SFH2701 - OSRAM Opto Semiconductors

SFH 2701

Schnelle PIN-Fotodiode

High Speed PIN-Photodiode

Lead (Pb) Free Product - RoHS Compliant

2008-12-04 1

Wesentliche Merkmale

• Speziell geeignet für Anwendungen von 400nm

bis 1050nm

• Sehr kurze Schaltzeit im spezifiz ierten

Wellenlängenbereich

• Sehr kurze Schaltzeiten bei geringer

Sperrspannung (<5V)

• Extrem kurze Abklingzeit („slow tail“)

• IEC Standard 3216 Chipled Bauform

Anwendungen

• Optische Laufwerke (CD, DVD)

• Lichtschranken für Gleich- und Wechselbetrieb

• Industrieelektronik

• „Messen/Steuern/Regeln“

Typ

Type Bestellnummer

Ordering Code

SFH 2701 Q65110A2960

Features

• Especially suitable for applications from 400nm

to 1050nm

• Fast switching time within the specified

wavelength

• Fast switching time at low reverse voltage

(<5V)

• Ultra short decay time (“slow tail“)

• IEC Standard 3216 Chipled package

Applications

• Optical Disc Drives (CD, DVD)

• Photointerrupters

• Industrial electronics

• For control and drive circuits

2008-12-04 2

SFH 2701

Grenzwerte

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top; Tstg – 40 … + 85 °C

Sperrspannung

Reverse voltage VR15 V

Sperrspannung, t < 120 s

Reverse voltage VR20 V

Elektrostatische Entladung

Electrostatic Discharge

Human Body Model according to EOS/ESD-5.1-1993

ESD 2 kV

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

min typ max

Spektrale Fotoempfindlichkeit des Chips

Spectral sensitivity of the chip

λ = 650nm

λ = 780nm

Sλ

0.45

0.5

A/W

Fotostrom, VR = 5 V, Ee = 0.5 mW/cm2

Photocurrent

λ = 650nm

λ = 780nm

1.2

1.4

μA

Wellenlänge der max. Fotoempfindlichkeit

Wavelength of max. sensitivity λS max 820 nm

Spektraler Bereich der Fotoempfindlichkeit

Spectr al range of sens itivity

S = 10% of Smax

λ400...1050 nm

Abmessung der bestrahlungsempfindlichen Fläche

Dimensions of radiant sensitive area L×B

L×W0.6 ×0.6 mm ×mm

Abstand Chipoberfläche zu Gehäuseoberfläche

Distance chip front to case surface H0.3 mm

Halbwinkel

Half angle ϕ±60 Grad

deg.

SFH 2701

2008-12-04 3

Dunkelstrom, VR = 5 V

Dark current IR 0.05 5 nA

Anstiegs- und Abfallzeit des Fotostromes

Rise and fall time of the photocurrent, 10% - 90%

VR = 5 V, RL = 50 Ω, λ = 650 nm, Ip = 1 mA

VR = 5 V, RL = 50 Ω, λ = 780 nm, Ip = 1 mA tr, tf

tr, tf

1.8

2.0 ns

Kapazität, f = 1 MHz, E = 0, VR = 0 V

Capacitance C035pF

Temperaturkoeffizient von Sλ

Temperature coefficient of Sλ

λ = 650 nm

λ = 780 nm TCI-0.03

-0.01 %/K

%/K

Rauschäquivalente Strahlungsleistung1)

Noise equivalent power, VR = 5 V, λ = 650 nm NEP 6.3 ×10-15

Kennwerte (TA = 25 °C)

Characteristics (cont’d)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

min typ max

-----------

NEP 17,9 15–

×10 IR

Sλ

---------

×=

SFH 2701

2008-12-04 4

Relative Spectral Sensitivity

Srel = f (λ)

Dark Current

IR = f (VR), E = 0

Directional Characteristics

Srel = f (ϕ)

OHF00815

rel

400 500 600 700 800 900 nm 1100

100

OHF03904

0.02

0.04

0.06

0.08

0.12

5 10 15 20

OHF01402

40 30 20 10

20 40 60 80 100 1200.40.60.81.0

0.2

0.4

0.6

0.8

1.0

100 0

Capacitance

C0 = f (VR), E = 0

Dark Current

IR = f (TA), E = 0, VR = 5V

OHF03901

-3

-2

-1

10V

0,01

0,1

100

25 35 45 55 65 75 85

°C

Switching time

tr, tf = f (VR),

OHF03917

2 4 6 8 10 12 16

SFH 2701

2008-12-04 5

Maßzeichnung

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch)

Kathoden Markieru ng (grün) kann von der in der Zeichung angegeben Form abweichen.

Cathode mark (green) can differ from the form shown in drawing.

Gehäuse / Package PCB mit klarem Epoxid / PCB with clear epoxy

Anschlussbelegung

Pin configuration Pad 1 = Kathode / cathode

Pad 2 = Anode / anode

1.25 (0.049)

0.92 (0.036)

0.5 (0.020)

0.9 (0.035)

0.7 (0.028)

0.4 (0.016)

1.35 (0.053)

1.65 (0.065)

3.05 (0.120)

3.35 (0.132)

1.85 (0.073)

2.15 (0.085)

Center of

GPLY7034

active area

ø0.7 (0.028)

ø0.9 (0.035)

Cathode mark

(layout may differ)

2008-12-04 6

SFH 2701

Empfohlenes Lötpaddesign

Recommended Solderpad Design

Maße in mm / Dimensions in mm

OHF03896

4.7

1.5

SFH 2701

2008-12-04 7

Lötbedingungen Vorbehandlung nach JEDEC Level 3

Soldering Conditions Preconditioning acc. to JEDEC Level 3

Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)

Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)

Published by

OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organiza tion.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.

1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected

to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.

2 Life support devices or syste ms are intended (a) to be im planted in the human body, or (b) to sup port and/or maintain

and sustain human life. If they fail, it is reasonable to assume that the he alth of the user may be endangered.

OHLA0687

˚C

120 s max

100

150

200

250

300

Ramp Up

100 s max

50 100 150 200 250 300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

245 ˚C

±5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

235 ˚C

-0 ˚C

+5 ˚C

Minimum Solder Profile

10 s min