* 10 dB ST Multimode 1300 nm LED Fast Ethernet/FDDI/ATM 155/194 MBd Transceiver V23809-C8-T10 Dimensions in (mm) inches (1) .039 (1.4) A 1 (0.6) .024 (2.8) max. .11 max. bottom view (25.4) max. 1 max. (12.7) .5 (2.54) .1 (20.32) 8 9 (0.3) .012 x.012 x 9 (0.3) M A M (3.8) .15 max. 2x (1.4) .055 (0.1) M A M (9.8) max. .39 max. (5.27) .207 (14.4) .567 (20.32) .8 (18.47) .727 (41.2) 1.622 FEATURES * Fully compliant with all major standards * SONET OC3 * Compact integrated transceiver unit with duplex SC receptacle * Single power supply with 3.0 V to 5.5 V range * Extremely low power consumption < 0.7 W at 3.3 V * PECL differential inputs and outputs * System optimized for 62.5/50 m graded index fiber * Industry standard multisource footprint * Very low profile for high slot density * Testboard available * UL-94 V-0 certified * ESD Class 2 per MIL-STD 883 Method 3015 * Compliant with FCC (Class B) and EN 55022 * For distances of up to 2 km *Available also as 8 dB V23809-C8-T11 on request. Semiconductor Group (30.2) .118.008 APPLICATIONS * ATM switches/bridges/routers * Fast Ethernet, FDDI * High speed computer links * Local area networks * Switching systems Absolute Maximum Ratings Exceeding any one of these values may destroy the device immediately. Supply Voltage (VCC-VEE)................................................... -0.5 V to 7 V Data Input Levels (PECL) (VIN) ................................................ VEE-VCC Differential Data Input Voltage........................................................... 3 V Operating Ambient Temperature (TAMB) ............................. 0 C to 85C Storage Ambient Temperature......................................... -40C to 85C Humidity/Temperature Test Condition (RH).............................85%/85C Soldering Conditions, Temp/Time (TSOLD/tSOLD) (MIL-STD 883C, Method 2003) .......................................... 270C/10s ESD Resistance (all pins to VEE, human body) ..............................1.5 kV Output Current (IO) ......................................................................50 mA FEBRUARY 1998 DESCRIPTION TECHNICAL DATA The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions. This data sheet describes the Siemens Fast Ethernet/FDDI/ATM transceiver--part of Siemens Multistandard Transceiver Family. It is fully compliant with the Asynchronous Transfer Mode (ATM) OC-3 standard, the Fiber Distributed Data Interface (FDDI) Low Cost Fiber Physical Layer Medium Dependent (LCF-PMD) draft standard(1), and the FDDI PMD standard(2). Recommended Operating Conditions ATM was developed because of the need for multimedia applications, including real time transmission. The data rate is scalable and the ATM protocol is the basis of the broadband public networks being standardized in the International Telegraph and Telephone Consultative Committee (CCITT). ATM can also be used in local private applications. Parameter Symbol Min. Ambient Temperature TAMB 0 Power Supply Voltage VCC-VEE 3 Supply Current 3.3 V ICC Typ. Max. 70 Supply Current 5 V(1) Units C 5.5 V 230 mA 260 Transmitter Data Input High Voltage VIH-VCC -1165 -880 Data Input Low Voltage VIL-VCC -1810 -1475 Threshold Voltage VBB-VCC -1380 -1260 Input Data Rise/Fall, 20%-80% tR, tF 1.3 Fast Ethernet was developed because of the higher bandwidth requirement in local area networking. It is based on the proven effectiveness of millions of installed Ethernet systems. Data High Time(2) ton 1000 Output Current lO 25 mA The Siemens multimode transceiver is a single unit comprised of a transmitter, a receiver, and an ST receptacle. This design frees the customer from many alignment and PC board layout concerns. The modules are designed for low cost applications. Input Duty Cycle Distortion tDCD 1.0 ns Input Data Dependent Jitter tDDj FDDI is a Dual Token Ring standard developed in the U.S. by the Accredited National Standards Committee (ANSC) X3T9, within the Technical Committee X3T9.5. It is applied to the local area networks of stations, transferring data at 100 Mbits/s with a 125 MBaud transmission rate. LCF FDDI is specially developed for short distance applications of up to 500 m (fiber-to-the-desk) as compared to 2 km for backbone applications. Regulatory Compliance Standard Comments Electromagnetic Interference (EMI) FCC Class B EN 55022 Class B CISPR 22 Noise frequency range:30 MHz to 1 GHz Immunity: Electrostatic Discharge EN 61000-4-2 IEC 1000-4-2 Discharges of 15kV with an air discharge probe on the receptacle cause no damage. Immunity: Radio Frequency Electromagnetic Field EN 61000-4-3 IEC 1000-4-3 With a field strength of 10 V/m rms, noise frequency ranges from 10 MHz to 1 GHz Eye Safety IEC 825-1 Class 1 ns Receiver The inputs/outputs are PECL compatible and the unit operates from a 3.0 V to 5.5 V power supply. As an option, the data output stages can be switched to static levels during absence of light, as indicated by the Signal Detect function. It can be directly interfaced with available chipsets. Feature 0.4 mV Input Random Jitter tRJ Input Center Wavelength lC Electrical Output Load(3) RL 0.76 1260 1380 50 nm Notes 1. For VCC-VEE (min., max.). 50% duty cycle. The supply current (ICC2+ICC3) does not include the load drive current (Icc1). Add max. 45 mA for the three outputs. Load is 50 into VCC -2V. 2. To maintain good LED reliability, the device should not be held in the ON state for more than the specified time. Normal operation should be done with 50% duty cycle. 3. To achieve proper PECL output levels the 50 termination should be done to VCC -2 V. For correct termination see the application notes. Notes 1. FDDI Token Ring, Low Cost Fiber Physical Layer Medium Dependent (LCF-PMD) ANSI X3T9.5 / 92 LCF-PMD / Proposed Rev. 1.3, September 1, 1992. American National Standard. 2. FDDI Token Ring, Physical Layer Medium Dependent (PMD) ANSI X3.166-1990 American National Standard. ISO/IEC 9314-3: 1990. Semiconductor Group V23809-C8-T10, 1300 nm LED Fast Ethernet/FDDI/ATM Transceiver 2 Transmitter Electro-Optical Characteristics Transmitter Symbol Min. Data Rate DR Launched Power (Average) into 62.5 m Fiber for -C8-C10(1, 2) PO Typ. -20 -16 Launched Power (Average) into 62.5 m Fiber for -C8-C11(1, 2) -22 -17 Center Wavelength(2, 3) C 1270 Spectral Width (FWHM)(2, 4) Output Rise/Fall Time, 10%-90%(2, 5) tR, tF Temperature Coefficient of Optical Output Power Receiver Electro-Optical Characteristics Max. Units Receiver Symbol Min. 170 MBaud Data Rate DR 5 -14 dBm Sensitivity Average Power)(1) PIN nm 170 Max. Units 170 MBaud -31 dBm ns -35.5 Saturation (Average PSAT Power)(2) 0.6 -33 Sensitivity (Average Power) Center(2) 1360 Typ. -14 -11 Duty Cycle Distortion(3, 4) tDCD 1 Deterministic Jitter(4, 5) tDJ 1 Random Jitter(4, 6) tRJ Signal Detect Assert Level(7) PSDA -42.5 -30 -31.5 2.5 ns TCp 0.03 dB/C Extinction Ratio (Dynamic)(2, 6) ER 10 % Signal Detect Deassert Level(8) PSDD -45 Optical Power Low(7) PTD -45 dBm Signal Detect Hysteresis 1.5 Overshoot OS 10 % PSDA- PSDD tDCD 0.6 ns Output Low Voltage(9) VOL-VCC -1810 -1620 Duty Cycle Distortion(8, 9) tDDJ 0.3 Output High Voltage(9) VOH-VCC -1025 -880 Data Dependent Jitter(8, 10) tRJ 0.6 Output Data Rise/Fall Time, 20%-80% tR, tF 1.3 Random Jitter(8, 11) Notes 1. Measured at the end of 5 meters of 62.5/125/0.275 graded index fiber using calibrated power meter and a precision test ferrule. Cladding modes are removed. Values valid for EOL and worst-case temperature. 2. The input data pattern is a 12.5 MHz square wave pattern. 3. Center wavelength is defined as the midpoint between the two 50% levels of the optical spectrum of the LED. 4. Spectral width (full width, half max) is defined as the difference between 50% levels of the optical spectrum of the LED. 5. 10% to 90% levels. Measured using the 12.5 MHz square wave pattern with an optoelectronic measurement system (detector and oscilloscope) having 3 dB bandwidth ranging from less than 0.1 MHz to more than 750 MHz. 6. Extinction Ratio is defined as PL/PH x 100%. Measurement system as in Note 5. 7. Optical Power Low is the output power level when a steady state low data pattern (FDDI Quiet Line state) is used to drive the transmitter. Value valid <1 ms after input low. 8. Test method as for FDDI-PMD. Jitter values are peak-to-peak. 9. Duty Cycle Distortion is defined as 0.5 [(width of wider state) minus (width of narrower state)]. It is measured with stream of Idle Symbols (62.5 MHz square wave). 10.Measured with the same pattern as for FDDI-PMD. 11. Measured with the Halt Line state (12.5 MHz square wave). Output SD Rise/Fall Time, 20%-80% dBm dB mV ns 40 Notes 1. For a bit error rate (BER) of less than 1x10E-12 over a receiver eye opening of least 1.5 ns. Measured with a 223-1 PRBS at 155 MBd. 2. For a BER of less than 1x10E-12. Measured in the center of the eye opening with a 223-1 PRBS at 155 MBd. 3. Measured at an average optical power level of -20 dBm with a 62.5 MHz square wave. 4. All jitter values are peak-to-peak. RX output jitter requirements are not considered in the ATM standard draft. In general the same requirements as for FDDI are met. 5. Measured at an average optical power level of -20 dBm. 6. Measured at -33 dBm average power. 7. An increase in optical power through the specified level will cause the SIGNAL detect output to switch from a Low state to a High state. 8. A decrease in optical power through the specified level will cause the SIGNAL detect output to switch from a High state to a Low state. 9. PECL compatible. Load is 50 into VCC -2 V. Measured under DC conditions. For dynamic measurements a tolerance of 50 mV should be added for VCC=5 V. Semiconductor Group V23809-C8-T10, 1300 nm LED Fast Ethernet/FDDI/ATM Transceiver 3 Pin Description Pin Name Level/Logic Pin# Description RxVEE Rx Ground Power Supply 1 Negative power supply, normally ground RD Rx Output Data PECL Output 2 Receiver output data 3 Inverted receiver output data RDn RxSD RX Signal Detect PECL Output active high 4 High level on this output shows there is an optical signal. RxVCC Rx +3.3 V...5 V Power Supply 5 Positive power supply, +3.3 V...5 V 7 Inverted transmitter input data TxVCC Tx +3.3 V...5 V TxDn Tx Input Data PECL Input 6 8 Transmitter input data TxVEE Tx Ground Power Supply 9 Negative power supply, normally ground Case Support Not Connected S1/S2 Support stud, not connected TxD APPLICATION NOTE FOR 1X9 PIN ROW TRANSCEIVER VCC-RX VCC-TX VCC-RX GND R5 82R GND R3 82R 82R R1 VCC L1 1 9 82R C1/3=4700 nF (optional) C2/4=4700 nF L1/2=15000 nH (L2 is optional) VCC R7 RD RDN SD TXD TXDN R1/3 82 100 127 R2/4 130 100 83 R5/7 82 100 127 R6/8 130 100 83 GNDGND 130R R9 VCC-RX 130R R4 200R 3.3 V 130R 4V 130R 5V C2 GND GND VCC-TX L2 VCC-TX R2 R in Ohm C1 R8 C3 C4 GND GND R6 Transceiver GND GNDGND DC coupling between ECL gates. R9=200 Ohm The power supply filtering is required for good EMI performance. Use short tracks from the inductor L1/L2 to the module VCC-RX/VCC-TX. A GND plane under the module is recommended for good EMI and sensitivity performance. Semiconductor Group V23809-C8-T10, 1300 nm LED Fast Ethernet/FDDI/ATM Transceiver 4 APPLICATION NOTE FOR MULTIMODE 1300 NM LED TRANSCEIVER Solutions for connecting a Siemens 3.3 V Fiber Optic Transceiver to a 5.0 V Framer-/Phy-Device. Figure 1. Common GND Figure 1a. Circuitry for SD (Differential) and Common GND VCC 5.0 V VCC 3.3 V VCC 3.3 V VCC Rx Out Tx In 83 500 100 nF SD In 127 39K Siemens Fiber Optic Transceiver Framer/Phy SD Clock Recovery 5V SD SD Siemens Fiber Optic 3.3 V Transceiver 26K Framer/Phy Clock Data Recovery Out VCC VCC 500 127 Data In 83 100 nF 180 VCC 68 VCC 5.0 V SD Out Figure 1b. Circuitry for SD (Single Ended) and Common GND Inputs and outputs are differential and should be doubled. Signal Detect (SD) is single ended (if used). VCC 5.0 V VCC 3.3 V VCC 18K VCC SD In 1 510 1.8 V Framer/Phy Clock Recovery 5V 1 Zener-Diode 1.8 V Figure 2. Common VCC Framer/Phy Clock Data Recovery Out 83 Siemens Fiber Optic Transceiver GND 3.3 V Tx In 130 Inputs and outputs are differential and should be doubled. Signal Detect (SD) is single ended. VCC Rx Out Data In 82 VCC 127 VCC SD GND 5.0 V In 200 SD Out GND 5.0 V GND 3.3 V GND 3.3 V Siemens Microelectronics, Inc. * Optoelectronics Division * 19000 Homestead Road * Cupertino, CA 95014 USA Siemens Semiconductor Group * Fiber Optics * Wernerwerkdamm 16 * Berlin D-13623, Germany www.smi.siemens.com/opto.html (USA) * www.siemens.de/Semiconductor/products/37/376.htm (Germany) SD Siemens Out Fiber Optic 3.3 V Transceiver