BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website: www.bitechnologies.com
May 6, 2009 page 1 of 3
BI technologies
MODELS
SS103VD, SFN06VD
Voltage divider circuit
Thin film resistor network
RoHS compliant available
FEATURES
Precision Nichrome Resistors on Silicon Passivation coating provides protection in humid environments
Industry Standard Packaging 6 pad SON1 2mm square with 0.65 mm pitch (JEDEC MO-229D)
3 lead SOT23 (JEDEC TO-239)
Ratio Tolerances < ± 0.05%
TCR Tracking Tolerances < ± 5 ppm/°C
CIRCUIT SCHEMATIC
ELECTRICAL2
Standard Resistance Range 1K ohms to 100K ohms
Resistor Tolerances ± 0.25%
Ratio Tolerances ± 0.05%
TCR Reference TCR table
Operating Temperature Range -55°C to +125°C
Interlead Capacitance < 2 pF
Insulation Resistance = 10,000 Megohms
Maximum Operating Voltage 100 Vdc or v PR
Noise, Maximum (MIL-STD-2002, Method 308) -25 dB
Maximum Package Power @ 70°C 0.2 Watts
RESISTANCE TOLERANCES
Accuracy Code at 25°C CA CB D FA F G J
Absolute Resistance Tolerances (%) ± 0.25 ± 0.25 ± 0.5 ± 1.0 ± 1.0 ± 2.0 ± 5.0
Ratio Tolerances (R1 Ref) (%) ± 0.05 ± 0.1 ± 0.1 ± 0.05 ± 1.0 N/A N/A
1 Small outline no lead (SON) package is also referred to as quad flat no lead (QFN) or dual flat no lead (DFN) packages.
2 Specifications subject to change without notice.
SS103VD
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website: www.bitechnologies.com
May 6, 2009 page 2 of 3 BI technologies
TEMPERATURE COEFFICIENT OF RESISTANCE (TCR)
TCR Code (-55°C to 125°C) Q P S L
Absolute (ppm/°C) ± 25 ± 50 ± 100 ± 200
Tracking (R1 Ref) (ppm/°C) ± 5 ± 5 N/A N/A
POWER DERATING CURVE
ENVIRONMENTAL (MIL-R-83401)
Thermal Shock plus Power Conditioning R 0.25%
Short Time Overload R 0.1%
Moisture Resistance R 0.2%
Mechanical Shock R 0.25%
Vibration R 0.25%
Low Temperature Operation R 0.1%
High Temperature Exposure R 0.1%
Resistance to Solder Heat R 0.05%
Marking Permanency Per MIL-STD-202, Method 215
Storage Temperature Range -55°C to +125°C
MECHANICAL
Lead Plating 80/20 Tin Lead (Standard)
100 matte Tin (RoHS)
Lead Material Copper Alloy
Lead Configurations (SLP/SS1) No lead, Gull Wing
Lead Coplanarity (SS1 only) 0.003” (0.102 mm)
Substrate Material Silicon
Resistor Material Passivated Nichrome
Body Material Molded Epoxy
Package Types 6 pad SON 2mm square, 3 lead SOT23
SS103VD
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website: www.bitechnologies.com
May 6, 2009 page 3 of 3 BI technologies
S S1 03 VD 05 F S LF 13
Packaging Option (Qty/reel)
7=7” Tape & Reel (1000 pcs)
13 = 13" Tape & Reel (3000 pcs)
Lead Finish:
No Code=SnPb
LF=Lead Free (RoHS)
TCR Code:
TCR table
Tolerance Code:
Resistance tolerance table
Model Series:
S = Passivated Nichrome
on Silicon
Package Type:
S1 = SOT-23
FN = SON 2mm sq
Pin Count:
Circuit Type:
VD=Voltage Divider
Resistance Code:
Divider ratio table
DIVIDER RATIO
Resistance Code Ratio (R2/R1) R1 (ohms) R2 (ohms)
01 1.613 12.4K 20K
02 10 10K 100K
03 4 5K 20K
05 1 20K 20K
06 9 11.3K 101.7K
07 2 10K 20K
08 3 3.333K 10K
09 2 5K 10K
10 1 10K 10K
11 2 1K 2K
12 2 50K 100K
ORDERING INFORMATION3
TYPICAL MARKING
3 Contact our customer service for custom designs and features.