SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
1
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SPECIFICATIONS
Ceramic - metal package, 3.3 x 3.3 x 2.75mm
High-resolution module 0.2 mbar
Fast conversion down to 0.5 ms
Low power, 0.6 µA (standby < 0.1 µA at 25°C)
Integrated digital pressure sensor (24 bit ΔΣ ADC)
Supply voltage 1.5 to 3.6 V
Operating range: 0 to 30 bar, -20 to +85 °C
I2C interface
No external components (Internal oscillator)
Excellent long term stability
Hermetically sealable for outdoor devices
Sealing designed for 1.8 x 0.8mm O-ring
The MS5837-30BA is a new generation of high resolution
pressure sensors with I2C bus interface for depth
measurement systems with a water depth resolution of 2 mm.
The sensor module includes a high linearity pressure sensor
and an ultra-low power 24 bit ΔΣ ADC with internal factory
calibrated coefficients. It provides a precise digital 24 Bit
pressure and temperature value and different operation modes
that allow the user to optimize for conversion speed and
current consumption. A high resolution temperature output
allows the implementation in depth measurement systems and
thermometer function without any additional sensor. The
MS5837-30BA can be interfaced to virtually any
microcontroller. The communication protocol is simple, without
the need of programming internal registers in the device. The
gel protection and antimagnetic stainless steel cap make the
module water resistant. This new sensor module generation is
based on leading MEMS technology and latest benefits from
MEAS Switzerland proven experience and know-how in high
volume manufacturing, which has been widely used for over a
decade.
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
2
PERFORMANCE SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Supply voltage
VDD
-0.3
+4
V
Storage temperature
TS
-40
+85
°C
Overpressure
Pmax
ISO 22810
50
Bar
Maximum Soldering
Temperature
Tmax
40 sec max
250
°C
ESD rating
Human Body
Model
-2
+2
kV
Latch up
JEDEC standard
No 78
-100
+100
mA
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Operating Supply voltage
VDD
1.5
3.0
3.6
V
Operating Temperature
T
-20
+25
+85
°C
Supply current
(1 sample per sec.)
IDD
OSR
8192
4096
2048
1024
512
256
20.09
10.05
5.02
2.51
1.26
0.63
µA
Peak supply current
during conversion
1.25
mA
Standby supply current
at 25°C
0.01
0.1
µA
VDD Capacitor
From VDD to GND
100
470
nF
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output Word
24
Bit
Conversion time (1)
tc
OSR 8192
4096
2048
1024
512
256
14.8
7.40
3.72
1.88
0.95
0.48
16.44
8.22
4.13
2.08
1.06
0.54
18.08
9.04
4.54
2.28
1.17
0.60
ms
(1): Maximum values must be applied to determine waiting times in I2C communication
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
3
PERFORMANCE SPECIFICATIONS (CONTINUED)
PRESSURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Operating Pressure Range
Prange
Full Accuracy
0
30
Bar
Absolute Accuracy (1),
Temperature range: 0 … 40°C
0 … 6 bar
0 … 20 bar
0 … 30 bar
-50
-100
-200
+50
+100
+200
mbar
Absolute Accuracy (1),
Temperature range: -20 … 85°C
0 … 6 bar
0 … 20 bar
0 … 30 bar
-100
-200
-400
+100
+200
+400
mbar
Maximum error with supply
voltage (2)
VDD = 1.5 V … 3.6 V
±30
mbar
Long-term stability
±30
mbar/year
Resolution RMS
OSR
8192
4096
2048
1024
512
256
0.20
0.28
0.38
0.54
0.84
1.57
mbar
Reflow soldering impact
IPC/JEDEC J-STD-020D.1
(See application note AN808
on http://meas-spec.com)
-8
mbar
Recovering time after reflow (3)
7
Days
(1) With autozero at one pressure point
(2) With autozero at 3V point
(3) Time to recover at least 66% of the reflow impact.
TEMPERATURE OUTPUT CHARACTERISTICS (VDD = 3 V, T = 25°C UNLESS OTHERWISE NOTED)
Parameter
Conditions
Min.
Typ.
Max
Unit
Absolute Accuracy
0 …10 bar, 25°C
0 …10 bar, 0..60°C
-20..85°C
-1.5
-2.0
-4.0
+1.5
+2.0
+4.0
°C
Maximum error with supply
voltage
VDD = 1.5 V … 3.6 V
± 0.3
°C
Resolution RMS
OSR
8192
4096
2048
1024
512
256
0.0022
0.0026
0.0033
0.0041
0.0055
0.0086
°C
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
4
PERFORMANCE SPECIFICATIONS (CONTINUED)
DIGITAL INPUTS (SCL, SDA)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Serial data clock
SCL
400
kHz
Input high voltage
VIH
80% VDD
100% VDD
V
Input low voltage
VIL
0% VDD
20% VDD
V
Input leakage current
Ileak25°C
at 25°c
0.1
µA
DIGITAL OUTPUTS (SDA)
Parameter
Symbol
Conditions
Min.
Typ.
Max
Unit
Output high voltage
VOH
Isource = 0.6 mA
80% VDD
100% VDD
V
Output low voltage
VOL
Isink = 0.6 mA
0% VDD
20% VDD
V
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
5
PERFORMANCE CHARACTERISTICS
PRESSURE ERROR VS PRESSURE AND TEMPERATURE
TEMPERATURE ERROR VS PRESSURE AND TEMPERATURE
PRESSURE AND TEMPERATURE ERROR VS POWER SUPPLY
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
6
FUNCTIONAL DESCRIPTION
GENERAL
The MS5837-30BA consists of a piezo-resistive sensor and a sensor interface IC. The main function of the
MS5837-30BA is to convert the uncompensated analogue output voltage from the piezo-resistive pressure sensor
to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients
necessary to compensate for process variations and temperature variations are calculated and stored in the 112-
bit PROM of each module. These bits (partitioned into 6 coefficients W1 to W6) must be read by the
microcontroller software and used in the program converting D1 and D2 into compensated pressure and
temperature values.
The coefficients W0 is for factory configuration and CRC.
SERIAL I2C INTERFACE
The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta). The
sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. So this interface type uses
only 2 signal lines and does not require a chip select.
Module ref
Mode
Pins used
MS5837-30BA
I2C
SDA, SCL
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
7
PRESSURE AND TEMPERATURE CALCULATION
Flow chart for pressure and temperature reading and software compensation.
Size
[1]
[bit]
min
max
C1
Pressure sensitivity | SENS
T1
unsigned int 16
16
0
65535
34982
C2
Pressure offset | OFF
T1
unsigned int 16
16
0
65535
36352
C3
Temperature coefficient of pressure sensitivity | TCS
unsigned int 16
16
0
65535
20328
C4
Temperature coefficient of pressure offset | TCO
unsigned int 16
16
0
65535
22354
C5
Reference temperature | T
REF
unsigned int 16
16
0
65535
26646
C6
Temperature coefficient of the temperature | TEMPSENS
unsigned int 16
16
0
65535
26146
D1
Digital pressure value
unsigned int 32
24
0
16777215
4958179
D2
Digital temperature value
unsigned int 32
24
0
16777215
6815414
dT
Difference between actual and reference temperature
[2]
dT
= D2 - T
REF
=
D2
-
C5 * 2
8
signed int 32
25
-16776960
16777215
-5962
1981
= 19.81 °C
OFF
Offset at actual temperature
[3]
OFF
=
OFF
T1
+
TCO
*
dT =
C2
*
2
16
+
(C4
*
dT
)
/
2
7
signed int 64
41
-17179344900
25769410560
2381326464
SENS
Sensitivity at actual temperature
[4]
SENS
=
SENS
T1
+
TCS
*
dT
=
C1 * 2
15
+
(
C3
*
dT
)
/
2
8
signed int 64
41
-8589672450
12884705280
1145816755
39998
= 3999.8 mbar
Notes
[1]
[2]
[3]
[4]
min and max have to be defined
min and max have to be defined
Maximal size of intermediate result during evaluation of variable
300000
0
58
P
Recommended
variable type
Description | Equation
signed int 32
Actual temperature (-40…85°C with 0.01°C resolution)
TEMP = 20°C+dT*TEMPSENS = 2000+dT *C6 /2
23
Read digital pressure and temperature data
signed int 32
Temperature compensated pressure (0…30 bar with
0.25mbar resolution)
P
= D1 * SENS - OFF =
(D1 * SENS / 2
21
- OFF) / 2
13
min and max have to be defined
Convert calibration data into coefficients (see bit pattern of W1 to W4)
Variable
Example /
Typical
Value
Calculate temperature compensated pressure
8500
-4000
TEMP
41
Start
Maximum values for calculation results:
P
MIN
= 0 bar P
MAX
= 30 bar
T
MIN
= -20°C T
MAX
= 85°C T
REF
= 20°C
Read calibration data (factory calibrated) from PROM
Read digital pressure and temperature data
Calculate temperature
Calculate temperature compensated pressure
Display pressure and temperature value
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
8
SECOND ORDER TEMPERATURE COMPENSATION
Yes
No
SENSi = 5 (TEMP – 2000)2 / 23
SENS2 = SENS - SENSi
(TEMP/ 100)< 20°C
Low temperature
OFFi = 1 (TEMP – 2000)2 / 24
OFFi = 3 (TEMP – 2000)2 / 21
OFF2 = OFF - OFFi
TEMP2 = (TEMP – Ti) / 100 [°C]
Low temperature
High temperature
Calculate pressure and temperature 2nd order
(TEMP/ 100) < -15°C
No
Yes
OFFi = OFFi + 7 (TEMP + 1500)2
Very low temperature
SENSi = 0
Ti = 3 dT2 / 233
Ti = 2 dT2 / 237
SENSi = SENSi + 4 (TEMP + 1500)2
Pressure and Temperature parameters values first order:
OFF, SENS and TEMP
P2 = ((( D1 SENS2 ) / 221 – OFF2) / 213) / 10 [mbar]
Flow chart for pressure and temperature to the optimum accuracy.
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
9
I2C INTERFACE
COMMANDS
The MS5837-30BA has only five basic commands:
1. Reset
2. Read PROM (112 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5837-30BA address is 1110110x (write: x=0, read: x=1).
Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands, the device
will return 24 bit result and after the PROM read 16 bit results. The address of the PROM is embedded inside of
the PROM read command using the a2, a1 and a0 bits.
Command byte
hex value
Bit number
0
1
2
3
4
5
6
7
Bit name
PRO
M
CO
NV
-
Typ
Ad2/
Os2
Ad1/
Os1
Ad0/
Os0
Stop
Command
Reset
0
0
0
1
1
1
1
0
0x1E
Convert D1 (OSR=256)
0
1
0
0
0
0
0
0
0x40
Convert D1 (OSR=512)
0
1
0
0
0
0
1
0
0x42
Convert D1 (OSR=1024)
0
1
0
0
0
1
0
0
0x44
Convert D1 (OSR=2048)
0
1
0
0
0
1
1
0
0x46
Convert D1 (OSR=4096)
0
1
0
0
1
0
0
0
0x48
Convert D1 (OSR=8192)
0
1
0
0
1
0
1
0
0x4A
Convert D2 (OSR=256)
0
1
0
1
0
0
0
0
0x50
Convert D2 (OSR=512)
0
1
0
1
0
0
1
0
0x52
Convert D2 (OSR=1024)
0
1
0
1
0
1
0
0
0x54
Convert D2 (OSR=2048)
0
1
0
1
0
1
1
0
0x56
Convert D2 (OSR=4096)
0
1
0
1
1
0
0
0
0x58
Convert D2 (OSR=8192)
0
1
0
1
1
0
1
0
0x5A
ADC Read
0
0
0
0
0
0
0
0
0x00
PROM Read
1
0
1
0
Ad2
Ad1
Ad0
0
0xA0 to
0xAE
Command structure
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
10
RESET SEQUENCE
The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded into
the internal register. It can be also used to reset the device PROM from an unknown condition.
The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused
by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5837-30BA to
function is to send several SCLs followed by a reset sequence or to repeat power on reset.
I2C Reset Command
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the calibration
PROM and to calculate the calibration coefficients. There are in total 7 addresses resulting in a total memory of
112 bit. Addresses contain factory data and the setup, calibration coefficients, the serial code and CRC. The
command sequence is 8 bits long with a 16 bit result which is clocked with the MSB first. The PROM Read
command consists of two parts. First command sets up the system into PROM read mode. The second part gets
the data from the system.
I2C Command to read memory address= 011
I2C answer from MS5837-30BA
111011 0 00000111100
S W A A P
From Master
S = Start Condition
W = Write A = Acknowledge
From Slave P = Stop Condition R = Read
N = Not Acknowledge
cmd byte
Device Address
Device Address
command
111011 0 00101001100
S W A A P
From Master
S = Start Condition
W = Write A = Acknowledge
From Slave P = Stop Condition R = Read
N = Not Acknowledge
Device Address
Device Address
cmd byte
command
1 1 1 0 1 1 0 1 0 X X X X X X X X 0 X X X X X X X X 0
S R A A N P
From Master
S = Start Condition
W = Write A = Acknowledge
From Slave P = Stop Condition R = Read N = Not Acknowledage
Memory bit 7 - 0
Device Address
Device Address
Memory bit 15 - 8
data
data
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
11
CONVERSION SEQUENCE
The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2)
conversion. After the conversion, using ADC read command the result is clocked out with the MSB first. If the
conversion is not executed before the ADC read command, or the ADC read command is repeated, it will give 0
as the output result. If the ADC read command is sent during conversion the result will be 0, the conversion will
not stop and the final result will be wrong. Conversion sequence sent during the already started conversion
process will yield incorrect result as well. A conversion can be started by sending the command to MS5837-30BA.
When command is sent to the system it stays busy until conversion is done. When conversion is finished the data
can be accessed by sending a Read command, when acknowledge is sent from the MS5837-30BA, 24 SCL
cycles may be sent to receive all result bits. Every 8 bits the system waits for an acknowledge signal.
I2C command to initiate a pressure conversion (OSR=4096, typ=D1)
I2C ADC read sequence
I2C answer from MS5837-30BA
111011 0 00010010000
S W A A P
From Master
S = Start Condition
W = Write A = Acknowledge
From Slave P = Stop Condition R = Read
N = Not Acknowledge
cmd byte
Device Address
Device Address
command
111011 0 00000000000
S W A A P
From Master
S = Start Condition
W = Write A = Acknowledge
From Slave P = Stop Condition R = Read
N = Not Acknowledge
Device Address
Device Address
cmd byte
command
1
1
1
0
1
1
0
1
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
X
X
X
X
X
X
X
X
0
S
R
A
A
A
N
P
F rom M aster
S = Start C ondition
W = Write
A = A cknow ledge
F rom S lave
P = S top C ondition
R = Read
N = Not A cknow ledge
Data 7 - 0
Data 15 - 8
Dev ice A ddress
Dev ice A ddress
data
data
Data 23-16
data
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
12
CYCLIC REDUNDANCY CHECK (CRC)
MS5837-30BA contains a PROM memory with 112-Bit. A 4-bit CRC has been implemented to check the data
validity in memory. The besides C code describes in detail CRC-4 calculation.
C6
D
B
1
5
D
B
1
4
D
B
1
3
D
B
1
2
D
B
1
1
D
B
1
0
D
B
9
D
B
8
D
B
7
D
B
6
D
B
5
D
B
4
D
B
3
D
B
2
D
B
1
D
B
0
0
CRC
Factory defined
1
C1
2
C2
3
C3
4
C4
5
C5
6
Memory PROM mapping
C Code example for CRC-4 calculation:
unsigned char crc4(unsigned int n_prom[]) // n_prom defined as 8x unsigned int (n_prom[8])
{
int cnt; // simple counter
unsigned int n_rem=0; // crc remainder
unsigned char n_bit;
n_prom[0]=((n_prom[0]) & 0x0FFF); // CRC byte is replaced by 0
n_prom[7]=0; // Subsidiary value, set to 0
for (cnt = 0; cnt < 16; cnt++) // operation is performed on bytes
{ // choose LSB or MSB
if (cnt%2==1) n_rem ^= (unsigned short) ((n_prom[cnt>>1]) & 0x00FF);
else n_rem ^= (unsigned short) (n_prom[cnt>>1]>>8);
for (n_bit = 8; n_bit > 0; n_bit--)
{
if (n_rem & (0x8000)) n_rem = (n_rem << 1) ^ 0x3000;
else n_rem = (n_rem << 1);
}
}
n_rem= ((n_rem >> 12) & 0x000F); // final 4-bit remainder is CRC code
return (n_rem ^ 0x00);
}
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
13
APPLICATION CIRCUIT
The MS5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications.
Typical application circuit
PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE
UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE ± 0.1
1
GND
GROUND
2
VDD
POSITIVE SUPPLY
3
SCL
I2C CLOCK
4
SDA
I2C DATA
Package outlines and Pin configuration
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
14
RECOMMENDED PAD LAYOUT
Pad layout for bottom side of the MS5837-30BA soldered onto printed circuit board.
Recommended PCB footprint
SHIPPING PACKAGE
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
15
MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering recommendations.
MOUNTING
The MS5837-30BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It
is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for
applications in watches and other special devices.
SEALING WITH O-RINGS
In applications such as outdoor watches the electronics must be protected against direct water or humidity. For
such applications the MS5837-30BA provides the possibility to seal with an O-ring. The O-ring shall be placed at
the groove location, i.e. the small outer diameter of the metal lid. The following O-ring / housing dimensions are
recommended:
O-ring inner diameter
1.8 ± 0.05 mm
O-ring cross-section diameter
0.8 ± 0.03 mm
Housing bore diameter
3.07 ± 0.03 mm
Please refer to the application note AN523 available on our website for O-ring mounting recommendations.
CLEANING
The MS5837-30BA has been manufactured under clean-room conditions. It is therefore recommended to
assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to
protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB,
solder paste of type “no-clean” shall be used. Warning: cleaning might damage the sensor.
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 2 kV HBM (human body model). It is therefore
essential to ground machines and personnel properly during assembly and handling of the device. The MS5837-
30BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the
assembly of the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A minimum of 100nF ceramic
capacitor must be placed as close as possible to the MS5837-30BA VDD pin. This capacitor will stabilize the
power supply during data conversion and thus, provide the highest possible accuracy.
MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
16
ORDERING INFORMATION
Part Number / Art. Number
Product
Delivery Form
MS583730BA01-50
MS5837-30BA Ultra Small Gel Filled Pressure Sensor
Tape & Reel
CDOC-DA-0093
4
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a TE Connectivity company
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Website: www.meas-spec.com
EUROPE
MEAS Switzerland Sàrl,
a TE Connectivity company
Ch. Chapons-des-Prés 11
CH-2022 Bevaix, Switzerland
Tel: +41 32 847 9550
Fax: +41 32 847 9569
e-mail: sales.ch@meas-spec.com
Website: www.meas-spec.com
ASIA
Measurement Specialties (China), Ltd.,
a TE Connectivity company
No. 26 Langshan Road
Shenzhen High-Tech Park (North) Nanshan
District, Shenzhen, 518057
China
Tel: +86 755 3330 5088
Fax: +86 755 3330 5099
e-mail: pfg.cs.asi@ameas-spec.com
Website: www.meas-spec.com
