Products Learn & Develop Support USA (English) Type Here to Search Products ARK Menu Intel(R) Dual Band Wireless-AC 3165 Compare Specifications Specifications Essentials Networking Specifications Package Specifications Advanced Technologies Ordering / sSpecs / Steppings + Related Products - Essentials Intel(R) Wireless Products Status Launched Launch Date Q3'14 Board Form Factor M.2 22x30; M.2 12x16 Weight (in grams) 2.4 Operating Temperature Range 0C to 80C Supported Operating Systems Microsoft Windows 7*, Microsoft Windows 8.1*, Microsoft Windows 10*, Linux* (most features not available on Linux) Warranty Period 1 yrs Antenna 1x1 Product Brief Link Conflict Free Yes Intel(R) Wireless 3100 Series Products formerly Stone Peak Learn how Intel is pursuing conflict-free technology. Quick Links Export Full Specifications Support Overview Search Distributors - Networking Specifications TX/RX Streams 1X1 Bands 2.4 GHz, 5 GHz Max Speed 433 Mbps Wi-Fi CERTIFIED* Yes Compliance FIPS, FISMA Integrated Bluetooth Yes System Interface Type PCIe, USB PCN/MDDS Information 940106: PCN | MDDS 940107: PCN | MDDS 944381: PCN | MDDS 944382: PCN | MDDS 944397: PCN 944398: PCN | MDDS - Package Specifications Package Size 22mm x 30mm x 2.4mm - Advanced Technologies Intel(R) Wireless Display Yes 4G WiMAX Wireless Technology No Supported Under vPro No Intel(R) Smart Connect Technology Yes All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems. "Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the correct classification of any item at the time of export. Refer to Datasheet for formal definitions of product properties and features. "Announced" SKUs are not yet available. Please refer to the Launch Date for market availability. "Conflict free" and "conflict-free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers. Send us your feedback! Company Information Our Commitment Communities Investor Relations Contact Us Newsroom Jobs (c) Intel Corporation Terms of Use *Trademarks Privacy Cookies Supply Chain Transparency Site Map