© Semiconductor Components Industries, LLC, 2011
June, 2011 − Rev. 8
1Publication Order Number:
MC14584B/D
MC14584B
Hex Schmitt Trigger
The MC14584B Hex Schmitt Trigger is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. These devices find primary use where low power
dissipation and/or high noise immunity is desired. The MC14584B
may be used in place of the MC14069UB hex inverter for enhanced
noise immunity to “square up” slowly changing waveforms.
Features
•Supply Voltage Range = 3.0 Vdc to 18 Vdc
•Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load over the Rated Temperature Range
•Double Diode Protection on All Inputs
•Can Be Used to Replace MC14069UB
•For Greater Hysteresis, Use MC14106B which is Pin−for−Pin
Replacement for CD40106B and MM74Cl4
•These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol Parameter Value Unit
VDD DC Supply Voltage Range −0.5 to +18.0 V
Vin, Vout Input or Output Voltage Range
(DC or Transient)
−0.5 to VDD + 0.5 V
Iin, Iout Input or Output Current
(DC or Transient) per Pin
±10 mA
PDPower Dissipation, per Package
(Note 1)
500 mW
TAAmbient Temperature Range −55 to +125 °C
Tstg Storage Temperature Range −65 to +150 °C
TLLead Temperature
(8−Second Soldering)
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
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MARKING
DIAGRAMS
1
14
PDIP−14
P SUFFIX
CASE 646
MC14584BCP
AWLYYWWG
SOIC−14
D SUFFIX
CASE 751A
TSSOP−14
DT SUFFIX
CASE 948G
1
14
14584BG
AWLYWW
14
584B
ALYWG
G
1
14
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G= Pb−Free Package
SOEIAJ−14
F SUFFIX
CASE 965
1
14
MC14584B
ALYWG
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
(Note: Microdot may be in either location)
MC14584B
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2
PIN ASSIGNMENT
11
12
13
14
8
9
105
4
3
2
1
7
6
OUT 5
IN 5
OUT 6
IN 6
VDD
OUT 4
IN 4
OUT 2
IN 2
OUT 1
IN 1
VSS
OUT 3
IN 3
LOGIC DIAGRAM
13
11
9
5
3
1
12
10
8
6
4
2
VDD = PIN 14
VSS = PIN 7
EQIVALENT CIRCUIT SCHEMATIC
(1/6 OF CIRCUIT SHOWN)
ORDERING INFORMATION
Device Package Shipping†
MC14584BCPG PDIP−14
(Pb−Free) 500 Units / Rail
MC14584BDG SOIC−14
(Pb−Free) 55 Units / Rail
MC14584BDR2G SOIC−14
(Pb−Free) 2500 / Tape & Reel
MC14584BDTR2G TSSOP−14*
MC14584BFG SOEIAJ−14
(Pb−Free) 50 Units / Rail
MC14584BFELG SOEIAJ−14
(Pb−Free) 2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
MC14584B
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3
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic Symbol
VDD
Vdc
− 55_C 25_C 125_C
Unit
Min Max Min Typ (2) Max Min Max
Output Voltage “0” Level
Vin = VDD
VOL 5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
Vin = 0 “1” Level VOH 5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
IOH
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
−
−
−
−
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
−
−
−
−
– 1.7
– 0.36
– 0.9
– 2.4
−
−
−
−
mAdc
(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
IOL 5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current Iin 15 −±0.1 −±0.00001 ±0.1 −±1.0 mAdc
Input Capacitance
(Vin = 0)
Cin − − − − 5.0 7.5 − − pF
Quiescent Current
(Per Package)
IDD 5.0
10
15
−
−
−
0.25
0.5
1.0
−
−
−
0.0005
0.0010
0.0015
0.25
0.5
1.0
−
−
−
7.5
15
30
mAdc
Total Supply Current (3) (4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT5.0
10
15
IT = (1.8 mA/kHz) f + IDD
IT = (3.6 mA/kHz) f + IDD
IT = (5.4 mA/kHz) f + IDD
mAdc
Hysteresis Voltage VH (5) 5.0
10
15
0.27
0.36
0.77
1.0
1.3
1.7
0.25
0.3
0.6
0.6
0.7
1.1
1.0
1.2
1.5
0.21
0.25
0.50
1.0
1.2
1.4
Vdc
Threshold Voltage
Positive−Going
VT+
5.0
10
15
1.9
3.4
5.2
3.5
7.0
10.6
1.8
3.3
5.2
2.7
5.3
8.0
3.4
6.9
10.5
1.7
3.2
5.2
3.4
6.9
10.5
Vdc
Negative−Going VT– 5.0
10
15
1.6
3.0
4.5
3.3
6.7
9.7
1.6
3.0
4.6
2.1
4.6
6.9
3.2
6.7
9.8
1.5
3.0
4.7
3.2
6.7
9.9
Vdc
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
5. VH = VT+ – VT– (But maximum variation of VH is specified as less than VT + max – VT – min).
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25_C)
Characteristic Symbol
VDD
Vdc Min Typ (6) Max Unit
Output Rise Time tTLH 5.0
10
15
−
−
−
100
50
40
200
100
80
ns
Output Fall Time tTHL 5.0
10
15
−
−
−
100
50
40
200
100
80
ns
Propagation Delay Time tPLH, tPHL 5.0
10
15
−
−
−
125
50
40
250
100
80
ns
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
MC14584B
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4
Figure 1. Switching Time Test Circuit and Waveforms
PULSE
GENERATOR
VDD
INPUT
CL
VSS
7
OUTPUT
20 ns 20 ns
VDD
VSS
VOH
VOL
90%
50%
10%
90%
50%
10%
tPLH
tPHL
OUTPUT
INPUT
tftr
VDD
VT+
VT-
VSS
VDD
VSS
Vout
Vin
VHVHVDD
VT+
VT-
VSS
VDD
VSS
Vout
Vin
VDD
0VDD
VT+
VT-
0
VH
Vin, INPUT VOLTAGE (Vdc)
Vout , OUTPUT VOLTAGE (Vdc)
Figure 2. Typical Schmitt Trigger Applications
(b) A Schmitt trigger offers maximum noise immunity
in gate applications.
(a) Schmitt Triggers will square up inputs with slow
rise and fall times.
Figure 3. Typical Transfer Characteristics
Vin Vout
14
MC14584B
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5
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
17
14 8
B
ADIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.715 0.770 18.16 19.56
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
F0.040 0.070 1.02 1.78
G0.100 BSC 2.54 BSC
H0.052 0.095 1.32 2.41
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L
M−−− 10 −−− 10
N0.015 0.039 0.38 1.01
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
HG D
K
C
SEATING
PLANE
N
−T−
14 PL
M
0.13 (0.005)
L
M
J
0.290 0.310 7.37 7.87
MC14584B
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6
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
−B−
G
P7 PL
14 8
7
1
M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
−T−
F
RX 45
SEATING
PLANE D14 PL K
C
J
M
_DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
__ __
7.04
14X
0.58
14X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
7X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC14584B
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7
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L−U−
SEATING
PLANE
0.10 (0.004)
−T−
ÇÇÇ
ÇÇÇ
SECTION N−N
DETAIL E
JJ1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36 14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC14584B
http://onsemi.com
8
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE B
HE
A1
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.004 0.008
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 1.42 --- 0.056
A1
HE
Q1
LE
_10 _0
_10 _
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005) M0.10 (0.004)
D
Z
E
1
14 8
7
eA
b
VIEW P
c
L
DETAIL P
M
A
b
c
D
E
e
L
M
Z
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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Phone: 81−3−5773−3850
MC14584B/D
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