MS5837-30BA Ultra Small Gel Filled Pressure Sensor SPECIFICATIONS Ceramic - metal package, 3.3 x 3.3 x 2.75mm High-resolution module 0.2 mbar Fast conversion down to 0.5 ms Low power, 0.6 A (standby < 0.1 A at 25C) Integrated digital pressure sensor (24 bit ADC) Supply voltage 1.5 to 3.6 V Operating range: 0 to 30 bar, -20 to +85 C 2 I C interface No external components (Internal oscillator) Excellent long term stability Hermetically sealable for outdoor devices Sealing designed for 1.8 x 0.8mm O-ring The MS5837-30BA is a new generation of high resolution 2 pressure sensors with I C bus interface for dept h measurement systems with a water depth resolution of 2 mm. The sensor module includes a high linearity pressure sensor and an ultra-low power 24 bit ADC with int ernal factory calibrated coefficients. It provides a precise digit al 24 Bit pressure and temperature value and different operation modes that allow the user to optimize for conversion speed and current consumption. A high resolution temperature output allows the implementation in depth measurement systems and thermometer function without any additional sensor. The MS5837-30BA can be interfaced to virtually any microcontroller. The communication protocol is simple, without the need of programming internal registers in the device. The gel protection and antimagnetic stainless steel cap make the module water resistant. This new sensor module generation is based on leading MEMS technology and latest benefits from MEAS Switzerland proven experience and know -how in high volume manufacturing, which has been widely used for over a decade. SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 1 MS5837-30BA Ultra Small Gel Filled Pressure Sensor PERFORMANCE SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Storage temperature Overpressure Maximum Soldering Temperature Symbol VDD TS Pmax Conditions Tmax Min. -0.3 -40 ISO 22810 Max +4 +85 50 Unit V C Bar 40 sec max 250 C -2 +2 kV -100 +100 mA Max 3.6 +85 Unit V C Human Body Model JEDEC standard No 78 ESD rating Latch up Typ. ELECTRICAL CHARACTERISTICS Parameter Operating Supply voltage Operating Temperature Supply current (1 sample per sec.) Symbol VDD T IDD Peak supply current Standby supply current VDD Capacitor Conditions Min. 1.5 -20 OSR 8192 4096 2048 1024 512 256 during conversion at 25C From VDD to GND 100 Conditions Min. Typ. 3.0 +25 20.09 10.05 5.02 2.51 1.26 0.63 1.25 0.01 470 A 0.1 mA A nF ANALOG DIGITAL CONVERTER (ADC) Parameter Output Word Symbol OSR Conversion time (1) tc 8192 4096 2048 1024 512 256 14.8 7.40 3.72 1.88 0.95 0.48 Typ. 24 16.44 8.22 4.13 2.08 1.06 0.54 Max 18.08 9.04 4.54 2.28 1.17 0.60 Unit Bit ms (1): Maximum values must be applied to determine w aiting times in I2C communication SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 2 MS5837-30BA Ultra Small Gel Filled Pressure Sensor PERFORMANCE SPECIFICATIONS (CONTINUED) PRESSURE OUTPUT CHARACTERISTICS (V DD = 3 V, T = 25C UNLESS OTHERWISE NOTED ) Parameter Operating Pressure Range Absolute Accuracy (1), Temperature range: 0 ... 40C Absolute Accuracy (1), Temperature range: -20 ... 85C Maximum error with supply voltage (2) Long-term stability Resolution RMS Reflow soldering impact Conditions Prange Full Accuracy 0 ... 6 bar 0 ... 20 bar 0 ... 30 bar 0 ... 6 bar 0 ... 20 bar 0 ... 30 bar Min. 0 -50 -100 -200 -100 -200 -400 VDD = 1.5 V ... 3.6 V OSR 8192 4096 2048 1024 512 256 IPC/JEDEC J-STD-020D.1 (See application note AN808 on http://meas -spec.com) Recovering time after reflow (3) Typ. Max 30 +50 +100 +200 +100 +200 +400 Unit Bar mbar mbar 30 mbar 30 mbar/year 0.20 0.28 0.38 0.54 0.84 1.57 mbar -8 mbar 7 Days (1) With autozero at one pressure point (2) With autozero at 3V point (3) Time to recover at least 66% of the reflow impact. TEMPERATURE OUTPUT CHARACTERISTICS (V DD = 3 V, T = 25C UNLESS OTHERWISE NOTED) Parameter Conditions 0 ...10 bar, 25C Min. -1.5 Absolute Accuracy 0 ...10 bar, 0..60C -20..85C Maximum error with supply voltage VDD = 1.5 V ... 3.6 V OSR 8192 4096 2048 1024 512 256 Resolution RMS SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 Typ. Max +1.5 Unit -2.0 +2.0 C -4.0 +4.0 0.3 C 0.0022 0.0026 0.0033 0.0041 0.0055 0.0086 C 3 MS5837-30BA Ultra Small Gel Filled Pressure Sensor PERFORMANCE SPECIFICATIONS (CONTINUED) DIGITAL INPUTS (SCL, SDA) Parameter Serial data clock Input high voltage Input low voltage Input leakage current Symbol SCL VIH VIL Ileak25C Conditions Min. Parameter Output high voltage Symbol VOH Conditions Isource = 0.6 mA Min. 80% VDD Output low voltage VOL Isink 0% VDD Typ. Max 400 100% VDD 20% VDD 0.1 Unit kHz V V A Typ. Max 100% VDD Unit V 80% VDD 0% VDD at 25c DIGITAL OUTPUTS (SDA) SENSOR SOLUTIONS /// MS5837-30BA = 0.6 mA 10/11/2015 20% VDD V 4 MS5837-30BA Ultra Small Gel Filled Pressure Sensor PERFORMANCE CHARACTERISTICS PRESSURE ERROR VS PRESSURE AND TEMPERATURE TEMPERATURE ERROR VS PRESSURE AND TEMPERATURE PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 5 MS5837-30BA Ultra Small Gel Filled Pressure Sensor FUNCTIONAL DESCRIPTION GENERAL The MS5837-30BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the MS5837-30BA is to convert the uncompensat ed analogue out put voltage from the piezo -resistive pressure sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor. FACTORY CALIBRATION E very module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients necessary to compensate for process variations and temperat ure variations are calc ulated and stored in the 112 bit PROM of each module. These bits (partitioned into 6 coefficients W1 to W6) must be read by the microcontroller soft ware and used in the program converting D1 and D2 into compensated pressure and temperature values. The coefficients W0 is for factory configuration and CRC. SERIAL I2C INTERFACE The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The 2 sensor responds on the same pin SDA which is bidirectional for the I C bus interface. So this interface type uses only 2 signal lines and does not require a chip select. Module ref MS5837-30BA SENSOR SOLUTIONS /// MS5837-30BA Mode I2C 10/11/2015 Pins used SDA, SCL 6 MS5837-30BA Ultra Small Gel Filled Pressure Sensor PRESSURE AND TEMPERATURE CALCULATION Start Maximum v alues f or calculation results: PMIN = 0 bar PMAX = 30 bar T MIN = -20C TMAX = 85C TREF = 20C Convert calibration data data into coefficients (see bit pattern W1 to W4) Read calibration (factory calibrated) fromofPROM [1] Recommended Size variable type [bit] Variable Description | Equation Value min max Example / Typical C1 Pressure sensitiv ity | SENST1 unsigned int 16 16 0 65535 34982 C2 Pressure of f set | OFFT1 unsigned int 16 16 0 65535 36352 C3 Temperature coef f icient of pressure sensitiv ity | TCS unsigned int 16 16 0 65535 20328 C4 Temperature coef f icient of pressure of fset | TCO unsigned int 16 16 0 65535 22354 C5 Ref erence temperature | T REF unsigned int 16 16 0 65535 26646 C6 Temperature coef f icient of the temperature | TEMPSENS unsigned int 16 16 0 65535 26146 Read Read digital digitalpressure pressure and andtemperature temperature datadata D1 Digital pressure v alue unsigned int 32 24 0 16777215 4958179 D2 Digital temperature v alue unsigned int 32 24 0 16777215 6815414 -5962 Calculate temperature dT [2] Dif f erence between actual and ref erence temperature dT = D2 - TREF = D2 - C5 * 28 signed int 32 25 -16776960 16777215 TEMP Actual temperature (-40...85C with 0.01C resolution) TEMP = 20C+dT*TEMPSENS = 2000+dT *C6 /2 23 signed int 32 41 -4000 8500 1981 = 19.81 C Calculatetemperature temperature compensated pressure Calculate compensated pressure OFF Of f set at actual temperature[3] OFF = OFFT1 + TCO* dT = C2 * 216 + (C4* dT ) / 27 signed int 64 41 -17179344900 25769410560 2381326464 -8589672450 12884705280 1145816755 [4] SENS Sensitiv ity at actual temperature 15 8 SENS = SENS T1+ TCS * dT = C1 * 2 + (C3 * dT ) / 2 signed int 64 41 P Temperature compensated pressure (0...30 bar with 0.25mbar resolution) P = D1 * SENS - OFF = (D1 * SENS / 2 21- OFF) / 213 signed int 32 58 39998 0 300000 = 3999.8 mbar Display pressure and temperature value Notes [1] [2] [3] [4] Maximal size of intermediate result during ev aluation of v ariable min and max hav e to be def ined min and max hav e to be def ined min and max hav e to be def ined Flow chart for pressure and temperature reading and software compensation. SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 7 MS5837-30BA Ultra Small Gel Filled Pressure Sensor SECOND ORDER TEMPERATURE COMPENSATION Pressure and Temperature parameters values first order: OFF, SENS and TEMP Yes No (TEMP/ 100)< 20C Low temperature Low temperature High temperature Ti = 3 dT / 2 2 Ti = 2 dT2 / 237 33 OFFi = 1 (TEMP - 2000)2 / 24 SENSi = 0 OFFi = 3 (TEMP - 2000) / 2 SENSi = 5 (TEMP - 2000)2 / 23 2 1 No Yes (TEMP/ 100) < -15C Very low temperature OFFi = OFFi + 7 (TEMP + 1500) 2 SENSi = SENSi + 4 (TEMP + 1500)2 Calculate pressure and temperature 2 nd order OFF2 = OFF - OFFi SENS2 = SENS - SENSi TEMP2 = (TEMP - Ti) / 100 [C] P2 = ((( D1 SENS2 ) / 2 - OFF2) / 2 ) / 10 21 13 [mbar] Flow chart for pressure and temperature to the optimum accuracy. SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 8 MS5837-30BA Ultra Small Gel Filled Pressure Sensor I2C INTERFACE COMMANDS The MS5837-30BA has only five basic commands: 1. Reset 2. Read PROM (112 bit of calibration words) 3. D1 conversion 4. D2 conversion 5. Read ADC result (24 bit pressure / temperature) 2 Each I C communication message starts with the start condition and it is ended with t he stop condition. The MS5837-30BA address is 1110110x (write: x=0, read: x=1). Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands, the device will return 24 bit result and after the PROM read 16 bit results. The address of the PROM is embedded inside of the PROM read command using the a2, a1 and a0 bits. Command byte 0 1 2 PRO CO M NV 3 Typ 4 5 6 7 Ad2/ Ad1/ Ad0/ Stop Os2 Os1 Os0 Command Reset 0 0 0 1 1 1 1 0 0x1E Convert D1 (OSR=256) Convert D1 (OSR=512) Convert D1 (OSR=1024) Convert D1 (OSR=2048) Convert D1 (OSR=4096) Convert D1 (OSR=8192) Convert D2 (OSR=256) Convert D2 (OSR=512) Convert D2 (OSR=1024) Convert D2 (OSR=2048) Convert D2 (OSR=4096) Convert D2 (OSR=8192) ADC Read PROM Read 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 1 1 1 1 1 1 0 0 0 0 0 0 1 1 0 0 0 0 1 1 0 Ad2 0 0 1 1 0 0 0 0 1 1 0 0 0 Ad1 0 1 0 1 0 1 0 1 0 1 0 1 0 Ad0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0x40 0x42 0x44 0x46 0x48 0x4A 0x50 0x52 0x54 0x56 0x58 0x5A 0x00 0xA0 to 0xAE Bit number Bit name hex value Command structure SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 9 MS5837-30BA Ultra Small Gel Filled Pressure Sensor RESET SEQUENCE The Res et sequenc e shall be sent once after power-on to make sure that the calibration PROM gets loaded into the internal register. It can be also used to reset the device PROM from an unknown condition. The reset can be sent at any time. In the event that there is not a successful power on res et this may be caused by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5837-30BA to function is to send several SCLs followed by a reset sequence or to repeat power on reset. 1 1 1 0 1 1 0 0 0 0 0 0 1 1 1 1 0 0 Device Address command S Device Address W A cmd byte A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge I2C Reset Command PROM READ SEQUENCE The read command for P ROM shall be executed once after reset by the user to read the content of the calibration PROM and to calculate the calibration coefficients. There are in total 7 addresses resulting in a total memory of 112 bit. Addresses contain factory data and the setup, calibration coefficients, the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is clocked with the MSB first. The P ROM Read command consists of two parts. First command sets up the system into PROM read mode. The second part gets the data from the system. 1 1 1 0 1 1 0 0 0 1 0 1 0 0 1 1 0 0 Device Address command S Device Address W A cmd byte A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge 2 I C Command to read memory address= 011 1 1 1 0 1 1 0 1 0 X X X X X X X X 0 X X X X X X X X 0 Device Address data data S Device Address R A Memory bit 15 - 8 A Memory bit 7 - 0 N P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledage I2C answer from MS5837-30BA SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 10 MS5837-30BA Ultra Small Gel Filled Pressure Sensor CONVERSION SEQUENCE The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2) conversion. After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output result. If the A DC read command is sent during conversion the result will be 0, the conversi on will not stop and the final result will be wrong. Conversion sequence sent during the already started conversion process will yield incorrect result as well. A conversion can be started by sending the command to MS5837 -30BA. When command is sent to the system it stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read command, when acknowledge is sent from the MS5837 -30BA, 24 S CL cycles may be sent to receive all result bits. Every 8 bits the system wait s for an acknowledge signal. 1 1 1 0 1 1 0 0 0 0 1 0 0 1 0 0 0 0 Device Address command S Device Address W A cmd byte A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge I2C command to initiate a pressure conversion (OSR=4096, typ=D1) 1 1 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 Device Address command S Device Address W A cmd byte A P From Master From Slave S = Start Condition P = Stop Condition W = Write R = Read A = Acknowledge N = Not Acknowledge I2C ADC read sequence 1 1 1 0 1 1 0 Dev ice A ddress S Dev ice A ddress F rom M aster F rom S lave 1 0 X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0 data data data R A Data 23-16 A Data 15 - 8 A Data 7 - 0 N P S = S tart C ondition P = S top C ondition W = Write R = Read A = A cknow ledge N = N ot A cknow ledge I2C answer from MS5837-30BA SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 11 MS5837-30BA Ultra Small Gel Filled Pressure Sensor CYCLIC REDUNDANCY CHECK (CRC) MS5837-30BA contains a PROM memory with 112 -Bit. A 4-bit CRC has been implemented to check the data validity in memory. The besides C code describes in detail CRC-4 calculation. C6 D D D D D D D D D D D D D D D D B B B B B B 1 5 0 1 2 3 4 5 6 1 1 1 4 3 2 B B B B B B B B B B 1 1 9 8 7 6 5 4 3 2 1 0 1 0 CRC Factory defined C1 C2 C3 C4 C5 Memory PROM mapping C Code example for CRC-4 calculation: unsigned char crc4(unsigned int n_prom[]) { int cnt; unsigned int n_rem=0; unsigned char n_bit; // n_prom defined as 8x unsigned int (n_prom[8]) // simple counter // crc remainder n_prom[0]=((n_prom[0]) & 0x0FFF); n_prom[7]=0; for (cnt = 0; cnt < 16; cnt++) { // CRC byte is replaced by 0 // Subsidiary value, set to 0 // operation is performed on bytes // choose LSB or MSB if (cnt%2==1) n_rem ^= (unsigned short) ((n_prom[cnt>>1]) & 0x00FF); else n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8); for (n_bit = 8; n_bit > 0; n_bit--) { if (n_rem & (0x8000)) n_rem = (n_rem << 1) ^ 0x3000; else n_rem = (n_rem << 1); } } n_rem= ((n_rem >> 12) & 0x000F); return (n_rem ^ 0x00); // final 4-bit remainder is CRC code } SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 12 MS5837-30BA Ultra Small Gel Filled Pressure Sensor APPLICATION CIRCUIT The MS5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications. Typical application circuit PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE 0.1 1 2 3 4 GND VDD SCL SDA GROUND POSITIVE SUPPLY I2C CLOCK I2C DATA Package outlines and Pin configuration SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 13 MS5837-30BA Ultra Small Gel Filled Pressure Sensor RECOMMENDED PAD LAYOUT Pad layout for bottom side of the MS5837-30BA soldered onto printed circuit board. Recommended PCB footprint SHIPPING PACKAGE SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 14 MS5837-30BA Ultra Small Gel Filled Pressure Sensor MOUNTING AND ASSEMBLY CONSIDERATIONS SOLDERING Please refer to the application note AN808 available on our website for all soldering recommendations. MOUNTING The MS5837-30BA can be placed with automatic Pick & Place equipment using vac uum nozzles. It will not be damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It is important to solder all contact pads. CONNECTION TO PCB The package outline of the module allows the us e of a flexible P CB for interconnection. This can be important for applications in watches and other special devices. SEALING WITH O-RINGS In applications such as outdoor watches the electronics must be protected against direct water or humidity. For such applications the MS5837-30BA provides the possibility to seal with an O-ring. The O-ring shall be placed at the groove location, i.e. the small outer diameter of the metal lid. The following O-ring / housing dimensions are recommended: O-ring inner diameter O-ring cross-section diameter Housing bore diameter 1.8 0.05 mm 0.8 0.03 mm 3.07 0.03 mm Please refer to the application note AN523 available on our website for O-ring mounting recommendations. CLEANING The MS 5837-30BA has been manufactured under clean-room conditions. It is therefore recommended to assemble the sensor under class 10'000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the P CB, solder paste of type "no-clean" shall be used. Warning: cleaning might damage the sensor. ESD PRECAUTIONS The electrical contact pads are protected against ESD up to 2 kV HBM (human body model). It is therefore essential to ground machines and personnel properly during assembly and handling of the device. The MS5837 30BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. DECOUPLING CAPACITOR Particular care must be taken when connecting the device to the power supply. A minimum of 100nF ceramic capacitor must be placed as close as possible to the MS5837 -30BA VDD pin. This capacitor will stabilize the power supply during data conversion and thus, provide the highest possible accuracy. SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 15 MS5837-30BA Ultra Small Gel Filled Pressure Sensor ORDERING INFORMATION Part Number / Art. Number MS583730BA01-50 Product MS5837-30BA Ultra Small Gel Filled Pressure Sensor Delivery Form Tape & Reel NORTH AMERICA EUROPE ASIA Measurement Specialties, Inc., a TE Connectiv ity company 45738 Northport Loop West Fremont, CA 94538 Tel: +1 800 767 1888 Fax: +1 510 498 1578 e-mail: pf g.cs.amer@meas-spec.com Website: www.meas-spec.com MEAS Switzerland Sarl, a TE Connectiv ity company Ch. Chapons-des-Pres 11 CH-2022 Bev aix, Switzerland Tel: +41 32 847 9550 Fax: +41 32 847 9569 e-mail: sales.ch@meas-spec.com Website: www.meas-spec.com Measurement Specialties (China), Ltd., a TE Connectiv ity company No. 26 Langshan Road Shenzhen High-Tech Park (North) Nanshan District, Shenzhen, 518057 China Tel: +86 755 3330 5088 Fax: +86 755 3330 5099 e-mail: pf g.cs.asi@ameas-spec.com Website: www.meas-spec.com TE.com /sensorsolutions Measurement Specialties, Inc., a TE Connectivity company. Measurement Speci alties, TE Connecti vity, TE Connecti vity (logo) and EVERY CONNECTION COUNTS are trademar ks. All other logos, products and/or company names referred to herein might be trademarks of their respective owners. The information given herein, includi ng drawings, illustrati ons and sc hematics which are i ntended for illustration purpos es o nl y, is believed to be reliable. H owever, TE Connecti vity makes no warranties as to its accur ac y or c ompleteness and disclai ms any liability in c onnection with its us e. T E Connecti vity`s obligations s hall onl y be as s et forth i n TE Connecti vity`s Standard Terms and Conditions of Sale for this product and in no c ase will TE Connecti vity be liable for any i ncidental, i ndirect or cons equential damages arising out of the sal e, resal e, us e or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. (c) 2015 TE Connectivity Ltd. family of companies All Rights Reserved. CDOC-DA-0093 SENSOR SOLUTIONS /// MS5837-30BA 10/11/2015 16 4 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: TE Connectivity: MS583730BA01-50