Phycomp Product specification
Surface-mount ceramic
multilayer capacitors Class 2, Y5V
16/25/50 V
2003 Jul 08 Rev.7 9 www.yageo.com
TESTS AND REQUIREMENTS
Table 2 Test procedures and requirements
IEC
60384-10/
CECC 32 100
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.4 mounting the capacitors may be mounted
on printed-circuit boards or
ceramic substrates by applying
wave soldering, reflow soldering
(including vapour phase
soldering) or conductive
adhesive
no visible damage
4.5 visual inspection and
dimension check any applicable method using ×10
magnification in accordance with
specification
4.6.1 capacitance f = 1 kHz; Y5V measuring
voltage 1 Vrms at 25 °C within specified tolerance
4.6.2 tan
δ f = 1 kHz; Y5V measuring
voltage 1 Vrms at 25 °C in accordance with
specification
4.6.3 insulation resistance
at UR (DC) for 1 minute RiCR ≥500 s
4.6.4 voltage proof 2.5 × UR for 1 minute no breakdown or flashover
4.7.1 temperature
coefficient between minimum and maximum
temperature in accordance with
specification
4.8 adhesion a force of 5 N applied for 10 s to
the line joining the terminations
and in a plane parallel to the
substrate
no visible damage
mounted in accordance with IEC
60384-1, paragraph 4.35 no visible damage 4.9 bond strength of
plating on end face
conditions:
bending 1 mm at a rate of 1
mm/s, radius jig 340 mm
∆C/C: ≤30%
resistance to
soldering heat preconditioning:
120 to 150 °C during 1 minute;
260 ±5 °C for 10 ±0.5 s in a
static solder bath
the terminations shall be
well tinned
after recovery ∆C/C: ±20%
tan δ: original specification
Rins: original specification
4.10 Tb
resistance to
leaching 260 ±5 °C for 30 ±1 s
in a static solder bath using visual enlargement
of ×10, dissolution of the
terminations shall not
exceed 10%