Parameter Test Conditions Min. Typ. Max. Unit
V
nA
µA
Ω
S ( )
pF
nC
ns
A
V
ns
µC
IRFQ110
Document Number ****
Issue 1
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100
2.0 4.0
100
-100
25
250
0.70
0.80
0.86 180
82
15 15
7.5
7.5
20
25
40
40
1.0
4.0
1.5
200
0.83
VGS = 0 ID= 1mA
VDS = VGS ID= 250µA
VGS = 20V
VGS = -20V
VDS = 80V. VGS =0
TC= 125°C
VGS = 10V ID= 0.6A
VGS = 10V ID= 1.0A
VDS = 15V IDS = 0.6A
VGS = 0 VDS = 25V
f = 1MHz
VGS = 10V VDS = 50V
IDS = 1.0A
VDD = 50V ID= 1.0A
RG= 24Ω
(MOSFET switching times are essentially
independent of operating temperature.)
Modified MOS POWER
symbol showing the intergal
P-N junction rectifier.
IS= 1.0A VGS = 0
IF =1.0A TJ= 25°C
di/ dt=100A/µsV
DD = 50V
ELECTRICAL CHARACTERISTICS FOR EACH CHIP(Tcase = 25°C unless otherwise stated)
Drain – Source Breakdown Voltage
Gate Threshold Voltage
Gate – Source Leakage Forward
Gate – Source Leakage Reverse
Zero Gate Voltage Drain Current
Static Drain Source On-State
Resistance*
Forward Transductance *
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate
–
Source Charge
Gate
–
Drain Charge
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
Continuous Source Current Body
Diode
Source Current* (Body Diode)
Diode Forward Voltage *
Reverse Recovery Time
Reverse Recovery Charge
BVDSS
VGS(th)
IGSSF
IGSSR
IDSS
RDS(on)
gfs
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
IS
ISM
VSD
trr
QRR
BODY– DRAIN DIODE RATINGS & CHARACTERISTICS