Preliminary Data Sheet PS9308L, PS9308L2 R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 2.0 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 6-PIN SDIP PHOTOCOUPLER DESCRIPTION The PS9308L and PS9308L2 are optical coupled isolators containing a GaAlAs LED on the input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip. The PS9308L and PS9308L2 are in 6-pin plastic SDIP (Shrink Dual In-line Package). The PS9308L2 has 8 mm creepage distance. The mount area of 6-pin plastic SDIP is half size of 8-pin DIP. The PS9308L and PS9308L2 are designed specifically for high common mode transient immunity (CMR) and high switching speed. It is suitable for driving IGBTs and MOS FETs. The PS9308L is lead bending type (Gull-wing) for surface mounting. The PS9308L2 is lead bending type for long creepage distance (Gull-wing) for surface mount. FEATURES <R> Long creepage distance (8 mm MIN.: PS9308L2) Half size of 8-pin DIP Peak output current (2.0 A MAX., 1.0 A MIN.) High speed switching (tPLH, tPHL = 0.25 s MAX.) UVLO (Under Voltage Lock Out) protection with hysteresis High common mode transient immunity (CMH, CML = 25 kV/s MIN.) Embossed tape product : PS9308L-E3, PS9308L2-E3 : 2 000 pcs/reel Pb-Free product Safety standards * UL approved: No. E72422 * CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950) * SEMKO approved (EN 60065, EN 60950) * DIN EN60747-5-5 (VDE0884-5) approved (Option) PIN CONNECTION (Top View) 6 5 4 SHIELD * * * * * * * * * 1 2 1. Anode 2. NC 3. Cathode 4. VEE 5. VO 6. VCC 3 APPLICATIONS * IGBT, Power MOS FET Gate Driver * Industrial inverter * IH (Induction Heating) The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 1 of 20 PS9308L, PS9308L2 Chapter Title PACKAGE DIMENSIONS (UNIT: mm) Lead Bending Type (Gull-wing) For Surface Mount PS9308L 4.580.3 6.80.25 (0.82) 9.70.3 0.250.15 0.20.15 3.50.2 3.70.25 7.62 1.27 0.40.1 0.80.25 0.25 M Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount) PS9308L2 4.580.3 6.80.25 (0.82) 11.50.3 1.27 0.40.1 R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 0.250.15 0.20.15 3.50.2 3.70.25 7.62 0.750.25 0.25 M Page 2 of 20 PS9308L, PS9308L2 Chapter Title PHOTOCOUPLER CONSTRUCTION Parameter Air Distance (MIN.) Outer Creepage Distance (MIN.) Isolation Distance (MIN.) <R> PS9308L 7 mm 7 mm 0.4 mm PS9308L2 8 mm 8 mm 0.4 mm MARKING EXAMPLE R 9308 N231 Company Initial Type Number Assembly Lot No. 1 pin Mark N 2 31 Week Assembled Year Assembled (Last 1 Digit) Rank Code R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 3 of 20 PS9308L, PS9308L2 Chapter Title <R> ORDERING INFORMATION Part Number Order Number PS9308L PS9308L-E3 PS9308L-AX PS9308L-E3-AX PS9308L2 PS9308L2-E3 PS9308L2-AX PS9308L2-E3-AX PS9308L-V PS9308L-V-E3 PS9308L-V-AX PS9308L-V-E3-AX PS9308L2-V PS9308L2-V-AX PS9308L2-V-E3 PS9308L2-V-E3-AX Note: Solder Plating Specification Pb-Free (Ni/Pd/Au) Packing Style 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel Safety Standard Approval Standard products (UL, CSA, SEMKO approved) DIN EN 60747-5-5 (VDE 0884-5) approved (Option) 20 pcs (Tape 20 pcs cut) Embossed Tape 2 000 pcs/reel Application *1 Part Number PS9308L PS9308L2 PS9308L PS9308L2 *1. For the application of the Safety Standard, following part number should be used. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 4 of 20 PS9308L, PS9308L2 Chapter Title ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Forward Current Diode Peak Transient Forward Current (Pulse Width < 1 s) Reverse Voltage Detector High Level Peak *1 Output Current Symbol IF IF (TRAN) Ratings 25 1.0 Unit mA A VR 5 2.0 V A IOH (PEAK) 2.0 A IOL (PEAK) Low Level Peak *1 Output Current Supply Voltage (VCC-VEE) 0 to 35 V Output Voltage VO 0 to VCC V Power Dissipation *2 PC 250 mW Isolation Voltage *3 BV 5 000 Vr.m.s. *4 Total Power Dissipation PT 300 mW Operating Frequency *5 f 50 kHz Operating Ambient Temperature TA -40 to +110 C Storage Temperature Tstg -55 to +125 C Notes: *1. Maximum pulse width = 10 s, Maximum duty cycle = 0.2% *2. Reduced to 4.8 mW/C at TA = 70C or more. *3. AC voltage for 1 minute at TA = 25C, RH = 60% between input and output. Pins 1-3 shorted together, 4-6 shorted together. *4. Reduced to 5.4 mW/C at TA = 70C or more. *5. IOH (PEAK) 2.0 A ( 0.3 s), IOL (PEAK) 2.0 A ( 0.3 s) RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Forward Current (ON) Forward Voltage (OFF) Operating Ambient Temperature R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Symbol (VCC-VEE) IF (ON) VF (OFF) TA MIN. 15 7 -2 -40 TYP. 10 MAX. 30 16 0.8 110 Unit V mA V C Page 5 of 20 PS9308L, PS9308L2 Chapter Title ELECTRICAL CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS, VEE = GND, unless otherwise specified) Diode Detector Parameter Forward Voltage Reverse Current Input Capacitance High Level Output Current Symbol VF IR CIN IOH Low Level Output Current IOL High Level Output Voltage Low Level Output Voltage High Level Supply Current Low Level Supply Current UVLO Threshold VOH VOL ICCH ICCL VUVLO+ VUVLOUVLOHYS UVLO Hysteresis Coupled Threshold Input Current (L H) IFLH Conditions MIN. TYP.*1 MAX. IF = 10 mA, TA = 25C 1.2 1.56 1.8 VR = 3 V, TA = 25C 10 f = 1 MHz, VF = 0 V, TA = 25C 30 VO = (VCC - 4 V) *2 1.0 1.5 *3 VO = (VCC - 15 V) 1.5 VO = (VEE + 2.5 V) *2 1.0 1.5 *3 VO = (VEE + 15 V) 1.5 IO = -100 mA *4 VCC - 3.0 VCC - 1.3 IO = 100 mA 0.1 0.5 IF = 10 mA, VO = open 1.2 2.0 VF = 0 to 0.8 V, VO = open 1.2 2.0 Vo > 5V, IF = 10 mA 10.8 12.3 13.4 9.5 11.0 12.5 0.4 1.3 IO = 0 mA, VO > 5 V 1.8 5.0 IO = 0 mA, VO < 5 V VFHL Threshold Input Voltage (H L) Notes: *1. Typical values at TA = 25C. *2. Maximum pulse width = 50 s, Maximum duty cycle = 0.5%. *3. Maximum pulse width = 10 s, Maximum duty cycle = 0.2%. 0.8 Unit V A pF A A V V mA mA V mA V *4. VOH is measured with the DC load current in this testing. (Maximum pulse width = 2 ms, Maximum duty cycle = 20%) R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 6 of 20 PS9308L, PS9308L2 Chapter Title <R> SWITCHING CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS, VEE = GND, unless otherwise specified) Parameter Symbol Propagation Delay Time (L H) tPLH Propagation Delay Time (H L) tPHL Pulse Width Distortion (PWD) |tPHL-tPLH| tPHL-tPLH Propagation Delay Time (Difference Between Any Two Products) Rise Time tr Fall Time tf |CMH| Common Mode Transient Immunity at High Level Output Common Mode Transient Immunity at Low Level Output Note: |CML| Conditions Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty Cycle = 50%, IF = 10 mA MIN. TYP.*1 0.08 0.10 0.02 -0.1 50 50 MAX. 0.25 0.25 0.1 0.1 Unit s s s s TA = 25C, IF = 10 mA, VCC = 30 V, VCM = 1.5 kV, VO (MIN.) = 26 V 25 ns ns kV/s TA = 25C, IF = 0 mA, VCC = 30 V, VCM = 1.5 kV, VO (MAX.) = 1 V 25 kV/s *1. Typical values at TA = 25C. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 7 of 20 PS9308L, PS9308L2 Chapter Title TEST CIRCUIT Fig. 1 IOH Test Circuit 1 6 2 5 3 4 IF = 7 to 16 mA Fig. 2 IOL Test Circuit 4V 1.0 F IOH VCC = 15 to 30 V 1 6 2 5 3 4 SHIELD 1 6 2 5 VCC = 15 to 30 V 2.5 V 1 6 2 5 3 4 1.0 F VOL 100 mA SHIELD Fig. 5 UVLO Test Circuit IF = 10 mA 1 6 2 5 3 4 Fig. 6 IFLH Test Circuit 1.0 F VCC IF 1 6 2 5 3 4 1.0 F VO > 5 V VO > 5 V R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 VCC = 15 to 30 V 100 mA SHIELD SHIELD VCC = 15 to 30 V Fig. 4 VOL Test Circuit 1.0 F VOH 4 IF = 7 to 16 mA IOL SHIELD Fig. 3 VOH Test Circuit 3 1.0 F VCC = 15 to 30 V SHIELD Page 8 of 20 PS9308L, PS9308L2 Chapter Title Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms IF = 10 mA 1 6 2 5 IF 1.0 F VO 10 kHz 50% DUTY CYCLE 3 tr VCC = 15 to 30 V 90% 50% 10% 10 10 nF 4 VOUT tPLH SHIELD tf tPHL Fig. 8 CMR Test Circuit and Wave Forms IF A B 1 6 2 5 3 4 SHIELD VCM = 1.5 kV R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 VCM VCM V = t t 1.0 F VCC = 30 V VO 0V VO (Switch A: IF = 10 mA) VO (Switch B: IF = 0 mA) t VOH 26 V 1V VOL Page 9 of 20 PS9308L, PS9308L2 Chapter Title <R> TYPICAL CHARACTERISTICS (TA = 25C, unless otherwise specified) TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE DETECTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE 400 Total Power Dissipation PT (mW) Detector Power Dissipation PC (mW) 300 250 200 150 100 50 0 25 50 100 75 200 150 100 50 25 50 100 75 Ambient Temperature TA (C) FORWARD CURRENT vs. FORWARD VOLTAGE THRESHOLD INPUT CURRENT vs. AMBIENT TEMPERATURE Threshold Input Current IFLH (mA) 10 TA = +110C +100C +85C +50C +25C 0C -40C 1 0.1 1.2 1.4 1.6 1.8 2.0 2.2 VCC = 30 V, VO > 5 V, IO = 0 mA 4 3 2 1 0 -40 2.4 -20 0 20 40 60 80 100 Forward Voltage VF (V) Ambient Temperature TA (C) OUTPUT VOLTAGE vs. FORWARD CURRENT HIGH LEVEL OUTPUT VOLTAGE - SUPPLY VOLTAGE vs. AMBIENT TEMPERATURE 35 VCC = 30 V 30 25 20 15 10 5 0 125 Ambient Temperature TA (C) 1 2 3 4 5 Forward Current IF (mA) High Level Output Voltage - Supply Voltage VOH - VCC (V) Forward Current IF (mA) 250 5 0.01 1.0 Output Voltage VO (V) 300 0 125 100 0 350 0.0 VCC = 30 V, IF = 10 mA, IO = -100 mA -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -40 -20 0 20 40 60 80 100 Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 10 of 20 PS9308L, PS9308L2 Chapter Title HIGH LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE LOW LEVEL OUTPUT CURRENT vs. AMBIENT TEMPERATURE 6 VO = VCC-4 V -2 -3 VO = VCC-15 V -4 -5 -6 -40 -20 0 20 40 60 80 VCC = 30 V, IF = 0 mA 5 VO = VEE+15 V 4 3 VO = VEE+2.5 V 2 1 0 -40 100 0 20 40 60 80 Ambient Temperature TA (C) LOW LEVEL OUTPUT VOLTAGE vs. AMBIENT TEMPERATURE SUPPLY CURRENT vs. AMBIENT TEMPERATURE VCC = 30 V, IF = 0 mA, IO = 100mA 0.4 0.3 0.2 0.1 0 -40 -20 0 20 40 60 80 VCC = 30 V, VO = OPEN 1.5 ICCH (IF = 10 mA) ICCL (IF = 0 mA) 1.0 0.5 0.0 -40 100 100 2.0 -20 0 20 40 60 80 100 Ambient Temperature TA (C) Ambient Temperature TA (C) HIGH LEVEL OUTPUT VOLTAGE - SUPPLY VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT LOW LEVEL OUTPUT VOLTAGE vs. LOW LEVEL OUTPUT CURRENT 5.0 0.0 VCC = 30 V, IF = 10 mA Low Level Output Voltage VOL (V) High Level Output Voltage - Supply Voltage VOH - VCC (V) -20 Ambient Temperature TA (C) 0.5 Low Level Output Voltage VOL (V) Low Level Output Current IOL (A) -1 VCC = 30 V, IF = 10 mA High Level Supply Current ICCH (mA) Low Level Supply Current ICCL (mA) High Level Output Current IOH (A) 0 1.0 2.0 TA = -40C 3.0 4.0 TA = 110C TA = 25C -5.0 -2.0 -1.5 -1.0 -0.5 0.0 High Level Output Current IOH (A) VCC = 30 V, IF = 0 mA 4.0 TA = 110C 3.0 TA = 25C 2.0 TA = -40C 1.0 0.0 0.0 0.5 1.0 1.5 2.0 Low Level Output Current IOL (A) Remark The graphs indicate nominal characteristics. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 11 of 20 PS9308L, PS9308L2 Chapter Title PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. AMBIENT TEMPERATURE SUPPLY CURRENT vs. SUPPLY VOLTAGE VO = OPEN 1.5 ICCH (IF = 10 mA) ICCL (IF = 0 mA) 1.0 0.5 0.0 15 20 250 Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion |tPHL-tPLH| (ns) High Level Supply Current ICCH (mA) Low Level Supply Current ICCL (mA) 2.0 25 200 VCC = 30 V, IF = 10 mA, Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty cycle = 50% 150 tPHL 100 tPLH 50 PWD 0 -40 30 -20 0 20 40 60 80 100 Ambient Temperature TA (C) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. FORWARD CURRENT PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. SUPPLY VOLTAGE 250 VCC = 30 V, Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty Cycle = 50% 200 150 tPLH 100 tPHL 50 PWD 0 7 250 Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion |tPHL-tPLH| (ns) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion |tPHL-tPLH| (ns) Supply Voltage VCC (V) 10 13 200 IF = 10 mA, Rg = 10 , Cg = 10 nF, f = 10 kHz, Duty Cycle = 50% 150 tPHL 100 tPLH 50 PWD 0 15 16 20 25 30 Forward Current IF (mA) Supply Voltage VCC (V) PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD CAPACITANCE PROPAGATION DELAY TIME, PULSE WIDTH DISTORTION vs. LOAD RESISTANCE 200 250 VCC = 30 V, IF = 10 mA, Rg = 10 , f = 10 kHz, Duty Cycle = 50% Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion |tPHL-tPLH| (ns) Propagation Delay Time tPHL, tPLH (ns), Pulse Width Distortion |tPHL-tPLH| (ns) 250 150 tPHL 100 tPLH 50 PWD 0 0 10 20 30 40 50 Load Capacitance Cg (nF) 200 VCC = 30 V, IF = 10 mA, Cg = 10 nF, f = 10 kHz, Duty Cycle = 50% 150 tPHL 100 tPLH 50 PWD 0 0 10 20 30 40 50 Load Resistance Rg () Remark The graphs indicate nominal characteristics. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 12 of 20 PS9308L, PS9308L2 Chapter Title POWER CONSUMPTION PER CYCLE vs. LOAD RESISTANCE 14 8 Output Voltage VO (V) 12 10 8 UVLOHYS 6 4 VUVLO+ UVLO+ (12.3 V) VUVLO- (11.0 V) 2 0 0 5 10 15 20 Supply Voltage VCC - VEE (V) Power Consumption Per Cycle ESW ( J) OUTPUT VOLTAGE vs. SUPPLY VOLTAGE IF = 10 mA, VEE = GND 7 6 5 Qg = 1000 nC 4 3 Qg = 500 nC 2 1 Qg = 100 nC 0 0 10 20 30 40 50 Load Resistance Rg () Remark The graphs indicate nominal characteristics. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 13 of 20 PS9308L, PS9308L2 Chapter Title <R> TAPING SPECIFICATIONS (UNIT: mm) 7.50.1 1.5 +0.1 -0 4.5 MAX. 10.20.1 4.00.1 16.00.3 2.00.1 1.750.1 Outline and Dimensions (Tape) 1.5 +0.1 -0 0.35 8.00.1 4.050.1 5.080.1 Tape Direction PS9308L-E3 Outline and Dimensions (Reel) R 1.0 1001.0 2.00.5 13.00.2 3302.0 2.00.5 21.00.8 17.51.0 21.51.0 Packing: 2 000 pcs/reel R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 14 of 20 PS9308L, PS9308L2 Chapter Title 11.50.1 1.5 +0.1 -0 4.5 MAX. 12.00.1 4.00.1 24.00.3 2.00.1 1.750.1 Outline and Dimensions (Tape) 2.0 +0.1 -0 8.00.1 0.35 4.050.1 5.080.1 Tape Direction PS9308L2-E3 Outline and Dimensions (Reel) R 1.0 1001.0 2.00.5 13.00.2 3302.0 2.00.5 21.00.8 25.51.0 29.51.0 Packing: 2 000 pcs/reel R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 15 of 20 PS9308L, PS9308L2 Chapter Title RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) B C D A Part Number Lead Bending A B C D PS9308L lead bending type (Gull-wing) for surface mount 9.2 1.27 0.8 2.2 PS9308L2 lead bending type (Gull-wing) for long creepage distance (surface mount) 10.2 1.27 0.8 2.2 R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 16 of 20 PS9308L, PS9308L2 Chapter Title NOTES ON HANDLING (UNIT: mm) 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 120 30 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating) Time (s) (2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 17 of 20 PS9308L, PS9308L2 Chapter Title 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 1.0 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close to the input block pattern of the photocoupler. If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT output side might affect the photocoupler's LED input, leading to malfunction or degradation of characteristics. (If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the range of the recommended operating conditions, and be sure to thoroughly evaluate operation.) (3) Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open. Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. Note: *1. NC: Non-Connection (No Connection). 3. Make sure the rise/fall time of the forward current is 0.5 s or less. 4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/s or less. 5. Avoid storage at a high temperature and high humidity. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 18 of 20 PS9308L, PS9308L2 <R> Chapter Title SPECIFICATION OF VDE MARKS LICENSE DOCUMENT Parameter Symbol Climatic test class (IEC 60068-1/DIN EN 60068-1) Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.6 x UIORM., Pd < 5 pC Spec. Unit 40/110/21 UIORM Upr 1 130 1 808 Vpeak Vpeak Test voltage (partial discharge test, procedure b for all devices) Upr = 1.875 x UIORM., Pd < 5 pC Upr 2 119 Vpeak Highest permissible overvoltage UTR 8 000 Vpeak CTI 175 Degree of pollution (DIN EN 60664-1 VDE0110 Part 1) Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11)) 2 Material group (DIN EN 60664-1 VDE0110 Part 1) III a Storage temperature range Tstg -55 to +125 C Operating temperature range TA -40 to +110 C Ris MIN. Ris MIN. 1012 11 10 Tsi Isi Psi 175 400 700 C mA mW Ris MIN. 109 Isolation resistance, minimum value VIO = 500 V dc at TA = 25C VIO = 500 V dc at TA MAX. at least 100C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = Tsi R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 19 of 20 PS9308L, PS9308L2 Caution GaAs Products Chapter Title This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. R08DS0048EJ0200 Rev.2.00 Sep 27, 2013 Page 20 of 20 Revision History PS9308L, PS9308L2 Data Sheet Rev. Date Page 1.00 2.00 Aug 31, 2011 Sep 27, 2013 - p.1 p.3 p.4 p.7 pp.10 to 13 pp.14 to 15 p.19 Description Summary First edition issued Modification of FEATURES Modification of MARKING EXAMPLE Modification of ORDERING INFORMATION Modification of SWITCHING CHARACTERISTICS Addition of TYPICAL CHARACTERISTICS Modification of TAPING SPECIFICATIONS Modification of SPECIFICATION OF VDE MARKS LICENCE DOCUMENT All trademarks and registered trademarks are the property of their respective owners. C-1 Notice 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. 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Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. http://www.renesas.com SALES OFFICES Refer to "http://www.renesas.com/" for the latest and detailed information. California Eastern Laboratories, Inc. 4590 Patrick Henry Drive, Santa Clara, California 95054, U.S.A. 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