〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
. 1/21
TSZ02201-0GCG0H300010-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
21.Dec.2015 Rev.003
TSZ22111 • 14 • 001
www.rohm.com
1 Channel High Side Switch ICs
2.5A Current Limit High Side Switch ICs
BD82044FVJ
General Description
BD82044FVJ is a Single Channel High Side Switch IC
employing N-channel power MOSFET with low on
resistance and low supply current for the power supply
line of universal serial bus (USB).
This IC has a built-in over current detection circuit,
thermal shutdown circuit, under voltage lockout and soft
start circuits.
Features
Over-Current Protection : 2.5A
Control Input Logic : Active-High
Output Discharge Function
Reverse Current Protection when Power Switch Off
Thermal Shutdown
Open-Drain Fault Flag Output
Under-Voltage Lockout
OCP Fast Response
Soft-Start Circuit
ESD Protection
UL : File No.E243261
IEC 60950-1 CB scheme approval
Applications
USB hub in consumer appliances, PC,
PC peripheral equipment, and so forth
Key Specifications
Input Voltage Range: 2.7V to 5.5V
ON Resistance: (VIN=5V) 72mΩ(Typ)
Over Current Threshold: 2.5A
Standby Current: 0.01μA (Typ)
Operating Temperature Range: -40°C to +85°C
Package W(Typ) x D(Typ) x H(Max)
TSSOP-B8J 3.00mm x 4.90mm x 1.10mm
Typical Application Circuit
TSSOP-B8J
( MSOP8 Jedec )
Figure 1. Typical Application Circuit
10kΩ to
OUT
OUT
OUT
IN
IN
/OC
GND
C
L
C
I
N
-
+
EN
3.3V
VOUT
5V(Typ)
Datashee
t
2/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
21.Dec.2015 Rev.003
Block Diagram
Pin Configuration
Pin Descriptions
Pin
No.
Symbol
I/O
Function
1
GND
-
Ground
2, 3
IN
I
Power supply input
Input terminal to the power switch and power supply input terminal of the internal
circuit
Short these pins externally
4
EN
I
Enable input
Active high power on switch
High level input > 2.0V, Low level input < 0.8V
5
/OC
O
Error flag output
Low when over-current or thermal shutdown is activated
Open drain output
6, 7, 8
OUT
O
Power switch output
Short these pins externally
1
2
3
4
8
7
6
5
GND
IN
IN
/OC
OUT
OUT
OUT
Top View
EN
UVLO
IN
GND
Charge
Pump
Gate
Logic
OCD
TSD
IN
EN
OUT
OUT
OUT
/OC
Figure 3. Pin Configuration (TOP VIEW)
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BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
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Absolute Maximum Ratings(Ta=25°C)
Parameter
Symbol
Rating
Unit
IN Supply Voltage
VIN
-0.3 to +6.0
V
EN Input Voltage
VEN
-0.3 to +6.0
V
/OC Voltage
V/OC
-0.3 to +6.0
V
/OC Sink Current
I/OC
5
mA
OUT Voltage
VOUT
-0.3 to +6.0
V
Storage Temperature
Tstg
-55 to +150
°C
Power Dissipation
Pd
0.58 (Note 1)
W
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 4.7mW per 1°C above 25°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Ratings
Parameter
Symbol
Rating
Unit
Min
Typ
Max
IN Operating Voltage
VIN
2.7
5.0
5.5
V
Operating Temperature
Topr
-40
-
+85
°C
Electrical Characteristics (VIN= 5V, Ta= 25°C, unless otherwise specified.)
DC Characteristics
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
Operating Current
IDD
-
110
150
μA
VEN = 5V, VOUT = open
Standby Current
ISTB
-
0.01
5
μA
VEN = 0V, VOUT = open
EN Input Voltage
VENH
2.0
-
-
V
High input
VENL
-
-
0.8
V
Low input
EN Input Leakage
IEN
-1
0.01
+1
μA
VEN = 0V or 5V
On Resistance
RON
-
72
90
mΩ
IOUT = 0.5A
-
74
93
IOUT = 1.0A
-
78
98
IOUT = 1.5A
-
84
105
IOUT = 2.0A
Reverse Leak Current
IREV
-
-
1
μA
VOUT = 5.5V, VIN = 0V
Over-Current Threshold
ITH
2.05
2.50
2.80
A
Current Load Slew rate
100A/s
Short Circuit Output Current
ISC
1.20
1.60
2.00
A
VOUT=0V, CL=100μF
RMS
Output Discharge Resistance
RDISC
-
55
100
Ω
IOUT = 1mA, VEN = 0V
/OC Output Low Voltage
V/OC
-
-
0.4
V
I/OC = 1mA
/OC Output Leak Current
IL/OC
-
0.01
1
μA
V/OC = 5V
UVLO Threshold
VTUVH
2.1
2.3
2.5
V
VIN increasing
VTUVL
2.0
2.2
2.4
V
VIN decreasing
AC Characteristics
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
Output Rise Time
tON1
-
0.3
10
ms
RL=10Ω
Output Turn-on Time
tON2
-
0.5
20
ms
Output Fall Time
tOFF1
-
2
10
μs
Output Turn-off Time
tOFF2
-
4
20
μs
/OC Delay Time
t/OC
4
7
15
ms
4/21
BD82044FVJ
© 2014 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
21.Dec.2015 Rev.003
Measurement Circuit
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
VEN(V/EN)
1µF
VIN
A
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
VEN(V/EN)
1µF
RL
VIN
10kΩ
VIN
A
Operating Current
EN, Input Voltage, Output Rise/Fall Time
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
VEN(V/EN)
1µF
10kΩ
CL
VIN
VIN
IOUT
※10µF
A
GND
IN
IN
EN(/EN)
OUT
OUT
OUT
/OC
VEN(V/EN)
1µF
VIN
A
I/OC
On Resistance, Over-Current Protection
※Use capacitance of more than 10μF at
output short test by using external supply.
/OC Output Low Voltage
Figure 4. Measurement Circuit
Timing Diagram
tON1
VOUT
10%
90%
90%
tOFF1
tON2
VEN
VENH
tOFF2
VENL
10%
Figure 5. Output Rise/Fall Time
5/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
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Ta=25°C
Figure 6. Operating Current vs
Supply Voltage
EN Enable
0
50
100
150
200
250
-50 0 50 100
AMBIENT TEMPERATURE : Ta[℃]
OPERATING CURRENT : IDD[µA]
VIN=5.0V
Figure 7. Operating Current vs
Ambient Temperature
EN Enable
VIN=5.0V
Figure 9. Standby Current vs
Ambient Temperature
EN Disable
Ta=25°C
Figure 8. Standby Current vs
Supply Voltage
EN Disable
Typical Performance Curves
Operating Current : IDD [µA]
Operating Current : IDD [µA]
Ambient Temperature : Ta[°C]
Ambient Temperature : Ta[°C]
Supply Voltage : VIN [V]
Supply Voltage : VIN [V]
Standby Current : ISTB [µA]
Standby Current : ISTB [µA]
6/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
21.Dec.2015 Rev.003
Typical Performance Curves - continued
Ta=25°C
Figure 12. On Resistance vs
Supply Voltage
VIN=5.0V
Figure 13. On Resistance vs
Ambient Temperature
Figure 10. EN Input Voltage vs
Supply Voltage
Ta=25°C
Figure 11. EN Input Voltage vs
Ambient Temperature
VIN=5.0V
Low to High
High to Low
Ambient Temperature : Ta[°C]
Ambient Temperature : Ta[°C]
Supply Voltage : VIN [V]
Supply Voltage : VIN [V]
Enable Input Voltage : VEN[V]
Enable Input Voltage : VEN[V]
On Resistance : RON[mΩ]
On Resistance : RON[mΩ]
2.0A Load
2.0A Load
Low to High
High to Low
7/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
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Typical Performance Curves - continued
VIN=5.0V
Figure 15. Over-Current
Threshold vs Ambient
Temperature
Figure 14. Over-Current
Threshold vs Supply Voltage
Ta=25°C
Ta=25°C
Figure 16. /OC Output Low
Voltage vs Supply Voltage
VIN=5.0V
Figure 17. /OC Output Low
Voltage vs Ambient Temperature
Ambient Temperature : Ta[°C]
Ambient Temperature : Ta[°C]
Supply Voltage : VIN [V]
Supply Voltage : VIN [V]
Over Current Threshold : ITH[A]
Over Current Threshold : ITH[A]
/OC Output Low Voltage : V/OC[mV]
/OC Output Low Voltage : V/OC[mV]
8/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
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Typical Performance Curves - continued
VIN=5.0V
Figure 21. Output Rise Time vs
Ambient Temperature
Figure 19. UVLO Hysteresis
Voltage vs Ambient Temperature
Ta=25°C
Figure 20. Output Rise Time vs
Supply Voltage
Figure 18. UVLO Threshold vs
Ambient Temperature
VTUVH
VTUVL
Ambient Temperature : Ta[°C]
Ambient Temperature : Ta[°C]
Supply Voltage : VIN [V]
Ambient Temperature : Ta[°C]
UVLO Threshold : VTUVL, VTUVH[V]
UVLO Hysteresis Voltage : VHYS[V]
Rise Time : tON1[ms]
Rise Time : tON1[ms]
9/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
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Ta=25°C
Figure 22. Output Turn-on Time
vs Supply Voltage
VIN=5.0V
Figure 23. Output Turn-on Time
vs Ambient Temperature
Ta=25°C
Figure 24. Output Fall Time vs
Supply Voltage
VIN=5.0V
Figure 25. Output Fall Time vs
Ambient Temperature
Typical Performance Curves - continued
Ambient Temperature : Ta[°C]
Ambient Temperature : Ta[°C]
Supply Voltage : VIN [V]
Supply Voltage : VIN [V]
Turn On Time : tON2[ms]
Turn On Time : tON2[ms]
Fall Time : tOFF1[µs]
Fall Time : tOFF1[µs]
10/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
21.Dec.2015 Rev.003
Typical Performance Curves - continued
Ta=25°C
Figure 26. Output Turn-off Time
vs Supply Voltage
VIN=5.0V
Figure 27. Output Turn-off Time
vs Ambient Temperature
Ta=25°C
Figure 28. /OC Delay Time vs
Supply Voltage
VIN=5.0V
Figure 29. /OC Delay Time vs
Ambient Temperature
Ambient Temperature : Ta[°C]
Ambient Temperature : Ta[°C]
Supply Voltage : VIN [V]
Supply Voltage : VIN [V]
/OC Delay Time : t/OC[ms]
/OC Delay Time : t/OC[ms]
Turn-off Time : tOFF2[µs]
Turn-off Time : tOFF2[µs]
11/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
21.Dec.2015 Rev.003
Typical Performance Curves - continued
Ta=25°C
Figure 30. Discharge On
Resistance vs Supply Voltage
VIN=5.0V
Figure 31. Discharge On Resistance
vs Ambient Temperature
Ambient Temperature : Ta[°C]
Supply Voltage : VIN [V]
Disc On Resistance: RDISC[Ω]
Disc On Resistance: RDISC[Ω]
12/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
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Typical Wave Forms（BD82044FVJ）
TIME(0.4ms/div.)
Figure 34. Inrush Current Response
TIME(0.4ms/div.)
Figure 32. Output Rise Characteristic
TIME(4ms/div.)
Figure 35. Over-Current Response
Ramped Load
TIME(1μs/div.)
Figure 33. Output Fall Characteristic
IIN
(1.0A/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IIN
(1.0A/div.)
VIN=5V
RL=10Ω
VIN=5V
CL=100μF
CL=47µF
CL=100µF
CL=220µF
CL=47µF
CL=100µF
CL=220µF
VEN
(5V/div.)
IIN
(0.5A/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IIN
(0.5A/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
VIN=5V
RL=10Ω
VIN=5V
RL=10Ω
13/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
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Typical Wave Forms（BD82044FVJ）
TIME(10ms/div.)
Figure 38. UVLO Response
Increasing VIN
TIME(10ms/div.)
Figure 39. UVLO Response
Decreasing VIN
TIME(4ms/div.)
Figure 37. Over-Current Response
1ΩLoad Connected at Enable
TIME(10ms/div.)
Figure 36. Over-Current Response
Enable to Shortcircuit
VIN
(5V/div.)
IIN
(1.0A/div.)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IIN
(1.0A/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IIN
(0.5A/div.)
VOUT
(5V/div.)
VIN
(5V/div.)
IIN
(0.5A/div.)
VOUT
(5V/div.)
VIN=5V
CL=100μF
RL=10Ω
VIN=5V
CL=100μF
RL=10Ω
14/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
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Typical Application Circuit
IN
OUT
Regulator
OUT
OUT
OUT
IN
IN
/OC
GND
VBUS
D-
D+
GND
USB
Controller
5V(Typ)
10kΩ to
100kΩ
CL
CIN
-
+
EN(/EN)
Figure 40. Typical Application Circuit
Application Information
IN terminal supply internal circuit of IC and input of power switch. Therefore ringing of power line causes bad influences on
IC operations. In order to avoid this case, it is recommended to connect a low ESR bypass capacitor (1μF or higher) as
close to between IN and GND terminal as possible. When excessive current flows due to output short-circuit or so, ringing
occurs because of inductance between power source line to IC may exert a bad influence upon IC. In order to decrease
voltage fluctuations from power source line to IC, connect a low ESR capacitor in parallel with CIN. 10μF to 100μF or higher
is effective.
Pull up /OC output by resistance 10kΩ to 100kΩ.
Set up a value for CL which satisfies the application.
This system connection diagram does not guarantee operation as the intended application.
When using the circuit with changes to the external circuit values, make sure to leave an adequate margin for external
components including static and transitional characteristics as well as the design tolerance of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal
is also used as power source input to internal control circuit.
When the switch is turned on from EN control input, the IN terminal and OUT terminal are connected by a 72mΩ(Typ)
switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of the IN
terminal, current flows from OUT terminal to IN terminal.
Since the parasitic diode between the drain and the source of switch MOSFET is canceled, current flow from OUT to IN is
prevented during off state. Output Discharge Function operates at off state.
2. Thermal Shutdown Circuit (TSD)
If over current would continue, the temperature of the IC would increase drastically. If the junction temperature reaches
beyond 135°C(Typ) during the condition of over-current detection, thermal shutdown circuit operates and turns power
switch off and outputs error flag (/OC). Then, when the junction temperature decreases below 115°C(Typ), power switch
is turned on and error flag (/OC) is cancelled. Unless the cause of the increase of the chip’s temperature is removed or
the output of power switch is turned off, this operation repeats.
The thermal shutdown circuit operates when the switch is on (EN signal is active).
3. Over Current Detection (OCD)
The over current detection circuit (OCD) limits current (ISC) and outputs error flag (/OC) when current flowing in each
switch MOSFET exceeds a specified value. There are three cases when the OCD circuit is activated. The OCD operates
when the switch is on (EN signal is active).
15/21
BD82044FVJ
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TSZ22111・15・001
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(1) When the switch is turned on while the output is in short-circuit status, the switch gets in current limit status
immediately.
(2) When the output short-circuits or when high current load is connected while the switch is on, very large current
will flow until the over-current limit circuit reacts. When this happens, the over-current limit circuit is activated
and the current limitation is carried out.
(3) When the output current increases gradually, current limitation does not work until the output current exceeds
the over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until VIN exceeds 2.3V(Typ). If VIN drops below 2.2V(Typ) while the
switch is still on, then the UVLO will shut off the power switch. UVLO has a hysteresis of 100mV(Typ).
Under-voltage lockout circuit works when the switch is on (EN signal is active). And While UVLO works, Output
Discharging Function operates.
5. Error Flag (/OC) Output
Error flag output is an N-MOS open drain output. Upon detection of over current or thermal overrun, the output level
becomes low.
Over current detection has a delay filter. This delay filter prevents current detection flags from being sent during
instantaneous events such as surge current due to switching or hot plug. If fault flag output is unused, /OC pin should be
connected to open or ground line.
6. Output Discharge Function
When the switch is turned off from disable control input or UVLO function, the 55Ω(Typ.) discharge circuit between OUT
and GND turns on. By turning on this switch, electric charge at capacitive load is discharged. But when the voltage of IN
declines extremely, then the OUT pin becomes Hi-Z without UVLO function.
Figure 41. Over-Current Detection, Thermal Shutdown Timing.
VEN
VOUT
IOUT
V/OC
Output shortcircuit
Thermal shut down
/OC Delay Time
16/21
BD82044FVJ
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Power Dissipation
The power dissipation depends on output load, ambient temperature and PCB layout. The device has current capacity of
2.0A. Power dissipation can be calculated using the output current and the RON of the power switch as below.
Pd = RON x IOUT2
The derating curve is shown below
TSSOP-B8J(MSOP-8 JEDEC standard)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
025 50 75 100 125 150
Ambient Temperature : Ta [℃]
Power Dissipation : Pd [W]
4 layer board mounting
2 layer board mounting
1 layer board mounting
0.96W
0.75W
0.58W
Note: IC is Mounted on 70mmx70mmx1.6mm glass-epoxy PCB.
Derating is 4.7mW/°C above Ta=25°C(when 1layer board mounting).
Figure 42. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalent Circuit
Symbol
Pin No.
Equivalent Circuit
EN
4
EN
/OC
5
/OC
OUT
6,7,8
OUT
17/21
BD82044FVJ
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TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
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Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. In rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
18/21
BD82044FVJ
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TSZ22111・15・001
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21.Dec.2015 Rev.003
Operational Notes - continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 43. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Thermal design
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in actual states of
use.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
19/21
BD82044FVJ
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
21.Dec.2015 Rev.003
Ordering Information
Marking Diagram
B
D
8
2
0
4
4
F
V
J
-
G E2
G:
Halogen
free
package
Packaging and forming
specification
E2: Embossed tape and reel
Part
Number
Package
FVJ: TSSOP-B8J
(MSOP-8 Jedec)
TSSOP-B8J(TOP VIEW)
044
Part Number Marking
LOT Number
1PIN MARK
D 8 2
20/21
BD82044FVJ
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
21.Dec.2015 Rev.003
Physical Dimension, Tape and Reel Information
Package Name
TSSOP-B8J
21/21
BD82044FVJ
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
TSZ02201-0GCG0H300010-1-2
21.Dec.2015 Rev.003
Revision History
Date
Revision
Changes
06.JAN.2014
0001
Target Specification
05.FEB.2014
001
Release
26.MAY.2014
002
UL, CB recognized.
21.DEC.2015
003
Revise CB File No.
Add Functional Description(6.Output Discharge Function)
Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.