SG1503/SG2503/SG3503 Precision 2.5-Volt Reference Description The SG1503 is a monolithic integrated circuit implementing a self-contained precision voltage reference generator. It is internally trimmed for 1% accuracy and requires less than 2mA quiescent current. SG1503 can deliver greater than 10mA output current while achieving total load and line induced tolerances of less than 0.5%. In addition to voltage accuracy, internal trimming achieves a temperature coefficient of output voltage of typically 10 ppm/C. As a result, these references are excellent choices for applications in critical instrumentation and D-to-A converter systems. The SG1503 is specified for operation over the full military ambient temperature range of -55C to 125C, while the SG2503 is designed for -25C to 85C and the SG3503 for commercial applications of 0C to 70C. Features Output Voltage Trimmed to 1% Input Voltage Range of 4.5V to 40V Temperature Coefficient of 10ppm/C Quiescent Current Typically 1.5mA Output Current in excess of 10mA Interchangeable with MC1503 and AD580 Application Available to MIL-STD-883, 1.2.1 Available to DSCC Standard Microcircuit Drawing (SMD) (R) Microsemi Level "S" Processing Available Functional Diagram VIN I1 = I2 VO 1.25V GND Figure 1 * Functional Block Diagram December 2014 Rev. 1.3a www.microsemi.com (c) 2014 Microsemi Corporation 1 Precision 2.5-Volt Reference Connection Diagrams and Ordering Information Ambient Temperature Type Package Part Number 8-PIN ceramic DIP SG1503Y-DESC SG1503Y Packaging Type Connection Diagram SG1503Y-883B -55C to 125C Y -25C to 85C 0C to 70C -25C to 85C M 0C to 70C -25C to 85C DM 0C to 70C 8-PIN plastic DIP Pb-free / RoHS Transition DC: 0503* 8-PIN plastic SOIC Pb-free / RoHS Transition DC: 0440* CERDIP SG2503Y SG3503Y SG2503M PDIP SG3503M SG2503DM SOIC SG3503DM VIN 1 8 N.C. Vout 2 7 N.C. GND 3 6 N.C. N.C. 4 5 N.C. Y Package: PbSn Lead Finish M Package: Pb-free / RoHS 100% Matte Tin Lead Finish VIN 1 8 VOUT GND N.C. 2 7 3 6 4 5 DM Package: Pb-free / RoHS 100% Matte Tin Lead Finish SG1503T-883B -55C to 125C T -25C to 85C 0C to 70C 3-PIN METAL CAN 2 2 TO-39 GND 3 1 VIN SG2503T SG3503T Notes: 1. Contact factory for JAN and DESC product availability. 2. All packages are viewed from the top. *RoHS compliant VOUT SG1503T-DESC SG1503T N.C. N.C. N.C. N.C. T Package: PbSn Lead Finish Absolute Maximum Ratings Absolute Maximum Ratings Parameter Input Voltage Storage Temperature Range Value Units 40 V C -65 to 150 Operating Junction Temperature Hermetic (T, Y Packages) 150 Plastic (M, DM Packages) Lead Temperature (Soldering, 10 seconds) 150 300 260 (+0, -5) C C C C Value Units Thermal Resistance-Junction to Case, JC 15 C/W Thermal Resistance-Junction to Ambient, JA Y Package 120 C/W Thermal Resistance-Junction to Case, JC Thermal Resistance-Junction to Ambient, JA 50 130 C/W C/W M Package Thermal Resistance-Junction to Case, JC 60 C/W 95 C/W Pb-free / RoHS Peak Solder Reflow Temp (40s max. exp.) Note: Exceeding these ratings could cause damage to the device. Thermal Data Parameter T Package Thermal Resistance-Junction to Ambient, JA DM Package Thermal Resistance-Junction to Case, JC 55 C/W Thermal Resistance-Junction to Ambient, JA 165 C/W Notes: 1. Junction Temperature Calculation: TJ = TA + (PD x JA). 2. The above numbers for JC are maximums for the limiting thermal resistance of the package in a standard mounting configuration. The JA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. 3 Precision 2.5-Volt Reference Recommended Operating Conditions Value Units 4.5 to 40 V SG1503 -55 to 125 C SG2503 -25 to 85 C 0 to 70 C Parameter Input Voltage Operating Ambient Temperature Range SG3503 Note: Range over which the device is functional. Electrical Characteristics (Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1503 with -55C TA 125C, SG2503/SG3503 with 0C TA 70C, VIN = 15V, and IL = 0mA. Low duty cycle pulse testing techniques are used that maintains junction and case temperatures equal to the ambient temperature.) Test Conditions Parameter Output Voltage Input Voltage SG1503/2503 TA = 25C Min 2.485 TA = 25C 4.7 4.5 Typ 2.500 VIN= 5V TO 15V VIN = 15V TO 40V Line Regulation IL = 10mA IL = 10mA, VIN = 30V Load Regulation Temperature Regulation (SG1503 only) (SG2503/SG3503 only) Quiescent Current Short Circuit Current VIN = 40V TA = 25C Ripple Rejection Output Noise f = 120Hz, TA = 25C BW = 10kHz, TA = 25C 15 Voltage Stability SG3503 Max 2.515 Min 2.475 40 40 4.7 4.5 Typ 2.500 Max 2.525 Units V 40 40 V V 1 3 3 5 1 3 3 10 mV mV 3 4 5 8 3 4 10 15 mV mV 15 2.5 20 5 5 10 mV mV 1.5 20 2.0 30 1.5 20 2.0 30 mA mA 15 76 100 76 100 dB V rms 250 250 V/khr Ripple Rejection - (dB) Output Voltage - (V) Characteristics Curves 2.52 2.50 VIN = 15V IO = 0 2.48 -20 VIN = 15V VIN = 10V IO = 0 TA = 25 oC -40 -60 -80 -50 0 50 100 150 Junction Temperature - (oC) Figure 2 * Output Voltage versus Temperature 4 0 10 100 1k 10k 100k Frequency - (Hz) Figure 3. Ripple Rejection 1M Package Outline Dimensions Package Outline Dimensions Controlling dimensions are in inches; metric equivalents are shown for general information. Y 8-Pin CERDIP Package Dimensions Dim D 5 8 E 11 4 A Q SEATING PLANE e H c L b INCHES MIN MAX A 4.32 5.08 0.170 0.200 b 0.38 0.51 0.015 0.020 b2 1.04 1.65 0.045 0.065 c 0.20 0.38 0.008 0.015 D 9.52 10.29 0.375 0.405 E 5.59 7.11 0.220 0.280 e eA b2 MILLIMETERS MIN MAX 2.54 BSC 0.100 BSC eA 7.37 7.87 0.290 0.310 H 0.63 1.78 0.025 0.070 L 3.18 4.06 0.125 0.160 - 15 - 15 Q 0.51 1.02 0.020 0.040 Note: Dimensions do not include protrusions; these shall not exceed 0.155mm (.006") on any side. Lead dimension shall not include solder coverage. Figure 4 * Y 8-Pin CERDIP Package Dimensions M 8-Pin PDIP Package Dimensions Dim D A A2 b b2 c D E e E1 L 8 E1 11 b2 A2 E A L H c e b MILLIMETERS MIN MAX 5.08 3.30 Typ. 0.38 0.51 0.76 1.65 0.20 0.38 10.16 7.62 BSC 2.54 BSC 6.10 6.86 3.05 0 15 INCHES MIN MAX 0.200 1.30 Typ. 0.145 0.020 0.030 0.065 0.008 0.015 0.400 0.300 BSC 0.100 BSC 0.240 0.270 0.120 0 15 Note: Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm (.006") on any side. Lead dimension shall not include solder coverage. Figure 5 * M 8-Pin PDIP Package Dimensions 5 Precision 2.5-Volt Reference DM 8-Pin SOIC Package Dimensions Dim D A A1 A2 b c D E e H L *LC 8 H E 1 e A2 A INCHES MIN MAX 0.053 0.069 0.004 0.010 0.049 0.060 0.013 0.020 0.007 0.010 0.189 0.205 0.228 0.244 0.050 BSC 0.150 0.158 0.016 0.050 0 8 0.004 *Lead Co-planarity b A1 MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 1.25 1.52 0.33 0.51 0.19 0.25 4.83 5.21 5.79 6.20 1.27 BSC 3.81 4.01 0.40 1.27 0 8 .010 L c Note: Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm (.006") on any side. Lead dimension shall not include solder coverage. Figure 6 * DM 8-Pin SOIC Package Dimensions T 3-Pin Metal Can TO-39 Dim D D1 Q A e F b 2 L1 e1 1 3 L b1 k k1 A b b1 D D1 e e1 F k k1 L L1 Q MILLIMETERS MIN MAX 4.19 4.70 0.41 0.48 0.41 0.53 8.89 9.40 8.13 8.51 5.08 BSC 2.54 TYP 1.02 0.71 0.86 0.74 1.14 12.70 14.48 1.27 90 TYP 45 TYP INCHES MIN MAX 0.165 0.185 0.016 0.019 0.016 0.021 0.350 0.370 0.320 0.335 0.200 BSC 0.100 TYP 0.040 0.028 0.034 0.029 0.045 0.500 0.570 0.050 90 TYP 45 TYP Note: Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm (.006") on any side. Lead dimension shall not include solder coverage. Figure 7 * T 3-Pin Metal Can TO-39 6 Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 E-mail: sales.support@microsemi.com (c) 2014 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. SG1503/SG2503/SG3503.1/12.14