DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC8178TK SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS DESCRIPTION The PC8178TK is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC can realize low current consumption with external chip inductor which can not be realized on internal 50 wide band matched IC. PC8178TK adopts 6-pin lead-less minimold package using same chip as the conventional PC8178TB in 6-pin super minimold. TK suffix IC which is smaller package than TB suffix IC contributes to reduce mounting space by 50 %. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. FEATURES * Low current consumption * Supply voltage * Excellent isolation * Power gain : ICC = 1.9 mA TYP. @ VCC = 3.0 V : VCC = 2.4 to 3.3 V : ISL = 40 dB TYP. @ f = 1.0 GHz ISL = 41 dB TYP. @ f = 1.9 GHz ISL = 42 dB TYP. @ f = 2.4 GHz : GP = 11.0 dB TYP. @ f = 1.0 GHz GP = 11.0 dB TYP. @ f = 1.9 GHz GP = 11.0 dB TYP. @ f = 2.4 GHz * Gain 1 dB compression output power : PO (1 dB) = -5.5 dBm TYP. @ f = 1.0 GHz PO (1 dB) = -8.0 dBm TYP. @ f = 1.9 GHz PO (1 dB) = -8.0 dBm TYP. @ f = 2.4 GHz * Operating frequency : 0.1 to 2.4 GHz (Output port LC matching) * Light weight : 3 mg (Standard value) * High-density surface mounting : 6-pin lead-less minimold package (1.5 x 1.3 x 0.55 mm) APPLICAION * Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PU10063EJ02V0DS (2nd edition) Date Published March 2005 CP(K) The mark shows major revised points. PC8178TK ORDERING INFORMATION Part Number PC8178TK-E2 Order Number PC8178TK-E2-A Package Marking 6-pin lead-less minimold 6B (1511) (Pb-Free) Supplying Form * Embossed tape 8 mm wide Note * Pin 1, 2, 3 face the perforation side of the tape * Qty 5 kpcs/reel Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC8178TK PRODUCT LINE-UP (TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 ) Parameter 1.0 GHz output port 1.66 GHz output port 1.9 GHz output port 2.4 GHz output port matching frequency matching frequency matching frequency matching frequency Marking ICC GP ISL PO(1dB) GP ISL PO(1dB) GP ISL PO(1dB) GP ISL PO(1dB) (mA) (dB) (dB) (dBm) (dB) (dB) (dBm) (dB) (dB) (dBm) (dB) (dB) (dBm) PC8178TB 1.9 11.0 39.0 -4.0 - - - 11.5 40.0 -7.0 11.5 38.0 -7.5 C3B PC8178TK 1.9 11.0 40.0 -5.5 - - - 11.0 41.0 -8.0 11.0 42.0 -8.0 6B PC8179TB 4.0 13.5 44.0 +3.0 - - - 15.5 42.0 +1.5 15.5 41.0 +1.0 C3C PC8128TB 2.8 12.5 39.0 -4.0 13.0 39.0 -4.0 13.0 37.0 -4.0 - - - C2P PC8151TB 4.2 12.5 38.0 +2.5 15.0 36.0 +1.5 15.0 34.0 +0.5 - - - C2U PC8152TB 5.6 23.0 40.0 -4.5 19.5 38.0 -8.5 17.5 35.0 -8.5 - - - C2V Part No. Remarks 1. Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2. To know the associated product, please refer to each latest data sheet. 2 Data Sheet PU10063EJ02V0DS PC8178TK SYSTEM APPLICATION EXAMPLE Location examples in digital cellular Low Noise Tr. RX I Q DEMOD. SW /N PLL PLL I 0 TX PA 90 Q These ICs can be added to your system around parts, when you need more isolation or gain. The application herein, however, shows only examples, therefore the application can depend on your kit evaluation. Data Sheet PU10063EJ02V0DS 3 PC8178TK PIN CONNECTIONS (Top View) 2 6B 1 (Bottom View) 3 6 6 1 5 5 2 4 4 3 Pin No. Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC PIN EXPLANATION Pin Pin No. Name 1 INPUT Applied Pin Voltage (V) Voltage Note (V) - 0.90 Function and Applications Internal Equivalent Circuit Signal input pin. A internal matching circuit, configured with resisters, enables 50 connection over a wide band. This pin must be coupled to signal source with capacitor for DC cut. 2 GND 0 - Ground pin. This pin should be 3 connected to system ground with 5 minimum inductance. Ground 6 4 pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance defference. 4 OUTPUT Voltage - Signal output pin. This pin is de- as same signed as collector output. Due to as VCC the high impedance output, this pin through should be externally equipped with external LC matching circuit to next stage. inductor For L, a size 1 005 chip inductor can be chosen. 6 VCC 2.4 to 3.3 - Power supply pin. This pin should be externally equipped with bypass capacitor to minimize its impedance. Note Pin voltage is measured at VCC = 3.0 V. 4 Data Sheet PU10063EJ02V0DS 2 3 1 5 PC8178TK ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit Supply Voltage VCC TA = +25C, Pin 4, Pin 6 3.6 V Circuit Current ICC TA = +25C 15 mA Power Dissipation PD TA = +85C 232 mW Operating Ambient Temperature TA -40 to +85 C Storage Temperature Tstg -55 to +150 C Input Power Pin +5 dBm Note TA = +25C Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Supply Voltage Symbol MIN. TYP. MAX. Unit Remarks VCC 2.4 3.0 3.3 V The same voltage should be applied to pin 4 and pin 6. Operating Ambient Temperature TA -40 +25 +85 C ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 , at LC matched frequency) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No signal 1.4 1.9 2.4 mA Power Gain GP f = 1.0 GHz, Pin = -30 dBm 9.0 11.0 13.0 dB f = 1.9 GHz, Pin = -30 dBm 9.0 11.0 13.5 f = 2.4 GHz, Pin = -30 dBm 9.0 11.0 13.5 f = 1.0 GHz, Pin = -30 dBm 35.0 40.0 - f = 1.9 GHz, Pin = -30 dBm 36.0 41.0 - f = 2.4 GHz, Pin = -30 dBm 37.0 42.0 - f = 1.0 GHz -8.0 -5.5 - f = 1.9 GHz -11.0 -8.0 - f = 2.4 GHz -11.5 -8.0 - f = 1.0 GHz - 5.5 7.0 f = 1.9 GHz - 5.5 7.0 f = 2.4 GHz - 5.5 7.0 f = 1.0 GHz, Pin = -30 dBm 4.0 7.0 - f = 1.9 GHz, Pin = -30 dBm 5.0 8.0 - f = 2.4 GHz, Pin = -30 dBm 6.5 9.5 - Isolation Gain 1 dB Compression Output ISL PO(1 dB) Power Noise Figure Input Return Loss NF RLin Data Sheet PU10063EJ02V0DS dB dBm dB dB 5 PC8178TK TEST CIRCUITS <1> f = 1.0 GHz Output port matching circuit C6 C5 VCC C4 L1 6 C1 C2 4 1 IN C3 OUT DUT Strip Line : 1 mm Strip Line : 5 mm 2, 3, 5 <2> f = 1.9 GHz Output port matching circuit C7 C6 C5 VCC C4 L1 6 C1 IN C2 4 1 C3 OUT DUT Strip Line : 7 mm 2, 3, 5 <3> f = 2.4 GHz Output port matching circuit C6 C5 C4 VCC C3 L2 6 C1 IN 1 4 C2 L1 OUT DUT Strip Line : 4 mm 2, 3, 5 Strip Line : 3 mm 6 Data Sheet PU10063EJ02V0DS PC8178TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD <1> f = 1.0 GHz VCC C6 IN VCC C5 C4 Top View OUT 6B L1 C1 C2 C3 Mounting direction PC8178TK (1) 42 x 35 x 0.4 mm polyimide board, double-sided copper clad (2) Back side: GND pattern (3) Gold plated on pattern (4) {: Through holes COMPONENT LIST Form Symbol Value Type code Maker C1, C3 1 000 pF GRM40CH102J50PT murata C2 0.75 pF GRM39CKR75C50PT murata C4 20 pF GRM39CH200J50PT murata C5 10 pF GRM39CH100D50PT murata Feed-though Capacitor C6 1 000 pF DFT301-801 x 7R102S50 murata Chip inductor L1 12 nH LL1608-FH12N TOKO Chip capacitor Data Sheet PU10063EJ02V0DS 7 PC8178TK <2> f = 1.9 GHz C5 VCC C7 IN VCC C4 Top View OUT C6 6B L1 C1 C2 C3 Mounting direction PC8178TK (1) 42 x 35 x 0.4 mm polyimide board, double-sided copper clad (2) Back side: GND pattern (3) Gold plated on pattern (4) {: Through holes COMPONENT LIST Form Symbol Value Type code Maker C1, C3, C5, C6 1 000 pF GRM40CH102J50PT murata C2 0.5 pF GRM39CKR5C50PT murata C4 8 pF GRM39CH080D50PT murata Feed-though Capacitor C7 1 000 pF DFT301-801 x 7R102S50 murata Chip inductor L1 2.7 nH LL1608-FH2N7S TOKO Chip capacitor 8 Data Sheet PU10063EJ02V0DS PC8178TK <3> f = 2.4 GHz VCC C4 C6 IN VCC OUT Top View C5 C3 6B L2 C1 L1 C2 Mounting direction PC8178TK (1) 42 x 35 x 0.4 mm polyimide board, double-sided copper clad (2) Back side: GND pattern (3) Gold plated on pattern (4) {: Through holes COMPONENT LIST Form Symbol Value Type code Maker C1, C2, C4, C5 1 000 pF GRM40CH102J50PT murata C3 10 pF GRM39CH100D50PT murata Feed-though Capacitor C6 1 000 pF DFT301-801 x 7R102S50 murata Chip inductor L1 2.7 nH LL1608-FH2N7S TOKO L2 1.8 nH LL1608-FH1N8S TOKO Chip capacitor Data Sheet PU10063EJ02V0DS 9 PC8178TK TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified) CIRCUIT CURRENT vs. SUPPLY VOLTAGE Circuit Current ICC (mA) 3.0 2.5 2.0 1.5 TA = +25C 1.0 +50C +85C 0.5 -40C -20C 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Supply Voltage VCC (V) Remark The graph indicates nominal characteristics. 10 Data Sheet PU10063EJ02V0DS PC8178TK f = 1.0 GHz MATCHING S22-FREQUENCY S11-FREQUENCY 1: 54.049 -12.43 12.804 pF 1: 63.219 -64.27 2.4764 pF MARKER 1 1.0 GHz MARKER 1 1.0 GHz 1 1 VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz S12-FREQUENCY S11-FREQUENCY S11 log 0 -2 -4 MAG 2 dB/ REF 0 dB 1 : -6.9156 dB Pin = -30 dBm, MARKER 1 f = 1.0 GHz VCC = 2.4 V S12 log -20 MAG -40 -10 -45 -12 3.3 V -14 -55 -16 -60 -18 -65 -20 START 100.000 000 MHz STOP 3 100.000 000 MHz -70 START 100.000 000 MHz REF 0 dB 1 : 11.235 dB Pin = -30 dBm, MARKER 1 f = 1.0 GHz S22 log 0 -4 14 -6 1 6 2 dB/ REF 0 dB 1 : -16.86 dB VCC = 2.4 V 2.7 V 3.0 V 3.3 V -8 -10 10 8 MAG -2 16 12 STOP 3 100.000 000 MHz S22-FREQUENCY S21-FREQUENCY 2 dB/ VCC = 2.4 V 2.7 V 3.0 V 3.3 V 1 -50 2.7 V 18 1 : -40.104 dB Pin = -30 dBm, MARKER 1 f = 1.0 GHz -35 3.0 V MAG REF -20 dB -30 -8 S21 log 20 5 dB/ -25 1 -6 STOP 3 100.000 000 MHz -12 VCC = 3.3 V 3.0 V 4 -14 -16 2.7 V 2 2.4 V 0 START 100.000 000 MHz 1 -18 STOP 3 100.000 000 MHz -20 START 100.000 000 MHz Pin = -30 dBm, MARKER 1 f = 1.0 GHz STOP 3 100.000 000 MHz Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 11 PC8178TK S11-FREQUENCY S11 log 0 MAG 2 dB/ REF 0 dB S12-FREQUENCY 1 : -6.8297 dB -2 S12 log -20 MAG -35 -8 -40 -10 -45 -14 1 -55 -16 +25C -60 Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz -18 -20 START 100.000 000 MHz STOP 3 100.000 000 MHz -65 +85C -70 START 100.000 000 MHz MAG 2 dB/ REF 0 dB 1 : 11.053 dB Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz 18 S22 log 0 -4 14 -6 -12 TA = -40C 1 : -13.758 dB TA = -40C +25C +85C 1 -14 +25C -16 2 -18 STOP 3 100.000 000 MHz Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz -20 START 100.000 000 MHz Remark The graphs indicate nominal characteristics. 12 REF 0 dB -10 4 +85C 0 START 100.000 000 MHz 2 dB/ -8 1 10 6 MAG -2 16 8 STOP 3 100.000 000 MHz S22-FREQUENCY S21-FREQUENCY 12 TA = -40C -50 +25C +85C -12 1 : -39.127 dB -30 TA = -40C 1 -6 REF -20 dB Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz -25 -4 S21 log 20 5 dB/ Data Sheet PU10063EJ02V0DS STOP 3 100.000 000 MHz PC8178TK OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER 10 10 5 5 VCC = 3.3 V 0 3.0 V Output Power Pout (dBm) Output Power Pout (dBm) TA = -40C 2.4 V -5 2.7 V -10 -15 +25C 0 +85C -5 -10 -15 -20 -20 VCC = 3.0 V f = 1.0 GHz f = 1.0 GHz -10 -20 0 -25 -30 10 0 10 Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 3.5 dBm Pout (undes) 0 -10 -20 Pout (des) -30 IM3 (undes) -40 IM3 (des) -50 -60 -70 -80 -30 -20 VCC = 2.4 V f1 = 1 000 MHz f2 = 1 001 MHz -10 0 20 OIP3 = 4.2 dBm 10 Pout (undes) 0 -10 -20 Pout (des) -30 IM3 (des) -40 IM3 (undes) -50 -60 -70 -80 -30 Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 5.0 dBm 0 Pout (undes) -10 -20 -30 Pout (des) -40 IM3 (des) IM3 (undes) -50 -60 -70 -80 -30 -20 -20 VCC = 2.7 V f1 = 1 000 MHz f2 = 1 001 MHz -10 0 Input Power Pin (dBm) VCC = 3.0 V f1 = 1 000 MHz f2 = 1 001 MHz 0 -10 Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) -10 -20 Input Power Pin (dBm) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) -25 -30 OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 5.3 dBm 0 Pout (undes) -10 -20 Pout (des) -30 -40 IM3 (undes) -50 -60 -70 -80 -30 Input Power Pin (dBm) IM3 (des) -20 VCC = 3.3 V f1 = 1 000 MHz f2 = 1 001 MHz -10 0 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 13 20 10 OIP3 = 3.0 dBm Pout (undes) 0 -10 -20 Pout (des) -30 -40 IM3 (des) IM3 (undes) -50 VCC = 3.0 V TA = -40C f1 = 1 000 MHz f2 = 1 001 MHz -60 -70 -80 -30 -25 -20 -15 -10 -5 0 Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 5.0 dBm Pout (undes) 0 -10 -20 Pout (des) -30 IM3 (undes) -50 -60 -80 -30 -20 Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 20 10 OIP3 = 5.0 dBm Pout (undes) 0 -10 -20 -30 Pout (des) IM3 (des) -40 IM3 (undes) -50 VCC = 3.0 V TA = +85C f1 = 1 000 MHz f2 = 1 001 MHz -60 -70 -80 -30 -25 -20 -15 0 -5 -10 60 VCC = 3.0 V 50 3.3 V 40 2.4 V 2.7 V 30 20 10 f1 = 1 000 MHz f2 = 1 001 MHz 0 -25 6.5 6 TA = +85C +25C 5.5 5 -40C 4.5 f = 1.0 GHz 4 2 2.5 3 3.5 -20 -15 -10 -5 Output Power of Each Tone Pout (each) (dBm) NOISE FIGURE vs. SUPPLY VOLTAGE Noise Figure NF (dB) VCC = 3.0 V f1 = 1 000 MHz f2 = 1 001 MHz -10 0 -70 Input Power Pin (dBm) 4 Supply Voltage VCC (V) Remark The graphs indicate nominal characteristics. 14 IM3 (des) -40 Input Power Pin (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) PC8178TK Data Sheet PU10063EJ02V0DS 0 PC8178TK f = 1.9 GHz MATCHING S22-FREQUENCY S11-FREQUENCY 1: 33.535 -44.393 1.8869 pF MARKER 1 1.9 GHz 1: 43.529 -16.648 5.0314 pF MARKER 1 1.9 GHz 1 1 VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz S11-FREQUENCY S11 log 0 MAG 2 dB/ REF 0 dB S12-FREQUENCY 1 : -8.4012 dB -2 -4 VCC = 2.4 V -6 S12 log MAG 5 dB/ REF -20 dB -20 -25 Pin = -30 dBm, MARKER 1 f = 1.9 GHz -30 -35 2.7 V 1 -8 VCC = 2.4 V 2.7 V 3.0 V 3.3 V -45 3.0 V -12 -50 3.3 V -14 -55 -60 -16 Pin = -30 dBm, MARKER 1 f = 1.9 GHz -18 -20 START 100.000 000 MHz -65 STOP 3 100.000 000 MHz -70 START 100.000 000 MHz S21 log MAG 2 dB/ REF 0 dB 1 : 11.5 dB Pin = -30 dBm, MARKER 1 f = 1.9 GHz 18 STOP 3 100.000 000 MHz S22-FREQUENCY S21-FREQUENCY S22 log 0 MAG 2 dB/ REF 0 dB 1 : -15.578 dB -2 -4 16 14 1 : -41.705 dB 1 -40 -10 20 STOP 3 100.000 000 MHz VCC = 3.0 V 12 -6 1 3.3 V -8 10 8 -12 2.4 V 6 -14 4 -16 2 0 START 100.000 000 MHz VCC = 2.4 V 2.7 V 3.0 V 3.3 V -10 2.7 V STOP 3 100.000 000 MHz 1 -18 Pin = -30 dBm, MARKER 1 f = 1.9 GHz -20 START 100.000 000 MHz STOP 3 100.000 000 MHz Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 15 PC8178TK S12-FREQUENCY S11-FREQUENCY S11 log 0 MAG 2 dB/ REF 0 dB 1 : -8.2405 dB -2 -4 TA = -40C -6 +25C -35 1 -8 S12 log MAG 5 dB/ REF -20 dB 1 : -40.84 dB -20 Pin = -30 dBm, VCC = 3.0 V -25 MARKER 1 f = 1.9 GHz TA = -40C -30 1 -40 -10 -45 -12 -50 +85C -14 -55 -16 -60 Pin = -30 dBm, VCC = 3.0 V -18 MARKER 1 f = 1.9 GHz -20 START 100.000 000 MHz STOP 3 100.000 000 MHz +25C +85C -65 -70 START 100.000 000 MHz S22-FREQUENCY S21-FREQUENCY S21 log MAG 2 dB/ REF 0 dB 20 Pin = -30 dBm, VCC = 3.0 V 18 MARKER 1 f = 1.9 GHz 16 14 +85C 12 1 : 11.553 dB S22 log 0 REF 0 dB 1 : -14.437 dB -6 1 TA = -40C -8 -14 4 -16 STOP 3 100.000 000 MHz TA = -40C +25C +85C -10 -12 +25C 2 1 Pin = -30 dBm, -18 VCC = 3.0 V, -20 MARKER 1 f = 1.9 GHz START 100.000 000 MHz STOP 3 100.000 000 MHz Remark The graphs indicate nominal characteristics. 16 2 dB/ -4 6 0 START 100.000 000 MHz MAG -2 10 8 STOP 3 100.000 000 MHz Data Sheet PU10063EJ02V0DS PC8178TK OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER 10 10 5 5 Output Power Pout (dBm) Output Power Pout (dBm) TA = -40C VCC = 3.3 V 0 3.0 V 2.7 V -5 2.4 V -10 -15 -10 -15 +85C f = 1.9 GHz, VCC = 3.0 V -25 -10 -30 -20 f = 1.9 GHz -25 -30 -20 0 -10 10 0 10 Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 0.8 dBm Pout (undes) 0 -10 IM3 (des) -20 Pout (des) -30 -40 IM3 (undes) -50 -60 -70 -80 -30 -20 VCC = 2.4 V f1 = 1 900 MHz f2 = 1 901 MHz -10 0 Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Input Power Pin (dBm) 20 10 OIP3 = 1.6 dBm Pout (undes) 0 IM3 (des) -10 -20 Pout (des) -30 -40 IM3 (undes) -50 -60 -70 -80 -30 -20 VCC = 2.7 V f1 = 1 900 MHz f2 = 1 901 MHz 0 -10 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 2.3 dBm 0 Pout (undes) IM3 (des) -10 -20 -30 Pout (des) -40 IM3 (undes) -50 -60 -70 -80 -30 -20 VCC = 3.0 V f1 = 1 900 MHz f2 = 1 901 MHz -10 0 Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) +25C -5 -20 -20 Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) 0 20 10 OIP3 = 2.5 dBm 0 Pout (undes) IM3 (des) -10 -20 Pout (des) -30 -40 IM3 (undes) -50 -60 -70 -80 -30 Input Power Pin (dBm) -20 VCC = 3.3 V f1 = 1 900 MHz f2 = 1 901 MHz 0 -10 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 17 20 10 OIP3 = 2.3 dBm Pout (undes) 0 -10 -20 Pout (des) -30 -40 IM3 (des) IM3 (undes) -50 VCC = 3.0 V TA = -40C f1 = 1 900 MHz f2 = 1 901 MHz -60 -70 -80 -30 -20 0 -10 Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 2.3 dBm -20 -30 IM3 (undes) IM3 (des) -50 -60 VCC = 3.0 V f1 = 1 900 MHz f2 = 1 901 MHz -10 0 -70 -80 -30 -20 Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 20 10 OIP3 = 2.1 dBm 0 Pout (undes) -10 -20 -30 Pout (des) IM3 (des) -40 IM3 (undes) -50 VCC = 3.0 V TA = +85C f1 = 1 900 MHz f2 = 1 901 MHz -60 -70 -80 -30 -10 -20 0 50 45 35 30 15 5 0 -25 -40C 3 3.5 -20 -15 f1 = 1 900 MHz f2 = 1 901 MHz 0 -10 -5 Output Power of Each Tone Pout (each) (dBm) 5 f = 1.9 GHz 4 2 2.5 2.7 V 10 +25C 4.5 2.4 V 20 TA = +85C 5.5 3.3 V 25 NOISE FIGURE vs. SUPPLY VOLTAGE 6 VCC = 3.0 V 40 6.5 Noise Figure NF (dB) Pout (des) -40 Input Power Pin (dBm) 4 Supply Voltage VCC (V) Remark The graphs indicate nominal characteristics. 18 Pout (undes) 0 -10 Input Power Pin (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) PC8178TK Data Sheet PU10063EJ02V0DS PC8178TK f = 2.4 GHz MATCHING S22-FREQUENCY S11-FREQUENCY 1: 47.047 13.205 875.69 pH 1: 26.945 -32.572 2.0359 pF MARKER 1 2.4 GHz 1 MARKER 1 2.4 GHz 1 VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm START 100.000 000 MHz STOP 3 100.000 000 MHz VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm START 100.000 000 MHz S12-FREQUENCY S11-FREQUENCY S11 log 0 MAG 2 dB/ REF 0 dB 1 : -10.022 dB -2 -4 -6 -10 -50 2.7 V 3.0 V -55 VCC = 2.4 V 2.7 V 3.0 V 3.3 V -60 -16 -18 Pin = -30 dBm, MARKER 1 f = 2.4 GHz -20 START 100.000 000 MHz -65 STOP 3 100.000 000 MHz -70 START 100.000 000 MHz S21-FREQUENCY S21 log MAG 2 dB/ REF 0 dB 20 Pin = -30 dBm, 18 MARKER 1 f = 2.4 GHz 16 14 VCC = 3.3 V 12 10 S22 log 0 MAG 2 dB/ REF 0 dB 1 : -16.424 dB -2 -4 3.0 V -6 1 -8 2.4 V -10 -12 VCC = 2.4 V 2.7 V 3.0 V 3.3 V -14 2.7 V -16 4 2 0 START 100.000 000 MHz STOP 3 100.000 000 MHz S22-FREQUENCY 1 : 11.623 dB 8 6 VCC = 2.4 V 2.7 V 3.0 V 3.3 V -45 3.3 V -14 1 : -41.967 dB 1 -40 1 -12 S12 log MAG 5 dB/ REF -20 dB -20 -25 Pin = -30 dBm, MARKER 1 f = 2.4 GHz -30 -35 VCC = 2.4 V -8 STOP 3 100.000 000 MHz -18 STOP 3 100.000 000 MHz 1 Pin = -30 dBm, MARKER 1 f = 2.4 GHz -20 START 100.000 000 MHz STOP 3 100.000 000 MHz Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 19 PC8178TK S11-FREQUENCY S11 log 0 MAG 2 dB/ REF 0 dB S12-FREQUENCY 1 : -10.156 dB -2 -4 TA = -40C -6 +25C -8 S12 log MAG 5 dB/ REF -20 dB 1 : -39.14 dB -20 -25 Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz TA = -40C -30 +25C -35 1 -40 1 -10 -45 -12 -50 +85C -14 -55 -16 -60 -18 Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz -20 START 100.000 000 MHz STOP 3 100.000 000 MHz -65 -70 START 100.000 000 MHz S21-FREQUENCY S22-FREQUENCY S21 log MAG 2 dB/ REF 0 dB 20 Pin = -30 dBm, VCC = 3.0 V 18 MARKER 1 f = 2.4 GHz 16 TA = -40C 14 1 : 10.851 dB 12 1 10 S22 log 0 REF 0 dB 1 : -12.302 dB TA = +85C -6 -8 -10 +25C 6 -14 +25C 1 -40C -16 +85C 2 STOP 3 100.000 000 MHz -18 Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz -20 START 100.000 000 MHz STOP 3 100.000 000 MHz Remark The graphs indicate nominal characteristics. 20 2 dB/ -4 -12 0 START 100.000 000 MHz MAG -2 8 4 +85C STOP 3 100.000 000 MHz Data Sheet PU10063EJ02V0DS PC8178TK OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER 10 10 5 VCC = 3.0 V 3.3 V 0 Output Power Pout (dBm) Output Power Pout (dBm) 5 -5 2.7 V -10 2.4 V -15 -20 0 TA = +85C -5 -40C -10 -15 -20 +25C -25 -30 -20 f = 2.4 GHz, VCC = 3.0 V 0 10 f = 2.4 GHz -25 -30 -10 -20 0 10 OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 1.0 dBm Pout (undes) 0 -10 IM3 (undes) -20 Pout (des) -30 -40 IM3 (des) -50 -60 VCC = 2.4 V f1 = 2 400 MHz f2 = 2 401 MHz -70 -80 -30 -20 -10 0 Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 1.4 dBm Pout (undes) 0 -10 IM3 (undes) -20 Pout (des) -30 IM3 (des) -40 -50 -60 VCC = 2.7 V f1 = 2 400 MHz f2 = 2 401 MHz -70 -80 -30 -20 -10 0 Input Power Pin (dBm) Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 2.1 dBm 0 Pout (undes) -10 IM3 (undes) -20 -30 Pout (des) IM3 (des) -40 -50 -60 -70 -80 -30 -20 VCC = 3.0 V f1 = 2 400 MHz f2 = 2 401 MHz -10 0 Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Input Power Pin (dBm) -10 20 10 OIP3 = 2.6 dBm 0 Pout (undes) IM3 (undes) -10 -20 -30 Pout (des) IM3 (des) -40 -50 -60 -70 -80 -30 -20 VCC = 3.3 V f1 = 2 400 MHz f2 = 2 401 MHz -10 0 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 21 20 10 OIP3 = 1.1 dBm Pout (undes) 0 -10 Pout (des) IM3 (undes) -20 -30 IM3 (des) -40 -50 VCC = 3.0 V TA = -40C f1 = 2 400 MHz f2 = 2 401 MHz -60 -70 -80 -30 -20 -10 0 Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) OUTPUT POWER, IM3 vs. INPUT POWER OUTPUT POWER, IM3 vs. INPUT POWER 20 10 OIP3 = 2.1 dBm -10 -30 -40 IM3 (des) IM3 (undes) -50 -60 -70 -80 -30 -20 VCC = 3.0 V f1 = 2 400 MHz f2 = 2 401 MHz -10 0 Input Power Pin (dBm) OUTPUT POWER, IM3 vs. INPUT POWER 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 20 10 OIP3 = 2.2 dBm Pout (undes) 0 -10 Pout (des) -20 -30 IM3 (undes) -40 IM3 (des) -50 VCC = 3.0 V TA = +85C f1 = 2 400 MHz f2 = 2 401 MHz -60 -70 -80 -30 -20 -10 0 50 45 40 35 20 15 10 0 -25 +25C 5.5 5 -40C 4.5 f = 2.4 GHz 3.5 -20 -15 -10 -5 Output Power of Each Tone Pout (each) (dBm) 6 3 f1 = 2 400 MHz f2 = 2 401 MHz 5 TA = +85C 2.5 2.7 V 25 NOISE FIGURE vs. SUPPLY VOLTAGE 4 2 VCC = 3.0 V 3.3 V 2.4 V 30 6.5 Noise Figure NF (dB) Pout (des) -20 Input Power Pin (dBm) 4 Supply Voltage VCC (V) Remark The graphs indicate nominal characteristics. 22 Pout (undes) 0 Input Power Pin (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) PC8178TK Data Sheet PU10063EJ02V0DS 0 PC8178TK f = 3.0 GHz MATCHING S22-FREQUENCY S11-FREQUENCY 1: 67.34 -63.512 1 GHz 2: 34.416 -46.209 1.9 GHz 3: 27.732 -34.887 2.4 GHz 4: 24.257 -25.16 2.1086 pF MARKER 4 3 GHz 4 1 3 2 START 100.000 000 MHz 1: 100.98 1 GHz 2: 61.047 1.9 GHz 3: 45.648 2.4 GHz 4: 29.031 354.18 fF -350.69 -216.37 -180.84 -149.79 2 4 1 VCC = 3.0 V, ICC = 2.11 mA 3 Pin = -30 dBm, TA = +25C (at L loaded) VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm, TA = +25C (at L loaded) STOP 3 100.000 000 MHz MARKER 4 3 GHz START 100.000 000 MHz STOP 3 100.000 000 MHz Remark The graphs indicate nominal characteristics. Data Sheet PU10063EJ02V0DS 23 PC8178TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) (Bottom View) 0.160.05 1.50.1 0.480.05 0.480.05 (Top View) 1.10.1 0.20.1 24 0.11+0.1 -0.05 0.550.03 1.30.05 Data Sheet PU10063EJ02V0DS 0.90.1 PC8178TK NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor (L) should be attached between output and VCC pins. The L and series capacitor (C) values should be adjusted for applied frequency to match impedance to next stage. (5) The DC capacitor must be attached to input pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10063EJ02V0DS 25 PC8178TK When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. * The information in this document is current as of March, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 26 Data Sheet PU10063EJ02V0DS PC8178TK For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406