CPC2125NTR - IXYS Integrated Circuits Division

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

DS-CPC2125N-R05 1

CPC2125N

400V Dual Normally-Closed Single-Pole

8-Pin SOIC OptoMOS® Relay

Part # Description

CPC2125N 8-Pin SOIC (50/tube)

CPC2125NTR 8-Pin SOIC (2000/reel)

Parameter Rating Units

Blocking Voltage 400 VP

Load Current 100 mArms / mADC

On-Resistance (max) 35 

LED Forward Current (to Activate) 2 mA

Applications

Features

Description

Ordering Information

Pin Configuration

• Telecommunications

• Telecom Switching

• Tip/Ring Circuits

• Modem Switching (Laptop, Notebook, Pocket Size)

• Hook Switch

• Dial Pulsing

• Ground Start

• Ringing Injection

• Security

• Passive Infrared Detectors (PIR)

• Data Signaling

• Sensor Circuitry

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Medical Equipment—Patient/Equipment Isolation

• Aerospace

• Industrial Controls

• 1500Vrms Input/Output Isolation

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Immune to Radiated EM Fields

• Tape & Reel Version Available

• Small 8-Pin SOIC Package

• Flammability Rating UL 94 V-0

The CPC2125N is a miniature device with two

independent normally-closed (1-Form-B) solid state

relays in an 8-pin SOIC package that employs

optically coupled MOSFET technology to provide

1500Vrms of input to output isolation.

Optically coupled outputs, using the patented

OptoMOS architecture, are controlled by a highly

efficient infrared LED.

Constructed using IXYS Integrated Circuits' state

of the art double-molded, vertical construction

packaging, this device is one of the world’s smallest

relays. It offers substantial board space savings over

the competitor’s larger 8-pin SOIC relay.

Switching Characteristics

of Normally-Closed (Form-B) Devices

Approvals

Form-B

10% 90%

ILOAD

toff ton

+ Control

– Control

Load

+ Control

– Control

Load

• UL Recognized Component: File E76270

• CSA Approval Pending

• EN/IEC 60950-1 Certified Component:

Certificate available on our website

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

2R05

CPC2125N

Absolute Maximum Ratings @ 25ºC

Parameter Ratings Units

Blocking Voltage 400 VP

Reverse Input Voltage 5 V

LED Forward Current

Peak (10ms)

50 mA

Input Power Dissipation 70 mW

Total Power Dissipation 1600 mW

Isolation Voltage, Input to Output

(60 Seconds) 1500 Vrms

ESD Rating, Human Body Model 8 kV

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

1 Derate linearly 5mW / ºC

Parameter Conditions Symbol Min Typ Max Units

Output Characteristics

Load Current

Continuous 1IF=0mA IL- - 100 mArms / mADC

Peak t =10ms ILPK - - ±350 mAP

On-Resistance 2IL=100mA RON -2635 

Switching Speeds

Turn-On IF=5mA, VL=10V ton - 0.31 2 ms

Turn-Off toff - 0.30 2

Off-State Leakage Current VL=400V, IF=2mA ILEAK --5 µA

Output Capacitance IF=2mA, VL= 50V, f=1MHz COUT -6 - pF

Input Characteristics

LED Forward Current

To Activate 3IL=100mA IF

--2 mA

To Deactivate - 0.1 - -

Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V

Reverse Input Current VR=5V IR- - 10 µA

Common Characteristics

Capacitance, Input to Output VIO=0V, f=1MHz CIO -1 - pF

1 Load current derates linearly from 100mA @ 25oC to 60mA @ 85oC, and must be derated if both poles are operating simultaneously.

2 Measurement taken within 1 second of on-time.

3 For applications requiring high temperature operation (greater than 60°C) a minimum LED forward current of 4mA is recommended.

Electrical Characteristics @ 25ºC

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to the

device. Functional operation of the device at conditions beyond

those indicated in the operational sections of this data sheet is

not implied.

Typical values are characteristic of the device at +25°C, and

are the result of engineering evaluations. They are provided for

information purposes only, and are not part of the manufacturing

testing requirements.

INTEGRATED CIRCUITS DIVISION

CPC2125N

www.ixysic.com 3

R05

PERFORMANCE DATA*

LED Forward Voltage (V)

1.250 1.255 1.260 1.265 1.270 1.275

Device Count (N)

Typical LED Forward Voltage Drop

(N=50, IF=5mA)

LED Forward Current (mA)

0.12 0.14 0.16 0.18 0.20 0.22

Device Count (N)

Typical LED Forward Current

to Activate

(N=50, IL=120mA)

On-Resistance (:)

24 25 25 26 27 28 28

Device Count (N)

Typical On-Resistance Distribution

(N=50, IF=0mA, IL=100mA)

Turn-On Time (ms)

0.24 0.26 0.28 0.30 0.32 0.34 0.36

Device Count (N)

Typical Turn-On Time

(N=50, IF=5mA, IL=60mA)

Turn-Off Time (ms)

0.20 0.23 0.26 0.29 0.32 0.35 0.38

Device Count (N)

Typical Turn-Off Time

(N=50, IF=5mA, IL=60mA)

Blocking Voltage (VP)

400 410 420 430 440 450 460 470

Device Count (N)

Typical Blocking Voltage Distribution

(N=50, IF=2mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Forward Voltage (V)

1.0

1.1

1.2

1.3

1.4

1.5

1.6

Typical LED Forward Voltage Drop

vs. Temperature

IF=50mA

IF=20mA

IF=10mA

IF=5mA

IF=2mA

LED Forward Current (mA)

0 1020304050

Turn-Off Time (Ps)

200

400

600

800

1000

1200

Typical Turn-Off Time

vs. LED Forward Current

(IL=60mA)

LED Forward Current (mA)

0 1020304050

Turn-On Time (Ps)

306

308

310

312

314

316

318

Typical Turn-On Time

vs. LED Forward Current

(IL=60mA)

LED Forward Voltage (V)

1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55

LED Forward Current (mA)

Typical LED Forward Voltage

vs. LED Forward Current

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Forward Current (mA)

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

Typical LED Forward Current

to Activate

(IL=60mA)

Load Voltage (V)

-3 -2 -1 0 1 2 3

Load Current (mA)

-150

-100

-50

100

150

Typical Load Current vs. Load Voltage

(IF=0mA)

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

4R05

CPC2125N

PERFORMANCE DATA*

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Load Current (mA)

100

110

Maximum Load Current

vs. Temperature

(IF=0mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Blocking Voltage (VP)

440

445

450

455

460

465

Typical Blocking Voltage

vs. Temperature

(IF=5mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Leakage Current (PA)

Leakage Current vs. Temperature

Measured Across Pins 5&6, 7&8

(IF=2mA, VL=400V)

Load Voltage (V)

0.1 1 10 100 1000

Output Capacitence (pF)

Output Capacitance vs. Load Voltage

(IF=2mA, f=1MHz)

Time

10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s

Load Current (A)

0.2

0.4

0.6

0.8

1.0

Energy Rating Curve

0.9

0.7

0.5

0.3

0.1

Temperature (ºC)

-40 -20 0 20 40 60 80 100

On-Resistance (:)

Typical On-Resistance vs. Temperature

(IF=0mA, IL=60mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-Off Time (Ps)

400

800

1200

1600

2000

Typical Turn-Off Time

vs. Temperature

(IL=60mA)

IF=2mA

IF=5mA

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-On Time (Ps)

100

150

200

250

300

350

400

450

500

Typical Turn-On Time

vs. Temperature

(IL=60mA)

IF=5mA

IF=2mA

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

CPC2125N

www.ixysic.com 5

R05

Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of

the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of

our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices

when handled according to the limitations and information in that standard as well as to any limitations set forth in

the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Classiﬁ cation

CPC2125N MSL 3

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the

body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum

Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other

processes, the guidelines of J-STD-020 must be observed.

Device Classiﬁ cation Temperature (Tc) Dwell Time (tp) Max Reﬂ ow Cycles

CPC2125N 260ºC 30 seconds 3

Board Wash

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux

residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage

to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow

up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the

variability of the wash parameters used to clean the board, determination of the bake temperature and duration

necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning

or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the

device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION

IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes

to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'

Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but

not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property

or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC2125N-R05

OptoMOS® is a registered trademark of IXYS Integrated Circuits

6/4/2018

For additional information please visit our website at: www.ixysic.com

CPC2125N

MECHANICAL DIMENSIONS

CPC2125N

CPC2125NTR Tape & Reel

Dimensions

(inches)

PCB Land Pattern

2.184 MAX

(0.086 MAX)

0.838 ± 0.102

(0.033 ± 0.004) 0.381 ± 0.051

(0.015 ± 0.002)

Pin to Package Standoff

MIN 0.0254 (0.001)

(MAX 0.102 (0.004)

0.432 ± 0.127

(0.017 ± 0.005)

0.203 ± 0.025

(0.008 ± 0.001)

1.016 ± 0.025

(0.040 ± 0.001)

5.60

(0.22)

1.30

(0.051)

0.55

(0.022)

2.54

(0.100)

9.347 ± 0.203

(0.368 ± 0.008)

6.096 ± 0.102

(0.240 ± 0.004)

3.810 ± 0.051

(0.150 ± 0.002)

2.540 TYP

(0.100 TYP)

Pin 1

Note:

1. Lead dimensions do not include plating: 1000 microinches max.

NOTES:

1. All dimensions in millimeters

2. 10 sprocket hole pitch cumulative tolerance ± 0.20.

3. Carrier camber is within 1mm in 250mm.

4. Tape material : Black Conductive Polystyrene Alloy.

5. All dimensions meet EIA-481-C requirements.

6. Thickness : 0.30 ± 0.05mm.

7.50 ± 0.10

16.00 ± 0.30

1.75 ± 0.10 P1=8.00 ± 0.104.00 ± 0.10

2.00 ± 0.10

9.65 ± 0.106.50

1.20

2.85 ± 0.10

2.35 ± 0.10

6.55 ± 0.10

3.50

Ø1.50

+0.1, -0

Ø1.50 MIN

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

Direction of feed