Schnelle PIN-Fotodiode High Speed PIN-Photodiode Lead (Pb) Free Product - RoHS Compliant SFH 2701 Wesentliche Merkmale Features * Speziell geeignet fur Anwendungen von 400nm bis 1050nm * Sehr kurze Schaltzeit im spezifizierten Wellenlangenbereich * Sehr kurze Schaltzeiten bei geringer Sperrspannung (<5V) * Extrem kurze Abklingzeit (slow tail") * IEC Standard 3216 Chipled Bauform * Especially suitable for applications from 400nm to 1050nm * Fast switching time within the specified wavelength * Fast switching time at low reverse voltage (<5V) * Ultra short decay time ("slow tail") * IEC Standard 3216 Chipled package Anwendungen Applications * * * * * * * * Optische Laufwerke (CD, DVD) Lichtschranken fur Gleich- und Wechselbetrieb Industrieelektronik Messen/Steuern/Regeln" Typ Type Bestellnummer Ordering Code SFH 2701 Q65110A2960 2008-12-04 1 Optical Disc Drives (CD, DVD) Photointerrupters Industrial electronics For control and drive circuits SFH 2701 Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 85 C Sperrspannung Reverse voltage VR 15 V Sperrspannung, t < 120 s Reverse voltage VR 20 V 2 kV Elektrostatische Entladung ESD Electrostatic Discharge Human Body Model according to EOS/ESD-5.1-1993 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value min typ Einheit Unit max Spektrale Fotoempfindlichkeit des Chips Spectral sensitivity of the chip = 650nm = 780nm S Fotostrom, VR = 5 V, Ee = 0.5 mW/cm2 Photocurrent = 650nm = 780nm IP Wellenlange der max. Fotoempfindlichkeit Wavelength of max. sensitivity S max 820 nm Spektraler Bereich der Fotoempfindlichkeit Spectral range of sensitivity S = 10% of Smax 400...1050 nm Abmessung der bestrahlungsempfindlichen Flache L x B Dimensions of radiant sensitive area LxW 0.6 x 0.6 mm x mm Abstand Chipoberflache zu Gehauseoberflache Distance chip front to case surface H 0.3 mm Halbwinkel Half angle 60 Grad deg. 2008-12-04 A/W 0.45 0.5 A 1.2 1.4 2 SFH 2701 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value min Dunkelstrom, VR = 5 V Dark current Anstiegs- und Abfallzeit des Fotostromes Rise and fall time of the photocurrent, 10% - 90% VR = 5 V, RL = 50 , = 650 nm, Ip = 1 mA VR = 5 V, RL = 50 , = 780 nm, Ip = 1 mA Kapazitat, f = 1 MHz, E = 0, VR = 0 V Capacitance Temperaturkoeffizient von S Temperature coefficient of S = 650 nm = 780 nm Rauschaquivalente Strahlungsleistung1) Noise equivalent power, VR = 5 V, = 650 nm 1) - 15 NEP = 17,9 x10 2008-12-04 IR x --------S 3 Einheit Unit typ max IR 0.05 5 t r , tf t r , tf 1.8 2.0 C0 3 TCI -0.03 -0.01 NEP 6.3 x 10-15 nA ns ns 5 pF %/K %/K W ----------Hz SFH 2701 Relative Spectral Sensitivity Srel = f () Capacitance OHF00815 100 % Srel 90 Switching time C0 = f (VR), E = 0 tr, tf = f (VR), OHF03901 4 pF C tr , tf OHF03917 8 ns 7 80 3 6 70 5 60 2 50 4 40 3 30 2 1 20 1 10 0 400 500 600 700 800 900 nm 1100 0 -3 10 0 10 -2 10 -1 10 0 10 1 V 10 2 VR Dark Current IR = f (TA), E = 0, VR = 5V Dark Current IR = f (VR), E = 0 OHF03904 0.12 nA 100 nA IR IR 10 0.08 1 0.06 0.04 0,1 0.02 0 0,01 5 0 10 15 V 20 25 35 45 55 75 C 85 65 VR TA Directional Characteristics Srel = f () 40 30 20 10 0 OHF01402 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 2008-12-04 0.8 0.6 0.4 0 20 40 60 80 4 100 120 0 2 4 6 8 10 12 V 16 VR SFH 2701 Mazeichnung Package Outlines 1.65 (0.065) 1.25 (0.049) Cathode mark 2.15 (0.085) 0.9 (0.035) 3.35 (0.132) 3.05 (0.120) Center of active area o0.9 (0.035) 0.92 (0.036) (layout may differ) 0.7 (0.028) 2 0.4 (0.016) o0.7 (0.028) GPLY7034 Mae in mm (inch) / Dimensions in mm (inch) Gehause / Package PCB mit klarem Epoxid / PCB with clear epoxy Anschlussbelegung Pin configuration Pad 1 = Kathode / cathode Pad 2 = Anode / anode Kathoden Markierung (grun) kann von der in der Zeichung angegeben Form abweichen. Cathode mark (green) can differ from the form shown in drawing. 2008-12-04 1.85 (0.073) 1 0.5 (0.020) 1.35 (0.053) 5 SFH 2701 Empfohlenes Lotpaddesign Recommended Solderpad Design 1.5 1.5 OHF03896 4.7 Mae in mm / Dimensions in mm 2008-12-04 6 SFH 2701 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 3 Preconditioning acc. to JEDEC Level 3 (nach J-STD-020C) (acc. to J-STD-020C) OHLA0687 300 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile C 255 C 240 C T 250 C 260 C +0 -5 C 245 C 5 C C 235 C +5 -0 C 217 C 10 s min 200 30 s max Ramp Down 6 K/s (max) 150 100 s max 120 s max 100 Ramp Up 3 K/s (max) 50 25 C 0 0 50 100 150 200 250 s 300 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2008-12-04 7