A
C32
33p
R78
150k
R79
150k
TP7
TP8TP9
TP11
R16
47k
1NO1
2V+
3IN1
4COM2 5
NO2
6
GND
7
IN2
8
COM1
U18
TS5A21366RSE
TS5A21366RSER
1EN1
2IN
3EN2 4
GND
5
OUT2
6
OUT1
U19
TLV7111533D
C25
10n
C58
1u
C59
1u
C61
1u
C2
33p
R9
150k
R18
150k
1
1 1 1 1 1
VCC_SENSE0_TRGT
A_VCC_SENSE0_TRGT
VBUS5
A_VBUS5
VF
A_VF
DCDC_PULSE
VCC_SUPPLY FPGA_TP0
FPGA_TP1
FPGA_TP2
VBUS
GND1
VBUS
HOST_TEST
HOST_TDO
HOST_TDI
HOST_TMS
HOST_TCK
HOST_RST
DCDC_RST
DCDC_TEST
VCC_POD33
FPGA_TRST
FPGA_TCK
FPGA_TMS
FPGA_TDI
FPGA_TDO
GND1
GND1
A_VCC_SUPPLY_HOST
VCC_POD15
VBUS5
VCC_DT
A_VCC_DT
GND1
DCDC_IO1DCDC_IO0
VCC_DT
HOST_SCL
HOST_SDA
VCC_SUPPLY_TRGT
VCC_SUPPLY_TRGT
VBUS
VCC_SUPPLY2TRGT_CTRL
VCC_SUPPLY
VCC_DT
VCC_DT2SUPPLY_CTRL
GND1
GND1
GND1
VCC_POD15
VCC_POD33VBUS
PWRGNDPWRGND PWRGND PWRGNDPWRGND
VCC_DT_BSR
A_VCC_DT_BSR
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MSP-FET
Figure B-83. MSP-FET USB Debugger, Schematic (5 of 5)
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MSP-FET
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B.39.4 Layout
Figure B-84. MSP-FET USB Debugger, PCB (Top) Figure B-85. MSP-FET USB Debugger, PCB (Bottom)
B.39.5 LED Signals
The MSP-FET shows its operating states using two LEDs, one green and one red. Table B-43 lists all
available operation modes. An or icon indicates that the LED is off, an or icon indicates that
the LED is on, and an or icon indicates that the LED flashes.
Table B-43. MSP-FET LED Signals
Function Power LED Mode LED
MSP-FET not connected to PC, or MSP-FET not ready; for example, after a major firmware
update. Connect or reconnect MSP-FET to PC.
MSP-FET connected and ready
MSP-FET waiting for data transfer
Ongoing data transfer
An error has occurred; for example, target VCC overcurrent. Unplug MSP-FET from target,
and cycle the power off and on. Check target connection, and reconnect MSP-FET.
Firmware update in progress. Do not disconnect MSP-FET while both LEDs are blinking.
FPGA update in progress. Do not disconnect MSP-FET while both LEDs are blinking rapidly.
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MSP-FET
B.39.6 JTAG Target Connector
Figure B-86 shows the pinout of the JTAG connector.
Figure B-86. JTAG Connector Pinout
Table B-44. JTAG Connector Pin State by Operating Mode
When JTAG Protocol is When Spy-Bi-Wire Protocol
Pin Name After Power-Up Selected is Selected
1 TDO/TDI Hi-Z, pulled up to 3.3 V In, TDO In and Out, SBWTDIO
2 VCC_TOOL 3.3 V VCC VCC
3 TDI/VPP Hi-Z, pulled up to 3.3 V Out, TDI Hi-Z, pulled up to VCC
4 VCC_TARGET In, external VCC sense In, external VCC sense In, external VCC sense
5 TMS Hi-Z, pulled up to 3.3 V Out, TMS Hi-Z, pulled up to VCC
6 N/C N/C N/C N/C
7 TCK Hi-Z, pulled up to 3.3 V Out, TCK Out, SBWTCK
8 TEST/VPP Out, Gnd Out, TEST Hi-Z, pulled up to VCC
9 GND Ground Ground Ground
Out, Target UART Clear-To- Out, Target UART Clear-To-
10 UART_CTS/SPI_CLK/I2C_SCL Hi-Z, pulled up to 3.3 V Send Handshake input Send Handshake input
11 RST Out, VCC Out, RST Out
12 UART_TXD/SPI_SOMI/I2C_SDA Hi-Z, pulled up to 3.3 V In, Target UART TXD output In, Target UART TXD output
In, Target UART Ready-to- In, Target UART Ready-to-
13 UART_RTS Hi-Z, pulled up to 3.3 V Send Handshake output Send Handshake output
14 UART_RXD/SPI_SIMO Hi-Z, pulled up to 3.3 V Out, Target UART RXD input Out, Target UART RXD input
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12 UART_TXD
11 RST
8TEST
7TCK
5TMS
3TDI
1TDO/TDI
2VCC_TOOL
-USB Power
10 UART_CTS
14 UART_RXD
13 UART_RTS
Pin Signal
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Figure B-87 shows the state of each pin in the connector after power-up.
Figure B-87. Pin States After Power-Up
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MSP-FET
B.39.7 Specifications
Table B-45 shows the physical and electrical specifications of the MSP-FET.
Table B-45. Specifications
Mechanical
Size (without cables) 80 mm x 50 mm x 20 mm
Interfaces
USB interface USB 2.0, full speed
Target interface JTAG 14-pin See Table B-44 for pinout
JTAG cable length 20 cm (max)
JTAG and Spy-Bi-Wire Interface, Electrical
USB powered, 200 mA
Power supply (max)
Target output voltage 1.8 V to 3.6 V Selectable in 0.1-V steps. VCC_TOOL available from JTAG pin 2.
VCC_TOOL
Target output current 100 mA (max) Current supplied through JTAG pin 2
Target output overcurrent 160 mA (max)
detection level
JTAG signal overcurrent 30 mA (max) Total current supplied through JTAG pins 1, 3, 5, 7, 8, 10, 11, 12, 13, 14
detection level Connect external target voltage VCC_TARGET to JTAG pin 4. JTAG
External target supply Supported (1.8 V to 3.6 V) and SBW signals are regulated to external target voltage ±100 mV.
Fuse blow Supported For devices with poly-fuse
JTAG and Spy-Bi-Wire Interface, Timing
JTAG clock speed 8 MHz (max) Protocol speed selectable by software
Protocol speed selectable by software. System limitations due to
Spy‑Bi‑Wire clock speed 8 MHz (max) external RC components on reset pin (SBWTDIO) might apply.
JTAG and Spy-Bi-Wire Interface, Speed
Flash write speed (JTAG) Up to 20 kB/sec
Flash write speed Up to 7 kB/sec
(Spy‑Bi‑Wire)
FRAM write speed (JTAG) Up to 50 kB/sec
FRAM write speed Up to 14 kB/sec
(Spy‑Bi‑Wire)
EnergyTrace™ Technology
Target output current For target output voltage = 1.8 V to 3.6 V, target output current <75 mA
± 2%, ± 500 nA
accuracy and USB voltage = 5 V constant during and after calibration
B.39.8 MSP-FET Revision History
Revision numbers are printed on the PCB and are stored in nonvolatile memory in firmware. Table B-46
shows the revision history of the MSP-FET.
Table B-46. MSP-FET Revision History
Revision Date Comments
Revision 1.2 March 2014 Initial release
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MSP-FET430UIF
B.41.1 MSP-FET430UIF Revision History
Revision 1.3
• Initial released hardware version
Assembly change on 1.3 (May 2005)
• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R
Changes 1.3 to 1.4 (Aug 2005)
• J5: VBUS and RESET additionally connected
• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R
• U1, U7: F1612 can reset TUSB3410; R44 = 0R added
• TARGET-CON.: pins 6, 10, 12, 13, 14 disconnected from GND
• Firmware-upgrade option through BSL: R49, R52, R53, R54 added; R49, R52 are currently DNP
• Pullups on TCK and TMS: R78, R79 added
• U2: Changed from SN74LVC1G125DBV to SN74LVC1G07DBV
NOTE: Using a locally powered target board with hardware revision 1.4
Using an MSP-FET430UIF interface hardware revision 1.4 with populated R62 in conjunction
with a locally powered target board is not possible. In this case, the target device RESET
signal is pulled down by the FET tool. It is recommended to remove R62 to eliminate this
restriction. This component is located close to the 14-pin connector on the MSP-FET430UIF
PCB. See the schematic and PCB drawings in this document for the exact location of this
component.
Assembly change on 1.4a (January 2006)
• R62: not populated
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Appendix C
SLAU278V–May 2009–Revised May 2015
Hardware Installation Guide
This section describes the hardware installation process of the following USB debug interfaces on a PC
running Windows XP:
• MSP-FET430UIF
• eZ430-F2013
• eZ430-RF2500
• eZ430-Chronos
• eZ430-RF2780
• eZ430-RF2560
• MSP-WDSxx "Metawatch"
• LaunchPad (MSP-EXP430G2)
• MSP-EXP430FR5739
• MSP-EXP430F5529
The installation procedure for other supported versions of Windows is very similar and, therefore, not
shown here.
Topic ........................................................................................................................... Page
C.1 Hardware Installation ........................................................................................ 182
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C.1 Hardware Installation
Table C-1 shows the USB VIDs and PIDs used in MSP430 tools.
Table C-1. USB VIDs and PIDs Used in MSP430 Tools
Tool USB VID USB PID INF File Name
eZ430-F2013 0x0451 0xF430 usbuart3410.inf
eZ430-RF2500 0x0451 0xF432 430CDC.inf
eZ430-RF2780 0x0451 0xF432 430CDC.inf
eZ430-RF2560 0x0451 0xF432 430CDC.inf
MSP-WDSxx "Metawatch" 0x0451 0xF432 430CDC.inf
eZ430-Chronos 0x0451 0xF432 430CDC.inf
MSP-FET430UIF(1) 0x2047 0x0010 msp430tools.inf
MSP-FET 0x2047 0x0204 msp430tools.inf
eZ-FET 0x2047 0x0203 msp430tools.inf
LaunchPad (MSP-EXP430G2) 0x0451 0xF432 430CDC.inf
MSP-EXP430FR5739 0x0451 0xF432 430CDC.inf
MSP-EXP430F5529 0x0451 0xF432 430CDC.inf
(1) The older MSP-FET430UIF used with IAR versions before v5.20.x and CCS versions before v5.1 has VID 0x0451 and PID
0xF430. With the firmware update, it is updated to the 0x2047 and 0x0010, respectively.
1. Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one of
IDEs (CCS or IAR) should be installed. The IDE installation isntalls also drivers for USB Debug
Interfaces without user interaction. After IDE installation the USB Debug Interface can be connected
and will be ready to work within few seconds.
2. The driver can be also installed manually. After plug in the USB Debug Interface to USB port of the PC
the Hardware Wizard starts automatically and opens the "Found New Hardware Wizard" window.
3. Select "Install from a list or specific location (Advanced)" (see Figure C-1).
Figure C-1. Windows XP Hardware Wizard
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Hardware Installation
4. Browse to the folder where the driver information files are located (see Figure C-2).
For CCS, the default folder is: c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC, or
c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, or
c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_eZ-RF depending of firmware version of the tool.
For IAR Embedded Workbench, the default folder is: <Installation Root>\Embedded Workbench
x.x\430\drivers\TIUSBFET\eZ430-UART, or
<Installation Root>\Embedded Workbench x.x\430\drivers\<Win_OS>.
Figure C-2. Windows XP Driver Location Selection Folder
5. The Wizard generates a message that an appropriate driver has been found.
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6. The wizard installs the driver files.
7. The wizard shows a message that it has finished the installation of the software USB Debug Interface.
8. The USB debug interface is installed and ready to use. The Device Manager lists a new entry as
shown in Figure C-3,Figure C-4,orFigure C-5.
Figure C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010
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Revision History
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Revision History
Changes from January 14, 2015 to May 20, 2015 ........................................................................................................... Page
• Changed "Included Devices" column for MSP-TS430PM64F row ................................................................ 18
• Added MSP-TS430PZ100AUSB to Table 1-2 ....................................................................................... 18
• Added Section B.34,MSP-TS430PZ100AUSB .................................................................................... 141
• Changed Figure B-71,EM430F5137RF900 Target Board, Schematic ......................................................... 148
• Changed from "CC430F52x1" to "CC430F5137" for Item 34 in Table B-37 ................................................... 151
• Changed Figure B-73,EM430F6137RF900 Target Board, Schematic ......................................................... 152
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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