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APPLICATION I NFORMATIONS (ref er to appl ication circui t)
D1 and D2 diodes a re r equi re d only for r ev er se po-
larity pr ot ec tion.
If VS may be higher than VZS a re sist or RS is neces-
sary to limit the z ener current I ZS. In order to det er -
mine RS value the following equatio ns can be used :
VS M AX – VD1 – V ZS min
1) < IZS MAX
RS
2) V S min – VD1 – RS – ISON MAX > VST min
wher e f rom T amb = 25 °C :
- VS MAX and VS min a re the maxim um and minimum
values of power su pply volt a ge
- VD1 is the forwa rd diod e D1 vol t age dr op
- VZS min = 20 V
- IZS MAX = 30 mA for d.c. mode and IZS MAX = 80 mA
for puls ed m ode (see Abso lut e m ax im um r atings)
- ISOM MAX = 30 mA
- VST min = 3.5 V
If no RS value ca n satisf y t he syste m 1), 2) a more
power f ull externa l z ene r DZ = 18 V is re quired.
Then 1) becomes :
VS MAX – V D1 – 18 < IDZ MAX
RS
wher e I DZ MAX is t he m ax im um all owed DZ current.
VA voltage cannot be higher than 20 V otherwise
output overvoltage protection may be activated.
Morever VA must be less than 16 V if short circuit
protect io n is re quir ed .
DZ2 = 22 to 24 V i s a m andator y for out put 7 pr otec-
tion if VS may be hi gher than 26 V .
MOUNTIN G INSTRUCTIO N
The L9305A is assembled in a new plastic package,
the Pow er dip , in wh ic h 8 pin s ( fro m 9 to 16) are at -
tache d to the frame and re mover the heat produced
by the chip.
Figure 2 and 3 show two ways of heatsinkin g. In the
first case, a PC board copper area is used as a
heatsink I = 65 mm. While in the second case, the
device is soldered to an external heatsink. In both
examples, the thermal resistance junction-ambient
is 35 °C/W.
Figure 2 : Exam pl e of Hea tsink Using P C Bo ar d
Copper (I = 65 mm). Figure 3 : Exam p le of an E x ter nal Heats in k.
L9305A
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