1Rectifier Device Data
Surface Mount Power Package
Schottky Power Rectifiers employ the use of the Schottky Barrier principle in
a large area metal-to-silicon power diode. State-of-the-art geometry features
epitaxial construction with oxide passivation and metal overlay contact. Ideally
suited for low voltage, high frequency rectification, or as free wheeling and
polarity protection diodes, in surface mount applications where compact size
and weight are critical to the system. These state-of-the-art devices have the
following features:
•Small Compact Surface Mountable Package with J-Bend Leads
•Rectangular Package for Automated Handling
•Highly Stable Oxide Passivated Junction
•High Blocking Voltage — 100 Volts
•150°C Operating Junction Temperature
•Guardring for Stress Protection
Mechanical Characteristics
•Case: Epoxy, Molded
•Weight: 95 mg (approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal Leads are
Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes: 260°C
Max. for 10 Seconds
•Shipped in 12 mm Tape and Reel, 2500 units per reel
•Polarity: Notch in Plastic Body Indicates Cathode Lead
•Markings; MBRS190T3: B19
Markings; MBRS1100T3: B1C
MAXIMUM RATINGS
Rating Symbol MBRS190T3 MBRS1100T3 Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR90 100 Volts
Average Rectified Forward Current TL = 120°C
TL = 100°CIF(AV) 1.0
2.0 Amps
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 50 Amps
Operating Junction Temperature TJ– 65 to +150 °C
Voltage Rate of Change dv/dt 10 V/ns
THERMAL CHARACTERISTICS
Thermal Resistance — Junction to Lead (TL = 25°C) RθJL 22 °C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (1)
(iF = 1.0 A, TJ = 25°C) VF0.75 Volts
Maximum Instantaneous Reverse Current (1)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 100°C)
iR0.5
5.0
mA
(1) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤2.0%.
Preferred devices are Motorola recommended choices for future use and best overall value.
Designer’s Data for “W orst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Motorola, Inc. 1998
Order this document
by MBRS1100T3/D
SEMICONDUCTOR TECHNICAL DATA
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE
90, 100 VOLTS
CASE 403A–03
SMB
Motorola Preferred Device
Rev 3
2Rectifier Device Data
TYPICAL ELECTRICAL CHARACTERISTICS
Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current*
Figure 3. Power Dissipation Figure 4. Current Derating, Lead
Figure 5. Typical Capacitance
20
10
5
2
1
0.5
0.2
0.1
0.05
0.020 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4
vF, INSTANTANEOUS VOLTAGE (VOLTS)
100
°
C
25
°
C
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
1 K
400
200
100
40
20
10
4
2
1
0.4
0.2
0.1
0.04
0.01
0.02
0 102030405060708090100
T
J
= 150
°
C
125
°
C
100
°
C
VR, REVERSE VOLTAGE (VOLTS)
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
00 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
TJ = 100
°
C
SQUARE
WAVE
DC
IF(AV), AVERAGE FORW ARD CURRENT (AMPS)
P , AVERAGE POWER DISSIPATION (WATTS)
F(AV)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
00 20 40 60 80 100 120 140 160
RATED VR APPLIED
R
θ
JL = 22
°
C/W
TJ = 100
°
C
SQUARE
WAVE
DC
TL, LEAD TEMPERATURE (
°
C)
I , AVERAGE FORWARD CURRENT (AMPS)
F(AV)
280
260
240
220
200
180
160
140
120
100
80
60
40
20
00.1 0.2 0.5 1 2 5 10 20 50 100
VR, REVERSE VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
NOTE: TYPICAL CAPACITANCE
NOTE: AT 0 V = 270 pF
TJ = 150
°
C
IR, REVERSE CURRENT ( A)
µ
*The curves shown are typical for the highest voltage device in the voltage
grouping. Typical reverse current for lower voltage selections can be estimated
from these curves if VR is sufficient below rated VR.
25
°
C
3Rectifier Device Data
INFORMATION FOR USING THE SMB SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must be
the correct size to insure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self align when subjected to a
solder reflow process.
mm
inches
0.085
2.159
0.108
2.743
0.089
2.261
MOUNTING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
•Always preheat the device.
•The delta temperature between the preheat and soldering
should be 100°C or less.*
•When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference shall be a maximum of 10°C.
•The soldering temperature and time shall not exceed
260°C for more than 5 seconds.
•When shifting from preheating to soldering, the maximum
temperature gradient shall be 5°C or less.
•After soldering has been completed, the device should be
allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
•Mechanical stress or shock should not be applied during
cooling
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
4Rectifier Device Data
PACKAGE DIMENSIONS
CASE 403A–03
ISSUE B
A
S
DB
J
P
K
C
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.160 0.180 4.06 4.57
B0.130 0.150 3.30 3.81
C0.075 0.095 1.90 2.41
D0.077 0.083 1.96 2.11
H0.0020 0.0060 0.051 0.152
J0.006 0.012 0.15 0.30
K0.030 0.050 0.76 1.27
P0.020 REF 0.51 REF
S0.205 0.220 5.21 5.59
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MBRS1100T3/D
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