○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays
. 1/14
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
TSZ22111・14・001
www.rohm.com
Voltage Detector IC Series for Automotive
Standard CMOS
Voltage Detector IC
BD48Exxx-M series BD49Exxx-M series
●General Description
ROHM’s BD48Exxx-M and BD49Exxx-M series are
highly accurate, low current consumption Voltage
Detector IC series. The line up includes BD48xxx
devices with N-channel open drain output and BD49xxx
devices with CMOS output. The devices are available for
specific detection voltages ranging from 2.3V to 6.0V in
increments of 0.1V.
●Features
High accuracy detection
Ultra-low current consumption
Two output types (N-ch open drain and CMOS
output)
Wide Operating temperature range
Very small and low height package
Package SSOP5 is similar to SOT-23-5(JEDEC)
AEC-Q100 Qualified
●Typical Application Circuit
●Key Specifications
Detection voltage: 2.3V to 6.0V (Typ.),
0.1V steps
High accuracy detection voltage: ±1.0%
Ultra-low current consumption: 0.9μA (Typ.)
Operating temperature range: -40°C to +105°C
●Package
SSOP5: 2.90mm x 2.80mm x 1.25mm
●Applications
Circuits using microcontrollers or logic circuits that
require a reset for automotive applications (car
navigation, car audio, meter panel, exterior lamp etc.)
(Open Drain Output type）
BD48Exxx-M series
V
DD1
BD48Exxx-M
V
DD2
GND
Micro
Controller
R
ST
C
L
(
Capacitor for
noise filtering
）
R
L
(CMOS Output type）
BD49Exxx-M series
C
L
(
Capacitor for
noise filtering
）
V
DD1
BD49Exxx-M
Micro
Controller
R
ST
GND
Datashee
t
2/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Connection Diagram
SSOP5
●Pin Descriptions
SSOP5
PIN No.
Symbol
Function
1
VOUT
Reset Output
2
VDD
Power Supply Voltage
3
GND
GND
4
N.C.
Unconnected Terminal
5
N.C.
Unconnected Terminal
Ordering Information
Lot. No
TOP VIEW
VOUT
VDD
GND
N.C.
N.C.
Marking
Part Output Type Reset Voltage Value Package Product Category Packaging and
Number 48 : Open Drain 23 : 2.3V G : SSOP5 M : Automotive Category forming specification
49 : CMOS 0.1V step
TR : Embossed tape
60 : 6.0V and reel
R
E
x
x
x
M
B
D
x
x
-
T
3/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Lineup
Output Type
Open Drain
CMOS
Detection Voltage
Marking
Part Number
Marking
Part Number
6.0V
Cm
BD48E60
Ff
BD49E60
5.9V
Ck
BD48E59
Fe
BD49E59
5.8V
Ch
BD48E58
Fd
BD49E58
5.7V
Cg
BD48E57
Fc
BD49E57
5.6V
Cf
BD48E56
Fb
BD49E56
5.5V
Ce
BD48E55
Fa
BD49E55
5.4V
Cd
BD48E54
Ey
BD49E54
5.3V
Cc
BD48E53
Er
BD49E53
5.2V
Cb
BD48E52
Ep
BD49E52
5.1V
Ca
BD48E51
En
BD49E51
5.0V
By
BD48E50
Em
BD49E50
4.9V
Br
BD48E49
Ek
BD49E49
4.8V
Bp
BD48E48
Eh
BD49E48
4.7V
Bn
BD48E47
Eg
BD49E47
4.6V
Bm
BD48E46
Ef
BD49E46
4.5V
Bk
BD48E45
Ee
BD49E45
4.4V
Bh
BD48E44
Ed
BD49E44
4.3V
Bg
BD48E43
Ec
BD49E43
4.2V
Bf
BD48E42
Eb
BD49E42
4.1V
Be
BD48E41
Ea
BD49E41
4.0V
Bd
BD48E40
Dy
BD49E40
3.9V
Bc
BD48E39
Dr
BD49E39
3.8V
Bb
BD48E38
Dp
BD49E38
3.7V
Ba
BD48E37
Dn
BD49E37
3.6V
Ay
BD48E36
Dm
BD49E36
3.5V
Ar
BD48E35
Dk
BD49E35
3.4V
Ap
BD48E34
Dh
BD49E34
3.3V
An
BD48E33
Dg
BD49E33
3.2V
Am
BD48E32
Df
BD49E32
3.1V
Ak
BD48E31
De
BD49E31
3.0V
Ah
BD48E30
Dd
BD49E30
2.9V
Ag
BD48E29
Dc
BD49E29
2.8V
Af
BD48E28
Db
BD49E28
2.7V
Ae
BD48E27
Da
BD49E27
2.6V
Ad
BD48E26
Cy
BD49E26
2.5V
Ac
BD48E25
Cr
BD49E25
2.4V
Ab
BD48E24
Cp
BD49E24
2.3V
Aa
BD48E23
Cn
BD49E23
4/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Absolute Maximum Ratings
Parameter
Symbol
Limits
Unit
Power Supply Voltage
VDD-GND
-0.3 to +10
V
Output Voltage
Nch Open Drain Output
VOUT
GND-0.3 to +10
V
CMOS Output
GND-0.3 to VDD+0.3
Output Current
Io
70
mA
Power Dissipation
SSOP5 *1*2
Pd
540
mW
Operating Temperature
Topr
-40 to +105
°C
Ambient Storage Temperature
Tstg
-55 to +125
°C
*1 Reduced by 5.4mW/°C when used over 25°C.
*2 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).
●Electrical Characteristics (Unless Otherwise Specified Ta=-40°C to 105°C)
Parameter
Symbol
Condition
Limit
Unit
Min.
Typ.
Max.
Detection Voltage
VDET
RL=470kΩ, VDD=HL *1
VDET(T)
×0.99
VDET(T)
VDET(T)
×1.01
V
VDET=2.5V
Ta=+25°C
2.475
2.5
2.525
Ta=-40°C to 85°C
2.418
-
2.584
Ta=85°C to 105°C
2.404
-
2.597
VDET=3.0V
Ta=+25°C
2.970
3.0
3.030
Ta=-40°C to 85°C
2.901
-
3.100
Ta=85°C to 105°C
2.885
-
3.117
VDET=3.3V
Ta=+25°C
3.267
3.3
3.333
Ta=-40°C to 85°C
3.191
-
3.410
Ta=85°C to 105°C
3.173
-
3.428
VDET=4.2V
Ta=+25°C
4.158
4.2
4.242
Ta=-40°C to 85°C
4.061
-
4.341
Ta=85°C to 105°C
4.039
-
4.364
VDET=4.8V
Ta=+25°C
4.752
4.8
4.848
Ta=-40°C to 85°C
4.641
-
4.961
Ta=85°C to 105°C
4.616
-
4.987
Output Delay Time “LH”
tPLH
CL=100pF RＬ=100kΩ *2
Vout=GND50%
-
-
100
µs
Circuit Current when ON
ICC1
VDD=VDET-0.2V *1
VDET=2.3-3.1V
-
0.51
1.53
µA
VDET=3.2-4.2V
-
0.56
1.68
VDET=4.3-5.2V
-
0.60
1.80
VDET=5.3-6.0V
-
0.66
1.98
Circuit Current when OFF
ICC2
VDD=VDET+2.0V *1
VDET=2.3-3.1V
-
0.75
2.25
µA
VDET=3.2-4.2V
-
0.80
2.40
VDET=4.3-5.2V
-
0.85
2.55
VDET=5.3-6.0V
-
0.90
2.70
Operating Voltage Range
VOPL
VOL≤0.4V, Ta=25 to 105°C, RL=470kΩ
0.95
-
-
V
VOL≤0.4V, Ta=-40 to 25°C, RL=470kΩ
1.20
-
-
VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
CL: Capacitor to be connected between VOUT and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
*2 tPLH:VDD=(VDET typ.-0.5V)(VDET typ.+0.5V)
5/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Electrical Characteristics (Unless Otherwise Specified Ta=-40°C to 105°C) - continued
Parameter
Symbol
Condition
Limit
Unit
Min.
Typ.
Max.
‘Low’Output Voltage (Nch)
VOL
VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V
-
-
0.5
V
VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V
-
-
0.5
‘High’Output Voltage (Pch)
(BD49Exxx-M Series)
VOH
VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V)
VDD-0.5
-
-
V
VDD=6.0V, ISOURCE=0.9 mA,VDET(4.3V to 5.2V)
VDD-0.5
-
-
VDD=8.0V, ISOURCE=1.1 mA,VDET(5.3V to 6.0V)
VDD-0.5
-
-
Leak Current when OFF
(BD48Exxx-M Series)
Ileak
VDD=VDS=10V *1
-
-
0.1
µA
Detection Voltage
Temperature coefficient
VDET/∆T
Ta=-40°C to 105°C
(Designed Guarantee)
-
±100
±360
ppm/°C
Hysteresis Voltage
∆VDET
VDD=LHL, RL=470kΩ
VDET×0.03
VDET×0.05
VDET×0.08
V
VDET(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step)
Rl: Pull-up resistor to be connected between Vout and power supply.
Cl: Capacitor to be connected between Vout and GND.
Design Guarantee. (Outgoing inspection is not done on all products.)
*1 Guarantee is Ta=25°C.
6/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Block Diagrams
Fig.1 BD48Exxx-M series
Fig.2 BD49Exxx-M series
VOUT
VDD
GND
Vref
VOUT
VDD
GND
Vref
7/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves
Fig.3 Circuit Current
0.0
0.5
1.0
1.5
2.0
0 1 2 3 4 5 6 7 8 9 10
VDD SUPPLY VOLTAGE ：VDD[V]
CIRCUIT CURRENT ： IDD[μA]
【BD4842G/FVE】
0
5
10
15
20
0.0 0.5 1.0 1.5 2.0 2.5
DRAIN-SOURCE VOLTAGE ： VDS[V]
"LOW" OUTPUT CURRENT ： I
OL[mA]
【BD4842G/FVE】
VDD=2.4V
VDD=1.2V
Fig.4 “Low” Output Current
Fig.6 I/O Characteristics
0
1
2
3
4
5
6
7
8
9
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
VDD SUPPLY VOLTAGE ：VDD[V]
OUTPUT VOLTAGE
： V
OUT[V]
【BD4842G/FVE】
Ta=25℃
Ta=25℃
0
5
10
15
20
25
30
35
40
45
0 1 2 3 4 5 6
DRAIN-SOURCE VOLTAGE ： VDS[V]
"HIGH" OUTPUT CURRENT ： IOH[mA]
【BD4942G/FVE】
VDD=8.0V
VDD=6.0V
VDD=4.8V
Fig.5 “High” Output Current
【BD49E42G-M】
【BD49E42G-M】
【BD48E42G-M】
【BD49E42G-M】
【BD48E42G-M】
【BD49E42G-M】
【BD48E42G-M】
8/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves – continued
Fig.7 Operating Limit Voltage
[V]
0.0
0.2
0.4
0.6
0.8
1.0
0
0.5
1
1.5
2
2.5
SUPPLY VOLTAGE:
OUTPUT VOLTAGE
:
V
OUT
[V]
【
BD4842G/FVE
】
Fig.9 Circuit Current when ON
0.0
0.5
1.0
1.5
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN ON ： I DD1 [μA]
【BD4842G/FVE】
Fig.10 Circuit Current when OFF
0.0
0.5
1.0
1.5
-40 -20 0 20 40 60 80 100
TEMPERATURE ： Ta[℃]
CIRCUIT CURRENT WHEN OFF ： I DD2[μA]
【BD4842G/FVE】
【
BD48x42x
】
【
BD48x42x
】
【
BD48x42x
】
【BD49E42G-M】
【BD48E42G-M】
【BD49E42G-M】
【BD48E42G-M】
【BD49E42G-M】
【BD48E42G-M】
Fig.8 Detection Voltage
Release Voltage
3.0
3.4
3.8
4.2
4.6
5.0
5.4
-40
0
40
80
TEMPERATURE
:
Ta[℃]
DETECTION VOLTAGE:
VDET[V]
【
BD4842G/FVE
】
Low to High(VDET+ΔVDET）
High to Low(VDET）
～
～
【
BD48x42x
】
【BD49E42G-M】
【BD48E42G-M】
9/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Typical Performance Curves – continued
Fig.11 Operating Limit Voltage
0.0
0.5
1.0
1.5
-40 -20 020 40 60 80 100
TEMPERATURE ： Ta[℃]
MINIMUM OPERATION VOLTAGE ： VOPL[V]
【BD4842G/FVE】
【
BD48x42x
】
【BD49E42G-M】
【BD48E42G-M】
10/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Application Information
Explanation of Operation
For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as
threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical
Characteristics for information on hysteresis. Because the BD48Exxx-M series uses an open drain output type, it is
necessary to connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this
case becomes VDD or the voltage of the other power supply].
Fig.12 (BD48Exxx-M series Internal Block Diagram) Fig.13 (BD49Exxx-M series Internal Block Diagram)
Reference Data
Examples of Leading (tPLH) and Falling (tPHL) Output
Part Number
tPLH (μs)
tPHL (μs)
BD48E45G-M
39.5
87.8
BD49E45G-M
32.4
52.4
VDD=4.3V5.1V
VDD=5.1V4.3V
*This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
Timing Waveform
Example: the following shows the relationship between the input voltages VDD and the output voltage VOUT when the
input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig.12 and 13).
1
When the power supply is turned on, the output is unstable
from after over the operating limit voltage (VOPL) until tPHL.
Therefore it is possible that the reset signal is not valid when the
rise time of VDD is faster than tPHL.
2
When VDD is greater than VOPL, but less than the reset release
voltage (VDET + ∆VDET), the output voltages will switch to Low.
3
If VDD exceeds the reset release voltage (VDET + ∆VDET), then,
VOUT switches from L to H.
4
If VDD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply
fluctuation, VOUT switches to L (with a delay of tPHL).
5
The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (∆VDET).
The system is designed such that the output does not toggle with
power supply fluctuations within this hysteresis width, preventing
the
malfunctions due to noise.
VDD
VDET+ΔVDET
VDET
VOPL
0V
tPHL
①
②
VOUT
tPLH
tPHL
tPLH
③
④
VOL
VOH
⑤
Fig.14 Timing Waveform
Vref
R1
R2
V
DD
GND
Q1
V
OUT
R3
R
L
Vref
R1
R2
R3
Q2
Q1
V
DD
V
OUT
GND
11/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Circuit Applications
1) Examples of a common power supply detection reset circuit.
Application examples of BD48Exxx-M series (Open
Drain output type) and BD49Exxx-M series (CMOS
output type) are shown on the left.
CASE1: Power supply of the microcontroller (VDD2)
differs from the power supply of the reset detection
(VDD1).
Use an open drain output type (BD48xxx-M) device with
a load resistance RL attached as shown in figure 15.
CASE2: Power supply of the microcontroller (VDD1) is
same as the power supply of the reset detection (VDD1).
Use a CMOS output type (BD49xxx-M) device or an
open drain device with a pull up resistor between output
and VDD1.
When a capacitance CL for noise filtering is connected to
the VOUT pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall of the output voltage (VOUT).
The Electrical characteristics were measured using
RL= 470kΩ and CL = 100pF.
2) The following is an example of a circuit application in which an OR connection between two types of detection voltage
resets the microcontroller.
To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain
output type (BD48Exxx-M series) to the microcontroller’s input with pull-up resistor to the supply voltage of the
microcontroller (VDD3) as shown in Fig. 17. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is
possible.
Fig.16 CMOS Output Type
V
DD1
BD48Exxx-M
V
DD2
GND
Micro
Controller
R
ST
C
L
(
Capacitor is for
noise filtering
）
R
L
C
L
(
Capacitor is for
filtering
）
V
DD1
BD49Exxx-M
Micro
Controller
R
ST
GND
Fig.15 Open Drain Output Type
VDD2
VDD1
VDD3
GND
Microcontroller
RL
BD48Exxx-M
BD48Exxx-M
RST
Fig.17
12/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
3) Examples of the power supply with resistor dividers
In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow into
the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of current that
flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow may cause
malfunction in the systems operation such as output oscillations, etc.
Fig.18
When an in-rush current (I1) flows into the circuit (Refer to Fig. 18) at the time when output switches from “Low” to “High”,
a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD
voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”
condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches
again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to
oscillation.
VOUT
R2
VDD
BD48Exxx-M
BD49Exxx-M
GND
R1
I1
V1
CIN
CL
IDD
VDD
VDET
0
Through Current
Fig.19 Current Consumption vs. Power Supply Voltage
13/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Operational Notes
1) Absolute maximum ratings
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such
as adding a fuse, in case the IC is operated over the absolute maximum ratings.
2) Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no
pins are at a voltage below the ground pin at any time, even during transient condition.
3) Recommended operating conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
4) Bypass Capacitor for Noise Rejection
To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.
Be careful when using extremely big capacitor as transient response will be affected.
5) Short between pins and mounting errors
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong
orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation under strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) The VDD line impedance might cause oscillation because of the detection current.
8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)
condition.
10) External parameters
The recommended parameter range for RL is 10kΩ to 1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
11) Power on reset operation
Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual
operation.
12) Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
13) Rush current
When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to
the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special
consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
14) This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might
cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is
assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD
terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the
pull up resistor should be less than 1/10 of the assumed leak resistance.
14/14
BD48Exxx-M series BD49Exxx-M series
TSZ02201-0R7R0G300070-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
27.Aug.2013 Rev.004
www.rohm.com
TSZ22111・15・001
●Revision History
Date
Revision
Changes
30.Mar.2012
001
New Release
14.Dec.2012
002
Updated General Description, Features, Applications, Absolute maximum ratings, Explanation
of Operation, Timing Waveform, Circuit Applications, and Operational Notes.
Changed Lineup table format.
Add Io in Absolute Maximum Rating table
Add limits for VDET specifically at VDET=2.5V,3.0V,3.3V,4.2V,4.8V
Change parameter in electrical characteristics from IOL to VOL and IOH to VOH
Add circuits application numbers 2 and 3
Added Revision History.
22.May.2013
003
Change limits for VDET at VDET=2.5V,3.0V,3.3V,4.2V,4.8V
27.Aug.2013
004
Update the applications and features on page 1 and ordering information on page 2
Datasheet
Datasheet
Notice - SS Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
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[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - SS Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
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Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
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for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
