TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
 
1
APRIL 1971 - REVISED SEPTEMBER 2002
Specifications are subject to change without notice.
5 A Continuous On-State Current
20 A Surge-Current
Glass Passivated Wafer
400 V to 800 V Off-State Voltage
Max IGT of 1 mA
absolute maximum ratings over operating case temperature (unless otherwise noted)
NOTES: 1. These values apply when the gate-cathode resistance RGK = 1 k.
2. These values apply for continuous dc operation with resistive load. Above 80°C derate linearly to zero at 110°C.
3. This value may be applied continuously under single phase 50 Hz half-sine-wave operation with resistive load. Above 80°C derate
linearly to zero at 110°C.
4. This value applies for one 50 Hz half-sine-wave when the device is operating at (or below) the rated value of peak reverse volta ge
and on-state current. Surge may be repeated after the device has returned to original thermal equilibrium.
5. This value applies for a maximum averaging time of 20 ms.
.
RATING SYMBOL VALUE UNIT
Repetitive peak off-state voltage (see Note 1)
TIC108D
TIC108M
TIC108S
TIC108N
VDRM
400
600
700
800
V
Repetitive peak reverse voltage
TIC108D
TIC108M
TIC108S
TIC108N
VRRM
400
600
700
800
V
Continuous on-state current at (or below) 80°C case temperature (see Note 2) IT(RMS) 5 A
Average on-state current (180° conduction angle) at (or below) 80°C case temperature
(see Note 3) IT(AV) 3.2 A
Surge on-state current (see Note 4) ITSM 20 A
Peak positive gate current (pulse width 300 µs) IGM 0.2 A
Peak gate power dissipation (pulse width 300 µs) PGM 1.3 W
Average gate power dissipation (see Note 5) PG(AV) 0.3 W
Operating case temperature range TC-40 to +110 °C
Storage temperature range Tstg -40 to +125 °C
Lead temperature 1.6 mm from case for 10 seconds TL230 °C
K
A
G
TO-220 PACKAGE
(TOP VIEW)
Pin 2 is in electrical contact with the mounting base.
MDC1ACA
1
2
3
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
2
 
APRIL 1971 - REVISED SEPTEMBER 2002
Specifications are subject to change without notice.
NOTE 6: This parameter must be measured using pulse techniques, tp = 300 µs, duty cycle 2 %. Voltage sensing-contacts, separate from
the current carrying contacts, are located within 3.2 mm from the device body.
electrical characteristics at 2C case temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IDRM
Repetitive peak
off-state current VD = rated VDRM RGK = 1 kTC = 11C 400 µA
IRRM
Repetitive peak
reverse current VR= rated VRRM IG = 0 TC = 11C 1mA
IGT Gate trigger current VAA = 12 V RL= 100tp(g) 20 µs0.2 0.5 1mA
VGT Gate trigger voltage
VAA = 12 V
tp(g) 20 µs
RL= 100
RGK =1k
TC = - 40°C 1.2
V
VAA = 12 V
tp(g) 20 µs
RL= 100
RGK =1k0.4 0.6 1
VAA = 12 V
tp(g) 20 µs
RL= 100
RGK =1k
TC = 11C 0.2
IHHolding current
VAA = 12 V
Initiating IT = 20 mA
RGK =1kTC = - 40°C 3.5 15
mA
VAA = 12 V
Initiating IT = 20 mA
RGK =1k210
VTOn-state voltage IT=5A (see Note 6) 1.3 1.7 V
dv/dt Critical rate of rise of
off-state voltage VD = rated VDRGK =1kTC = 11C 20 V/µs
thermal characteristics
PARAMETER MIN TYP MAX UNIT
RθJC Junction to case thermal resistance 3.5 °C/W
RθJA Junction to free air thermal resistance 62.5 °C/W
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
3
 
APRIL 1971 - REVISED SEPTEMBER 2002
Specifications are subject to change without notice.
THERMAL INFORMATION
Figure 1. Figure 2.
Figure 3. Figure 4.
AVERAGE ANODE ON-STATE CURRENT
TC - Case Temperature - °C
30 40 50 60 70 80 90 100 110
IT(AV) - Maximum Average Anode Forward Current - A
0
1
2
3
4
5
6TI23AA
DERATING CURVE
Continuous DC
Conduction
Angle
Φ
180°
Φ = 180°
MAX ANODE POWER DISSIPATED
IT - Anode Forward Current - A
110100
PA - Max Anode Power Dissipated - W
1
10
100 TI23AB
ANODE ON-STATE CURRENT
vs
TJ = 110 °C
SURGE ON-STATE CURRENT
Consecutive 50 Hz Half-Sine-Wave Cycles
110100
ITM - Peak Half-Sine-Wave Current - A
1
10
100 TI23AC
CYCLES OF CURRENT DURATION
vs
TC 80°C
No Prior Device Conduction
Gate Control Guaranteed
TRANSIENT THERMAL RESISTANCE
Consecutive 50 Hz Half-Sine-Wave Cycles
110100
RθJC(t) - Transient Thermal Resistance - °C/W
0·1
1
10 TI23AD
CYCLES OF CURRENT DURATION
vs
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
4
 
APRIL 1971 - REVISED SEPTEMBER 2002
Specifications are subject to change without notice.
TYPICAL CHARACTERISTICS
Figure 5. Figure 6.
Figure 7. Figure 8.
GATE TRIGGER CURRENT
TC - Case Temperature - °C
-60 -40 -20 0 20 40 60 80 100 120
IGT - Gate Trigger Current - mA
0·1
1
10 TC23AA
CASE TEMPERATURE
vs
VAA = 12 V
RL = 100
tp(g) 20 µs
GATE TRIGGER VOLTAGE
TC - Case Temperature - °C
-50-25 0 255075100125
VGT - Gate Trigger Voltage - V
0.3
0.4
0.5
0.6
0.7
0.8 TC23AB
CASE TEMPERATURE
vs
VAA = 12 V
RL = 100
RGK = 1 k
tp(g) 20 µs
HOLDING CURRENT
TC - Case Temperature - °C
-50 -25 0 25 50 75 100 125
I
H -
H
o
ldi
ng
C
urren
t
- m
A
0.1
1
10 TC23AD
CASE TEMPERATURE
vs
VAA = 12 V
RGK = 1 k
Initiating IT = 20 mA
PEAK ON-STATE VOLTAGE
ITM - Peak On-State Current - A
0·1 1 10
VTM - Peak On-State Voltage - V
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6 TC23AE
vs
PEAK ON-STATE CURRENT
TC = 25 °C
tp = 300 µs
Duty Cycle 2 %