EHF–125–01–L–D–SM–LC
Polarized
(1,27mm)
.050"
pitch Optional
Locking Clip
Ejector
mechanism
EHF–110–01–F–D–SM–LC
EHF–105–01–F–D–SM
WWW.SAMTEC.COM
Mates with:
FFSD, FFTP
EHF 1NO. PINS
PER ROW 01 D
PLATING
OPTION
05, 08, 10, 13, 17, 20, 25 –L
= 10µ" (0,25µm)
Gold on post,
Matte Tin on tail
–F
= Gold fl ash on post,
Matte Tin on tail
F-209-1
. 050"(1,27mm) EJECTOR HEADER EHF, ECF
SERIES
–P
Note: Some lengths, styles
and options are non-standard,
non-returnable.
OTHER
OPTION
01
02
No. of positions x (1,27) .050
+ (14,48) .570
No. of positions x (1,27) .050
+ (7,37) .290
(1,27)
.050
(0,41)
.016 SQ
(3,05)
.120 (1,52)
.060
(3,05)
.120
(8,26)
.325
(11,30)
.445
(7,52)
.296
(8,51)
.335
(6,67)
.263
(3,43)
.135
x
(5,08)
.200
(7,44)
.293
(1,27)
.050
(2,72)
.107
(1,27)
.050
(1,27)
.050 (2,29)
.090
–“XX”
= Polarized Position
(–RA not available)
–LC
= Locking Clip
(–SM Only)
–K
= (7,50mm) .295" DIA
Polyimide Film Pick
& Place Pad
–P
= Pick & Place Pad
(–SM Only)
–TR
= Tape & Reel
Packaging
(–LC not available)
For complete specifi cations and
rec om mend ed PCB layouts
see www.samtec.com?EHF
Insulator Material:
Black Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over 50µ"
(1,27µm) Ni
Current Rating:
1.75A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
RoHS Compliant:
Ye s
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max
(Latch removed for clarity)
TAIL
OPTION
Leave blank
for Through-
Hole version
–SM
= Surface
Mount
–RA
=Right Angle
–RA
–SM –TH
–TH
–SM –RA
ECF
05, 08, 10,
13, 17, 20, 25
EJECTOR HEADER CAP
(Locks FFSD cable to EHF header)
NO. PINS PER ROW
No. of positions x (1,27) .050
+ (18,03) .710
(8,76)
.345
(9,65)
.380
SPECIFICATIONS
