72 ICs
1-1-4 Linear Regulator ICs
■Absolute Maximum Ratings
Unit
V
V
A
W
°C
°C
°C/W
°C/W
Ratings
17
VIN
1.0
0.76
–40 to +125
–40 to +125
130
22
Symbol
VIN*1
VC
IO*1
PD*1, *2
Tj
Tstg
θ
j-a
θ
j-L
Parameter
DC Input Voltage
Output Control Terminal Voltage
DC Output Current
Power Dissipation
Junction Temperature
Storage Temperature
Thermal Resistance (Junction to Ambient Air)
Thermal resistance (Junction to Lead (pin 7))
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO. Please calculate these values referring to the
Copper laminate area vs. Power dissipation data as shown hereinafter.
*2: When mounted on a glass epoxy board of 1600 mm2 (copper laminate area 2%).
(Ta=25°C)
■Features
•Compact surface-mount package (SOP8)
•Output current: 1.0 A
•Compatible with low ESR capacitor
•Low circuit current at output OFF Iq ≤ 350
µ
A
(IO = 0 A, VC = 2 V)
•Low current consumption Iq (OFF) ≤ 1
µ
A
(VC = 0 V)
•Low dropout voltage VDIF ≤ 0.6 V (IO = 1 A)
•3 types of output voltages (2.5 V, 3.3 V, and
variable type) available
•Output ON/OFF control terminal voltage
compatible with LS-TTL
•Built-in drooping-type-overcurrent and thermal
protection circuits
■Applications
•Local power supplies
•Battery-driven electronic equipment
■Electrical Characteristics (Ta=25°C, Vc=2 V, unless otherwise specified)
*1: Refer to the Dropout Voltage parameter.
*2: The Is1 is specified at the 5% drop point of output voltage VO on the condition that VIN = VO + 1 V, and IO = 10 mA.
*3: Output is OFF when the output control terminal VC is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
Surface-Mount, Low Current Consumption, Low Dropout Voltage
SI-3000KS Series
Unit
V
V
V
mV
mV
µ
A
µ
A
mV/°C
dB
A
V
µ
A
µ
A
Parameter
Input V oltage
Output Voltage
(Reference voltage V
ADJ
for SI-3012KS)
Dropout V oltage
Line Regulation
Load Regulation
Quiescent Circuit Current
Circuit Current at Output OFF
Temperature Coefficient of
Output V oltage
Ripple Rejection
Overcurrent Protection
Starting Current*2
Control Voltage (Output ON)
*3
Control Voltage (Output OFF)
VC
Control Current (Output ON)
Terminal
Control Current (Output OFF)
Symbol
VIN
VO (VADJ)
Conditions
VDIF
Conditions
Conditions
∆VOLINE
Conditions
∆VOLOAD
Conditions
Iq
Conditions
Iq (OFF)
Conditions
∆VO/∆Ta
Conditions
RREJ
Conditions
IS1
Conditions
VC, IH
VC, IL
IC, IH
Conditions
IC, IL
Conditions
Ratings
SI-3012KS (variable type) SI-3025KS SI-3033KS
min. typ. max. min. typ. max. min. typ. max.
2.4 *1 *1
1.24 1.28 1.32 2.45 2.50 2.55 3.234 3.300 3.366
0.3 0.4 0.4
0.6 0.6 0.6
10 10 15
40 40 50
350 350 350
111
±0.3 ±0.3 ±0.3
55 55 55
1.2 1.2 1.2
2.0 2.0 2.0
0.8 0.8 0.8
40 40 40
–5 0 –5 0 –5 0
VIN=3.3V, IO=10mA
IO=0.5A
IO=1A
VIN=3.3 to 8V, IO=10mA
VIN=3.3V, IO=0 to 1A
VIN=3.3V, IO=0A, VC=2V
VIN=3.3V, VC=0V
Tj=0 to 100°C
VIN=3.3V, f=100 to 120HZ
VIN=3.3V, IO=10mA
IO=1A (VO=2.5V)
V
IN
=3.3 to 8V, I
O
=10mA (V
O
=2.5V)
V
IN
=3.3V, I
O
=0A, V
C
=2V, R2=24kΩ
V
IN
=3.3V, I
O
=0 to 1A (V
O
=2.5V)
V
IN
=3.3V, f=100 to 120H
Z
(V
O
=2.5V)
Tj=0 to 100°C (VO=2.5V)
VIN=3.3V, VC=0V
VIN=3.3V (VO=2.5V)
IO=0.5A (VO=2.5V)
VC=0V
VC=2V
VIN=3.3V
VIN=5V, IO=10mA
IO=0.5A
IO=1A
VIN=5 to 10V, IO=10mA
VIN=5V, IO=0 to 1A
VIN=5V, IO=0A, VC=2V
VIN=5V, VC=0V
Tj=0 to 100°C
VIN=5V, f=100 to 120HZ
VIN=5V
73
ICs
SI-3000KS Series
■External Dimensions (SOP8) (Unit : mm)
0.995max.
0.10
1.27
0.4
±0.1
0.4
±0.1
0.15
+0.1
5.1
±0.4
1.27
8765
1234
4.4
±0.2
1.5
±0.1
1.55
±0.15
0.05
±0.05
6.2
±0.3
0 to 10°
0.5
±0.1
–0.05
0.12 M
Pin Assignment
qVC
wVIN
eVO
rSence (ADJ for SI-3012KS)
tGND
yGND
uGND
iGND
Plastic Mold Package Type
Flammability: UL 94V-0
Product Mass: Approx. 0.1 g
■Block Diagram
■Typical Connection Diagram
●SI-3012KS ●SI-3025KS, SI-3033KS
●SI-3012KS ●SI-3025KS, SI-3033KS
R1, R2: Output voltage setting resistors
The output voltage can be set by connecting R1 and R2
as shown above.
The recommended value of R2 is 24 kΩ .
R1=(V
O
–V
ADJ
)
÷
(V
ADJ
/R2)
2VIN
1
REF
VC
VO
ADJ
GND
4
8
7
6
5
3
TSD
-
+
2V
IN
1
REF
V
C
V
O
Sense
GND
4
8
7
6
5
3
TSD
-
+
GND
5 to 8
VIN
CIN
R1
R2
2VO
CO
3
VC
1ADJ
4
Load
GND
5 to 8
V
IN
C
IN
R2
2V
O
C
O
3
V
C
1
sense
4
Load
CIN:Input capacitor (22
µ
F or larger)
CO:Output capacitor (22
µ
F or larger)
For SI-3000KS series, Co has to be a low ESR capacitor.
When using the electrolytic capacitor, the SI-3000KS series may oscillate at a low temperature.
■Reference Data
Copper Laminate Area vs.
Thermal Resistance Copper Laminate Area vs.
Power Dissipation
•Obtaining the junction temperature
Measure the temperature TL at the lead part of the GND
pin (pin 7) with a thermocouple, etc. Then, substitute
this value in the following formula to obtain the junction
temperature.
T
j
=P
D
× θ
j–L
+ T
L
(
θ
j–L
= 22
°
C/W)
Thermal resistance j-a (°C/W)
Copper laminate area (mm
2
)
(GND terminal)
10 100
140
120
100
80
60
40 1000
Area of PC board : 40×40mm
θ
Power dissipation P
D
(W)
10 100
1.2
1
0.8
0.6
0.4
0.2
01000
Tj=100°C Area of PC board : 40×40mm
Ta=25°C
Ta=50°C
Ta=80°C
Copper laminate area (mm
2
)
(GND terminal)
