EMIF02-SPK02F2 2-line IPADTM, EMI filter and ESD protection Datasheet - production data Features Packaged in lead-free Flip Chip Very low resistance: 0.35 High attenuation: -45 dB at 900 MHz Very low PCB space consumption: 0.89 mm x 1.26 mm Very thin package: 0.65 mm High efficiency in ESD suppression IEC6 1000-4-2 level 4 High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Flip-Chip package (5 bumps) Figure 1. 3 2 O1 Complies with the following standards Pin configuration (bump side) IEC 61000-4-2 level 4: - 15 kV (air discharge) - 8 kV (contact discharge) 1 I1 B GND O2 A I2 C Application Figure 2. Mobile phones Input Functional schematic Output Description The EMIF02-SPK02F2 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. The EMIF02-SPK02F2 flip-chip packaging means the package size is equal to the die size. That's why the EMIF02-SPK02F2 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 30 kV. TM: IPAD is a trademark of STMicroelectronics April 2012 This is information on a product in full production. Doc ID 15035 Rev 3 1/12 www.st.com 12 Characteristics 1 EMIF02-SPK02F2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 C) Symbol Parameter Unit VPP ESD discharge IEC 61000-4-2 Air discharge Contact discharge 30 30 kV ISPK Maximum rms current per channel 350 mA Tj Junction temperature range -30 to 125 C Tstg Storage temperature range -55 to + 150 C Figure 3. Symbol VBR VCL IRM VRM IF IPP IR VF Rd T Table 2. Electrical characteristics - definitions = = = = = = = = = = Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Forward current Peak pulse current Breakdown current Forward voltage drop Dynamic resistance Voltage temperature IPP Slope: 1/Rd VCL VCL Slope: 1/Rd Test conditions VBR IR = 1 mA IRM VRM = 3 V Min Fc Typ Max 6 RI/O CLINE IPP Electrical characteristics - values (Tamb = 25 C) Symbol 2/12 Value VR = 0 V DC, 1 MHz Cut-off frequency: ZSOURCE = ZLOAD = 50 Doc ID 15035 Rev 3 185 Unit V 400 nA 0.35 0.8 250 315 pF 20 MHz EMIF02-SPK02F2 Figure 4. Characteristics Attenuation measurements versus frequency 0.00 S21 (dB) -10.00 -20.00 -30.00 -40.00 F (Hz) -50.00 100.0k Figure 5. 1.0M I1-O1 10.0M 100.0M I2-O2 1.0G Crosstalk measurements versus frequency XTalk (dB) 0.00 -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 F (Hz) -80.00 100.0k 1.0M 10.0M 100.0M 1.0G I1-O2 Doc ID 15035 Rev 3 3/12 Characteristics Figure 6. EMIF02-SPK02F2 ESD test conditions 2 x -20 dB 50 input Figure 7. Clamping voltage VCL versus peak pulse current IPP for short pulse duration such as ESD surges IPP (A) 40 35 Typical breakdown dynamic resistance RD: 140 m tP = 100 ns 30 TJ initial = 25 C 25 ) A (P20 IP 15 10 5 0 Note: 4/12 V CL (V) 0 2 4 6 8 VCL(V) 10 12 14 16 For further information on the dynamic characteristic see the STMicroelectronics' application note AN4022, "TVS short pulse Rd measurement and correlation with TVS clamping voltage during ESD". Doc ID 15035 Rev 3 EMIF02-SPK02F2 Figure 8. Characteristics Output filter ESD response to IEC 61000-4-2 (+8 kV contact discharge) I1 to O1 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 4 VCL :clamping voltage @ 100 ns 1 15.7 V 2 9.1 V 3 8.7 V Figure 9. 4 7.9 V Output filter ESD response to IEC 61000-4-2 (-8 kV contact discharge) I1 to O1 2 -8.9 V 3 -8.7V 4 -7.9 V 1 16.1 V 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 4 VCL :clamping voltage @ 100 ns Doc ID 15035 Rev 3 5/12 Characteristics EMIF02-SPK02F2 Figure 10. Output filter ESD response to IEC 61000-4-2 (+15 kV contact discharge) I1 to O1 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 4 VCL :clamping voltage @ 100 ns 1 25.5 V 2 9.7 V 3 10 V 4 8.3 V Figure 11. Output filter ESD response to IEC 61000-4-2 (-15 kV contact discharge) I1 to O1 2 -10.2 V 3 -8.3V 4 -8.2 V 1 23.8 V 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 4 VCL :clamping voltage @ 100 ns 6/12 Doc ID 15035 Rev 3 EMIF02-SPK02F2 Characteristics Figure 12. Output filter ESD response to IEC 61000-4-2 (+30 kV contact discharge) I1 to O1 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 4 VCL :clamping voltage @ 100 ns 1 37.1 V 2 11.8 V 3 10.8 V 4 8.8 V Figure 13. Output filter ESD response to IEC 61000-4-2 (-30 kV contact discharge) I1 to O1 2 -12.2 V 3 -11.3 V 4 -8.4 V 1 VPP: ESD peak voltage 2 VCL :clamping voltage @ 30 ns 3 VCL :clamping voltage @ 60 ns 4 VCL :clamping voltage @ 100 ns 1 -37.9 V Doc ID 15035 Rev 3 7/12 Ordering information scheme 2 EMIF02-SPK02F2 Ordering information scheme Figure 14. Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: lead-free, pitch = 500 m, bump = 315 m 8/12 Doc ID 15035 Rev 3 yy - xxx zz Fx EMIF02-SPK02F2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 15. Package dimensions 500 m 10 315 m 50 650 m 65 1.26 mm 50 m 1 5 0 m 435 m 250 m 10 50 3 Package information 0.89 mm 50 m Figure 16. Footprint Figure 17. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 m recommended, 300 m max. Solder stencil opening: 330 m recommended E x x z y ww Solder mask opening recommendation: 340 m min. for 315 m copper pad diameter Doc ID 15035 Rev 3 9/12 Package information EMIF02-SPK02F2 Figure 18. Flip Chip tape and reel specification Dot identifying Pin A1 location 3.5 0.1 8 0.3 ST E ST E ST E xxz yww xxz yww xxz yww 0.73 0.05 All dimensions in mm Note: 4 0.1 User direction of unreeling More information is available in the application notes: AN1235: "Flip Chip: Package description and recommendations for use" AN1751: "EMI filters: Recommendations and measurements" 10/12 1.75 0.1 O 1.5 0.1 4 0.1 Doc ID 15035 Rev 3 EMIF02-SPK02F2 4 Ordering information Table 3. 5 Ordering information Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-SPK02F2 JD Flip Chip 1.8 mg 5000 Tape and reel 7" Revision history Table 4. Document revision history Date Revision Changes 17-Sep-2008 1 Initial release. 12-Sep-2011 2 Updated Figure 15 and Figure 16. 3-Apr-2012 3 Updated cover page features and description.Inserted Figure 6 to Figure 13. Doc ID 15035 Rev 3 11/12 EMIF02-SPK02F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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