MICROWAVE POWER GaAs FET TIM7179-30UL MICROWAVE SEMICONDUCTOR TECHNICAL DATA FEATURES HIGH POWER P1dB=45.0 dBm at 7.1GHz to 7.9GHz HIGH GAIN G1dB=8.5dB at 7.1GHz to 7.9GHz BROAD BAND INTERNALLY MATCHED FET HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Output Power at 1dB Gain SYMBOL ( Ta= 25C ) CONDITIONS P1dB UNIT MIN. TYP. MAX. dBm 44.0 45.0 dB 7.5 8.5 A 7.0 8.0 Compression Point Power Gain at 1dB Gain VDS= 10V G1dB IDSset=6.4A Compression Point f = 7.1 to 7.9GHz Drain Current IDS1 Gain Flatness G dB 0.6 Power Added Efficiency add % 39 3rd Order Intermodulation IM3 dBc -44 -47 Distortion Two-Tone Test Po=34.0 dBm Drain Current IDS2 (Single Carrier Level) A 7.0 8.0 Channel Temperature Rise Tch (VDS X IDS + Pin - P1dB) C 100 UNIT MIN. TYP. MAX. mS 8000 V -0.5 -2.0 -3.0 A 16.0 V -5 C/W 1.0 1.5 X Rth(c-c) Recommended gate resistance(Rg) : Rg= 28 (MAX.) ELECTRICAL CHARACTERISTICS CHARACTERISTICS Transconductance Pinch-off Voltage SYMBOL gm VGSoff Saturated Drain Current IDSS Gate-Source Breakdown Voltage VGSO Thermal Resistance Rth(c-c) ( Ta= 25C ) CONDITIONS VDS= 3V IDS= 10.0A VDS= 3V IDS= 80mA VDS= 3V VGS= 0V IGS=-240A Channel to Case The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use, No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. February 2010 TIM7179-30UL ABSOLUTE MAXIMUM RATINGS ( Ta= 25C ) CHARACTERISTICS SYMBOL UNIT RATING Drain-Source Voltage VDS V 15 Gate-Source Voltage VGS V -5 Drain Current IDS A 18.0 Total Power Dissipation (Tc= 25 C) PT W 100 Channel Temperature Tch C 175 Storage Tstg C -65 to +175 PACKAGE OUTLINE (7-AA05A) Unit in mm Gate Source Drain HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260C. 2