74HCT1G14GV,125 - NXP Semiconductors / Philips Semiconductors

1. General description

74HC1G14 and 74HCT1G14 are high-speed Si-gate CMOS devices. They provide an

inverting buffer function with Schmitt trigger action. These devices are capable of

transforming slowly changing input signals into sharply deﬁned, jitter-free output signals.

The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.

The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

The standard output currents are half those of the 74HC14 and 74HCT14.

2. Features

nSymmetrical output impedance

nHigh noise immunity

nLow power dissipation

nBalanced propagation delays

nSOT353-1 and SOT753 package options

nSpeciﬁed from −40 °C to +125 °C

3. Applications

nWave and pulse shapers

nAstable multivibrators

nMonostable multivibrators

4. Ordering information

74HC1G14; 74HCT1G14

Inverting Schmitt trigger

Rev. 04 — 17 July 2007 Product data sheet

Table 1. Ordering information

Type number Package

Temperature range Name Description Version

74HC1G14GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package;

5 leads; body width 1.25 mm SOT353-1

74HCT1G14GW

74HC1G14GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753

74HCT1G14GV

Product data sheet Rev. 04 — 17 July 2007 2 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

5. Marking

6. Functional diagram

7. Pinning information

7.1 Pinning

7.2 Pin description

Table 2. Marking codes

Type number Marking

74HC1G14GW HF

74HCT1G14GW TF

74HC1G14GV H14

74HCT1G14GV T14

Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram

mna023

2424

mna024 mna025

Fig 4. Pin conﬁguration

74HC1G14

74HCT1G14

n.c. VCC

GND Y

001aaf106

Table 3. Pin description

Symbol Pin Description

n.c. 1 not connected

A 2 data input

GND 3 ground (0 V)

Y 5 data output

VCC 5 supply voltage

Product data sheet Rev. 04 — 17 July 2007 3 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

8. Functional description

9. Limiting values

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] Above 55 °C the value of Ptot derates linearly with 2.5 mW/K.

10. Recommended operating conditions

Table 4. Function table

H = HIGH voltage level; L = LOW voltage level

Input Output

A Y

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

[1]

Symbol Parameter Conditions Min Max Unit

VCC supply voltage −0.5 +7.0 V

IIK input clamping current VI < −0.5 V or VI>V

CC + 0.5 V - ±20 mA

IOK output clamping current VO<−0.5 V or VO>V

CC + 0.5 V - ±20 mA

IOoutput current −0.5 V < VO <V

CC + 0.5 V - ±12.5 mA

ICC supply current - 25 mA

IGND ground current −25 - mA

Tstg storage temperature −65 +150 °C

Ptot total power dissipation Tamb = −40 °C to +125 °C[2] - 200 mW

Table 6. Recommended operating conditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 74HC1G14 74HCT1G14 Unit

Min Typ Max Min Typ Max

VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V

VIinput voltage 0 - VCC 0-V

CC V

VOoutput voltage 0 - VCC 0-V

CC V

Tamb ambient temperature −40 +25 +125 −40 +25 +125 °C

Product data sheet Rev. 04 — 17 July 2007 4 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

11. Static characteristics

Table 7. Static characteristics

Voltages are referenced to GND (ground = 0 V). All typical values are measured at T

amb

=25

Symbol Parameter Conditions −40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max

For type 74HC1G14

VOH HIGH-level output

voltage VI= VIH or VIL

IO=−20 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - V

IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - V

IO=−20 µA; VCC = 6.0 V 5.9 6.0 - 5.9 - V

IO=−2.0 mA; VCC = 4.5 V 4.13 4.32 - 3.7 - V

IO=−2.6 mA; VCC = 6.0 V 5.63 5.81 - 5.2 - V

VOL LOW-level output

voltage VI= VIH or VIL

IO= 20 µA; VCC = 2.0 V - 0 0.1 - 0.1 V

IO= 20 µA; VCC = 4.5 V - 0 0.1 - 0.1 V

IO= 20 µA; VCC = 6.0 V - 0 0.1 - 0.1 V

IO= 2.0 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V

IO= 2.6 mA; VCC = 6.0 V - 0.16 0.33 - 0.4 V

IIinput leakage current VI=V

CC or GND; VCC = 6.0 V - - 1.0 - 1.0 µA

ICC supply current VI=V

CC or GND; IO=0A;

VCC = 6.0 V - - 10 - 20 µA

CIinput capacitance - 1.5 - - - pF

VT+ positive-going

threshold voltage see Figure 7 and 8

VCC = 2.0 V 0.7 1.09 1.5 0.7 1.5 V

VCC = 4.5 V 1.7 2.36 3.15 1.7 3.15 V

VCC = 6.0 V 2.1 3.12 4.2 2.1 4.2 V

VT−negative-going

threshold voltage see Figure 7 and 8

VCC = 2.0 V 0.3 0.60 0.9 0.3 0.9 V

VCC = 4.5 V 0.9 1.53 2.0 0.9 2.0 V

VCC = 6.0 V 1.2 2.08 2.6 1.2 2.6 V

VHhysteresis voltage see Figure 7 and 8

VCC = 2.0 V 0.2 0.48 1.0 0.2 1.0 V

VCC = 4.5 V 0.4 0.83 1.4 0.4 1.4 V

VCC = 6.0 V 0.6 1.04 1.6 0.6 1.6 V

For type 74HCT1G14

VOH HIGH-level output

voltage VI= VIH or VIL

IO=−20 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - V

IO=−2.0 mA; VCC = 4.5 V 4.13 4.32 - 3.7 - V

VOL LOW-level output

voltage VI= VIH or VIL

IO= 20 µA; VCC = 4.5 V - 0 0.1 - 0.1 V

IO= 2.0 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V

IIinput leakage current VI=V

CC or GND; VCC = 5.5 V - - 1.0 - 1.0 µA

Product data sheet Rev. 04 — 17 July 2007 5 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

12. Dynamic characteristics

[1] tpd is the same as tPLH and tPHL.

[2] CPD is used to determine the dynamic power dissipation PD(µW).

PD=C

PD ×VCC2×fi+∑(CL×VCC2×fo) where:

fi= input frequency in MHz; fo= output frequency in MHz

CL= output load capacitance in pF; VCC = supply voltage in Volts

∑(CL×VCC2×fo) = sum of outputs

ICC supply current VI=V

CC or GND; IO=0A;

VCC = 5.5 V - - 10 - 20 µA

∆ICC additional supply

current per input; VCC = 4.5 V to 5.5 V;

VI = VCC − 2.1 V; IO=0A - - 500 - 850 µA

CIinput capacitance - 1.5 - - - pF

VT+ positive-going

threshold voltage see Figure 7 and 8

VCC = 4.5 V 1.2 1.55 1.9 1.2 1.9 V

VCC = 5.5 V 1.4 1.80 2.1 1.4 2.1 V

VT−negative-going

threshold voltage see Figure 7 and 8

VCC = 4.5 V 0.5 0.76 1.2 0.5 1.2 V

VCC = 5.5 V 0.6 0.90 1.4 0.6 1.4 V

VHhysteresis voltage see Figure 7 and 8

VCC = 4.5 V 0.4 0.80 - 0.4 - V

VCC = 5.5 V 0.4 0.90 - 0.4 - V

Table 7. Static characteristics

…continued

Voltages are referenced to GND (ground = 0 V). All typical values are measured at T

amb

=25

Symbol Parameter Conditions −40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max

Table 8. Dynamic characteristics

GND = 0 V; t

= t

≤

6.0 ns; All typical values are measured at T

amb

=25

C. For test circuit see Figure 6

Symbol Parameter Conditions −40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max

For type 74HC1G14

tpd propagation delay A to Y; see Figure 5 [1]

VCC = 2.0 V; CL= 50 pF - 25 155 - 190 ns

VCC = 4.5 V; CL= 50 pF - 12 31 - 38 ns

VCC = 5.0 V; CL=15pF - 10 - - - ns

VCC = 6.0 V; CL= 50 pF - 11 26 - 32 ns

CPD power dissipation

capacitance VI= GND to VCC [2] -20- - -pF

For type 74HCT1G14

tpd propagation delay A to Y; see Figure 5 [1]

VCC = 4.5 V; CL= 50 pF - 17 43 - 51 ns

VCC = 5.0 V; CL=15pF - 15 - - - ns

CPD power dissipation

capacitance VI= GND to VCC −1.5 V [2] -22- - -pF

Product data sheet Rev. 04 — 17 July 2007 6 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

13. Waveforms

Measurement points are given in Table 9.

Fig 5. The input (A) to output (Y) propagation delays

mna033

A input

Y output

tPHL tPLH

Table 9. Measurement points

Type number Input Output

VIVMVM

74HC1G14 GND to VCC 0.5 × VCC 0.5 × VCC

74HCT1G14 GND to 3.0 V 1.5 V 0.5 × VCC

Test data is given in Table 8. Deﬁnitions for test circuit:

CL = Load capacitance including jig and probe capacitance.

RT = Termination resistance should be equal to output impedance Zo of the pulse generator.

Fig 6. Load circuitry for switching times

VCC

VIVO

mna034

DUT

50 pF

PULSE

GENERATOR

Product data sheet Rev. 04 — 17 July 2007 7 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

14. Transfer characteristics waveforms

Fig 7. Transfer characteristic Fig 8. The deﬁnitions of VT+, VT− and VH; where VT+

and VT− are between limits of 20 % and 70 %

mna026

VHVI

VT−VT+

mna027

VIVH

VT+

VT−

Fig 9. Typical 74HC1G14 transfer characteristics;

VCC = 2.0 V Fig 10. Typical 74HC1G14 transfer characteristics;

VCC = 4.5 V

mna028

0 2.0

100

ICC

(µA)

1.0 VI (V)

mna029

0 5.0

1.0

0.8

0.6

0.4

0.2

ICC

(mA)

2.5 VI (V)

Product data sheet Rev. 04 — 17 July 2007 8 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

15. Application information

The slow input rise and fall times cause additional power dissipation, this can be

calculated using the following formula:

Padd =f

i×(tr×∆ICC(AV) +t

f×∆ICC(AV))×VCC

Where:

Padd = additional power dissipation (µW)

fi= input frequency (MHz)

tr= rise time (ns); 10 % to 90 %

Fig 11. Typical 74HC1G14 transfer characteristics; VCC = 6.0 V

mna030

0 3.0 6.0

1.6

0.8

ICC

(mA)

VI (V)

Fig 12. Typical 74HCT1G14 transfer characteristics;

VCC = 4.5 V Fig 13. Typical 74HCT1G14 transfer characteristics;

VCC = 5.5 V

mna031

0 5.0

2.0

1.0

ICC

(mA)

2.5 VI (V)

mna032

3.0

2.0

1.0

03.0 6.0

ICC

(mA)

VI (V)

Product data sheet Rev. 04 — 17 July 2007 9 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

tf= fall time (ns); 90 % to 10 %

∆ICC(AV) = average additional supply current (µA)

∆ICC(AV) differs with positive or negative input transitions, as shown in Figure 14 and 15.

74HC1G14 and 74HCT1G14 used in relaxation oscillator circuit, see Figure 16.

Remark: All values given are typical unless otherwise speciﬁed.

Fig 14. ∆ICC(AV) for 74HC1G14 devices; linear change of

VI between 0.1 ×VCC to 0.9 ×VCC

Fig 15. ∆ICC(AV) for 74HCT1G14 devices; linear change

of VI between 0.1 ×VCC to 0.9 ×VCC

mna036

0 2.0 4.0 6.0

VCC (V)

200

150

100

∆ICC(AV)

(µA)

positive-going

edge

negative-going

edge

mna058

0462VCC (V)

200

100

150

∆ICC(AV)

(µA)

positive-going

edge

negative-going

edge

For 74HC1G14:

For 74HCT1G14:

Fig 16. Relaxation oscillator using 74HC1G14 and 74HCT1G14

mna035

--- 1

0.8 RC×

----------------------

≈=

--- 1

0.67 RC×

-------------------------

≈=

Product data sheet Rev. 04 — 17 July 2007 10 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

16. Package outline

Fig 17. Package outline SOT353-1 (TSSOP5)

UNIT A1

max. A2A3bpLHELpwyv

ceD(1) E(1) Z(1) θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.1

01.0

0.8 0.30

0.15 0.25

0.08 2.25

1.85 1.35

1.15 0.65

1.3 2.25

2.0 0.60

0.15 7°

0°

0.1 0.10.30.425

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

0.46

0.21

SOT353-1 MO-203 SC-88A 00-09-01

03-02-19

0.15

(A3)

detail X

vMA

1.5 3 mm0

scale

TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1

1.1

Product data sheet Rev. 04 — 17 July 2007 11 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

Fig 18. Package outline SOT753 (SC-74A)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT753 SC-74A

wBM

detail X

vMA

0 1 2 mm

scale

132

Plastic surface-mounted package; 5 leads SOT753

UNIT A1bpcDEHELpQywv

mm 0.100

0.013 0.40

0.25 3.1

2.7

0.26

0.10 1.7

1.3

0.95 3.0

2.5 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.6

0.2 0.33

0.23

1.1

0.9

02-04-16

06-03-16

Product data sheet Rev. 04 — 17 July 2007 12 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

17. Abbreviations

18. Revision history

Table 10. Abbreviations

Acronym Description

DUT Device Under Test

TTL Transistor-Transistor Logic

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74HC_HCT1G14_4 20070717 Product data sheet - 74HC_HCT1G14_3

Modiﬁcations: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Package SOT353 changed to SOT353-1 in Table 1 and Figure 17.

•Quick Reference Data and Soldering sections removed.

•Section 2 “Features” updated.

74HC_HCT1G14_3 20020515 Product speciﬁcation - 74HC_HCT1G14_2

74HC_HCT1G14_2 20010302 Product speciﬁcation - 74HC_HCT1G14_1

74HC_HCT1G14_1 19980805 Product speciﬁcation - -

Product data sheet Rev. 04 — 17 July 2007 13 of 14

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

19. Legal information

19.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

19.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

19.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of a NXP Semiconductors product can reasonably be expected to

result in personal injury, death or severe property or environmental damage.

NXP Semiconductors accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or applications and therefore

such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

19.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

20. Contact information

For additional information, please visit: http://www.nxp.com

For sales ofﬁce addresses, send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors 74HC1G14; 74HCT1G14

Inverting Schmitt trigger

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 17 July 2007

Document identifier: 74HC_HCT1G14_4

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

21. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

8 Functional description . . . . . . . . . . . . . . . . . . . 3

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

10 Recommended operating conditions. . . . . . . . 3

11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5

13 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

14 Transfer characteristics waveforms. . . . . . . . . 7

15 Application information. . . . . . . . . . . . . . . . . . . 8

16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

17 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12

18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12

19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13

19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13

19.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

19.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13

20 Contact information. . . . . . . . . . . . . . . . . . . . . 13

21 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14