EMIF02-SPK02F2 - STMICROELECTRONICS

This is information on a product in full production.

April 2012 Doc ID 15035 Rev 3 1/12

EMIF02-SPK02F2

2-line IPAD™, EMI filter and ESD protection

Datasheet − production data

Features

■Packaged in lead-free Flip Chip

■Very low resistance: 0.35 Ω

■High attenuation: -45 dB at 900 MHz

■Very low PCB space consumption:

0.89 mm x 1.26 mm

■Very thin package: 0.65 mm

■High efficiency in ESD suppression

IEC6 1000-4-2 level 4

■High reliability offered by monolithic integration

■High reduction of parasitic elements through

integration and wafer level packaging

Complies with the following standards

■IEC 61000-4-2 level 4:

– ±15 kV (air discharge)

– ±8 kV (contact discharge)

Application

■Mobile phones

Description

The EMIF02-SPK02F2 chip is a highly integrated

device designed to suppress EMI/RFI noise for

interface line filtering.

The EMIF02-SPK02F2 flip-chip packaging means

the package size is equal to the die size. That's

why the EMIF02-SPK02F2 is a very small device.

Additionally, this filter includes ESD protection

circuitry, which prevents damage to the protected

device when subjected to ESD surges up 30 kV.

Figure 1. Pin configuration (bump side)

Figure 2. Functional schematic

TM: IPAD is a trademark of STMicroelectronics

Flip-Chip package

(5 bumps)

GND

Input Output

www.st.com

Characteristics EMIF02-SPK02F2

2/12 Doc ID 15035 Rev 3

1 Characteristics

Figure 3. Electrical characteristics - definitions

Table 2. Electrical characteristics - values (Tamb = 25 °C)

Table 1. Absolute maximum ratings (Tamb = 25 °C)

Symbol Parameter Value Unit

VPP

ESD discharge IEC 61000-4-2

Air discharge

Contact discharge

ISPK Maximum rms current per channel 350 mA

TjJunction temperature range -30 to 125 °C

Tstg Storage temperature range -55 to + 150 °C

Symbol Test conditions Min Typ Max Unit

VBR IR = 1 mA 6 V

IRM VRM = 3 V 400 nA

RI/O 0.35 0.8 Ω

CLINE VR = 0 V DC, 1 MHz 185 250 315 pF

FcCut-off frequency: ZSOURCE = ZLOAD = 50 Ω20 MHz

Symbol Parameter

V = Breakdown voltage

I = Leakage current @ V

V = Stand-off voltage

I = Forward current

I = Peak pulse current

I = Breakdown current

V = Forward voltage drop

RM RM

V = Clamping voltage

d= Dynamic resistance

T = Voltage temperatureα

Slope: 1/Rd

EMIF02-SPK02F2 Characteristics

Doc ID 15035 Rev 3 3/12

Figure 4. Attenuation measurements versus frequency

Figure 5. Crosstalk measurements versus frequency

100.0k 1.0M 10.0M 100.0M 1.0G

-50.00

-40.00

-30.00

-20.00

-10.00

0.00

I1-O1 I2-O2

F (Hz)

S21 (dB)

100.0k 1.0M 10.0M 100.0M 1.0G

-80.00

-70.00

-60.00

-50.00

-40.00

-30.00

-20.00

-10.00

0.00

I1-O2

F (Hz)

XTalk (dB)

Characteristics EMIF02-SPK02F2

4/12 Doc ID 15035 Rev 3

Figure 6. ESD test conditions

Figure 7. Clamping voltage VCL versus peak pulse current IPP for short pulse duration such as

ESD surges

Note: For further information on the dynamic characteristic see the STMicroelectronics’

application note AN4022, “TVS short pulse Rd measurement and correlation with TVS

clamping voltage during ESD”.

2 x -20 dB

50 inputΩ

IPP (A)

0246810121416

(

)

VCL(V)

TJinitial = 25 °C

tP= 100 ns

Typical breakdown dynamic resistance RD: 140 mΩ

VCL (V)

EMIF02-SPK02F2 Characteristics

Doc ID 15035 Rev 3 5/12

Figure 8. Output filter ESD response to IEC 61000-4-2 (+8 kV contact discharge) I1 to O1

Figure 9. Output filter ESD response to IEC 61000-4-2 (-8 kV contact discharge) I1 to O1

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

15.7 V 9.1 V

8.7 V 7.9 V

16.1 V

-8.9 V -8.7V -7.9 V

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

Characteristics EMIF02-SPK02F2

6/12 Doc ID 15035 Rev 3

Figure 10. Output filter ESD response to IEC 61000-4-2 (+15 kV contact discharge) I1 to O1

Figure 11. Output filter ESD response to IEC 61000-4-2 (-15 kV contact discharge) I1 to O1

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

25.5 V 9.7 V

10 V 8.3 V

23.8 V

-10.2 V -8.3V -8.2 V

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

EMIF02-SPK02F2 Characteristics

Doc ID 15035 Rev 3 7/12

Figure 12. Output filter ESD response to IEC 61000-4-2 (+30 kV contact discharge) I1 to O1

Figure 13. Output filter ESD response to IEC 61000-4-2 (-30 kV contact discharge) I1 to O1

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

37.1 V 11.8 V

10.8 V 8.8 V

-37.9 V

-12.2 V -11.3 V -8.4 V

V : ESD peak voltage

V :clamping voltage @ 30 ns

V :clamping voltage @ 60 ns

V :clamping voltage @ 100 ns

Ordering information scheme EMIF02-SPK02F2

8/12 Doc ID 15035 Rev 3

2 Ordering information scheme

Figure 14. Ordering information scheme

EMIF yy - xxx zz Fx

EMI Filter

Number of lines

Information

Package

x = resistance value (Ohms)

z = capacitance value / 10(pF)

3 letters = application

2 digits = version

F = Flip Chip

x = 2: lead-free, pitch = 500 µm, bump = 315 µm

EMIF02-SPK02F2 Package information

Doc ID 15035 Rev 3 9/12

3 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 15. Package dimensions

Figure 16. Footprint Figure 17. Marking

0.89 mm ± 50 µm

1.26 mm ± 50 µm

435 µm

315 µm ± 50

500 µm ± 10

250 µm ± 10

650 µm ± 65

500 µm ± 15

Copper pad Diameter:

250 µm recommended, 300 µm max.

Solder stencil opening:

330 µm recommended

Solder mask opening recommendation:

340 µm min. for 315 µm copper pad diameter

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

Package information EMIF02-SPK02F2

10/12 Doc ID 15035 Rev 3

Figure 18. Flip Chip tape and reel specification

Note: More information is available in the application notes:

AN1235: “Flip Chip: Package description and recommendations for use”

AN1751: “EMI filters: Recommendations and measurements”

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

8 ± 0.3

4 ± 0.1

1.75 ± 0.1 3.5 ± 0.1

Ø 1.5 ± 0.1

0.73 ± 0.05

xxz

yww

xxz

yww

xxz

yww

EMIF02-SPK02F2 Ordering information

Doc ID 15035 Rev 3 11/12

4 Ordering information

5 Revision history

Table 3. Ordering information

Order code Marking Package Weight Base qty Delivery mode

EMIF02-SPK02F2 JD Flip Chip 1.8 mg 5000 Tape and reel 7”

Table 4. Document revision history

Date Revision Changes

17-Sep-2008 1 Initial release.

12-Sep-2011 2 Updated Figure 15 and Figure 16.

3-Apr-2012 3 Updated cover page features and description.Inserted Figure 6 to

Figure 13.

EMIF02-SPK02F2

12/12 Doc ID 15035 Rev 3

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the

right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any

time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no

liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this

document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products

or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such

third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED

WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED

WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS

OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT

RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING

APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,

DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE

GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void

any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any

liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America