Data sheet
Creation date October 14, 2019 5:51:46 AM CEST
Catalogue status 27.09.2019 / We reserve the right to make technical changes. 1
OMNIMATE Signal - series BL/SL 3.50
SL-SMT 3.50/03/90F 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 26
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
Product image
Similar to illustration
General ordering data
Type SL-SMT 3.50/03/90F 3.2SN BK BX
Order No. 1842090000
Version PCB plug-in connector, male header, Flange, THT/
THR solder connection, 3.50 mm, No. of poles: 3,
90°, Solder pin length (l): 3.2 mm, tinned, black,
Box
GTIN (EAN) 4032248353446
Qty. 102 pc(s).
Product data IEC: 320 V / 15 A
UL: 300 V / 10 A
Packaging Box
High-temperature-resistant male header, 3.50 mm
pitch.
Plugging direction parallel (90°), straight 180° or
angled (135°) to PCB
Housing variants: closed side (G), screw flange
(F), solder flange (LF) or snap-on solder flange
(RF)
Optimised for the SMT process
Pin length 3.2 mm universal for all soldering
methods
Pin length 1.5 mm optimised for reflow soldering
methods
Packed either in a box (BX) or tape-on-reel (RL)
Male header can be coded
Data sheet
OMNIMATE Signal - series BL/SL 3.50
SL-SMT 3.50/03/90F 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 26
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
Technical data
Creation date October 14, 2019 5:51:46 AM CEST
Catalogue status 27.09.2019 / We reserve the right to make technical changes. 2
Dimensions and weights
Width 17.5 mm Width (inches) 0.689 inch
Height 10.7 mm Height (inches) 0.421 inch
Height of lowest version 7.5 mm Depth 11.1 mm
Depth (inches) 0.437 inch Net weight 1.706 g
System specifications
Product family OMNIMATE Signal - series
BL/SL 3.50
Type of connection
Board connection
Mounting onto the PCB THT/THR solder
connection
Pitch in mm (P)
3.5 mm
Pitch in inches (P) 0.138 inch Outgoing elbow 90°
No. of poles 3 Number of solder pins per pole 1
Solder pin length (l) 3.2 mm Solder pin length tolerance 0 / -0.3 mm
Tolerance of solder pin position ± 0.1 mm Solder pin dimensions d = 1.2 mm, Octagonal
Solder pin dimensions = d tolerance 0 / -0,03 mm Solder eyelet hole diameter (D) 1.4 mm
Solder eyelet hole diameter tolerance (D)+ 0,1 mm Outside diameter of solder pad 2.3 mm
Template aperture diameter 2.1 mm L1 in mm 7 mm
L1 in inches 0.276 inch Number of rows 1
Pin series quantity
1
Touch-safe protection acc. to DIN VDE
57 106
Safe from back-of-hand
touch
Touch-safe protection acc. to DIN VDE
0470 IP 10
Volume resistance
4.50 mΩ
Can be coded Yes Plugging cycles 25
Plugging force/pole, max. 6 N Pulling force/pole, max. 6 N
Material data
Insulating material LCP GF Colour black
Colour chart (similar) RAL 9011 Insulating material group IIIa
Comparative Tracking Index (CTI) ≥ 175 Insulation strength ≥ 108 Ω
Moisture Level (MSL) 1 UL 94 flammability rating V-0
GWIT 930 °C GWFI 960 °C
Contact material CuSn Contact surface tinned
Layer structure of solder connection 2-3 µm Ni / 5-7 µm Sn Layer structure of plug contact 2-3 µm Ni / 5-7 µm Sn
Storage temperature, min. -25 °C Storage temperature, max. 55 °C
Max. relative humidity during storage 80 % Operating temperature, min. -50 °C
Operating temperature, max. 100 °C Temperature range, installation, min. -30 °C
Temperature range, installation, max. 100 °C
Rated data acc. to IEC
tested acc. to standard
IEC 60664-1, IEC 61984
Rated current, min. no. of poles
(Tu=20°C) 15 A
Rated current, max. no. of poles
(Tu=20°C) 12 A
Rated current, min. no. of poles
(Tu=40°C) 13 A
Rated current, max. no. of poles
(Tu=40°C) 10 A
Rated voltage for surge voltage class /
pollution degree II/2 320 V
Rated voltage for surge voltage class /
pollution degree III/2 160 V
Rated voltage for surge voltage class /
pollution degree III/3 160 V
Rated impulse voltage for surge voltage
class/ pollution degree II/2 2.5 kV
Rated impulse voltage for surge voltage
class/ pollution degree III/2 2.5 kV
Rated impulse voltage for surge voltage
class/ contamination degree III/3 2.5 kV
Short-time withstand current resistance
3 x 1s with 100 A
Data sheet
OMNIMATE Signal - series BL/SL 3.50
SL-SMT 3.50/03/90F 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 26
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
Technical data
Creation date October 14, 2019 5:51:46 AM CEST
Catalogue status 27.09.2019 / We reserve the right to make technical changes. 3
Rated data acc. to CSA
Institute (CSA) Certificate No. (CSA)
200039-1176845
Rated voltage (Use group B / CSA) 300 V Rated voltage (Use group D / CSA) 300 V
Rated current (Use group B / CSA) 10 A Rated current (Use group D / CSA) 10 A
Reference to approval values Specifications are
maximum values, details -
see approval certificate.
Rated data acc. to UL 1059
Institute (UR) Certificate No. (UR)
E60693
Rated voltage (Use group B / UL 1059) 300 V Rated voltage (Use group D / UL 1059) 300 V
Rated current (Use group B / UL 1059) 10 A Rated current (Use group D / UL 1059) 10 A
Reference to approval values Specifications are
maximum values, details -
see approval certificate.
Packing
Packaging Box VPE length 340 mm
VPE width 110 mm VPE height 100 mm
Classifications
ETIM 6.0 EC002637 ETIM 7.0 EC002637
eClass 9.0 27-44-04-02 eClass 9.1 27-44-04-02
eClass 10.0 27-44-04-02 UNSPSC 30-21-18-10
Notes
Notes Gold-plated contact surfaces on request
Rated current related to rated cross-section & min. No. of poles.
Diameter of solder eyelet D = 1.4+0.1mm
Solder eyelet diameter D = 1.5 + 0.1 mm, from 9 poles
P on drawing = pitch
Rated data refer only to the component itself. Clearance and creepage distances to other components are to
be designed in accordance with the relevant application standards.
For additional mechanical support for male connectors with screw flange (…F), we recommend an additional
cable gland with fastening screws (sheet metal screw ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C –
see Accessories). Cable gland only permitted before soldering.
IPC conformity Conformity: The products are developed, manufactured and delivered according international recognized
standards and norms and comply with the assured properties in the data sheet resp. fulfill decorative properties
in accordance with IPC-A-610 "Class 2". Further claims on the products can be evaluated on request.
Data sheet
OMNIMATE Signal - series BL/SL 3.50
SL-SMT 3.50/03/90F 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 26
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
Technical data
Creation date October 14, 2019 5:51:46 AM CEST
Catalogue status 27.09.2019 / We reserve the right to make technical changes. 4
Approvals
Approvals
ROHS Conform
Downloads
Approval/Certificate/Document of
Conformity Declaration of the Manufacturer
Brochure/Catalogue FL DRIVES EN
MB SMT EN
FL DRIVES DE
MB DEVICE MANUF. EN
CAT 2 PORTFOLIOGUIDE EN
FL BUILDING SAFETY EN
FL APPL LED LIGHTING EN
FL INDUSTR.CONTROLS EN
FL MACHINE SAFETY EN
FL HEATING ELECTR EN
FL APPL_INVERTER EN
FL_BASE_STATION_EN
FL ELEVATOR EN
FL POWER SUPPLY EN
FL 72H SAMPLE SER EN
PO OMNIMATE EN
Engineering Data SL-SMT.zip
STEP
SMT white paper Download Whitepaper
Data sheet
OMNIMATE Signal - series BL/SL 3.50
SL-SMT 3.50/03/90F 3.2SN BK BX
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 26
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
Drawings
Creation date October 14, 2019 5:51:46 AM CEST
Catalogue status 27.09.2019 / We reserve the right to make technical changes. 5
Dimensional drawing
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 16
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
260
240
220
200
180
160
140
120
100
80
60
40
20
00 20 40 60 80 100 120 140 160 180 200 220 240
time [s]
Temperature [°C]
Preheating
Cooling rate < 6 °K/s
250 °C
260 °C
Heating rate < 3 °K/s
255 °C
Typical process
Process limits
Temperature on board
Total contact time max. 10 sec.
appr. 150°C
260
240
220
200
180
160
140
120
100
80
60
40
20
00 20 40 60 80 100 120 140 160 180 200 220 240
time [s]
Temperature [°C]
Preheating
Cooling rate < 6 °K/s
250 °C
260 °C
Contact time appr. 3 sec.
Typical process
Prozess limits
Temperature on board
Heating rate < 3 °K/s
255 °C
appr. 150 °C
Wave soldering proles
Wired connection elements should be processed in accordance with the DIN EN 61760-1 standard. We have included
two recommendations for practical wave soldering proles, with which Weidmüller PCB terminals and connectors are
qualied.
When choosing a suitable prole for your application, the following factors also need to be considered:
- PCB thickness
- Proportion of Cu in the layers
- Single/double-sided assembly
- Product range
- Heating and cooling rates
The single and double wave proles each indicate the recommended operating range, including the maximum
soldering temperature of 260°C. In practice, the maximum soldering temperature is quite often well below the above
maximum prole.
Wave Solder Prole
Recommended wave solderding proles
We reserve the right to make technical changes.
Single Wave:
Double Wave:
Weidmüller Interface GmbH & Co. KG
Klingenbergstraße 16
D-32758 Detmold
Germany
Fon: +49 5231 14-0
Fax: +49 5231 14-292083
www.weidmueller.com
300
250
217
200
150
100
50
0
0 50 100 150 200 250 300 350
Time [sec]
Temperature [°C]
preheating
Melting point lead-free solder paste
Heating rate: < 3 °K/s
Cooling rate: < 6 °K/s
180 °C
190 °C
235 °C
245 °C
254 °C
approx.
60 s > 217 °C
Continuous line: Typical process
Dotted line: Process limits
Recommended reow soldering prole
Reow Solder Prole
We reserve the right to make technical changes.
Reow soldering prole
The perfect soldering prole for SMT Surface Mount Technology is one the most exiting question in SMT production.
But there are more than one correct answer: The diagram of temperature-on-time is related to processing features of
solder paste and to maximum load of components.
We have to consider the following parameters:
• Time for pre heating
• Maximum temperature
• Time above melting point
• Time for cooling
• Maximum heating rate
• Maximum cooling rate
We recommend a typical solder prole with associated process limits. With preheating components and board are
prepared smoothly for the solder phase. Heating rate is typically +3K/s. In parallel the solder paste is ‚activated’. The
time above melting point of 217°C the paste gets liquid and components and boards begin to connect. The maximum
temperature of 245°C to 254°C should stay between 10 and 40 seconds. In the cooling phase at -6K/s solder is
cured. Board and components cool down while avoiding cold cracks.