Low Cost, 2.7 V to 5.5 V, Micropower
Temperature Switches in SOT-23
Data Sheet
ADT6501/ADT6502/ADT6503/ADT6504
Rev. B Document Feedback
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FEATURES
±0.5°C (typical) threshold accuracy
Factory-set trip points from
−45°C to +15°C in 10°C increments
+35°C to +115°C in 10°C increments
No external components required
Maximum temperature of 125°C
Open-drain output (ADT6501/ADT6503)
Push-pull output (ADT6502/ADT6504)
Pin-selectable hysteresis of 2°C and 10°C
Supply current of 30 µA (typical)
Space-saving, 5-lead SOT-23 package
APPLICATIONS
Medical equipment
Automotive
Cell phones
Hard disk drives
Personal computers
Electronic test equipment
Domestic appliances
Process control
FUNCTIONAL BLOCK DIAGRAM
Figure 1.
GENERAL DESCRIPTION
The ADT6501/ADT6502/ADT6503/ADT6504 are trip point
temperature switches available in a 5-lead SOT-23 package.
Each part contains an internal band gap temperature sensor for
local temperature sensing. When the temperature crosses the
trip point setting, the logic output is activated. The ADT6501/
ADT6503 logic output is active low and open-drain. The
ADT6502/ADT6504 logic output is active high and push-pull.
The temperature is digitized to a resolution of 0.125°C (11-bit).
The factory trip point settings are 10°C apart starting from
−45°C to +15°C for the cold threshold models and from +35°C
to +115°C for the hot threshold models.
These devices require no external components and typically
consume 30 μA supply current. Hysteresis is pin-selectable at
2°C and 10°C. The temperature switch is specified to operate
over the supply range of 2.7 V to 5.5 V.
The ADT6501 and ADT6502 are used for monitoring
temperatures from +35°C to +115°C only. Therefore, the logic
output pin becomes active when the temperature goes higher
than the selected trip point temperature.
The ADT6503 and ADT6504 are used for monitoring tempera-
tures from −45°C to +15°C only. Therefore, the logic output
pin becomes active when the temperature goes lower than the
selected trip point temperature.
PRODUCT HIGHLIGHTS
1. Σ-Δ based temperature measurement gives high accuracy
and noise immunity.
2. Wide operating temperature range from −55°C to +125°C.
3. ±0.5°C typical accuracy from −45°C to +115°C.
4. Factory threshold settings from −45°C to +115°C in
10°C increments.
5. Supply voltage is 2.7 V to 5.5 V.
6. Supply current of 30 μA.
7. Space-saving, 5-lead SOT-23 package.
8. Pin-selectable temperature hysteresis of 2°C or 10°C.
9. Temperature resolution of 0.125°C.
06096-001
2ºC/10ºC
V
CC
4
GND
1
GND
2
HYST
3
TOVER
5
FACTORY PRESET
TRIP POINT
REGISTER
ADT6501
COMPARATOR
Σ-Δ
TEMPERATURE-TO-
DIGITAL CONVERTER
ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet
Rev. B | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
ESD Caution .................................................................................. 4
Pin Configurations and Function Descriptions ........................... 5
Typical Performance Characteristics ............................................. 6
Theory of Operation ........................................................................ 8
Circuit Information ...................................................................... 8
Converter Details ..........................................................................8
Factory-Programmed Threshold Range ....................................8
Hysteresis Input .............................................................................8
Temperature Conversion ..............................................................8
Application Information ................................................................ 10
Thermal Response Time ........................................................... 10
Self-Heating Effects .................................................................... 10
Supply Decoupling ..................................................................... 10
Temperature Monitoring ........................................................... 10
Typical Application Circuits ......................................................... 11
Outline Dimensions ....................................................................... 13
Ordering Guide .......................................................................... 13
REVISION HISTORY
9/12—Rev. A to Rev. B
Change to Supply Current Parameter, Table 1 .............................. 3
Updated Outline Dimensions ....................................................... 13
1/08—Rev. 0 to Rev. A
Added ADT6503 and ADT6504 ....................................... Universal
Changes to Features .......................................................................... 1
Changes to Product Highlights ....................................................... 1
Changes to Table 1 ............................................................................. 3
Changes to Typical Performance Characteristics ......................... 6
Changes to Ordering Guide .......................................................... 13
9/07—Revision 0: Initial Version
Data Sheet ADT6501/ADT6502/ADT6503/ADT6504
Rev. B | Page 3 of 16
SPECIFICATIONS
TA = −55°C to +125°C, VCC = 2.7 V to 5.5 V, open-drain RPULL-UP = 10 kΩ, unless otherwise noted.
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
TEMPERATURE SENSOR AND ADC
Threshold Accuracy ±0.5 ±6 °C T
A
= −45°C to −25°C
±0.5 ±4 °C T
A
= −15°C to +15°C
±0.5 ±4 °C T
A
= 35°C to 65°C
±0.5 ±6 °C T
A
= 75°C to 115°C
ADC Resolution 11 Bits
Temperature Conversion Time 30 ms Time necessary to complete a conversion
Update Rate 600 ms Conversion started every 600 ms
Temperature Threshold Hysteresis 2 °C HYST pin = 0 V
10 °C HYST pin = V
CC
DIGITAL INPUT (HYST)
Input Low Voltage, V
IL
0.2 × V
V
Input High Voltage, V
IH
0.8 × V
CC
V
DIGITAL OUTPUT (OPEN-DRAIN)
Output High Current, I
OH
10 nA Leakage current, V
CC
= 2.7 V and V
OH
= 5.5 V
Output Low Voltage, V
OL
0.3 V I
OL
= 1.2 mA, V
CC
= 2.7 V
V
IOL = 3.2 mA, VCC = 4.5 V
Output Capacitance, C
OUT
1 10 pF R
PULL-UP
= 10 kΩ
DIGITAL OUTPUT (PUSH-PULL)
Output Low Voltage, VOL
V
IOL = 1.2 mA, VCC = 2.7 V
0.4 V I
OL
= 3.2 mA, V
CC
= 4.5 V
Output High Voltage, V
OH
0.8 × V
CC
V I
SOURCE
= 500 µA, V
CC
= 2.7 V
V
CC
− 1.5 V I
SOURCE
= 800 µA, V
CC
= 4.5 V
Output Capacitance, C
OUT
1 10 pF
POWER REQUIREMENTS
Supply Voltage 2.7 5.5 V
Supply Current 30 55 µA
1 Guaranteed by design and characterization.
ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet
Rev. B | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
V
CC
to GND −0.3 V to +7 V
HYST Input Voltage to GND
−0.3 V to VCC + 0.3 V
Open-Drain Output Voltage to GND −0.3 V to +7 V
Push-Pull Output Voltage to GND −0.3 V to V
CC
+ 0.3 V
Input Current on All Pins 20 mA
Output Current on All Pins 20 mA
Operating Temperature Range
−55°C to +125°C
Storage Temperature Range −65°C to +160°C
Maximum Junction Temperature, T
JMAX
150.7°C
5-Lead SOT-23 (RJ-5)
Power Dissipation1 W
MAX
= (T
JMAX
− T
A
2)/θ
JA
Thermal Impedance
3
θJA, Junction-to-Ambient (Still Air)
240°C/W
IR Reflow Soldering
(RoHS Compliant Package)
Peak Temperature 260°C (+0°C)
Time at Peak Temperature 20 sec to 40 sec
Ramp-Up Rate 3°C/sec maximum
Ramp-Down Rate
−6°C/sec maximum
Time 25°C to Peak Temperature 8 minute maximum
1 Values relate to package being used on a standard 2-layer PCB. This gives a
worst case θJA. Refer to Figure 2 for a plot of maximum power dissipation vs.
ambient temperature (TA).
2 TA = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a
heat sink. Junction-to-ambient resistance is more useful for air-cooled,
PCB-mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature
ESD CAUTION
0.9
0
125
TEMPERATURE (°C)
MAXIMUM POWER DISSIPATIO N (W)
06096-002
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
–55–50–40–30–20–10010 20 30 40 50 60 70 80 90100110120
SOT-23 PD @ 125°C = 0.107W
Data Sheet ADT6501/ADT6502/ADT6503/ADT6504
Rev. B | Page 5 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. ADT6501/ADT6502 Pin Configuration
Figure 4. ADT6503/ADT6504 Pin Configuration
Table 3. Pin Function Descriptions
Pin Number
ADT6501 ADT6502 ADT6503 ADT6504 Mnemonic Description
1, 2 1, 2 1, 2 1, 2 GND Ground.
3 3 3 3 HYST Hysteresis Input. Connects HYST to GND for 2°C hysteresis or connects to
V
CC
for 10°C hysteresis.
4 4 4 4 V
CC
Supply Input (2.7 V to 5.5 V).
5 — — — TOVER
Open-Drain, Active Low Output. TOVER goes low when the temperature of
the part exceeds the factory-programmed threshold; must use a pull-up
resistor.
— 5 — — TOVER Push-Pull, Active High Output. TOVER goes high when the temperature of
the part exceeds the factory-programmed threshold.
— — 5 — TUNDER Open-Drain, Active Low Output. TUNDER goes low when the temperature
of the part exceeds the factory-programmed threshold; must use a pull-up
resistor.
— — — 5 TUNDER Push-Pull, Active High Output. TUNDER goes high when the temperature
of the part exceeds the factory-programmed threshold.
GND
1
GND
2
HYST
3
TOVER/
TOVER
5
V
CC
4
ADT6501/
ADT6502
TOP VIEW
(Not to Scal e)
06096-003
GND 1
GND 2
HYST 3
TUNDER/
TUNDER
5
VCC
4
ADT6503/
ADT6504
TOP VIEW
(Not to Scal e)
06096-004
ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet
Rev. B | Page 6 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 5. Trip Threshold Accuracy
Figure 6. Operating Supply Current vs. Temperature
Figure 7. ADT6502/ADT6504 Output Source Resistance vs. Temperature
Figure 8. Output Sink Resistance vs. Temperature
Figure 9. Thermal Step Response in Perfluorinated Fluid
Figure 10. Thermal Step Response in Still Air
35
0–0.5
06096-015
TE M P E RATURE ACCURACY ( °C)
PERCENTAGE OF PARTS SAMPLED (%)
30
25
20
15
10
5
–0.4 –0.3 –0.2 –0.1 0.1 0.2 0.3 0.4 0.5
SAMPLE SIZE = 300
45
0
06096-016
TEMPERATURE (°C)
I
CC
(µA)
40
35
30
25
20
15
10
5
–40 –10 25 75 120
3.3V
5V
180
0–55
06096-017
TEMPERATURE (°C)
OUTPUT SOURCE RESISTANCE (Ω)
160
140
120
100
80
60
40
20
–10 25 70 100 125
5.5V
3.3V
2.7V
80
0–55
06096-018
TEMPERATURE (°C)
OUTPUT SINK RESISTANCE (Ω)
–10 25 70 100 125
5.5V
3.3V
2.7V
70
60
50
40
30
20
10
06096-019
120
0
TIME (s)
TEMPERATURE (°C)
012.8
100
80
60
40
20
0.8 1.6 2.4 3.2 4.0 4.8 5.6 6.4 7.2 8.0 8.8 9.6 10.411.212.0
06096-020
140
0
TIME (s)
TEMPERATURE (°C)
0
120
100
80
60
40
20
3.6 7.210.8
14.4
18.0
21.6
25.2
28.8
32.4
36.0
39.6
43.2
46.8
50.4
54.0
57.6
61.2
Data Sheet ADT6501/ADT6502/ADT6503/ADT6504
Rev. B | Page 7 of 16
Figure 11. Hysteresis vs. Trip Temperature
Figure 12. ADT6501 Start-Up and Power-Down
Figure 13. ADT6501 Start-Up Delay
Figure 14. Operating Supply Current vs. Voltage Over Temperature
12
0–45
06096-021
TEMPERATURE (°C)
HYSTERESIS (°C)
10
8
6
4
2
–25 –15 15 25 35 65 75 115
V
CC
= 3.3V
10°C
2°C
06096-022
CH1 2.0V CH2 2.0V M 10. 0µ s 50.0MS /s 20. 0ns/pt
A CH1 1.68V
2
1
TOVER
V
CC
06096-023
CH1 2.0V CH2 2.0V M 10.0ms 50.0kS/s 20. 0µ s/p t
A CH1 1.68V
2
1
TOVER
V
CC
45
0
2.4 5.6
06096-024
V
CC
(V)
I
CC
(µA)
40
35
30
25
20
15
10
5
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4
–40ºC
–10ºC
+25ºC
+75ºC
+120ºC
ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet
Rev. B | Page 8 of 16
THEORY OF OPERATION
CIRCUIT INFORMATION
The ADT6501/ADT6502/ADT6503/ADT6504 are 11-bit digital
temperature sensors with a 12th bit acting as the sign bit. An
on-board temperature sensor generates a voltage precisely
proportional to absolute temperature, which is compared to
an internal voltage reference and input to a precision digital
modulator. The 12-bit output from the modulator is input into a
digital comparator where it is compared with a factory-set trip
level. The output trip pin is activated if the temperature measured
is greater than, in the case of the ADT6501/ADT6502, or less
than, in the case of the ADT6503/ADT6504, the factory-set trip
level. Overall accuracy for the ADT650x family is ±6°C
(maximum) from −45°C to +115°C.
The on-board temperature sensor has excellent accuracy and
linearity over the entire rated temperature range without needing
correction or calibration by the user. The ADT6501/ADT6503
have active low, open-drain output structures that can sink
current. The ADT6502/ADT6504 have active high, push-pull
output structures that can sink and source current. On power-
up, the output becomes active when the first conversion is
completed, which typically takes 30 ms.
The sensor output is digitized by a first-order, ∑-∆ modulator,
also known as the charge balance type analog-to-digital
converter (ADC). This type of converter utilizes time domain
oversampling and a high accuracy comparator to deliver 11 bits
of effective accuracy in an extremely compact circuit.
CONVERTER DETAILS
The Σ-Δ modulator consists of an input sampler, a summing
network, an integrator, a comparator, and a 1-bit digital-to-
analog converter (DAC). Similar to the voltage-to-frequency
converter, this architecture creates a negative feedback loop and
minimizes the integrator output by changing the duty cycle of
the comparator output in response to input voltage changes.
The comparator samples the output of the integrator at a much
higher rate than the input sampling frequency; this is called
oversampling. Oversampling spreads the quantization noise
over a much wider band than that of the input signal,
improving overall noise performance and increasing accuracy.
FACTORY-PROGRAMMED THRESHOLD RANGE
The ADT6501/ADT6502/ADT6503/ADT6504 are available
with factory-set threshold levels ranging from −45°C to +115°C
in 10°C temperature steps. The ADT6501/ADT6503 outputs are
intended to interface to reset inputs of microprocessors. The
ADT6502/ADT6504 are intended for driving circuits of
applications such as fan control circuits. Table 4 lists the
available temperature threshold ranges.
Table 4. Factory-Set Temperature Threshold Ranges
Device Threshold (T
TH
) Range
ADT6501 +35°C < T
TH
< +115°C
ADT6502 +35°C < T
TH
< +115°C
ADT6503 −45°C < T
TH
< +15°C
ADT6504
−45°C < TTH < +15°C
HYSTERESIS INPUT
The HYST pin is used to select a temperature hysteresis of 2°C or
10°C. The digital comparator ensures excellent accuracy for the
hysteresis value. If the HYST pin is connected to VCC, a hysteresis
of 10°C is selected. If the HYST pin is connected to GND, a
hysteresis of 2°C is selected. The HYST pin should not be left
floating. Hysteresis prevents oscillation on the output pin when
the temperature is approaching the trip point and after the
output pin is activated. For example, if the temperature trip is
45°C and the hysteresis selected is 10°C, the temperature would
have to go as low as 35°C before the output deactivates.
TEMPERATURE CONVERSION
The conversion clock for the part is generated internally. No
external clock is required. The internal clock oscillator runs an
automatic conversion sequence. During this automatic conversion
sequence, a conversion is initiated every 600 ms. At this time, the
part powers up its analog circuitry and performs a temperature
conversion.
This temperature conversion typically takes 30 ms, after which
the analog circuitry of the part automatically shuts down. The
analog circuitry powers up again 570 ms later, when the 600 ms
timer times out and the next conversion begins. The result of
the most recent temperature conversion is compared with the
factory-set trip point value. If the temperature measured is
greater than the trip point value, the output is activated. The
output is deactivated once the temperature crosses back over
the trip point threshold plus whatever temperature hysteresis is
selected. Figure 15 to Figure 18 show the transfer function for
the output trip pin of each generic model.
Data Sheet ADT6501/ADT6502/ADT6503/ADT6504
Rev. B | Page 9 of 16
Figure 15. ADT6501 TOVER Transfer Function
Figure 16. ADT6502 TOVER Transfer Function
Figure 17. ADT6503 TUNDER Transfer Function
Figure 18. ADT6504 TUNDER Transfer Function
TTH TEMP
TOVER
V
2°C
HYST
10°C
HYST
COLD HOT
06096-006
TTH TEMP
TOVER
V
2°C
HYST
10°C
HYST
COLD HOT
06096-007
TTH TEMP
TUNDER
V
COLD HOT
10°C
HYST
2°C
HYST
06096-008
TTH TEMP
V
COLD HOT
TUNDER
10°C
HYST
2°C
HYST
06096-009
ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet
Rev. B | Page 10 of 16
APPLICATION INFORMATION
THERMAL RESPONSE TIME
The time required for a temperature sensor to settle to a specified
accuracy is a function of the sensor’s thermal mass and the
thermal conductivity between the sensor and the object being
sensed. Thermal mass is often considered equivalent to
capacitance. Thermal conductivity is commonly specified using
the symbol Q and can be thought of as thermal resistance. It is
commonly specified in units of degrees per watt of power
transferred across the thermal joint. Thus, the time required for
the ADT650x to settle to the desired accuracy is dependent on
the characteristics of the SOT-23 package, the thermal contact
established in that particular application, and the equivalent
power of the heat source. In most applications, the settling time
is best determined empirically.
SELF-HEATING EFFECTS
The temperature measurement accuracy of the ADT6501/
ADT6502/ADT6503/ADT6504 can be degraded in some
applications due to self-heating. Errors can be introduced from
the quiescent dissipation and power dissipated when converting.
The magnitude of these temperature errors depends on the
thermal conductivity of the ADT650x package, the mounting
technique, and the effects of airflow. At 25°C, static dissipation
in the ADT650x is typically 99 µW operating at 3.3 V. In the
5-lead SOT-23 package mounted in free air, this accounts for a
temperature increase due to self-heating of
ΔT = PDISS × θJA = 99 µW × 240°C/W = 0.024°C
It is recommended that current dissipated through the device be
kept to a minimum because it has a proportional effect on the
temperature error.
SUPPLY DECOUPLING
The ADT6501/ADT6502/ADT6503/ADT6504 should be
decoupled with a 0.1 µF ceramic capacitor between VCC and
GND. This is particularly important when the ADT650x are
mounted remotely from the power supply. Precision analog
products such as the ADT650x require well filtered power
sources. Because the ADT650x operate from a single supply, it
may seem convenient to tap into the digital logic power supply.
Unfortunately, the logic supply is often a switch-mode design,
which generates noise in the 20 kHz to 1 MHz range. In addition,
fast logic gates can generate glitches that are hundreds of mV in
amplitude due to wiring resistance and inductance.
If possible, the ADT650x should be powered directly from the
system power supply. This arrangement, shown in Figure 19,
isolates the analog section from the logic switching transients.
Even if a separate power supply trace is not available, generous
supply bypassing reduces supply line induced errors. Local
supply bypassing consisting of a 0.1 µF ceramic capacitor is
advisable to achieve the temperature accuracy specifications.
This decoupling capacitor must be placed as close as possible to
the ADT650x VCC pin.
Figure 19. Separate Traces Used to Reduce Power Supply Noise
TEMPERATURE MONITORING
The ADT6501/ADT6502/ADT6503/ADT6504 are ideal for
monitoring the thermal environment within electronic equipment.
For example, the surface-mount package accurately reflects the
exact thermal conditions that affect nearby integrated circuits.
The ADT650x measure and convert the temperature at the
surface of its own semiconductor chip. When the ADT650x are
used to measure the temperature of a nearby heat source, the
thermal impedance between the heat source and the ADT650x
must be as low as possible.
As much as 60% of the heat transferred from the heat source to
the thermal sensor on the ADT650x die is discharged via the
copper tracks, package pins, and bond pads. Of the pins on the
ADT650x, the GND pins transfer most of the heat. Therefore,
to monitor the temperature of a heat source, it is recommended
that the thermal resistance between the ADT650x GND pins
and the GND of the heat source be reduced as much as possible.
For example, the unique properties of the ADT650x can be used
to monitor a high power dissipation microprocessor. The
ADT650x device in its SOT-23 package is mounted directly
beneath the microprocessor’s pin grid array (PGA) package.
The ADT650x requires no external characterization.
0.1
µ
F
ADT650x
TTL/CMOS
LOGIC
CIRCUITS
POWER
SUPPLY
06096-010
Data Sheet ADT6501/ADT6502/ADT6503/ADT6504
Rev. B | Page 11 of 16
TYPICAL APPLICATION CIRCUITS
Figure 20. Microprocessor Alarm
Figure 21. Overtemperature Fan Control
Figure 22. Temperature Window Alarms
06096-011
VCC
GND GNDHYST
INTTOVER
ADT6501
VCC
MICROPROCESSOR
GND
0.1µF
100kΩ
3.3V
06096-012
VCC
GND GND
HYST
TOVER
ADT6502
0.1µF
3.3V 12V
06096-013
VCC
GND GNDHYST
TUNDER
ADT6504
... N015
0.1µF
VCC
GND GNDHYST
TOVER
ADT6502
... P075
0.1µF
3.3V
OVER TEMPERATURE
UNDER T E M P E RATURE
OUT OF RANGE
ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet
Rev. B | Page 12 of 16
Figure 23. Fail-Safe Temperature Monitor
06096-014
V
CC
GND GNDHYST
INT
TOVER
ADT6501
... P075
V
CC
MICROPROCESSOR
GND
0.1µF
0.1µF
100kΩ
3.3V
12V
V
CC
GND GNDHYST
TOVER
ADT6502
... P045
Data Sheet ADT6501/ADT6502/ADT6503/ADT6504
Rev. B | Page 13 of 16
OUTLINE DIMENSIONS
Figure 24. 5-Lead Small Outline Transistor Package [SOT-23]
(RJ-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Threshold
Temperature
Accuracy @
Threshold
Temperature
Temperature
Range
Package
Description
Package
Option
Ordering
Quantity Branding
ADT6501SRJZP035RL7 35°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T1U
ADT6501SRJZP045RL7
45°C
±4°C
−55°C to +125°C
5-Lead SOT-23
RJ-5
3,000
T1V
ADT6501SRJZP055RL7 55°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T0B
ADT6501SRJZP065RL7 65°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T1W
ADT6501SRJZP075RL7 75°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T1X
ADT6501SRJZP085RL7 85°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T0W
ADT6501SRJZP085-RL 85°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 10,000 T0W
ADT6501SRJZP095RL7 95°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T1Y
ADT6501SRJZP105RL7 105°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T15
ADT6501SRJZP105-RL 105°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 10,000 T15
ADT6501SRJZP115RL7 115°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T1Z
ADT6502SRJZP035RL7 35°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T25
ADT6502SRJZP045RL7 45°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T26
ADT6502SRJZP055RL7 55°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T27
ADT6502SRJZP065RL7
65°C
±4°C
−55°C to +125°C
5-Lead SOT-23
RJ-5
3,000
T28
ADT6502SRJZP075RL7 75°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T17
ADT6502SRJZP085RL7 85°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T29
ADT6502SRJZP095RL7 95°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2B
ADT6502SRJZP105RL7 105°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2C
ADT6502SRJZP115RL7 115°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2D
ADT6503SRJZN045RL7 −45°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2E
ADT6503SRJZN035RL7 −35°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2F
ADT6503SRJZN025RL7 −25°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T19
ADT6503SRJZN015RL7
−15°C
±4°C
−55°C to +125°C
5-Lead SOT-23
RJ-5
3,000
T2J
ADT6503SRJZN005RL7 −5°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2M
COMPLIANT TO JEDEC STANDARDS MO-178-AA
10°
5°
0°
SEATING
PLANE
1.90
BSC
0.95 BSC
0.60
BSC
5
1 2 3
4
3.00
2.90
2.80
3.00
2.80
2.60
1.70
1.60
1.50
1.30
1.15
0.90
0.15 MAX
0.05 MIN
1.45 MAX
0.95 MIN
0.20 MAX
0.08 MIN
0.50 MAX
0.35 MIN
0.55
0.45
0.35
11-01-2010-A
ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet
Rev. B | Page 14 of 16
Model1
Threshold
Temperature
Accuracy @
Threshold
Temperature
Temperature
Range
Package
Description
Package
Option
Ordering
Quantity Branding
ADT6503SRJZP005RL7 +5°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2N
ADT6503SRJZP015RL7 +15°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2P
ADT6504SRJZN045RL7
−45°C
±6°C
−55°C to +125°C
5-Lead SOT-23
RJ-5
3,000
T2K
ADT6504SRJZN035RL7 −35°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2L
ADT6504SRJZN025RL7 −25°C ±6°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2Q
ADT6504SRJZN015RL7 −15°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2R
ADT6504SRJZN005RL7 −5°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2T
ADT6504SRJZP005RL7 +5°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2H
ADT6504SRJZP015RL7 +15°C ±4°C −55°C to +125°C 5-Lead SOT-23 RJ-5 3,000 T2U
1 Z = RoHS Compliant Part.
Data Sheet ADT6501/ADT6502/ADT6503/ADT6504
Rev. B | Page 15 of 16
NOTES
ADT6501/ADT6502/ADT6503/ADT6504 Data Sheet
Rev. B | Page 16 of 16
NOTES
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registered trademarks are the property of their respective owners.
D06096-0-10/12(B)