0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
0.3nH
5, 10
5, 10
5, 10
5, 10
5, 10
5, 10
5, 10
5, 10
0.07
0.09
0.09
0.09
0.10
0.10
0.10
0.12
0.15
0.17
0.18
0.18
0.20
0.20
0.22
0.24
0.24
0.24
0.26
0.26
0.28
0.32
0.36
IDC
Max.
(mA)
Note: Insert desired tolerance here “_” Tolerance Values J= ±5%, K= ±10%
Allied
Part
Number
Inductance
(nh) Tolerance
(%) Q
Min. SRF
(MHz)
RDC
Max.
(Ω)
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.2
2.7
3.3
3.6
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
12
15
18
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
10000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
6000
5300
4500
4500
4500
4200
3700
3400
3400
3000
2500
2200
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
HFCLR03High Frequency Low Resistance Inductor
Physical
Packaging: 10000 pieces per 7 inch reel.
HFCLR03-1N0S-RC
HFCLR03-1N1S-RC
HFCLR03-1N2S-RC
HFCLR03-1N3S-RC
HFCLR03-1N5S-RC
HFCLR03-1N6S-RC
HFCLR03-1N8S-RC
HFCLR03-2N2S-RC
HFCLR03-2N7S-RC
HFCLR03-3N3S-RC
HFCLR03-3N6S-RC
HFCLR03-4N7S-RC
HFCLR03-5N1S-RC
HFCLR03-5N6S-RC
HFCLR03-6N2S-RC
HFCLR03-6N8_-RC
HFCLR03-7N5_-RC
HFCLR03-8N2_-RC
HFCLR03-9N1_-RC
HFCLR03-10N_-RC
HFCLR03-12N_-RC
HFCLR03-15N_-RC
HFCLR03-18N_-RC
RoHS
ALLIED COMPONENTS INTERNATIONAL
714-665-1140www.alliedcomponents.com
Dimensions: Inches
(mm)
0.039±0.004
(1.0±0.10)
0.020±0.004
(0.51±0.10)
0.016
(0.41)
0.016
(0.41)
0.010±0.004
(0.25±0.10)
0.020±0.004
(0.5±0.10)
@100MHz Typical
5, 10
5, 10 0.42
0.46
22
27 8
8 1900
1700 300
300
HFCLR03-22N_-RC
HFCLR03-27N_-RC
All specifications subject to change without notice.
Features
• 0402 EIA size for high board density
applications.
• Excellent Q and SRF characteristics
• Cost effective monolithic construction
for high frequency applications.
Electrical
Inductance range: .3nh to 82nh
Tolerance: use S for ± .3nh, J for 5%,
K for 10%
Test Frequency: Inductance and Q
tested at 100MHz, 200mv with HP4291A
Inductance vs Freq. Characteristics
measured on HP4291A
Q vs Frequency Characteristics
measured on HP4291A
SRF measured on HPE4991 & HP87530
DCR measured on Chen Hwa CH502BC
Mechanical
Test Condition: Pre heat:150ºC. 1min.
Solder composition:
Solder temp: 245ºC±5ºC (pb Free)
Immersion time: 4 ± 1 sec.
No damage to part
Pre heat: 150ºC. 1min.
Solder composition:
Sn/Ag3.0/Cu.0.5 (Pb free)
Solder temp: 260ºC±5ºC (pb Free)
Immersion time: 10 ± 1 sec.
Solderability: 90% terminal coverage
Resistance to solder heat:
Sn/Ag3.0/Cu.0.5 (Pb free)
05/20/10
Test Condition
Operating Temperature: -55ºC-125ºC
Storage Temperature: -55ºC to +125ºC
after mounting to PCB, -5ºC to +40ºC @
Impedance Analyzer
or HP4338B
HFCLR03-0N3S-RC 0.3 0.3nH 810000 0.05 300
HFCLR03-0N5S-RC
HFCLR03-0N8S-RC 0.5
0.8
0.3nH
0.3nH 8
810000
10000 0.06
0.06 300
300
HFCLR03-2N0S-RC 2.0 0.3nH 86000 0.10 300
HFCLR03-2N4S-RC 2.4 0.3nH 86000 0.15 300
HFCLR03-3N0S-RC 3.0 0.3nH 86000 0.17 300
HFCLR03-3N9S-RC 3.9 0.3nH 86000 0.18 300
HFCLR03-4N3S-RC 4.3 0.3nH 86000 0.18 300
40% to 70% humidity before mounting to PCB
5, 10
5, 10
5, 10
5, 10
0.58
0.65
0.72
0.82
33
39
47
56
8
8
8
8
1600
1200
1000
800
200
200
200
200
HFCLR03-33N_-RC
HFCLR03-39N_-RC
HFCLR03-47N_-RC
HFCLR03-56N_-RC
5, 10
5, 10 0.92
1.20
68
82 8
8 800
700 180
150
HFCLR03-68N_-RC
HFCLR03-82N_-RC
