2FAA-M20R – Integrated Passive & Active Device using MLP
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
I/O PADS
GROUND
PAD
MLP
PACKAGE
General Information
Features
■Lead free as standard
■RoHS compliant*
■ESD protection
■Protects up to ten data lines
■Low insertion loss
Applications
■Cell Phones
■PDAs and Notebooks
■GPS and SMART Cards
The 2FAA-M20R device, manufactured using Thin Film on
Silicon technology, provides ESD protection for the external
ports of portable electronic devices such as cell phones,
modems and PDAs.
The ESD protection provided by the component enables a
data port to withstand a minimum ±8 KV Contact /±15 KV Air
Discharge per the ESD test method specified in IEC 61000-4-2.
The device measures 3.5 mm x 3.5 mm and is intended to be
mounted directly onto an FR4 printed circuit board. The MLP
device meets typical thermal cycle and bend test specifications.
Electrical Characteristics Symbol Minimum Nominal Maximum Unit
(TA= 25 °C unless otherwise noted)
Resistance R 180 200 220 Ω
Capacitance @ 2.5 V 1 MHz C 16 20 24 pF
Rated Standoff Voltage VWM 5.0 V
Breakdown Voltage @ 1 mA VBR 6.0 V
Forward Voltage @ 10 mA VF0.8 V
Leakage Current @ 3 V ID0.1 µA
ESD Protection: IEC 61000-4-2
Contact Discharge ±8 kV
Air Discharge ±15 kV
Thermal Characteristics
(TA= 25 °C unless otherwise noted)
DC Power Rating P 100 mW
Operating Temperature Range TJ -40 25 +85 °C
Storage Temperature Range TSTG -55 25 +150 °C
Electrical & Thermal Characteristics
*RoHS COMPLIANT
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Product Dimensions Recommended Pad Layout
2FAA-M20R – Integrated Passive & Active Device using MLP
How to Order
2 FAA – M 20 R
Thin Film
Model
MLP Package
No. of Solder Pads
Packaging Option
R = Tape and Reel
Packaged 3000 pcs. / 13 ˝ reel
(100 % Sn Termination)
FAA
B0412
3.51
(0.138)
2.01
(0.0790)
0.43
(0.0170)
0.27
(0.0106)
3.51
(0.138)
0.75
(0.0295)
3.51
(0.138)
2.03
(0.080)
0.75
(0.0295)
3.51
(0.138)
0.5
(0.020)
0.40
(0.016)
3.51
(0.138)
2.01
(0.079)
0.51
(0.020)
This silicon-based device is packaged using micro leadframe
packaging technology. The MLPs have an exposed die attach
pad that provides the interconnect medium from die to PCB.
The pads are arranged for easy PCB routing. The pitch is
0.5 mm and the dimensions for the packaged device are
shown below.
DIMENSIONS = MILLIMETERS
(INCHES)
Block Diagram
2FAA-M20R – Integrated Passive & Active Device using MLP
GND
EXT3 R3
R4
INT3
EXT4 INT5
GND
EXT8 R8
R7
INT8
EXT7 INT7
GND
R5
EXT5 INT5
R6
EXT6 INT6
GND
EXT1 R1
R2
INT1
EXT2 INT2
GND
EXT10 R10
R9
INT10
EXT9 INT9
The MLP Device block diagram below includes the pin names and basic electrical connections associated with each channel.
Frequency Response
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
2FAA-M20R – Integrated Passive & Active Device using MLP
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Device Pin Out
1
EXT3
2
EXT2
3
EXT1
4
INT1
5
INT2
15 EXT9
14 EXT10
13 INT10
12 INT9
11 INT8
6
INT3
7
INT4
8
INT5
9
INT6
10
INT7
20
EXT4
19
EXT5
18
EXT7
17
EXT7
16
EXT8
The Pin-Out for the device is shown below. Note also that the device is shown with bottom side pads facing up.
Packaging
The surface mount product is packaged in a 12 mm x 8 mm Tape and Reel format per EIA-481 standard.
COPYRIGHT© 2004, BOURNS, INC. LITHO IN U.S.A. 06/05 e/IPA0507
2FAA-M20R REV. A 03/05
Asia-Pacific: TEL +886- (0)2 25624117 • FAX +886- (0)2 25624116
Europe: TEL +41-41 768 5555 • FAX +41-41 768 5510
The Americas: TEL +1-951 781-5492 • FAX +1-951 781-5700
www.bourns.com
Reliable Electronic Solutions
Pin Out Function Pin Out Function Pin Out Function Pin Out Function
Pin1 EXT3 Pin6 INT3 Pin11 INT8 Pin16 EXT8
Pin2 EXT2 Pin7 INT4 Pin12 INT9 Pin17 EXT7
Pin3 EXT1 Pin8 INT5 Pin13 INT10 Pin18 EXT6
Pin4 INT1 Pin9 INT6 Pin14 EXT10 Pin19 EXT5
Pin5 INT2 Pin10 INT7 Pin15 EXT9 Pin20 EXT4
2.0 ± 0.05
(.08 ± .002)
0.3 ± 0.05
(.01 ± .002)
3.9 ± 0.1
(.154 ± .004)
3.9 ± 0.1
(.154 ± .004)
1.75 ± 0.1
(.07 ± .004)
5.5 ± 0.3
(.22 ± .01)
12.0 ± 0.3
(.47 ± .01)
0.9 ± 0.1
(.035 ± .004)
ORIENTATION
OF COMPONENT
IN POCKET
BACKSIDE FACING UP
TOP SIDE VIEW
(INTO COMPONENT POCKET)
0.3
(0.01)
4.0 ± 0.1
(.16 ± .004)
8.0 ± 0.3
(.31 ± .01) 0.25
(0.010)TYP.R
1.5 ± 0.1/-0
(.06 ± .004/-0)
DIA.
MAX.R
DIMENSIONS = MILLIMETERS
(INCHES)
