Precision 2.5-Volt Reference
Functional Diagram
V
O
V
IN
GND
1.25V
I
1
= I
2
Figure 1 · Functional Block Diagram
Features
Output Voltage Trimmed to ±1%
Input Voltage Range of 4.5V to 40V
Temperature Coefficient of 10ppm/°C
Quiescent Current Typically 1.5mA
Output Current in excess of 10mA
Interchangeable with MC1503 and AD580
Application
Available to MIL-STD-883, 1.2.1
Available to DSCC
-Standard Microcircuit Drawing (SMD)
Microsemi® Level “S” Processing Available
Description
The SG1503 is a monolithic integrated circuit
implementing a self-
contained precision voltage
reference generator. It is internally trimmed for ±1%
accuracy and requires less than 2mA quiescent
current. SG1503 can deliver greater than 10mA output
current while achieving total load and line induced
tolerances of less than 0.5%.
In addition to voltage accuracy, internal trimming
achieves a temperature coefficient of output voltage of
typically 10 ppm/°C. As a result, these references are
excellent choices for applications in critical
instrumentation and D-to-A converter systems. The
SG1503 is specified for operation over the full military
ambient temperature range of -55°C to 125°C, while
the SG2503 is designed for -25°C to 85°C and the
SG3503 for commercial applications of 0°C to 70°C.
SG1503/SG2503/SG3503
December 2014 Rev. 1.3a www.microsemi.com 1
© 2014 Microsemi Corporation
Precision 2.5-Volt Reference
Connection Diagrams and Ordering Information
Ambient
Temperature
Type Package Part Number Packaging
Type
Connection Diagram
-55°C to 125°C
Y
8-PIN
ceramic
DIP
SG1503Y-883B
CERDIP
4
3
2
1
V
IN
GND
V
out
7
6
5
8
N.C.
N.C.
N.C.
N.C.
N.C.
Y Package: PbSn Lead Finish
M Package: Pb-free / RoHS 100%
Matte Tin Lead Finish
SG1503Y-DESC
SG1503Y
-25°C to 85°C
SG2503Y
0°C to 70°C
SG3503Y
-25°C to 85°C
M
8-PIN
plastic DIP
Pb-free /
RoHS
Transition
SG2503M
PDIP
0°C to 70°C SG3503M
-25°C to 85°C
DM
8-PIN
plastic
SOIC
Pb-free /
RoHS
Transition
DC: 0440*
SG2503DM
SOIC
4
3
2
1
V
IN
GND
V
OUT
7
6
5
8
N.C.
N.C.
N.C.
N.C.
N.C.
DM Package: Pb-free / RoHS
100% Matte Tin Lead Finish
0°C to 70°C SG3503DM
-55°C to 125°C
T
3-PIN
METAL
CAN
SG1503T-883B
TO-39
3
2
1
V
IN
V
OUT
GND
T Package: PbSn Lead Finish
SG1503T-DESC
SG1503T
-25°C to 85°C SG2503T
0°C to 70°C SG3503T
Notes:
1. Contact factory for JAN and DESC product availability.
2. All packages are viewed from the top.
*RoHS compliant
2
Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter
Value
Units
Input Voltage
40
V
Storage Temperature Range
-65 to 150
°C
Operating Junction Temperature
Hermetic (T, Y Packages)
150
°C
Plastic (M, DM Packages)
150
°C
Lead Temperature (Soldering, 10 seconds)
300
°C
Pb-free / RoHS Peak Solder Reflow Temp (40s max. exp.)
260 (+0, -5)
°C
Note: Exceeding these ratings could cause damage to the device.
Thermal Data
Parameter Value Units
T Package
Thermal Resistance-Junction to Case, θJC 15 °C/W
Thermal Resistance-Junction to Ambient, θJA
120
°C/W
Y Package
Thermal Resistance-Junction to Case, θJC
50
°C/W
Thermal Resistance-Junction to Ambient, θJA 130 °C/W
M Package
Thermal Resistance-Junction to Case, θJC 60 °C/W
Thermal Resistance-Junction to Ambient, θJA
95
°C/W
DM Package
Thermal Resistance-Junction to Case, θJC
55
°C/W
Thermal Resistance-Junction to Ambient, θJA 165 °C/W
Notes:
1. Junction Temperature Calculation: TJ = TA + (PD × θJA).
2. The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting
configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of
the above assume no ambient airflow.
3
Precision 2.5-Volt Reference
Recommended Operating Conditions
Parameter
Value
Units
Input Voltage 4.5 to 40 V
Operating Ambient Temperature Range
SG1503 -55 to 125 °C
SG2503 -25 to 85 °C
SG3503 0 to 70 °C
Note: Range over which the device is functional.
Electrical Characteristics
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1503 with
-55°C ≤ TA ≤ 125°C, SG2503/SG3503 with 0°C ≤ TA ≤ 70°C, VIN = 15V, and IL = 0mA. Low duty cycle pulse testing
techniques are used that maintains junction and case temperatures equal to the ambient temperature.)
Characteristics Curves
Junction Temperature – (
o
C)
-50 0 50 100 150
2.48
2.50
2.52
Output Voltage – (V)
V
IN
= 15V
I
O
= 0
0 10 100 1k 10k 100k 1M
-80
-60
-40
-20
Frequency – (Hz)
Ripple Rejection – (dB)
V
IN
= 15V
V
IN
= 10V
I
O
= 0
T
A
= 25
o
C
Figure 2 · Output Voltage versus Temperature Figure 3. Ripple Rejection
Parameter
Test Conditions
SG1503/2503
SG3503
Units
Min
Typ
Max
Min
Typ
Max
Output Voltage
TA = 25
°
C
2.485
2.500
2.515
2.475
2.500
2.525
V
Input Voltage
4.7
40
4.7
40
V
TA
= 25
°
C
4.5
40
4.5
40
V
Line Regulation
VIN= 5V TO 15V
1
3
1
3
mV
VIN
= 15V TO 40V
3
5
3
10
mV
Load Regulation
IL = 10mA
3
5
3
10
mV
IL = 10mA, VIN
= 30V
4
8
4
15
mV
Temperature Regulation
(SG1503 only)
15
20
mV
(SG2503/SG3503 only)
2.5
5
5
10
mV
Quiescent Current
VIN
= 40V
1.5
2.0
1.5
2.0
mA
Short Circuit Current
TA
= 25
°
C
15
20
30
15
20
30
mA
Ripple Rejection
f = 120Hz, TA = 25°C
76
76
dB
Output Noise
BW = 10kHz, TA = 25°C
100
100
µ
V rms
Voltage Stability
250
250
µ
V/khr
4
Package Outline Dimensions
Package Outline Dimensions
Controlling dimensions are in inches; metric equivalents are shown for general information.
Y 8-Pin CERDIP Package Dimensions
A
H
1
E
D
e
b
b2
L
eA
c
α
Q
SEATING
PLANE
14
85
Dim
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
4.32
5.08
0.170
0.200
b
0.38
0.51
0.015
0.020
b2
1.04
1.65
0.045
0.065
c
0.20
0.38
0.008
0.015
D
9.52
10.29
0.375
0.405
E
5.59
7.11
0.220
0.280
e
2.54 BSC
0.100 BSC
eA
7.37
7.87
0.290
0.310
H
0.63
1.78
0.025
0.070
L
3.18
4.06
0.125
0.160
α
-
15°
-
15°
Q
0.51
1.02
0.020
0.040
Note:
Dimensions do not include protrusions; these shall not
exceed 0.155mm (.006”) on any side. Lead dimension shall
not include solder coverage.
Figure 4 · Y 8-Pin CERDIP Package Dimensions
M 8-Pin PDIP Package Dimensions
A
H
1
E1
D
e
b
L
E
c
A2
b2
θ
1
8
Note:
Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
Dim
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
-
5.08
-
0.200
A2
3.30 Typ.
1.30 Typ.
b
0.38
0.51
0.145
0.020
b2
0.76
1.65
0.030
0.065
c
0.20
0.38
0.008
0.015
D
-
10.16
-
0.400
E
7.62 BSC
0.300 BSC
e
2.54 BSC
0.100 BSC
E1
6.10
6.86
0.240
0.270
L
3.05
-
0.120
-
θ
0°
15°
0°
15°
Figure 5 · M 8-Pin PDIP Package Dimensions
5
Precision 2.5-Volt Reference
DM 8-Pin SOIC Package Dimensions
D
E
e
A1 L
A2
bc
A
H
Dim
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.25
1.52
0.049
0.060
b
0.33
0.51
0.013
0.020
c
0.19
0.25
0.007
0.010
D
4.83
5.21
0.189
0.205
E
5.79
6.20
0.228
0.244
e
1.27 BSC
0.050 BSC
H
3.81
4.01
0.150
0.158
L
0.40
1.27
0.016
0.050
θ
0°
8°
0°
8°
*LC
-
.010
-
0.004
*Lead Co-planarity
Note:
Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
Figure 6 · DM 8-Pin SOIC Package Dimensions
T 3-Pin Metal Can TO-39
Q
αk
k1
e
e1
A
D1
D
b
b1
L
F
L1
1
2
3
Note:
Dimensions do not include mold flash or protrusions; these
shall not exceed 0.155mm (.006”) on any side. Lead
dimension shall not include solder coverage.
Dim
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
4.19
4.70
0.165
0.185
b
0.41
0.48
0.016
0.019
b1
0.41
0.53
0.016
0.021
D
8.89
9.40
0.350
0.370
D1
8.13
8.51
0.320
0.335
e
5.08 BSC
0.200 BSC
e1
2.54 TYP
0.100 TYP
F
-
1.02
-
0.040
k
0.71
0.86
0.028
0.034
k1
0.74
1.14
0.029
0.045
L 12.70 14.48 0.500 0.570
L1
-
1.27
-
0.050
Q
90° TYP
90° TYP
α
45° TYP
45° TYP
Figure 7 · T 3-Pin Metal Can TO-39
1
8
6
SG1503/SG2503/SG3503.1/12.14
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