GEN E RAL RELEAS E DOCU MENT
CONSULT FACTORY FO R CU RRENT RE V ISION
REVISIONS
REVISION DESCRIPTION APPROVED DATE
- Initial release Luis Vargas 5/28/2008
SPECIFIC ATION CON TRO L DRAWING Q-TECH CORPORATION
10150 W. JEFFERSON BLVD.
CULVER CITY, CA 90232-3510
PREPA RED BY:
Lui s Va rg a s
DATE
6/5/08
LOW PROFILE 24 PIN DDIP HYBRID CRYSTAL
OSCILLATOR, TCXO, CLASS S,
Standard Design For Sine Wave up to 150MHz
UNLESS OTHERWISE
SPECI FIED, DIM ENS IONS
ARE IN INCHES.
TOLERANCES:
3 PLA CE DE CI MAL = .00 5
2 PLA CE DE CI MAL = .02
1 PLA CE DE CI MAL = .1
FRACTIONS = ± 1/16
ANGLES = 2 DEGREES
CHEC KED BY:
QUALI T Y
DATE
DRA W I NG NO.:
QT800 DDIP Sine-Wave
REVISION
-
RE LEASE D BY :
DOCUMENT CONTROL
APPROVED BY :
ENGINEERING
DATE
SCALE
NONE
SIZE
A
CAGE
CODE
51774 SHEET 1 OF 7
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
-50-45-40-35-30-25-20-15-10-5 0 5 1015202530354045505560657075808590
temp, deg C
freq error, PPM
Example 1 of Temperature Stability
Example 2 of Temperature Stability
50MHz TCXO ,Vcc=12v,+25ºC
9/17/08
-180
-170
-160
-150
-140
-130
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
1 10 100 1000 10000 100000
Frequency Offset, HZ
L(f), dB
c
QT800 DDIP Sine -Wa ve REV.
Q-TECH Corporation
10150 W. Jefferson Bl vd.
Culver Cit y, CA 90232
SIZE
A
CAGE NO.
51774 Sheet 2 of 7 -
1.0 SCOPE
This specification establishes the detail requirements for low profile hybrid , hermetically sealed, Sine-
Wave out pu t te mpe ra t ure c om pen sa te d c rystal os cil lat or s (TC XO) for use in spac e fl ig ht mi ss i ons.
2.0 APPLICABLE DOCUMENTS
The following documents of the latest issue form a part of this drawing to the extent specified herein.
2.1 Specifications and Standards
SPECIFICATIONS
MILITARY
MIL-S-19500 Semiconductor Devices, General Specification For
MIL-P RF-5 5310 Crystal Oscillat ors, Ge ner al Specification For
MIL-PRF-38535 In tegrate d Circuits, (Microcircuits) M anufacturing, General S pec ific ation For
MIL -P R F- 3 85 34 Hyb rid Mic r oc ir cu it s , Gen er al Sp e cif ic at i on F or
STANDARDS
MILITARY
MIL-STD-20 2 Test Methods for Electron ic and E lectrical Component P a rts
MIL-STD-88 3 Test Methods and Procedures for Microelectronics
MIL-STD- 1686 Electrosta tic Discharg e Con trol Program for Protection of Electrical and
Electronics Par ts, Assemblies and Equipment.
2.2 Conflicting requirements
In the event of conflict between requirements of this specification and other requirements of the
applicable detail drawing, the precedence in which requirements shall govern, in descending order, is
as follows:
a) Applicable Customer purchase order.
b) Applicable detail drawing.
c) This specification.
d) Other specifications or standards referenced in 2.1 herein.
2.3 Customer Purchase Order Special Requirements
Additional special requirements shall be specified in the applicable Customer purchase order when
additional requirements or modifications specified herein are needed for compliance to special
program or product line requirements.
3.0 PERFOR MAN CE REQUIRE MENT S
3.1 General Definition
The TCXO is a high reliability signal generat or that provides a sine-wa ve output. The TCXO has been
designed to operate in a spaceflight environment with an expected lifetime in excess of 15 years.
Lifetime is defined as the sum of operational and storage environments.
QT800 DDIP Sine -Wa ve REV.
Q-TECH Corporation
10150 W. Jefferson Bl vd.
Culver Cit y, CA 90232
SIZE
A
CAGE NO.
51774 Sheet 3 of 7 -
3.1.1 Electrical Characteristics
PARAMETER SYMBOL CONDITIONS VALUE UNIT
Frequenc y Nom. fo -
See part nu m ber
generation table
MHz
Sup p l y volt a ge , No m . Vs Vs±5%
See part nu m ber
generation table
V
Inp ut Current, max. Is Vs, nom. / Ta=+25°C 30 50 mA
Fre q. st a bi lit y vs .
temperature
(including ±5% Load
Change and ±5% Input
Voltage change)
f/fc (Ta)
Ta=-20°C…+70°C ( option 1)
Ta=-40°C…+85°C ( option 2)
Contact factory for other options
available
±1.0
±2.0
See part nu m ber
generation table
ppm
Electrical Frequency
Adjustment Min.
(when specified)
f/fo
(Vcc) ±5 PPM Tw o options:
1) via an external select-at-test
resist or connected from Pin 1
to Ground
2) Via Externa l tuning voltage
±5.0
See part nu m ber
generation table
ppm
Aging Max f/f o over 1 0 yea r (first year 1 ppm) ±5.0 ppm
Fre q. st a bi lit y vs . Va cu u m
f/fo Met by design, not tested ±0.2 ppm
Short term stability f/fc(t)
t=1sec. (Allan variance) 0.001 ppm
RF Output
Contact factory for other options
available
30 to
75
3rd
75.1 to
150
3rd X
MHz
Output level Min. Sine Class S, 100 krads (Si) total
dose Min
See part nu m ber
generation table
dBm
Harmoni cs Max. -20 -20 dBc
Sub-harmonics Max. N/A -20 dBc
Phase noise @ freq. offset
£ (f)
£ (f)
£ (f)
£ (f)
£ (f)
f=10Hz
f=100Hz
f=1kHz
f=10kHz
f=100kHz
-80
-110
-135
-145
-145
Contact
factory
for
options
available
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Spurious Under static co nditions. Met by
design, not tested. -70 dBc
3.2 Abso lu te Max im u m Rat in g
Sup p ly Vo lt a ge 0 to +1 6 . 5 VDC
DC Input Curr ent 50 mA maxi mum
Storage Temperature range -62°C to + 1 25°C
Lead Temperature (Solder ing, 10 seconds) 300°C
3.2.1 Physical Characteristics
3.2.1.1 Dimensions - The TCXO outline dimensions and terminal connections shall be as shown in Figure 1
herein.
3.2.1.2 Weight - The TCXO shall weigh less than or equal to 25 grams.
3.2.1.3 Materials - The TCXO package body and lead finish shall be gold in accordance with MIL-PRF-38534.
QT800 DDIP Sine -Wa ve REV.
Q-TECH Corporation
10150 W. Jefferson Bl vd.
Culver Cit y, CA 90232
SIZE
A
CAGE NO.
51774 Sheet 4 of 7 -
3.2.2 Environmental Conditions
Sine Vibration MIL-STD-202, Method 204, TC “D”
Rando m Vibratio n MIL-S TD-202, Method 214 TC “I-K” (15 minutes per axis)
Shock MIL-STD-202, Method 213, TC “F”
Acceleration MIL-STD-883, Method 2001, TC “A”
Altitude 50,000 feet min imum to deep space
Radiation Radiation te sting is not performed, but the se TCX Os have been acceptable for
use in environments up to 100K rads by analysis of the components used. Only
bipolar semiconductors are employed. A copy of the parts list and materials
can be provided for review.
The electronics used in the TCXO shall be sing le event latchup free.
Electrostatic Discharge Sensitivity
The TCXO supplied to this drawing shall be cons idered to be electrostatic
discharge sensitive and require further protection and shall use one of the
packaging requirements in accordance with MIL-PRF-38534, Category A,
Section 5.3.2.4 Transportability.
The TCXO shall be capable of being transported by air, ship or r oad when
packaged in a suitable container.
3.3 Design and Construction
The design and construction of the crystal oscillator shall be as specified herein. As a minimum, the
oscillators shall meet the design and construction requirements of MIL-PRF-55310, except element
evaluation shall be as specified in 3.3.1.
Operation
Design, Construction &
Component Screen (see 3.3.2) MIL-PRF-55310 Clas s S
Workmanship M883, Method 2017 for Class S
Screening MIL-PRF-55310 Class S
Non-Destruct Wire Bond Pull 100%, M883, Method 2023 (2.4 grams)
Internal Visual MIL-STD-883, methods 2017 & 2032 condition K (class S). During the time
interva l between final internal visual inspection and preparation for sealing,
hybr id cryst al oscil lator s sha ll be stored in a dry, contr olle d env iron men t as
defined in MIL-STD-883, method 2017 or in a vacuum bake oven.
Stabilization Bake 48 hrs minimum @ +150 C M883, Method 1008 TC B
Thermal Shock M883, Method 1011, TC A
Temperature Cycling M883, Method 1010, TC B
Constant Acceleration M883, Method 2001, TC A (5000 gs, Y1 Axis only)
Se al Test (fin e & gro ss) 100% Met hod 101 4, (TC A 1 for fine leak and TC C for gross leak)
PIND M8 83, Method 2020, TC B
Electrical Te st Frequenc y, Output le vel s, Input Current@ +25 C
Burn-In (Powered with load) +125 C for 240 hours
Electrical Test
Frequenc y, Output le vel s, Input Current
@ +25°C & Temp Extremes listed on the Electrical Specification
Radiographic M883, Method 2012 class S
Group A 100%
Group B (30 day Aging @ +70 C) 100%
External visual 883 Method 2009
QT800 DDIP Sine -Wa ve REV.
Q-TECH Corporation
10150 W. Jefferson Bl vd.
Culver Cit y, CA 90232
SIZE
A
CAGE NO.
51774 Sheet 5 of 7 -
3.3.1 All piece pa rts shall be deri ved from lots that meet the eleme nt evaluation requirements of MIL-PR F-
38534, Class K, with the exception of the following exceptions:
Active elements
a) Visual inspection of silicon on sapphire microcircuits. Semicircular crack(s) or multiple adjacent
cracks, not in the active area, starting and terminating at the edge of the die are acceptable.
Attached (chip in place) sapphire is nonconductive material and shall not be considered as foreign
material and will be considered as nonconductive material for all inspection criteria.
b) S ubgrou p 4, Sc anning Ele ctron Mi crosco pe (SEM ) ins p ection . T h e m an u f a ct u r e r m ay all o w t h e di e
di stri bu tor , at h is op tio n, to s ele ct two ( 2) dic e from a w affl e pack ( con ta inin g a max imu m q uanti ty
of 100 die), visually inspect for the worst case metallization of the 2 dice, and take SEM pho tog raphs
of the worst case.
c) Subgroup 5 radiation tests. Subgroup 5 radiation tests are not required unless otherwise specified
in the det ail p urc ha se or de r.
3.3.2 Processes - Processes used for manufacturing the TCXO are selected on the basis of their ability to
meet the quality requirements for space High Reliability manu facturing. Travelers or Process Cards are
used in the manufacturing and testing of all of the TCXO Series, and might be available for customer
review. Copies of these Travelers can be provided with the TCXOs at time of shipment if so specified
on the purchase order.
3.3.3 Interchangeability - Eac h T CX O shall be int ercha n ge ab le wi th o ut us ing a specia l sele cti on pr ocess.
3.3.4 Product Marking - Each unit shall be permanently marked with the manufacturer's name or symbol,
part numb er, l ot date c ode nu mber, a nd ser ial num ber. The unit sha ll be mar ked with the out line o f an
equilateral triangle near pin 1 to show that it contains devices which are sensitive to electrostatic
discharge.
3.4 Parts Program
Devices delivered to this specification represent the standardized Parts, Materials and Processes (PMP)
Program developed, implemented and certified for advanced applications and extended environments.
3.4.1 Quartz Crystal Resonator - The c rys ta l re so nat o r u sed shall be c o ns tr ucte d usi ng a 4 p oint mou nt
premium s ynthetic swep t Q uartz and procured t o Q-TEC H SCD. (F or the Enginee ring m odels, non-
swept quartz may be used).
3.5 Traceability Requirements
Material, element and pro cess traceability requirements shall be as specified by MIL-PRF-38534 for
Cla ss K hyb rid s.
3.6 Data
3.6.1. Design Documentation - When required by the purchase order, design, topography, process and flow
charts for all assembly/inspection and test operation for devices to be supplied under this specification
on the initial procurement shall be established and shall be available in-plant for review by the procuring
activity upon request. This design documentation shall be sufficient to depict the physical and electrical
construction of t he devices supplied under the specification and shall be traceable to the specific parts,
drawings or part type numbers to which it applies, and to the production lot(s) and inspection lot codes
under which devices are manufactured and tested so that revisions can be identified.
QT800 DDIP Sine -Wa ve REV.
Q-TECH Corporation
10150 W. Jefferson Bl vd.
Culver Cit y, CA 90232
SIZE
A
CAGE NO.
51774 Sheet 6 of 7 -
3.6.2. Technical Data Package - When required by the purchase order, the following design documentation
and information is deliverable 30 days prior to the start of production. The Technical Dat a Package sh all
consist of the following:
a) Assembly drawing(s).
b) All electrical schematics and drawings
not considered proprietary
.
c) The assembly and screening travelers to be used on-line to manufacture the devices supplied to this
specification.
d) Pa rt s and m ate rials li st.
3.7 Test Report
A test report is supplied with each shipment of oscillators and includes the following inform ation, as a
minimum:
a) A Certificate of Conformance to all specifications and purchase order requirements. As a minimum,
the Certificate of Conformance shall inc lude the following information:
Purchase order number.
Applicable part number.
Manu fac tu rer s lo t nu mbe r.
Lot date c ode.
b) Parts and materials traceability information.
c) Certificate of crystal sweeping.
d) Ma nu fac tu ring l ot tra ve ler.
e) Screening attributes and variables data a s applica ble.
f) Quality conformance inspection attributes and variables data as applicable.
g) Radiographic inspection negatives.
3.8 E ngin ee r i n g Mod e l s
Engineering Models are fit, form, and function representative of Flight Models and of commercial
construction using commercial parts of same generic type as Flight Models. Completed oscillators are
not scre e ned .
NOTES:
Th is o sc i lla t or is off ered to m e et th e sp ec ifica ti o ns ab ov e a nd is not g ua rant e ed to m e et a ny ot h er
requirements
QT800 DDIP Sine -Wa ve REV.
Q-TECH Corporation
10150 W. Jefferson Bl vd.
Culver Cit y, CA 90232
SIZE
A
CAGE NO.
51774 Sheet 7 of 7 -
Q-TECH
PART NUMBER
FREQUENCY
.300 MAX.
24X .200 MIN.
24X Ø .018 ± .002
1.100
1.280 MAX.
.600
.790 MAX.
22X .100
NON-ACCUMULATIVE
ESD SYMBOL
FOR PIN No. 1
USA
D/C S/N
112
24 13
PART NUMBER GENERATION
Series Out put type and suppl y
voltage Temperature
Range (
°
C)
Stability
Over
Temperature
Frequenc y
Range
(MHz) External Tuning
QT80: 24 Pin Double Di p
(available from 10 to 150
MHz)
4: SIN E WAVE +3dBm..5V
5: SIN E WAVE +7dBm.12V
6: SIN E WAVE 7dBm …..15V
N: 0…+50… ……..
R: 0… + 70… …..
Q: 0…+70………..
R: 0… + 70… …..
U: -20…+ 70. ….
V: -20…+70……..
W: -20…+70…….
X: -40…+85……..
Y: -40…+85……..
Z: -40…+85……..
(See note 1 below)
±1 ppm
±1 ppm
±2 ppm
±5 ppm
±1 ppm
±2 ppm
±5 ppm
±4 ppm
±5 ppm
±10 ppm
10…150
Blank: No tuning
R: External resistor
V: External voltage
1. Variations from standard specification are available, please contact factory.
EXAMPLE: QT805U-100.000000-R
EXAMPLE: The QT704S-100.000000-R would be a HF TCXO, 24 pin thru-hole pack, sine-wave 12 volts, stabilit y ±1 ppm
over -20…+70°C, @ 100 MHz with external tuning via external resistor.
FIGURE 1 INTERF ACE CONTRO L DRAWING
24 Pin Do ub l e Dip
PIN NO. DESIGNATION
1 External Frequency Adjustment
(wh en s pecifi ed )
2 - 11 NC
12 Ground/Case
13 RF Output
14 - 23 NC
24 Supply Voltage
NOTES:
Dimensions are in inches.
Lead numbers are for reference only and
are not ma rke d o n the u nit.
A tr iang le symbol is mark ed o n the
corner o f th e pa c ka ge to indicat e Pin 1 .
All pins with NC function may not be
connecte d as e xt ernal tie o r connections
(p ins m ay b e c o nnect ed internally) .