27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 1/28
EYSHCNZWZ
Bluetooth ® low energy Module
Bluetooth® 5.0 low energy
EYSHCNZWZ
Data Report
The Bluetooth® word mark and logos are owned by the Bluetooth SIG, Inc. and any use of
such marks by TAIYO YUDEN CO., LTD. is under license.
27-Feb.2019 Ver.1.3
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EYSHCNZWZ
Document constituent list
Control name
Control No.
Document Page
General Items
HD-AG-A160260
1/5 - 5/5
Absolute maximum ratings
HD-AM-A160260
1/1
Electrical characteristics
HD-AE-A160260
1/3 - 3/3
Circuit schematic
HD-MC-A160260
1/3 - 3/3
Outline / Appearance
HD-AD-A160260
1/3 - 3/3
Pin Layout
HD-BA-A160260
1/2 - 2/2
Handling Precaution
HQ-BA-537
1/2 - 2/2
Packaging Specification
HD-BB-A160260
1/3 - 3/3
Antenna application note
1/3 - 3/3
Design guide
1/1
Precautions
HQ-BK-002_02
1/2 - 2/2
Revision History
30-Jun.-2017 > Ver.1.0 Release
25-Sep.-2017 > Ver.1.1 Update
11-May -2018 > Ver.1.2 Update
27-Feb. -2019 > Ver.1.3 Update
27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 3/28
EYSHCNZWZ
Control No.
HD-AG-A160260 (1/5)
Control name
General Items
1. Scope
This specification (“Specification”) applies to the hybrid IC “EYSHCNZWZ”, a Bluetooth® 5.0 low
energy module (“Product”) manufactured by TAIYO YUDEN Co., Ltd. (“TAIYO YUDEN”)
2. Description
a) User Code : EYSHCNZWZ
Type : EYSHCN
*User Code may be changed for mass production or other cases.
Note: Please use the User Code (EYSHCNZWZ) to order this product
b) Chip : Nordic nRF52832 (512kB Flash, 64kB RAM)
c) Function : Radio frequency transceiver Module. Bluetooth®5.0 conformity.
d) Application : IoT devices, Health & Fitness Equipment, Sensor, Toys
e) Structure : Hybrid IC loaded with silicon monolithic semiconductor
Containment of hazardous substance in this Product
Can meet with RoHS compliance (Pb, Cd, Hg, Cr+6, PBB, PBDE)
f) Outline : 49-pin Land Grid Array
g) Marking : Part Number, Lot Number, Japan ID, FCC ID, ISED Number and manufacturer on
Shielding Case
h) Country of origin ： Japan
i) Packaging : Packaging method: Tape & reel + aluminum moisture barrier bag
Packaging unit: 1000
*It might be provided as tray at sample stage.
27-Feb.2019 Ver.1.3
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EYSHCNZWZ
Control No.
HD-AG-A160260 (2/5)
Control name
General Items
j) Notes:
a. Limitation of Warranty
1) TAIYO YUDEN provides warranties only if the Product is operated under the condition set
forth in this Specification. Please note that TAIYO YUDEN shall not be liable for any defect
and/or malfunction arising from use of the Product under the terms and conditions other
than the operating conditions hereof. In addition when this Product is used under
environmental conditions such as over voltage which is not guaranteed, it may be
destroyed in short mode. To ensure the security of customer’s product, please add an
extra fuse or/and a protection circuit for over voltage.
2) This Product is designed for use in products which comply with Bluetooth® Specifications.
TAIYO YUDEN disclaims and is not responsible for any liability concerning infringement by
this Product under any intellectual property right owned by third party in case the customer
uses this Product in any product which does not comply with Bluetooth® Specifications (the
“non-complying products”). Furthermore, TAIYO YUDEN warrants only that this Product
complies with this Specification and does not grant any other warranty including warranty
for application of the non-complying products.
3) In some cases, TAIYO YUDEN may use replacements as component parts of Products.
Such replacement shall apply only to component part of Products, which TAIYO YUDEN
deems it possible to replace or substitute according to (i) Scope of Warranty provided in
this specification (e.g. Electric Characteristics, Outline, dimension, Conditions of Use,
Reliability Tests, Official Standard (Type Approvals etc.)) and (ii) Quality of Products. TAIYO
YUDEN also ensures traceability of such replacement on production lot basis.
b. Instruction for Use (CAUTION)
1) Because Product is not designed for radiation durability, please refrain from exposing
Product to radiation in the use.
2) Communication between this Product and other might not be established nor maintained
depending upon radio environment or operating condition of this Product and other
products with wireless technology.
3) This Product operates in the unlicensed ISM band at 2.4GHz. In case this Product is used
around the other wireless devices which operate in same frequency band of this Product,
there is a possibility that interference occurs between this Product and such other devices.
If such interference occurs, please stop the operation of other devices or relocate this
Product before using this Product or do not use this Product around the other wireless
devices.
4) This Product mentioned in this Specification is manufactured for use in Health & Fitness
Equipment, Sensor, Toys. Before using this Product in any special equipment (such as
medical equipment, space equipment, air craft, disaster prevention equipment), where
higher safety and reliability are duly required, the applicability and suitability of this Product
must be fully evaluated by the customer at its sole risk to ensure correct and safety
operation of those special equipments. Also, evaluation of the safety function of this
Product even for use in general electronics equipment shall be thoroughly made and when
necessary, a protective circuit shall be added in design stage, all at the customer’s sole
risk.
27-Feb.2019 Ver.1.3
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EYSHCNZWZ
Control No.
HD-AG-A160260 (3/5)
Control name
General Items
5) Japan Regulatory Information
This module is approved with the specific antenna on this module.
a) Please ensure that your product can bear a label with the following information. If the
product is so small that it is not practicable to place the label, please place it in the
instruction manual and package.
This product installs a radio system which has been approved as a radio station in a
low power data communication system based on the Radio Law.
EYSHCN : 001-A10745
6) Canada Regulatory Information
a) This device complies with Industry Canada’s applicable license-exempt RSSs.
Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux
appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions
suivantes : 1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil
doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible
d’en compromettre le fonctionnement.
b) This product is certified as type of the portable device with Industry Canada Rules. To
maintain compliance with RF Exposure requirement,please use within specification of
this product.
Ce produit est certifié comme type de l'appareil portable avec Industrie Règles de
Canada. Pour maintenir l'acquiescement avec exigence Exposition de RF, veuillez
utiliser dans spécification de ce produit.
- IC: 4389B-EYSHCN
c) Please notify certified ID by either one of the following method on your product.
Specifiez ID certifiée dans votre produit par une de méthode suivante.
-Contains Transmitter module IC : 4389B-EYSHCN
-Contains IC : 4389B-EYSHCN
7) FCC Regulatory Information
a) This device complies with part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
b) Please notify certified ID by either one of the following method on your product.
-Contains Transmitter Module FCC ID: RYYEYSHCN
-Contains FCC ID: RYYEYSHCN
c) CAUTION: changes or modifications not expressly approved by the party responsible
for compliance could void the use’s authority to operate the equipment.
27-Feb.2019 Ver.1.3
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TAIYO YUDEN CO., LTD. 6/28
EYSHCNZWZ
Control No.
HD-AG-A160260 (4/5)
Control name
General Items
d) This product is certified as type of the portable device with FCC Rules. To maintain
compliance with RF Exposure requirement, please use within specification of this
product.
e) The antenna used for this transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
f) This module can change the output power depending on the circumstances by the
application software which is developed by module installer. Any end user cannot
change the output power.
8) CE Regulatory Information
a) When your end product installs this module, it is required to proceed additional
certification processes before placing on the market in EU member states to make your
products fully comply with relative EU standards.
b) TAIYO YUDEN can provide you the test reports of conducted measurement portion for
the radio module. You can utilize the test reports for the certification processes of your
end product as it requires radio testing.
c. Term of Support
1) In the case that customer requests TAIYO YUDEN to customize the hardware of this
Product in order to meet such customer’s specific needs, TAIYO YUDEN will make
commercially reasonable effort to modify such hardware or software at customer’s
expense; provide however, the customer is kindly requested to agrees it doesn’t mean that
TAIYO YUDEN has obligations to do so even in the case it is technically difficult for TAIYO
YUDEN.
2) Any failure arising out of this Product will be examined by TAIYO YUDEN regardless of
before or after mass production. Customer agrees that once such failure is turned out not to
be responsible for TAIYO YUDEN after aforesaid examination, some of the technical
support shall be conducted by TAIYO YUDEN at customer’s expense; provided however,
exact cost of this technical support can be agreed through the negotiation by the parties.
3) Do not alter hardware and/or software of this Product. Please note that TAIYO YUDEN
shall not be liable for any problem if it is caused by customer's alteration of Hardware
without Taiyo Yuden's prior approvals.
4) TAIYO YUDEN does not guarantee functions and performances which depend on the
customer's firmware. TAIYO YUDEN does not assume liabilities for defects and failures (i)
in functions, performances and quality of the Customer's product incorporating the
Products and (ii) which may occur as the Product is incorporated in the Customer's product.
27-Feb.2019 Ver.1.3
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EYSHCNZWZ
Control No.
HD-AG-A160260 (5/5)
Control name
General Items
d. Caution for Export Control
This Product may be subject to governmental approvals, consents, licenses, authorizations,
declarations, filings, and registrations for export or re-export of the Product, required by
Japanese Foreign Exchange and Foreign Trade Law (including related laws and
regulations) and/or any other country’s applicable laws or regulations related to export
control.
In case you will export or re-export this Product, you are strongly recommended to check
and confirm, before exporting or re-exporting, necessary procedures for export or re-export
of this Product which is required by applicable laws and regulations, and if necessary, you
have to obtain necessary and appropriate approvals or licenses from governmental
authority at your own risk and expense.
e. Term of Warranty
TAIYO YUDEN warrants only that this Product is in conformity with this Specification for
one year after purchase and shall in no event give any other warranty.
f. Items of the Specification
1) Any question arising from the Specification shall be solved in good faith through mutual
discussion by the parties hereof.
2) The language of this “General items” is Japanese and this “General items” shall be
interpreted by Japanese Any copies of translation is a reference purpose only and is not
binding on both parties hereto.
g. Special note
1) Taiyo Yuden writes firmware for and fixed SoftDevice (s132_nrf52_5.0.0_softdevice.hex) to
this product. Customer writes firmware that is match the customer applications including
SoftDevice at the customer's own responsibility.
2) The Electrical Characteristics defined in this Specification are of the module with above
Firmware (s132_nrf52_5.0.0_softdevice.hex). If other firmware developed by Customer is
installed, the characteristics may differ from the defined value in the Electrical
Characteristics. Bluetooth qualification and radio type approval may become invalid.
3) EYSHCN series module is qualified as PHY only with Component category by Bluetooth
SIG. The QDID of this module is 97470. The final product needs to get qualification as End
product combining with PHY (module), SoftDevice and Profile before selling the product.
The combination of Link and Host layer is differ with SoftDevice. Please refer to following
combination and consult with your qualification body and BQC.
27-Feb.2019 Ver.1.3
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EYSHCNZWZ
Control No.
HD-AM-A160260 (1/1)
Control name
Absolute maximum ratings
Absolute maximum ratings
Symbol
Parameter
Max.
Units
VCC_NRF
+3.9
V
GND
0
V
VIO, VCC_NRF≤3.6V
VCC_NRF+ 0.3
V
VIO, VCC_NRF>3.6V
+3.9
V
Storage temperature
+85
Deg-C
MSL
Moisture Sensitivity Level
3
ESD HBM
Human Body Model
1
kV
ESD MM
Machine Model
100
V
Endurance
Flash Memory Endurance
write/erase
cycles
Retention
Flash Memory Retention
At 40 deg-C
Number of times a 512
byte block can be written
between erase cycles
32bit writes
181
times
27-Feb.2019 Ver.1.3
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TAIYO YUDEN CO., LTD. 9/28
EYSHCNZWZ
Control No.
HD-AE-A160260 (1/3)
Control name
Electrical characteristics
Electrical characteristics
Recommendation operating range
Symbol
Parameter
Min.
Typ.
Max.
Units
VCC_NRF
Supply voltage, normal mode
1.7
3.0
3.6
V
tR_VCC_NRF
Supply rise time (0V to 1.7V)*1
60
ms
TA
Operation temperature*2
-40
25
85
Deg-C
*1 The on-chip power-on reset circuitry may not function properly for rise times outside the specified
interval. Also after power off, it must start up from below 0.3V. The on-chip power-on reset
circuitry may not function properly.
*2 ANT specification requires +/-50ppm accuracy for 32.768kHz clock. The internal 32.768kHz
crystal does not meet to +/-50ppm over the whole recommended operation temperature range.
DC Specifications
The Specification applies for Topr.= 25 degrees C, VCC_NRF = 3.0V
Symbol
Parameter (condition)
Min.
Typ.
Max.
Units
VIH
Input high voltage
0.7 VCC_NRF
VCC_NRF
V
VIL
Input low voltage
GND
0.3 VCC_NRF
V
VOH
Output high voltage (high drive 5 mA)
VCC_NRF-0.4
VCC_NRF
V
VOL
Output low voltage (high drive 5 mA)
GND
GND+0.4
V
RPU
Pull-up resistance
11
13
16
Kohm
RPD
Pull-down resistance
11
13
16
Kohm
ITX,+4dBm
,DCDC
TX only run current (DCDC, 3V)
PRF=+4 dBm
7.5
mA
ITX,+4dBm
TX only run current PRF=+4 dBm
16.6
mA
IRX,1M,
DCDC
RX only run current (DCDC, 3V)
1Msps BLE
5.4
mA
IRX,1M
RX only run current 1Msps BLE
11.7
mA
IRX,2M,
DCDC
RX only run current (DCDC, 3V)
2Msps BLE
5.8
mA
IRX,2M
RX only run current 2Msps BLE
12.9
mA
IOFF
Current in SYSTEM-OFF, no RAM
retention
0.3
uA
ION
SYSTEM-ON base current
1.2
uA
IRAM
Additional RAM retention current per
4KB RAM block
20
nA
27-Feb.2019 Ver.1.3
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EYSHCNZWZ
Control No.
HD-AE-A160260 (2/3)
Control name
Electrical characteristics
RF Specifications
Symbol
Description
Min.
Typ.
Max.
Units
Fop
Operating frequencies
2402
2480
MHz
PLLchsp
PLL channel spacing
1
MHz
DfBLE1M
Frequency deviation @ BLE 1Msps
+/-250
kHz
DfBLE2M
Frequency deviation @ BLE 2Msps
+/-500
kHz
PRF
Maximum output power
4
6
dBm
PRFC
RF power control range
24
dB
PRFCR
RF power accuracy
+/-4
dB
PRF1
1st Adjacent Channel Transmit Power 1 MHz
-25
dBc
PRF2
2nd Adjacent Channel Transmit Power 2 MHz
-50
dBc
PRXMAX
Maximum received signal strength at < 0.1% PER
0
dBm
PSENS,IT,1M,BLE
Receiver sensitivity 1Msps BLE Ideal transmitter
<=37bytes (0.1% BER)
-96
dBm
PSENS,IT,2M,BLE
Receiver sensitivity 2Msps BLE Ideal transmitter
Packet length<=37bytes
-93
dBm
Many documents of nRF52832, such as product specification and the errata, can be found at
the link below. Please be sure to check these latest documents when using our module.
nRF52832_Product Specification
https://www.nordicsemi.com/DocLib
nRF52832_Rev_1_Errata
https://www.nordicsemi.com/DocLib/Content/Errata/nRF52832_Rev1/latest/ERR/nRF52832/Rev1/l
atest/err_832
nRF52832_Rev_2_Errata
https://www.nordicsemi.com/DocLib/Content/Errata/nRF52832_Rev2/latest/ERR/nRF52832/Rev2/l
atest/err_832
S132_SoftDevice Specification
https://www.nordicsemi.com/DocLib/Content/SoftDevice_Spec/s132/latest/SDS/s1xx/s130
For more information
https://www.nordicsemi.com/DocLib
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EYSHCNZWZ
Control No.
HD-AE-A160260 (3/3)
Control name
Electrical characteristics
DFU Specifications
27-Feb.2019 Ver.1.3
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EYSHCNZWZ
Control No.
HD-MC-A160260 (1/3)
Control name
Circuit Schematic
Block Diagram
nRF51822
QFN48
X'tal
32MHz
X'tal
32.768KHz
VCC_NRF
SWDCLK
SWDIO
P0.00 to P0.25
P0.28 to P0.30
Filter
OUT_MOD
OUT_ANT
AVDD
DCC
DC/DC LC filter
nRF52832
P0.02 to P0.31
DEC4
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EYSHCNZWZ
Control No.
HD-MC-A160260 (2/3)
Control name
Circuit Schematic
Sample circuits
Internal LDO setup
DC/DC converter setup
27-Feb.2019 Ver.1.3
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EYSHCNZWZ
nRF5 SDK
Control No.
HD-MC-A160260 (3/3)
Control name
Circuit Schematic
Reference Circuits
"P0.02-0.31" are GPIOs. By setting
in the application software, the pin
is configurable such as UART, etc.
Please keep No Connection for
unused pins.
VIO is connected to VCC in the
module. Please use IO voltage
under the following conditions.
Input high (V): 0.7VCC to VCC
Input low (V): GND to 0.3VCC
SWD (Serial Wire Debug) is a high-performance
2-pin debug port low-pin-count alternative to JTAG. It
can write the application software and firmware by
those pins through the J-Link Lite.
When the customers use the cable in Nordic DK to
use J-LINK Lite, it will need to implement the socket
on the customers main board side. The socket will
be "10-pin connector two rows of 1.27mm pitch (Ex:
PSS-720153-05, Hirosugi instrument). The cable in
Nordic DK has a protection to avoid reverse
connection. In order to use this cable, please
remove the pin 7 of the socket on main board.
J-Link Lite is working with 3.3V. It does not work with
1.8V.
VCC: 1.7V to 3.6V
It can operate by a single supply. In
case of the operation with the battery,
we recommend that you add a capacitor
of about 100uF in view of the voltage
drop during TX/RX.
In case of the power supply voltage
fluctuation by the load change is large,
the module may not function properly.
If an external regulator is used, the load
change characteristic should be good in
order to keep stable voltage as possible
when the current is change.
In order to use the
built-in antenna on
the module, please
connect PAD22 and
PAD23.
DC/DC converter setup
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EYSHCNZWZ
Control No.
HD-AD-A160260 (1/3)
Control name
Outline/Appearance
Tolerance: +/- 0.2mm
Unit : (mm)
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EYSHCNZWZ
Control No.
HD-AD-A160260 (2/3)
Control name
Outline/Appearance
Tolerance: +/- 0.2mm
Unit: mm
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EYSHCNZWZ
Control No.
HD-AD-A160260 (3/3)
Control name
Outline/Appearance
LAND PATTERN EXAMPLE
Recommended metal mask for solder printing
Pad size
Mask opening
Signal pad 43 – 0.6 x 1.0 mm
0.5 x 0.9 mm
Corner pad 4 – 1.5 x 1.0 mm
1.0 x 0.7 mm
Center pad 2 – 3.0 x 3.4 mm
2.6 x 3.0 mm
The center of each mask opening is same as the pad center.
The metal mask thickness: t=0.1mm
The solder volume should be same by changing the mask opening if different metal mask thickness
is used.
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EYSHCNZWZ
Control No.
HD-BA-A160260 (1/2)
Control name
Pin Layout
Pin Descriptions
Pin
Pin name
Pin function
Description
1
DCC
Power
DC/DC converter output pin (built-in LC for DC/DC).
2
DEC4
Power
1V3 regulator supply decoupling.
Input from DC/DC converter. Output from 1.3 V LDO.
3
GND
Ground
Ground pin. (0 V)
4
VCC_NRF
Power
Power supply pin.
5
GND
Ground
Ground pin. (0 V)
6
P0.04
AIN2
Digital I/O
Analog input
General purpose I/O pin.
SAADC/COMP/LPCOMP input.
7
P0.05
AIN3
Digital I/O
Analog input
General purpose I/O pin.
SAADC/COMP/LPCOMP input.
8
P0.06
Digital I/O
General purpose I/O pin.
9
P0.07
Digital I/O
General purpose I/O pin.
10
P0.08
Digital I/O
General purpose I/O pin.
11
NFC1
P0.09
NFC input
Digital I/O
NFC antenna connection.
General purpose I/O pin.
12
NFC2
P0.10
NFC input
Digital I/O
NFC antenna connection.
General purpose I/O pin.
13
GND
Ground
Ground pin. (0 V)
14
SWDIO
Digital I/O
Serial Wire Debug I/O for debug and programming
15
SWDCLK
Digital input
Serial Wire Debug clock input for debug and
programming
16
P0.13
Digital I/O
General purpose I/O pin.
17
P0.14
TRACEDATA[3]
Digital I/O
General purpose I/O pin.
Trace port output.
18
P0.17
Digital I/O
General purpose I/O pin
19
P0.18
TRACEDATA[0]
Digital I/O
General purpose I/O pin
Trace port output.
20
P0.21
RESET
Digital I/O
General purpose I/O pin
Configurable as system RESET pin.
(Factory default : RESET)
21
GND
Ground
Ground pin. (0 V)
22
OUT_MOD
RF In/Out
RF I/O pin. It should be connected to Pin 23 OUT_ANT
for normal operation.
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EYSHCNZWZ
Control No.
HD-BA-A160260 (2/2)
Control name
Pin Layout
Pin
Pin name
Pin function
Description
23
OUT_ANT
Antenna In/Out
Internal antenna. It should be connected to Pin 22
OUT_MOD for normal operation.
24
P0.22
Digital I/O
General purpose I/O pin.
25
P0.23
Digital I/O
General purpose I/O pin.
26
P0.24
Digital I/O
General purpose I/O pin.
27
P0.25
Digital I/O
General purpose I/O pin.
28
P0.26
Digital I/O
General purpose I/O pin.
29
P0.27
Digital I/O
General purpose I/O pin.
30
P0.28
AIN4
Digital I/O
Analog input
General purpose I/O pin.
SAADC/COMP/LPCOMP input.
31
P0.29
AIN5
Digital I/O
Analog input
General purpose I/O pin.
SAADC/COMP/LPCOMP input.
32
P0.30
AIN6
Digital I/O
Analog input
General purpose I/O pin.
SAADC/COMP/LPCOMP input.
33
P0.31
AIN7
Digital I/O
Analog input
General purpose I/O pin.
SAADC/COMP/LPCOMP input.
34
P0.02
AIN0
Digital I/O
Analog input
General purpose I/O pin.
SAADC/COMP/LPCOMP input.
35
P0.03
AIN1
Digital I/O
Analog input
General purpose I/O pin.
SAADC/COMP/LPCOMP input.
36
P0.11
Digital I/O
General purpose I/O pin.
37
P0.12
Digital I/O
General purpose I/O pin.
38
P0.15
TRACEDATA[2]
Digital I/O
General purpose I/O pin.
Trace port output.
39
P0.16
TRACEDATA[1]
Digital I/O
General purpose I/O pin.
Trace port output.
40
P0.19
Digital I/O
General purpose I/O pin.
41
P0.20
TRACECLK
Digital I/O
General purpose I/O pin.
Trace port clock output.
42 to 45
GND
Ground
Ground pin. (0 V)
46
NC
Not Connected
Isolated pad on PCB for mechanical stability.
47 to 48
GND
Ground
Ground pin (0 V)
49
NC
Not Connected
Isolated pad on PCB for mechanical stability.
27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 20/28
EYSHCNZWZ
This specification describes desire and conditions especially for mounting.
Desire/Conditions
(1) Environment conditions for use and storage
1. Store the components in an environment of < 40deg-C/90％RH if they are in a moisture
barrier bag packed by TAIYO YUDEN.
2. Keep the factory ambient conditions at < 30deg-C/60％RH .
3. Store the components in an environment of < 25±5deg-C/10%RH after the bag is opened.
(The condition is also applied to a stay in the manufacture process).
(2) Conditions for handling of products
Make sure all of the moisture barrier bags have no holes, cracks or damages at receiving. If
an abnormality is found on the bag, its moisture level must be checked in accordance with 2
in (2).
Refer to the label on the bag.
1. All of the surface mounting process (reflow process) must be completed in 12 months
from the bag sea date.
2. Make sure humidity in the bag is less than 10%RH immediately after open, using a
humidity indicator card sealed with the components.
3. All of the surface mounting process (reflow process including rework process) must be
completed in 168 hours after the bag is opened (inclusive of any other processes).
4. If any conditions in (1) or condition 2 and 3 in (2) are not met, bake the components in
accordance with the conditions at 125deg-C 24hours
5. As a rule, baking the components in accordance with conditions 4 in (2) shall be once.
6. Since semi-conductors are inside of the components, they must be free from static
electricity while handled.(<100V) Use ESD protective floor mats, wrist straps, ESD
protective footwear, air ionizers etc. , if necessary.
7. Please make sure that there are lessen mechanical vibration and shock for this
module, and do not drop it.
8. Please recognize pads of back side at surface mount.
9. Washing the module is not recommended. If washing cannot be avoided, please
test module functionality and performance after thoroughly drying the module. We
cannot be held responsible for any failure due washing the module..
10. Please perform temperature conditions of module at reflow within the limits of the
following.
Please give the number of times of reflow as a maximum of 2 times.
Control No.
HQ-BA-537 (1/2)
Control name
Handling Precaution
27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 21/28
EYSHCNZWZ
Control No.
HQ-BA-537 (2/2)
Control name
Handling Precaution
0
50
100
150
200
250
300
IN OUT
Temp(deg)
130-180deg Pre-heat
: 60~120sec
Peak Temp:250deg Max
230deg up : 40secMax
Recommented Reflow Profile
27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 22/28
EYSHCNZWZ
Packaging Specification
梱包仕様
(1) Packaging Material 梱包材料
Name Outline Materials Note
部材名 概要 材質 備考
Emboss 24mm wide - 12mmPitch Conductive PS
エンボス 24mm幅 - 12mmピッチ
導電性 PS
Cover Tape
カバーテープ
Reel φ330 mm Conductive PS
リール
導電性 PS
Desiccant 30g×1
乾燥剤
Humidity indicator card
湿度インジケータ
Aluminum moisture barrier bag
420×460(mm)
(AS)PET/AL/NY/PE(AS)
アルミ防湿袋
Label
ラベル
Corrugated cardboard box(Inner) 339×351×74(mm)
個装箱
Corrugated cardboard box(Outer) 369×369×277(mm)
外装箱
(2) Packaging Unit
梱包数量
Max pieces/Reel Max pieces/Box(Outer)
(3) Packaging Figure
(4) Label
ラベル
Label-1
・CAMPANY NAME 御社名
・PURCHASE ORDER 注文番号
・DESCRIPITON 品名
・QUANTITY 数量
・ＬｏｔNo.　ロット番号
Label-2
・PURCHASE ORDER 注文番号
・DESCRIPITON 品名
・QUANTITY 数量
・ＬｏｔNo.　ロット番号
Label-3
ＣＡＵＴＩＯＮ　LABEL
注意ラベル
・MSL Level3
1000
3000
Desiccant
乾燥剤
Humidity indicator card
湿度インジケータ
Aluminum moisture
barrier bag
アルミ防湿袋
Corrugated cardboard box(Inner)
個装箱
Label-2
ﾗﾍﾞﾙ-2
Label-3
ﾗﾍﾞﾙ-3
Corrugated cardboard box(Outer)
外装箱
Corrugated cardboard
box(Inner)
個装箱
Label-1
ﾗﾍﾞﾙ-1
Control No.
HD-BB-A160260 (1/3)
Control name
Packaging Specification
27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 23/28
EYSHCNZWZ
Tape specification
テーピング仕様
The direction of a tape drawer
End part Module receipt part Leader part
The direction of a tape drawer
テープ引き出し方向
キャリアエンボス図面
160mm以上
300mm以上
100mm以上
リーダー部
More than300mm
製品部終端部
More than100mmMore than160mm
テープ引出し方向
１ピンマーク
First Pin Mark
Control No.
HD-BB-A160260 (2/3)
Control name
Packaging Specification
27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 24/28
EYSHCNZWZ
Reel specification
リール仕様
(Unit:mm)
Taping performance
テーピング性能
Both of an embossing tape top cover tape bear this, when the power of 10N is applied in the direction of a drawer.
・エンボステープ、トップカバーテープともに、引き出し方向に１０Nの力を加えた場合に、これに耐えうること．
The exfoliation adhesion of a top cover tape is the intensity of 0.1～1.3N.
(The angle to pull is 165～180 degrees. The speed to pull is 300 mm/min.)
・トップカバーテープの剥離強度は、角度165～180度に保ち、300mm/minのスピードでトップカバーテープを引っ張ったとき、
　0.1～1.3Nとする．
Note
備考
Lack of the parts in 1 reel is with two or less pieces.
１リール中の部品の欠落は2個までとします。（ラベル表示数量と梱包数は同じです。欠落とはテープ内でのモジュール抜け
が2個まで許容させていただくという意味になります。）
MSL Level 3　Under control
MSL はレベル３ で管理しています。
Tape wide
W
12ｍｍ
13.4mm
８ｍｍ
9.4mm
32ｍｍ
44ｍｍ
17.4mm
25.4mm
33.4mm
16ｍｍ
45.4mm
φ330±2
24ｍｍ
φ13±0.2
W-1.5/+2
Control No.
HD-BB-A160260 (3/3)
Control name
Packaging Specification
27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 25/28
EYSHCNZWZ
Recommended module mounting example
*1 Please do not place any metal components in blue shaded space,(*1) such as signal line and
metal chassis as possible except for main board while mounting the components in *1 space on
the main board is allowed except for no copper plating area. (*2).
*2 This area is routing prohibited area on the main board. Please do not place copper on any layer.
Please remain use of FR-4 dielectric material. The antenna is tuned with the FR-4.
*3 Characteristics may deteriorate when GND pattern length is less than 30mm. It should be 30 mm
or more as possible.
Even when above mentioned condition is satisfied, communication performance may be
significantly deteriorated depending on the structure of the product.
Control No. (1/3)
Control name
Antenna application note
27-Feb.2019 Ver.1.3
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TAIYO YUDEN CO., LTD. 26/28
EYSHCNZWZ
Other module mounting examples
Placement of resin or plastic parts
Control No. (2/3)
Control name
Antenna application note
27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 27/28
EYSHCNZWZ
Directional characteristics example (when mounted on evaluation board)
About this Application Note
・This Application Note has been prepared as a reference material to help obtaining the antenna
performance mounted on BLE module better while it is not guaranteed or assured to obtain better
communication performance and distance.
・This product “BLE module” has been certified and matching circuit constant for antenna within
module cannot be changed when ambient environment condition changes. The product must be
re-certified when matching circuit constant is changed.
Control No. (3/3)
Control name
Antenna application note
27-Feb.2019 Ver.1.3
TAIYO YUDEN CO., LTD.
TAIYO YUDEN CO., LTD. 28/28
EYSHCNZWZ
1. Power Up Sequence
VCC_NRF power supply rise time (0V to 1.7V) must not exceed 60ms.
2. Recommended Power Circuit
VCC_NRF is the main power supply (1.7 – 3.6V) for this module. The supply voltage range of
VCC_NRF is 1.7V to 3.6V in both of LDO and DCDC mode. In case of the power supply voltage
fluctuation by the load change is large, the module may not function properly. If an external regulator
is used, the load change characteristic should be good in order to keep stable voltage as possible
when the current is change.
3. Battery operation
When using a small battery (e.g. CR2032), a large capacitor (e.g.100uF low leakage capacitor)
should be placed near the battery. This will reduce the voltage drop especially when the module is
operated at low temperatures
4. Pattern Design Guide
4-1. Power Supply System
Power supply bypass capacitors should be placed close to the VCC_NRF pin of the module. The
VCC_NRF trace should be greater than 0.5mm and a bigger a via diameter is recommended.
5.0. Bypass Capacitor Layout
A parallel combination of a small capacitance (about 10pF) and a large capacitance (1uF to 10uF) is
recommended for bypass capacitors. The GND of the bypass capacitor must be placed close to an
adjacent module GND to ensure the shortest closed loop.
4-3. GND Pattern
Power supply bypass capacitor GND should be placed in proximity of module GND. Wide GND
area must be provided to ensure isolation for each layer.
GND pattern of each layer should be connected to GND area with large number of via.
Control No. (1/1)
Control name
Design guide
* If it is difficult to place a bigger via, please increase
the number of vias.
* Bypass capacitors with smaller capacitance must
be placed closer to module.
Line width greater than 0.5mm is recommended.
Via diameter greater than 0.2mm is recommended.
Module
GND area
Surface layer
High frequency line
VCC_NRF
Module