FUNCTIONAL BLOCK DIAGRAM
REV. A
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reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
a
DSP Microcomputer
The ADSP-217x combines the ADSP-2100 base architecture
(three computational units, data address generators, and a pro-
gram sequencer) with two serial ports, a host interface port, a
programmable timer, extensive interrupt capabilities, and on-
chip program and data memory.
In addition, the ADSP-217x supports new instructions, which
include bit manipulations–bit set, bit clear, bit toggle, bit test–
new ALU constants, new multiplication instruction (x squared),
biased rounding, and global interrupt masking, for increased
flexibility. The ADSP-217x also has a Bus Grant Hang Logic
(BGH) feature.
The ADSP-217x provides 2K words (24-bit) of program RAM
and 2K words (16-bit) of data memory. The ADSP-2172 pro-
vides an additional 8K words (24-bit) of program ROM. Power-
down circuitry is also provided to meet the low power needs of
battery operated portable equipment. The ADSP-217x is avail-
able in 128-pin TQFP and 128-pin PQFP packages.
Fabricated in a high-speed, double metal, low power, CMOS
process, the ADSP-217X operates with a 30 ns instruction cycle
time. Every instruction can execute in a single processor cycle.
The ADSP-217x’s flexible architecture and comprehensive in-
struction set allow the processor to perform multiple operations
in parallel. In one processor cycle the ADSP-217x can:
generate the next program address
fetch the next instruction
perform one or two data moves
update one or two data address pointers
perform a computational operation
This takes place while the processor continues to:
receive and transmit data through the two serial ports
receive and/or transmit data through the host interface port
decrement timer
FEATURES
30 ns Instruction Cycle Time (33 MIPS) from
16.67 MHz Crystal at 5.0 V
50 ns Instruction Cycle Time (20 MIPS) from 10 MHz
Crystal at 3.3 V
ADSP-2100 Family Code & Function Compatible with
New Instruction Set Enhancements for Bit Manipula-
tion Instructions, Multiplication Instructions, Biased
Rounding, and Global Interrupt Masking
Bus Grant Hang Logic
2K Words of On-Chip Program Memory RAM
2K Words of On-Chip Data Memory RAM
8K Words of On-Chip Program Memory ROM
(ADSP-2172)
8- or 16-Bit Parallel Host Interface Port
300 mW Typical Power Dissipation at 5.0 V at 30 ns
70 mW Typical Power Dissipation at 3.3 V at 50 ns
Powerdown Mode Featuring Less than 0.55 mW (ADSP-
2171/ADSP-2172) or 0.36 mW (ADSP-2173) CMOS
Standby Power Dissipation with 100 Cycle Recovery
from Powerdown
Dual Purpose Program Memory for Both Instruction
and Data Storage
Independent ALU, Multiplier/Accumulator, and Barrel
Shifter Computational Units
Two Independent Data Address Generators
Powerful Program Sequencer Provides
Zero Overhead Looping
Conditional Instruction Execution
Two Double-Buffered Serial Ports with Companding
Hardware and Automatic Data Buffering
Programmable 16-Bit Interval Timer with Prescaler
Programmable Wait State Generation
Automatic Booting of Internal Program Memory from
Byte-Wide External Memory, e.g., EPROM, or
Through Host Interface Port
Stand-Alone ROM Execution (Optional)
Single-Cycle Instruction Execution
Single-Cycle Context Switch
Multifunction Instructions
Three Edge- or Level-Sensitive External Interrupts
Low Power Dissipation in Standby Mode
128-Lead TQFP and 128-Lead PQFP
GENERAL DESCRIPTION
The ADSP-2171, ADSP-2172, and ADSP-2173 are single-chip
microcomputers optimized for digital signal processing (DSP)
and other high-speed numeric processing applications. The
ADSP-2171 and ADSP-2172 are designed for 5.0 V applica-
tions. The ADSP-2173 is designed for 3.3 V applications. The
ADSP-2172 also has 8K words (24-bit) of program ROM.
© Analog Devices, Inc., 1995
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 617/329-4700 Fax: 617/326-8703
EXTERNAL
ADDRESS
BUS
EXTERNAL
DATA
BUS
ARITHMETIC UNITS
SHIFTER
MAC
ALU
MEMORY
SERIAL PORTS
SPORT 0 SPORT 1
FLAGS
DATA
ADDRESS
GENERATORS
DAG 1 DAG 2
PROGRAM
SEQUENCER
PROGRAM MEMORY ADDRESS
DATA MEMORY ADDRESS
DATA MEMORY DATA
TIMER
PROGRAM MEMORY DATA
DATA
MEMORY
2K x 16
PROGRAM
ROM
8K x 24
PROGRAM
RAM
2K x 24
POWERDOWN
CONTROL
LOGIC
HOST
INTERFACE
PORT
ADSP-2100 BASE
ARCHITECTURE
ADSP-2171/ADSP-2172/ADSP-2173
REV. A
–2–
ADSP-2171/ADSP-2172/ADSP-2173
Development System
The ADSP-2100 Family Development Software, a complete set
of tools for software and hardware system development, supports
the ADSP-217x. The System Builder provides a high-level
method for defining the architecture of systems under develop-
ment. The Assembler has an algebraic syntax that is easy to
program and debug. The Linker combines object files into
an executable file. The Simulator provides an interactive
instruction-level simulation with a reconfigurable user interface
to display different portions of the hardware environment. A
PROM Splitter generates PROM programmer compatible files.
The C Compiler, based on the Free Software Foundation’s
GNU C Compiler, generates ADSP-217x assembly source
code. The Runtime Library includes over 100 ANSI-standard
mathematical and DSP-specific functions.
EZ-Tools, low cost, easy-to-use hardware tools, also support the
ADSP-217x.
The ADSP-217x EZ-ICE
®
Emulator aids in the hardware de-
bugging of ADSP-217x systems. The emulator consists of hard-
ware, host computer resident software, the emulator probe, and
the pin adaptor. The emulator performs a full range of emula-
tion functions including stand-alone operation or operation in
the target, setting up to 20 breakpoints, single-step or full-speed
operation in the target, examining and altering registers and
memory values, and PC upload/download functions. If you plan
to use the emulator, you should consider the emulator’s restric-
tions (differences between emulator and processor operation).
The EZ-LAB
®
Evaluation Board is a PC plug-in card, but it can
operate in stand-alone mode. The evaluation board/system de-
velopment board executes EPROM-based or downloaded pro-
grams. Modular Analog Front End daughter cards with different
codecs will be made available.
EZ-ICE and EZ-LAB are registered trademarks of Analog Devices, Inc.
Additional Information
This data sheet provides a general overview of ADSP-217x
functionality. For additional information on the architecture and
instruction set of the processor, refer to the ADSP-2100 Family
User’s Manual. For more information about the Development
System and ADSP-217x programmer’s reference information,
refer to the ADSP-2100 Family Assembler Tools & Simulator
Manual.
ARCHITECTURE OVERVIEW
Figure 1 is an overall block diagram of the ADSP-217x. The
processor contains three independent computational units: the
ALU, the multiplier/accumulator (MAC) and the shifter. The
computational units process 16-bit data directly and have provi-
sions to support multiprecision computations. The ALU per-
forms a standard set of arithmetic and logic operations; division
primitives are also supported. The MAC performs single-cycle
multiply, multiply/add and multiply/subtract operations with
40 bits of accumulation. The shifter performs logical and
arithmetic shifts, normalization, denormalization, and derive
exponent operations. The shifter can be used to efficiently
implement numeric format control including multiword and
block floating-point representations.
The internal result (R) bus directly connects the computational
units so that the output of any unit may be the input of any unit
on the next cycle.
A powerful program sequencer and two dedicated data address
generators ensure efficient delivery of operands to these compu-
tational units. The sequencer supports conditional jumps, sub-
routine calls and returns in a single cycle. With internal loop
counters and loop stacks, the ADSP-217x executes looped code
with zero overhead; no explicit jump instructions are required to
maintain the loop.
Figure 1. ADSP-217x Block Diagram
R BUS
16
HIP
CONTROL
HIP
REGISTERS
BOOT
ADDRESS
GENERATOR
BUS
EXCHANGE
COMPANDING
CIRCUITRY
DMA BUS
PMA BUS
DMD BUS
PMD BUS
PROGRAM
SEQUENCER
INSTRUCTION
REGISTER
DATA
ADDRESS
GENERATOR
#2
DATA
ADDRESS
GENERATOR
#1
14
14
INPUT REGS
OUTPUT REGS
SHIFTER
INPUT REGS
OUTPUT REGS
MAC
INPUT REGS
OUTPUT REGS
ALU
24
16
5
16
MUX
24
MUX
SERIAL
PORT 0
RECEIVE REG
TRANSMIT REG
CONTROL
LOGIC
DATA
SRAM
2K X 16
POWER DOWN
CONTROL
LOGIC
14
TIMER
2
3
11
HIP
DATA
BUS
PROGRAM ROM
8K X 24
PROGRAM SRAM
2K X 24
SERIAL
PORT 1
RECEIVE REG
TRANSMIT REG
FLAGS
EXTERNAL
DATA
BUS
EXTERNAL
ADDRESS
BUS
5
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –3–
Two data address generators (DAGs) provide addresses for
simultaneous dual operand fetches (from data memory and pro-
gram memory). Each DAG maintains and updates four address
pointers. Whenever the pointer is used to access data (indirect
addressing), it is post-modified by the value of one of four pos-
sible modify registers. A length value may be associated with
each pointer to implement automatic modulo addressing for
circular buffers.
Efficient data transfer is achieved with the use of five internal
buses.
Program Memory Address (PMA) Bus
Program Memory Data (PMD) Bus
Data Memory Address (DMA) Bus
Data Memory Data (DMD) Bus
Result (R) Bus
The two address buses (PMA and DMA) share a single external
address bus, allowing memory to be expanded off-chip, and the
two data buses (PMD and DMD) share a single external data
bus.
Program memory can store both instructions and data, permit-
ting the ADSP-217x to fetch two operands in a single cycle, one
from program memory and one from data memory. The ADSP-
217x can fetch an operand from on-chip program memory and
the next instruction in the same cycle.
The memory interface supports slow memories and memory-
mapped peripherals with programmable wait state generation.
External devices can gain control of external buses with bus
request/grant signals (BR and BG). One execution mode (Go
Mode) allows the ADSP-217x to continue running from inter-
nal memory. Normal execution mode requires the processor to
halt while buses are granted.
In addition to the address and data bus for external memory
connection, the ADSP-217x has a configurable 8- or 16-bit
Host Interface Port (HIP) for easy connection to a host proces-
sor. The HIP is made up of 16 data/address pins and 11 control
pins. The HIP is extremely flexible and provides a simple inter-
face to a variety of host processors. For example, the Motorola
68000 series, the Intel 80C51 series and the Analog Devices’
ADSP-2101 can be easily connected to the HIP. The host pro-
cessor can initialize the ASDP-217x’s on-chip memory through
the HIP.
The ADSP-217x can respond to eleven interrupts. There can be
up to three external interrupts, configured as edge or level sensi-
tive, and eight internal interrupts generated by the Timer, the
Serial Ports (“SPORTs”), the HIP, the powerdown circuitry,
and software. There is also a master RESET signal.
The two serial ports provide a complete synchronous serial in-
terface with optional companding in hardware and a wide vari-
ety of framed or frameless data transmit and receive modes of
operation. Each port can generate an internal programmable
serial clock or accept an external serial clock.
Boot circuitry provides for loading on-chip program memory
automatically from byte-wide external memory. After reset,
seven wait states are automatically generated. This allows, for
example, a 30 ns ADSP-217x to use an external 200 ns
EPROM as boot memory. Multiple programs can be selected
and loaded from the EPROM with no additional hardware. The
on-chip program memory can also be initialized through the
HIP.
The ADSP-217x features three general-purpose flag outputs
whose states can be simultaneously changed through software.
You can use these outputs to signal an event to an external
device. In addition, the data input and output pins on SPORT1
can be alternatively configured as an input flag and an output
flag.
A programmable interval timer generates periodic interrupts. A
16-bit count register (TCOUNT) is decremented every n pro-
cessor cycles, where n-l is a scaling value stored in an 8-bit regis-
ter (TSCALE). When the value of the count register reaches
zero, an interrupt is generated and the count register is reloaded
from a 16-bit period register (TPERIOD).
The ADSP-217x instruction set provides flexible data moves
and multifunction (one or two data moves with a computation)
instructions. Every instruction can be executed in a single pro-
cessor cycle. The ADSP-217x assembly language uses an alge-
braic syntax for ease of coding and readability. A comprehensive
set of development tools supports program development.
Serial Ports
The ADSP-217x incorporates two complete synchronous serial
ports (SPORT0 and SPORT1) for serial communications and
multiprocessor communication.
Here is a brief list of the capabilities of the ADSP-217x
SPORTs. Refer to the ADSP-2100 Family User’s Manual for
further details.
SPORTs are bidirectional and have a separate, double-
buffered transmit and receive section.
SPORTs can use an external serial clock or generate their own
serial clock internally.
SPORTs have independent framing for the receive and trans-
mit sections. Sections run in a frameless mode or with frame
synchronization signals internally or externally generated.
Frame sync signals are active high or inverted, with either of
two pulse widths and timings.
SPORTs support serial data word lengths from 3 to 16 bits
and provide optional A-law and µ-law companding according
to CCITT recommendation G.711.
SPORT receive and transmit sections can generate unique
interrupts on completing a data word transfer.
SPORTs can receive and transmit an entire circular buffer of
data with only one overhead cycle per data word. An interrupt
is generated after a data buffer transfer.
SPORT0 has a multichannel interface to selectively receive
and transmit a 24 or 32 word, time-division multiplexed,
serial bitstream.
SPORT1 can be configured to have two external interrupts
(IRQ0 and IRQ1) and the Flag In and Flag Out signals. The
internally generated serial clock may still be used in this
configuration.
REV. A
–4–
ADSP-2171/ADSP-2172/ADSP-2173
Pin Description
The ADSP-217x is available in 128-lead TQFP and 128-lead
PQFP packages. Table I contains the pin descriptions.
Table I. ADSP-217x Pin List
Pin #
Group of Input/
Name Pins Output Function
Address 14 O Address output for program,
data and boot memory spaces
Data 24 I/O Data I/O pins for program
and data memories. Input
only for boot memory space,
with two MSBs used as boot
space addresses.
RESET 1 I Processor reset input
IRQ2 1 I External interrupt request #2
BR 1 I External bus request input
BG 1 O External bus grant output
BGH 1 O External bus grant hang output
PMS 1 O External program memory select
DMS 1 O External data memory select
BMS 1 O Boot memory select
RD 1 O External memory read enable
WR 1 O External memory write enable
MMAP 1 I Memory map select
CLKIN,
XTAL 2 I External clock or quartz crystal
input
CLKOUT 1 O Processor clock output
HSEL 1 I HIP select input
HACK 1 O HIP acknowledge output
HSIZE 1 8/16 bit host select input
0 = 16-bit; 1 = 8-bit
BMODE 1 I Boot mode select input
0 = EPROM/data bus; 1 = HIP
HMD0 1 I Bus strobe select input
0 = RD, WR; 1 = RW, DS
HMD1 1 I HIP address/data mode select
input 0 = separate; 1 =
multiplexed
HRD/HRW 1 I HIP read strobe/read/write
select input
HWR/HDS 1 I HIP write strobe/host data
strobe select input
HD15–0/
HAD15-0 16 I/O HIP data/data and address
HA2/ALE 1 I Host address 2/Address latch
enable input
HA1–0/
Unused 2 I Host addresses 1 and 0 inputs
SPORT0 5 I/O Serial port 0 I/O pins (TFS0,
RFS0, DT0, DR0, SCLK0)
SPORT1 5 I/O Serial port 1 I/O pins
or
IRQ1 (TFS1) 1 I External interrupt request #1
IRQ0 (RFS1) 1 I External interrupt request #0
SCLK1 1 O Programmable clock output
FO (DT1) 1 O Flag Output pin
FI (DR1) 1 I Flag Input pin
FL2–0 3 O General purpose flag output
pins
V
DD
6 Power supply pins
GND 11 Ground pins
PWD 1 I Powerdown pin
PWDACK 1 O Powerdown acknowledge pin
Host Interface Port
The ADSP-217x host interface port is a parallel I/O port that al-
lows for an easy connection to a host processor. Through the
HIP, the ADSP-217x can be used as a memory-mapped periph-
eral to a host computer. The HIP can be thought of as an area
of dual-ported memory, or mailbox registers, that allow commu-
nication between the computational core of the ADSP-217x and
the host computer.
The HIP is completely asynchronous. The host processor can
write data into the HIP while the ADSP-217x is operating at full
speed.
The HIP can be configured with the following pins:
HSIZE configures HIP for 8-bit or 16-bit communication with
the host processor.
BMODE (when MMAP = 0) determines whether the ADSP-
217x boots from the host processor (through the HIP) or ex-
ternal EPROM (through the data bus).
HMD0 configures the bus strobes as separate read and write
strobes, or a single read/write select and a host data strobe.
HMD1 selects separate address (3-bit) and data (16-bit)
buses, or a multiplexed, 16-bit address/data bus with address
latch enable.
Tying these pins to appropriate values configures the ADSP-
217x for straight-wire interface to a variety of industry-standard
microprocessors and microcomputers.
In 8-bit reads, the ADSP-217x three-states the upper eight bits
of the bus. When the host processor writes an 8-bit value to the
HIP, the upper eight bits are all zeros. For additional informa-
tion refer to the ADSP-2100 Family User’s Manual.
HIP Operation
The HIP contains six data registers (HDR5–0) and two status
registers (HSR7–6) with an associated HMASK register for
masking interrupts from individual HIP data registers. All HIP
data registers are memory-mapped into the internal data
memory of the ADSP-217x. HIP transfers can be managed us-
ing either interrupts or a polling scheme. These registers are
shown in the section “ADSP-217x Registers.”
The HIP allows a software reset to be performed by the host
processor. The internal software reset signal is asserted for five
ADSP-217x processor cycles.
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –5–
Interrupts
The interrupt controller allows the processor to respond to the
eleven possible interrupts and reset with minimum overhead.
The ADSP-217x provides up to three external interrupt input
pins, IRQ0, IRQ1 and IRQ2. IRQ2 is always available as a dedi-
cated pin; SPORT1 may be reconfigured for IRQ0, IRQ1, and
the flags. The ADSP-217x also supports internal interrupts from
the timer, the host interface port, the two serial ports, software,
and the powerdown control circuit. The interrupt levels are in-
ternally prioritized and individually maskable (except power-
down and reset). The input pins can be programmed to be
either level- or edge-sensitive. The priorities and vector ad-
dresses of all interrupts are shown in Table II, and the interrupt
registers are shown in Figure 2.
Interrupts can be masked or unmasked with the IMASK regis-
ter. Individual interrupt requests are logically ANDed with the
bits in IMASK; the highest priority unmasked interrupt is then
selected.The powerdown interrupt is nonmaskable.
The ADSP-217x masks all interrupts for one instruction cycle
following the execution of an instruction that modifies the
IMASK register. This does not affect autobuffering.
The interrupt control register, ICNTL, allows the external in-
terrupts to be either edge- or level-sensitive. Interrupt routines
can either be nested with higher priority interrupts taking prece-
dence or processed sequentially.
The IFC register is a write-only register used to force and clear
interrupts generated from software.
Table II. Interrupt Priority & Interrupt Vector Addresses
Interrupt Vector
Source of Interrupt Address (Hex)
Reset (or Power-Up with PUCR = 1) 0000 (Highest Priority)
Powerdown (Nonmaskable) 002C
IRQ2 0004
HIP Write 0008
HIP Read 000C
SPORT0 Transmit 0010
SPORT0 Receive 0014
Software Interrupt 1 0018
Software Interrupt 0 001C
SPORT1 Transmit or IRQ1 0020
SPORT1 Receive or IRQ0 0024
Timer 0028 (Lowest Priority)
On-chip stacks preserve the processor status and are automati-
cally maintained during interrupt handling.
The stacks are twelve levels deep to allow interrupt nesting.
The following instructions allow global enable or disable servic-
ing of the interrupts (including powerdown), regardless of the
state of IMASK. Disabling the interrupts does not affect
autobuffering.
ENA INTS;
DIS INTS;
When you reset the processor, the interrupt servicing is enabled.
Figure 2. Interrupt Registers
Timer
SPORT1 Receive or IRQ0
SPORT1 Transmit or IRQ1
Software 0
Software 1
SPORT0 Receive
SPORT0 Transmit
IRQ2
IRQ2
SPORT0 Transmit
SPORT0 Receive
Software 1
Software 0
SPORT1 Transmit or IRQ1
SPORT1 Receive or IRQ0
Timer
INTERRUPT FORCE INTERRUPT CLEAR
IFC
9876543210101112131415
0000000000000 000
IRQ0 Sensitivity
IRQ1 Sensitivity
IRQ2 Sensitivity
Interrupt Nesting
1 = enable, 0 = disable
0
ICNTL
1 = edge
0 = level
43210 101112131415 9876543210
IRQ2
HIP Write
HIP Read
SPORT0 Transmit
SPORT0 Receive
IMASK
1 = enable, 0 = disable0000000000000000
Timer
IRQ0 or SPORT1 Receive
IRQ1 or SPORT1 Transmit
Software 0
Software 1
REV. A
–6–
ADSP-2171/ADSP-2172/ADSP-2173
LOW POWER OPERATION
The ADSP-217x has three low power modes that significantly
reduce the power dissipation when the device operates under
standby conditions. These modes are:
Powerdown
Idle
Slow Idle
The CLKOUT pin may also be disabled to reduce external
power dissipation. The CLKOUT pin is controlled by Bit 14 of
SPORT0 Autobuffer Control Register, DM[0x3FF3].
Powerdown
The ADSP-217x processor has a low power feature that lets the
processor enter a very low power dormant state through hard-
ware or software control. Here is a brief list of powerdown fea-
tures. Refer to the ADSP-2100 Family User’s Manual, Chapter 9
“System Interface” for detailed information about the
powerdown feature.
Powerdown mode holds the processor in CMOS standby with
a maximum current of less than 100 µA in some modes.
Quick recovery from powerdown. The processor begins ex-
ecuting instructions in as few as 100 CLKIN cycles.
Support for an externally generated TTL or CMOS processor
clock. The external clock can continue running during
powerdown without affecting the lowest power rating and 100
CLKIN cycle recovery.
Support for crystal operation includes disabling the oscillator
to save power (the processor automatically waits 4096 CLKIN
cycles for the crystal oscillator to start and stabilize), and let-
ting the oscillator run to allow 100 CLKIN cycle startup.
Powerdown is initiated by either the powerdown pin (PWD)
or the software powerdown force bit.
Interrupt support allows an unlimited number of instructions
to be executed before optionally powering down. The
powerdown interrupt also can be used as a non-maskable,
edge sensitive interrupt.
Context clear/save control allows the processor to continue
where it left off or start with a clean context when leaving the
powerdown state.
The RESET pin also can be used to terminate powerdown,
and the host software reset feature can be used to terminate
powerdown under certain conditions.
Powerdown acknowledge pin indicates when the processor has
entered powerdown.
Idle
When the ADSP-217x is in the Idle Mode, the processor waits
indefinitely in a low power state until an interrupt occurs. When
an unmasked interrupt occurs, it is serviced; execution then
continues with the instruction following the IDLE instruction.
Slow Idle
The IDLE instruction is enhanced on the ADSP-217x to let the
processor’s internal clock signal be slowed during IDLE, further
reducing power consumption. The reduced clock frequency, a
programmable fraction of the normal clock rate, is specified by a
selectable divisor given in the IDLE instruction. The format of
the instruction is
IDLE (n);
where n = 16, 32, 64, or 128. This instruction keeps the proces-
sor fully functional, but operating at the slower clock rate. While
it is in this state, the processor’s other internal clock signals,
such as SCLK, CLKOUT, and timer clock, are reduced by the
same ratio. The default form of the instruction, when no clock
divisor is given, is the standard IDLE instruction.
When the IDLE (n) instruction is used, it effectively slows down
the processor’s internal clock and thus its response time to in-
coming interrupts––the 1-cycle response time of the standard
idle state is increased by n, the clock divisor. When an enabled
interrupt is received, the ADSP-217x will remain in the idle
state for up to a maximum of n processor cycles (n = 16, 32, 64,
or 128) before resuming normal operation.
When the IDLE (n) instruction is used in systems that have an
externally generated serial clock (SCLK), the serial clock rate
may be faster than the processor’s reduced internal clock rate.
Under these conditions, interrupts must not be generated at a
faster rate than can be serviced, due to the additional time the
processor takes to come out of the idle state (a maximum of n
processor cycles).
SYSTEM INTERFACE
Figure 3 shows a basic system configuration with the ADSP-
217x, two serial devices, a host processor, a boot EPROM, and
optional external program and data memories. Up to 14K words
of data memory and 16K words of program memory can be sup-
ported. Programmable wait state generation allows the processor
to interface easily to slow memories. The ADSP-217x also pro-
vides one external interrupt and two serial ports or three exter-
nal interrupts and one serial port.
Clock Signals
The ADSP-217x can be clocked by either a crystal or by a TTL-
compatible clock signal.
The CLKIN input cannot be halted, changed during operation,
or operated below the specified frequency during normal opera-
tion. The only exception is while the processor is in the Power-
down State. For additional information, refer to Chapter 9,
ADSP-2100 Family User’s Manual for detailed information on
this powerdown feature.
If an external clock is used, it should be a TTL-compatible sig-
nal running at half the instruction rate. The signal is connected
to the processor’s CLKIN input. When an external clock is
used, the XTAL input must be left unconnected.
The ADSP-217x uses an input clock with a frequency equal to
half the instruction rate; a 16.67 MHz input clock yields a 30 ns
processor cycle (which is equivalent to 33 MHz). Normally, in-
structions are executed in a single processor cycle. All device
timing is relative to the internal instruction clock rate, which is
indicated by the CLKOUT signal when enabled.
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –7–
Figure 3. ADSP-217x Basic System Configuration
Because the ADSP-217x includes an on-chip oscillator circuit,
an external crystal may be used. The crystal should be con-
nected across the CLKIN and XTAL pins, with two capacitors
connected as shown in Figure 4. A parallel-resonant, fundamen-
tal frequency, microprocessor-grade crystal should be used.
CLKIN CLKOUT
XTAL
ADSP-217x
Figure 4. External Crystal Connections
A clock output (CLKOUT) signal is generated by the processor
at the processor’s cycle rate. This can be enabled and disabled
by the CLKODIS bit in the SPORT0 Autobuffer Control Reg-
ister, DM[0x3FF3].
Reset
The RESET signal initiates a master reset of the ADSP-217x.
The RESET signal must be asserted during the power-up se-
quence to assure proper initialization. RESET during initial
power-up must be held long enough to allow the internal clock
SCLK
RFS
TFS
DT
DR
ADSP-217x
CLKIN
CLKOUT
V
DD
SERIAL
PORT 0
GND
SERIAL
PORT 1
DATA
ADDRESSPMS DMS BMS
RD WR
14 24
16 8
24
SERIAL DEVICE
14 2
XTAL
MMAP
BG
BR
IRQ2
RESET
SCLK
RFS or IRQ0
TFS or IRQ1
DT or FO
DR or FI
AD
CS
DATA MEMORY
&
PERIPHERALS
ADCS
OE
WE
PROGRAM
MEMORY
(OPTIONAL)
NOTE:
THE TWO MSBs OF THE DATA BUS ARE USED AS THE MSBs OF THE BOOT EPROM ADDRESS.
THIS IS ONLY REQUIRED FOR THE 27C256 AND 27C512.
AD
BOOT MEMORY
SERIAL DEVICE
(OPTIONAL)
(OPTIONAL)
D
15-8
e.g., EPROM
27C64
27C128
27C256
27C512
HOST
MODE
FL2-0
4
697
16
HOST
PROCESSOR
(OPTIONAL)
3
HIP CONTROL
HIP
HIP DATA/ADDR
PWDACK
PWD
CLOCK OR
CRYSTAL
D
23-22
D
23-8
OE
WE
OE
CS
(OPTIONAL)
to stabilize. If RESET is activated any time after power-up, the
clock continues to run and does not require stabilization time.
The power-up sequence is defined as the total time required for
the crystal oscillator circuit to stabilize after a valid V
DD
is ap-
plied to the processor, and for the internal phase-locked loop
(PLL) to lock onto the specific crystal frequency. A minimum of
2000 CLKIN cycles ensures that the PLL has locked but does
not include the crystal oscillator start-up time. During this
power-up sequence the RESET signal should be held low. On
any subsequent resets, the RESET signal must meet the mini-
mum pulse width specification, t
RSP
.
The RESET input contains some hysteresis; however, if you use
an RC circuit to generate your RESET signal, the use of an ex-
ternal Schmidt trigger is recommended.
The master reset sets all internal stack pointers to the empty
stack condition, masks all interrupts and clears the MSTAT reg-
ister. When RESET is released, if there is no pending bus re-
quest and the chip is configured for booting (MMAP = 0), the
boot-loading sequence is performed. Then the first instruction is
fetched from internal program memory location 0x0000.
REV. A
–8–
ADSP-2171/ADSP-2172/ADSP-2173
Program Memory Interface
The on-chip program memory address bus (PMA) and the on-
chip program memory data bus (PMD) are multiplexed with
on-chip DMA and DMD buses, creating a single external data
bus and a single external address bus. The 14-bit address bus
directly addresses up to 16K words. 10K words of memory for
ADSP-217x with optional 8K ROM and 2K words of memory
for the non-ROM version are on-chip. The data bus is bidirec-
tional and 24 bits wide to external program memory. Program
memory may contain code and data.
The program memory data lines are bidirectional. The program
memory select (PMS) signal indicates access to the program
memory and can be used as a chip select signal. The write (WR)
signal indicates a write operation and is used as a write strobe.
The read (RD) signal indicates a read operation and is used as a
read strobe or output enable signal.
The ADSP-217x writes data from its 16-bit registers to the 24-
bit program memory using the PX register to provide the lower
eight bits. When it reads data (not instructions) from 24-bit pro-
gram memory to a 16-bit data register, the lower eight bits are
placed in the PX register.
Program Memory Maps
ADSP-217x
Program memory can be mapped in two ways, depending on the
state of the MMAP pin. Figure 5 shows the different configura-
tions. When MMAP = 0, internal RAM occupies 2K words be-
ginning at address 0x0000. In this configuration, the boot
loading sequence (described in “Boot Memory Interface”) is au-
tomatically initiated when RESET is released.
37FF
3800
3FFF
0000
MMAP = 1
BMODE = 0
2K
EXTERNAL
27FF
2800
8K
INTERNAL ROM
(ROMENABLE = 1)
OR
4K
EXTERNAL
2K
INTERNAL RAM
07FF
0800
8K
EXTERNAL
(ROMENABLE = 0)
2K
INTERNAL RAM
NOT BOOTED
6K
EXTERNAL
3FFF
0000
27FF
2800
07FF
0800
MMAP = 1
BMODE = 1
8K
INTERNAL ROM
(ROMENABLE
DEFAULTS
TO 1
DURING RESET)
MMAP = 0
BMODE = 0 or 1
2K
INTERNAL RAM
BOOTED
6K
EXTERNAL
3FFF
0000
27FF
2800
07FF
0800
OR
8K
EXTERNAL
(ROMENABLE = 0)
8K
INTERNAL ROM
(ROMENABLE = 1)
Figure 5. ADSP-217x Memory Maps
When MMAP = 1, words of external program memory begin at
address 0x0000 and internal RAM is located in the upper 2K
words, beginning at address 0x3800. In this configuration, pro-
gram memory is not loaded although it can be written to and
read from under program control.
The optional ROM always resides at locations PM[0x0800]
through PM[0x27FF] regardless of the state of the MMAP pin.
The ROM is enabled by setting the ROMENABLE bit in the
Data Memory Wait State control register, DM[0x3FFE]. When
the ROMENABLE bit is set to 1, addressing program memory
in this range will access the on-chip ROM. When set to zero,
addressing program memory in this range will access external
program memory. The ROMENABLE bit is set to 0 on chip re-
set unless MMAP and BMODE = 1.
The program memory interface can generate 0 to 7 wait states
for external memory devices; default is to 7 wait states after
RESET.
Boot Memory Interface
The ADSP-217x can load on-chip memory from external boot
memory space. The boot memory space consists of 64K by 8-bit
space, divided into eight separate 8K by 8-bit pages. Three bits
in the system control register select which page is loaded by the
boot memory interface. Another bit in the system control regis-
ter allows the user to force a boot loading sequence under soft-
ware control. Boot loading from page 0 after RESET is initiated
automatically if MMAP = 0.
The boot memory interface can generate 0 to 7 wait states; it
defaults to 7 wait states after RESET. This allows the ADSP-
217x to boot from a single low cost EPROM such as a 27C256.
Program memory is booted one byte at a time and converted to
24-bit program memory words.
The BMS and RD signals are used to select and to strobe the
boot memory interface. Only 8-bit data is read over the data
bus, on pins D8–D15. To accommodate addressing up to eight
pages of boot memory, the two MSBs of the data bus are used
in the boot memory interface as the two MSBs of the boot space
address.
The ADSP-2100 Family Assembler and Linker support the cre-
ation of programs and data structures requiring multiple boot
pages during execution.
RD and WR must always be qualified by PMS, DMS, or BMS
to ensure the correct program, data, or boot memory accessing.
HIP Booting
The ADSP-217x can also boot programs through its Host Inter-
face Port. If BMODE = 1 and MMAP = 0, the ADSP-217x
boots from the HIP. If BMODE = 0, the ADSP-217x boots
through the data bus (in the same way as the ADSP-2101), as
described above in “Boot Memory Interface.” For additional in-
formation about HIP booting, refer to the ADSP-2100 Family
User’s Manual, Chapter 7, “Host Interface Port.”
The ADSP-2100 Family Development Software includes a util-
ity program called the HIP Splitter. This utility allows the cre-
ation of programs that can be booted via the ADSP-217x’s HIP,
in a similar fashion as EPROM-bootable programs generated by
the PROM Splitter utility.
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –9–
Stand-Alone ROM Execution
When the MMAP and BMODE pins both are set to 1, the
ROM is automatically enabled and execution commences from
program memory location 0x0800 at the start of ROM. This
feature lets an embedded design operate without external
memory components. To operate in this mode, the ROM coded
program must copy an interrupt vector table to the appropriate
locations in program memory RAM. In this mode, the ROM
enable bit defaults to 1 during reset.
Table III. Boot Summary Table
BMODE = 0 BMODE = 1
MMAP = 0 Boot from EPROM, Boot from HIP, then
then execution starts execution starts at
at internal RAM internal RAM location
location 0x0000 0x0000
MMAP = 1 No booting, execution Stand-Alone Mode,
starts at external memory execution starts at
location 0x0000 internal ROM location
0x0800
Ordering Procedure for ADSP-2172 Processors
To place an order for a custom ROM-coded ADSP-2172 pro-
cessor, you must:
1. Complete the following forms contained in the ADSP ROM
Ordering Package, available from your Analog Devices sales
representative:
ADSP-2172 ROM Specification Form
ROM Release Agreement
ROM NRE Agreement & Minimum Quantity Order (MQO)
Acceptance Agreement for Pre-production ROM Products.
2. Return the forms to Analog Devices along with two copies of
the Memory Image File (.EXE file) of your ROM code. The
files must be supplied on two 3.5" or 5.25" floppy disks for
IBM PC (DOS 2.01 or higher).
3. Place a purchase order with Analog Devices for nonrecurring
engineering charges (NRE) associated with ROM product
development.
After this information is received, it is entered into Analog
Devices’ ROM Manager System which assigns a custom ROM
model number to the product. This model number will be
branded on all prototype and production units manufactured to
these specifications.
To minimize the risk of code being altered during this process,
Analog Devices verifies that the .EXE files on both floppy disks are
identical, and recalculates the checksums for the .EXE file en-
tered into the ROM Manager System. The checksum data, in the
form of a ROM memory map, a hard copy of the .EXE file, and a
ROM Data Verification Form are returned to you for inspection.
A signed ROM Verification Form and a purchase order for pro-
duction units are required prior to any product being manufac-
tured. Prototype units may be applied toward the minimum
order quantity.
Upon completion of the prototype manufacture, Analog Devices
will ship prototype units and a delivery schedule update for pro-
duction units. An invoice against your purchase order for the
NRE charges is issued at this time.
There is a charge for each ROM mask generated and a mini-
mum order quantity. Consult your sales representative for
details. A separate order must be placed for parts of a specific
package type, temperature range, and speed grade.
Data Memory Interface
The data memory address (DMA) bus is 14 bits wide. The bidi-
rectional external data bus is 24 bits wide, with the upper 16
bits (D8–D23) used for data memory data (DMD) transfers.
The data memory select (DMS) signal indicates access to the
data memory and can be used as a chip select signal. The write
(WR) signal indicates a write operation and can be used as a
write strobe. The read (RD) signal indicates a read operation
and can be used as a read strobe or output enable signal.
The ADSP-217x supports memory-mapped I/O, with the pe-
ripherals memory mapped into the data or program memory ad-
dress spaces and accessed by the processor in the same manner.
Data Memory Map
The on-chip data memory RAM resides in the 2K words of data
memory beginning at address 0x3000, as shown in Figure 6. In
addition, data memory locations from 0x3800 to the end of data
memory at 0x3FFF are reserved. Control registers for the sys-
tem, timer, wait state configuration, host interface port, and se-
rial port operations are located in this region of memory.
3BFF
3C00
37FF
3800
DATA MEMORY
12K
EXTERNAL
3FFF
0000
2FFF
3000
1K
RESERVED
MEMORY MAPPED
REGISTERS/
RESERVED
2K
INTERNAL
DATA RAM
03FF
0400
07FF
0800
WAIT STATES
DWAIT 2
(10K EXTERNAL)
3FFF
0000
2FFF
3000
NO WAIT
STATES
DWAIT 0
(1K EXTERNAL)
DWAIT 1
(1K EXTERNAL)
Figure 6. ADSP-217x Data Memory Map
The remaining 12K of data memory is external. External data
memory is divided into three zones, each associated with its own
wait state generator. By mapping peripherals into different
zones, you can accommodate peripherals with different wait
state requirements. All zones default to 7 wait states after
RESET. For compatibility with other ADSP-2100 Family pro-
cessors, bit definitions for DWAIT 3 and DWAIT4 are shown
in the Data Memory Wait State Control Register, but they are
not used by the ADSP-217x.
REV. A
–10–
ADSP-2171/ADSP-2172/ADSP-2173
Bus Request & Bus Grant
The ADSP-217x can relinquish control of the data and address
buses to an external device. When the external device requires
access to memory, it asserts the bus request (BR) signal. If the
ADSP-217x is not performing an external memory access, then
it responds to the active BR input in the following processor
cycle by:
three-stating the data and address buses and the PMS, DMS,
BMS, RD, WR output drivers,
asserting the bus grant (BG) signal, and
halting program execution.
If the Go Mode is enabled, the ADSP-217x will not halt pro-
gram execution until it encounters an instruction that requires
an external memory access.
If the ADSP-217x is performing an external memory access
when the external device asserts the BR signal, then it will not
three-state the memory interfaces or assert the BG signal until
the processor cycle after the access completes, which can be up
to eight cycles later depending on the number of wait states.
The instruction does not need to be completed when the bus is
granted. If a single instruction requires two external memory ac-
cesses, the bus will be granted between the two accesses.
When the BR signal is released, the processor releases the BG
signal, reenables the output drivers and continues program ex-
ecution from the point where it stopped.
The bus request feature operates at all times, including when
the processor is booting and when RESET is active.
The new Bus Grant Hang logic and associated BGH pin allow
the ADSP-217x to operate in a multiprocessor environment
with a minimal number of “wasted” processor cycles. The bus
grant hang pin is asserted when the ADSP-217x desires a cycle,
but cannot execute it because the bus is granted to some other
processor. With the BGH signal, the other processor(s) in the
system can be alerted that the ADSP-217x is hung and release
the bus by deasserting bus request. Once the bus is released the
ADSP-217x executes the external access and deasserts BGH.
This is a signal to the other processors that external memory is
now available.
ADSP-217X REGISTERS
Figure 7 summarizes all the registers in the ADSP-217x. Some
registers store values. For example, AX0 stores an ALU oper-
and; I4 stores a DAG2 pointer. Other registers consist of control
bits and fields, or status flags. For example, ASTAT contains
status flags from arithmetic operations, and fields in DWAIT
control the numbers of wait states for different zones of data
memory.
A secondary set of registers in all computational units allows a
single-cycle context switch.
The bit and field definitions for control and status registers are
given in the rest of this section, except for IMASK, ICNTL and
IFC, which are defined earlier in this data sheet. The system
control register, DWAIT register, timer registers, HIP control
registers, HIP data registers, and SPORT control registers are
all mapped into data memory; that is, registers are accessed by
reading and writing data memory locations rather than register
names. The particular data memory address is shown with each
memory-mapped register.
Register bit values shown on the following pages are the default
bit values after reset. If no values are shown, the bits are indeter-
minate at reset. Reserved bits are shown in gray; these bits
should always be written with zeros.
MAC
MR0 MR1 MFMR2
MX0 MX1 MY0 MY1
DMA BUS
PMA BUS
DMD BUS
PMD BUS
14
POWERDOWN
CONTROL
LOGIC
PROGRAM
ROM
8K X 24
PROGRAM
SRAM
2K X 24
DAG 2
M4
M5
M6
M7
L4
L5
L6
L7
I4
I5
I6
I7
DAG 1
M0
M1
M2
M3
L0
L1
L2
L3
I0
I1
I2
I3
PROGRAM SEQUENCER
COUNT
STACK
4 X 14
CNTR
OWRCNTR
STATUS
STACK
12 X 25
IMASK
MSTAT
ASTAT
SSTAT
ICNTL
IFC
PC
STACK
16 X 14
LOOP
STACK
4 X 18
DM WAIT CONTROL
SYSTEM CONTROL
0x3FFF
0x3FFE
HOST
INTERFACE
PORT
DATA
STATUS
HMASK
0x3FE0-0x3FE5
0x3FE6-0x3FE7
0x3FE8
ALU
AFAR
AX0 AY1AY0AX1
SHIFTER
SR0 SR1
SI SE SB
SPORT 1
CONTROL REGISTERS
0x3FF2-0x3FEF
RX1 TX1
SPORT 0
CONTROL REGISTERS
0x3FFA-0x3FF3
RX0 TX0
PX
TIMER
TPERIOD
TCOUNT
TSCALE
0x3FFD
0x3FFC
0x3FFB
FLAGS
14
16
24
DATA
SRAM
2K X 16
Figure 7. ADSP-217x Registers Control Register
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –11–
Control Registers
SSTAT (Read-Only)
PC Stack Empty
PC Stack Overflow
Count Stack Empty
Count Stack Overflow
Status Stack Empty
Status Stack Overflow
Loop Stack Empty
Loop Stack Overflow
76543210
10101010
Data Register Bank Select
0 = primary, 1 = secondary
Bit Reverse Mode Enable (DAG1)
ALU Overflow Latch Mode Enable
AR Saturation Mode Enable
MAC Result Placement
0 = fractional, 1 = integer
Timer Enable
Go Mode Enable
MSTAT
6543210
0000000
System Control Register
0x3FFF
PWAIT
Program Memory
Wait States
1514131211109876543210
BPAGE
Boot Page Select
BWAIT
Boot Wait States
BFORCE
Boot Force Bit
SPORT0 Enable
1 = enabled, 0 = disabled
SPORT1 Enable
1 = enabled, 0 = disabled
SPORT1 Configure
1 = serial port
0 = FI, FO, IRQ0, IRQ1, SCLK
1010000011111000
0x3FFC
Timer Registers
0x3FFD
0x3FFB
1514131211109876543210
TPERIOD Period Register
TCOUNT Counter Register
TSCALE Scaling Register
00000000
AZ ALU Result Zero
AN ALU Result Negative
AV ALU Overflow
AC ALU Carry
AS ALU X Input Sign
AQ ALU Quotient
MV MAC Overflow
SS Shifter Input Sign
76543210
ASTAT
00000000
REV. A
–12–
ADSP-2171/ADSP-2172/ADSP-2173
Control Registers
ROM Enable/Data Memory Wait State
Control Register
0x3FFE
DWAIT4 DWAIT0DWAIT1DWAIT2DWAIT3
ROM enable
1 = enable
0 = disable
1111111011111111
1514131211109876543210
SPORT0 Control Register
0x3FF6
Multichannel Enable MCE
Internal Serial Clock Generation ISCLK
Receive Frame Sync Required RFSR
Receive Frame Sync Width RFSW
Multichannel Frame Delay MFD
Only If Multichannel Mode Enabled
Transmit Frame Sync Required TFSR
Transmit Frame Sync Width TFSW
SLEN Serial Word Length
DTYPE Data Format
00 = right justify, zero-fill unused MSBs
01 = right justify, sign extend into unused MSBs
10 = compand using µ-law
11 = compand using A-law
INVRFS Invert Receive Frame Sync
INVTFS Invert Transmit Frame Sync
(or INVTDV Invert Transmit Data Valid
Only If Multichannel Mode Enabled)
IRFS Internal Receive Frame Sync Enable
0000000000000000
1514131211109876543210
ITFS Internal Transmit Frame Sync Enable
(or MCL Multichannel Length; 1 = 32 words, 0 = 24 words
Only If Multichannel Mode Enabled)
SPORT0 Multichannel Receive Word Enable Registers
1 = Channel Enabled
0 = Channel Ignored
SPORT0 Multichannel Transmit Word Enable Registers
1 = Channel Enabled
0 = Channel Ignored
0x3FF9
1514131211109876543210
0x3FFA
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
0x3FF7
1514131211109876543210
0x3FF8
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –13–
Control Registers
SPORT0 SCLKDIV
Serial Clock Divide Modulus
0x3FF5
SPORT0 RFSDIV
Receive Frame Sync Divide Modulus
0x3FF4
1514131211109876543210
1514131211109876543210
SPORT0 Autobuffer Control Register
0x3FF3
1514131211109876543210
000000
RBUF
Receive Autobuffering Enable
TBUF
Transmit Autobuffering Enable
RMREG
Receive Autobuffer M Register
RIREG
Receive Autobuffer I Register
CLKODIS
CLKOUT Disable Control Bit
BIASRND
MAC Biased Rounding Control Bit
TIREG
Transmit Autobuffer I Register
TMREG
Transmit Autobuffer M Register
SPORT1 Control Register
0x3FF2
Flag Out (Read Only)
Internal Serial Clock Generation ISCLK
Receive Frame Sync Required RFSR
Receive Frame Sync Width RFSW
Transmit Frame Sync Required TFSR
Transmit Frame Sync Width TFSW
SLEN Serial Word Length
DTYPE Data Format
00 = right justify, zero-fill unused MSBs
01 = right justify, sign extend into unused MSBs
10 = compand using µ-law
11 = compand using A-law
INVRFS Invert Receive Frame Sync
INVTFS Invert Transmit Frame Sync
IRFS Internal Receive Frame Sync Enable
ITFS Internal Transmit Frame Sync Enable
1514131211109876543210
000000000000000
REV. A
–14–
ADSP-2171/ADSP-2172/ADSP-2173
Control Registers
SPORT1 RFSDIV
Receive Frame Sync Divide Modulus
0x3FF0
1514131211109876543210
SPORT1 Autobuffer Control Register
0x3FEF
1514131211109876543210
000000
RBUF
Receive Autobuffer Enable
TBUF
Transmit Autobuffer Enable
RMREG
Receive M Register
RIREG
Receive I Register
TMREG
Transmit M Register
TIREG
Transmit I Register
XTALDIS
XTAL Pin Drive Disable
during Powerdown
1 = disabled, 0 = enabled
(disable XTAL pin when no external
crystal connected)
XTALDELAY
4096 Cycle Delay Enable
1 = delay, 0 = no delay
PDFORCE
Powerdown Force
PUCR
Powerup Context Reset Enable
1 = soft reset (context clear),
0 = resume execution
SPORT1 SCLKDIV
Serial Clock Divide Modulus
0x3FF1
1514131211109876543210
HIP Data Registers
HDR5
HDR4
HDR3
HDR2
HDR1
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
HDR0
0x3FE4
0x3FE3
0x3FE2
0x3FE1
0x3FE0
0x3FE5 HMASK Register
Host HDR5
Read
Host HDR4
Read
Host HDR3
Read
Host HDR2
Read
Host HDR1
Read
Host HDR0
Read
Host HDR0
Write
Host HDR1
Write
Host HDR2
Write
Host HDR3
Write
Host HDR4
Write
Host HDR5
Write
1514131211109876543210
0000000000000000
Interrupt Enables
1 = Enable
0 = Disable
0x3FE8
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –15–
Control Registers
INSTRUCTION SET DESCRIPTION
The ADSP-217x assembly language instruction set has an alge-
braic syntax that was designed for ease of coding and read-
ability. The assembly language, which takes full advantage of
the processor’s unique architecture, offers the following benefits:
The algebraic syntax eliminates the need to remember cryptic
assembler mnemonics. For example, a typical arithmetic add
instruction, such as AR = AX0 + AY0, resembles a simple
equation.
Every instruction assembles into a single, 24-bit word that can
execute in a single instruction cycle.
The syntax is a superset ADSP-2100 Family assembly lan-
guage and is completely source and object code compatible
with other family members. Programs may need to be relo-
cated to utilize internal memory and conform to the ADSP-
217x’s interrupt vector and reset vector map.
Sixteen condition codes are available. For conditional jump,
call, return, or arithmetic instructions, the condition can be
checked and the operation executed in the same instruction
cycle.
Multifunction instructions allow parallel execution of an arith-
metic instruction with up to two fetches or one write to pro-
cessor memory space during a single instruction cycle.
Consult the ADSP-2100 Family User’s Manual for a complete
description of the syntax and an instruction set reference.
Biased Rounding
A new mode allows biased rounding in addition to the normal
unbiased rounding. When the BIASRND bit is set to 0, the nor-
mal unbiased rounding operations occur. When the BIASRND
bit is set to 1, biased rounding occurs instead of the normal un-
biased rounding. When operating in biased rounding mode all
rounding operations with MR0 set to 0x8000 will round up,
rather than only rounding odd MR1 values up. For example:
MR value before RND biased RND result unbiased RND result
00-0000-8000 00-0001-8000 00-0000-8000
00-0001-8000 00-0002-8000 00-0002-8000
00-0000-8001 00-0001-8001 00-0001-8001
00-0001-8001 00-0002-8001 00-0002-8001
00-0000-7FFF 00-0000-7FFF 00-0000-7FFF
00-0001-7FFF 00-0001-7FFF 00-0001-7FFF
This mode only has an effect when the MR0 register contains
0x8000, all other rounding operation work normally. This mode
was added to allow more efficient implementation of bit speci-
fied algorithms which specify biased rounding such as the GSM
speech compression routines. Unbiased rounding is preferred
for most algorithms.
Note: BIASRND bit is Bit 12 of the SPORT0 Autobuffer
Control register.
HSR6
1514131211109876543210
0000000000000000
Host HDR0 Write
Host HDR1 Write
Host HDR2 Write
Host HDR3 Write
Host HDR4 Write
Host HDR5 Write
2171 HDR5 Write
2171 HDR4 Write
2171 HDR3 Write
2171 HDR2 Write
2171 HDR1 Write
2171 HDR0 Write
Overwrite Mode
Software Reset
HSR7
1514131211109876543210
0000000000000001
2171 HDR0 Write
2171 HDR1 Write
2171 HDR2 Write
2171 HDR3 Write
2171 HDR4 Write
2171 HDR5 Write
0x3FE6
0x3FE7
REV. A
–16–
ADSP-2171/ADSP-2172/ADSP-2173
Example Code
The following example is a code fragment that performs the
filter tap update for an adaptive (least-mean-squared algorithm)
filter. Notice that the computations in the instructions are
written like algebraic equations.
MF=MX0*MY1 (RND), MX0=DM (I2,M1); /* MF=error*beta */
MR=MX0*MF (RND), AY0=PM (I6,MS);
DO adapt UNTIL CE;
AR=MR1 + AY0, MX0=DM (I2,M1), AY0=PM (I6,M7);
adapt:
PM(I6,M6) =AR, MR=MX0*MF (RND);
MODIFY (I2, M3); /* Point to oldest data */
MODIFY (I6, M7); /* Point to start of data */
Interrupt Enable
The ADSP-217x supports an interrupt enable instruction. Inter-
rupts are enabled by default at reset. The instruction source
code is specified as follows:
Syntax: ENA INTS;
Description: Executing the ENA INTS instruction allows all
unmasked interrupts to be serviced again.
Interrupt Disable
The ADSP-217x supports an interrupt disable instruction. The
instruction source code is specified as follows:
Syntax: DIS INTS;
Description: Reset enables interrupt servicing. Executing the
DIS INTS instruction causes all interrupts to be
masked without changing the contents of the
IMASK register. Disabling interrupts does not
affect the autobuffer circuitry, which will operate
normally whether or not interrupts are enabled.
The disable interrupt instruction masks all user
interrupts including the powerdown interrupt.
ADSP-2171/ADSP-2172–SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
K Grade B Grade
Parameter Min Max Min Max Unit
V
DD
Supply Voltage 4.5 5.5 4.5 5.5 V
T
AMB
Ambient Operating Temperature 0 +70 –40 +85 °C
ELECTRICAL CHARACTERISTICS
K/B Grades
Parameter Test Conditions Min Max Unit
V
IH
Hi-Level Input Voltage
1, 2
@ V
DD
= max 2.0 V
V
IH
Hi-Level CLKIN Voltage @ V
DD
= max 2.2 V
V
IH
Hi-Level RESET Voltage @ V
DD
= max 2.2 V
V
IL
Lo-Level Input Voltage
1, 3
@ V
DD
= min 0.8 V
V
OH
Hi-Level Output Voltage
1, 4, 5
@ V
DD
= min
I
OH
= –0.5 mA 2.4 V
@ V
DD
= min
I
OH
= –100 µA
6
V
DD
– 0.3 V
V
OL
Lo-Level Output Voltage
1, 4, 5
@ V
DD
= min
I
OL
= 2 mA 0.4 V
I
IH
Hi-Level Input Current
3
@ V
DD
= max
V
IN
= V
DD
max 10 µA
I
IL
Lo-Level Input Current
3
@ V
DD
= max
V
IN
= 0 V 10 µA
I
OZH
Tristate Leakage Current
7
@ V
DD
= max,
V
IN
= V
DD
max
8
10 µA
I
OZL
Tristate Leakage Current
7
@ V
DD
= max,
V
IN
= 0 V
8
10 µA
I
DD
Supply Current (Idle)
9, 10
@ V
DD
= max 18 mA
I
DD
Supply Current (Dynamic)
10
@ V
DD
= max
t
CK
= 30 ns
11
75 mA
I
DD
Supply Current (Powerdown)
10
Lowest Power Mode
12
100 µA
C
I
Input Pin Capacitance
3, 6, 13
@ V
IN
= 2.5 V,
f
IN
= 1.0 MHz,
T
AMB
= 25°C8pF
C
O
Output Pin Capacitance
6, 7, 13, 14
@ V
IN
= 2.5 V,
f
IN
= 1.0 MHz,
T
AMB
= 25°C8pF
NOTES
1
Bidirectional pins: D0-D23, RFS0, RFS1, SCLK0, SCLK1, TFS0, TFS1, HD0-HD15/HAD0-HAD15.
2
Input only pins: RESET, IRQ2, BR, MMAP, DR0, DR1, HSEL, HSIZE, BMODE, HMD0, HMD1, HRD/HWR, HWR/HDS, PWD, HA2/ALE, HA1-0.
3
Input only pins: CLKIN, RESET, IRQ2, BR, MMAP, DR0, DR1, HSEL, HSIZE, BMODE, HMD0, HMD1, HRD/HWR, HWR/HDS, PWD, HA2/ALE, HA1-0.
4
Output pins: BG, PMS, DMS, BMS, RD, WR, PWDACK, A0-A13, DT0, DT1, CLKOUT, HACK, FL2-0, BGH.
5
Although specified for TTL outputs, all ADSP-2171/ADSP-2172 outputs are CMOS-compatible and will drive to V
DD
and GND, assuming no dc loads.
6
Guaranteed but not tested.
7
Three-statable pins: A0-A13, D0-D23, PMS, DMS, BMS, RD, WR, DT0, DT1, SCLK0, SCLK1, TFS0, TFS1, RFS0, RSF1, HD0-HD15/HAD0-HAD15.
8
0 V on BR, CLKIN Active (to force three-state condition).
9
Idle refers to ADSP-2171/ADSP-2172 state of operation during execution of IDLE instruction. Deasserted pins are driven to either V
DD
or GND. Current reflects
device operation with CLKOUT disabled.
10
Current reflects device operating with no output loads.
11
V
IN
= 0.4 V and 2.4 V. For typical figures for supply currents, refer to “Power Dissipation” section.
12
See Chapter 9, of the ADSP-2100 Family User’s Manual for details.
13
Applies to TQFP and PQFP package types.
14
Output pin capacitance is the capacitive load for any three-state output pin.
Specifications subject to change without notice.
ADSP-2171/ADSP-2172/ADSP-2173
–17–
REV. A
REV. A
–18–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2171/ADSP-2172
MEMORY REQUIREMENTS
This chart links common memory device specification names
and ADSP-2171/ADSP-2172 timing parameters for your
convenience.
Common
Parameter Memory Device
Name Function Specification Name
t
ASW
A0-A13, DMS, PMS Address Setup to
Setup before WR Low Write Start
t
AW
A0-A13, DMS, PMS Setup Address Setup
before WR Deasserted to Write End
t
WRA
A0-A13, DMS, PMS Address Hold Time
Hold after WR Deasserted
t
DW
Data Setup before WR High Data Setup Time
t
DH
Data Hold after WR High Data Hold Time
t
RDD
RD Low to Data Valid OE to Data Valid
t
AA
A0-A13, DMS, PMS, Address Access Time
BMS to Data Valid
ADSP-2171/ADSP-2172
ABSOLUTE MAXIMUM RATINGS
*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Output Voltage Swing . . . . . . . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range (Ambient) . . . .–40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . .–65°C to +150°C
Lead Temperature (5 sec) TQFP . . . . . . . . . . . . . . . . +280°C
Lead Temperature (5 sec) PQFP . . . . . . . . . . . . . . . . . +280°C
*
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ESD SENSITIVITY
The ADSP-217x is an ESD (electrostatic discharge) sensitive device. Electrostatic charges readily
accumulate on the human body and equipment and can discharge without detection. Permanent
damage may occur to devices subjected to high energy electrostatic discharges.
The ADSP-217x features proprietary ESD protection circuitry to dissipate high energy discharges
(Human Body Model). Per method 3015 of MIL-STD-883, the ADSP-217x has been classified as
a Class 1 device.
Proper ESD precautions are recommended to avoid performance degradation or loss of function-
ality. Unused devices must be stored in conductive foam or shunts, and the foam should be
discharged to the destination before devices are removed.
WARNING!
ESD SENSITIVE DEVICE
GENERAL NOTES
Use the exact timing information given. Do not attempt to de-
rive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results for
an individual device, the values given in this data sheet reflect
statistical variations and worst cases. Consequently, you cannot
meaningfully add up parameters to derive longer times.
TIMING NOTES
Switching characteristics specify how the processor changes its
signals. You have no control over this timing; it is dependent on
the internal design. Timing requirements apply to signals that
are controlled outside the processor, such as the data input for a
read operation.
Timing requirements guarantee that the processor operates cor-
rectly with another device. Switching characteristics tell you
what the device will do under a given circumstance. Also, use
the switching characteristics to ensure any timing requirement
of a device connected to the processor (such as memory) is
satisfied.
ADSP-2171/ADSP-2172 TIMING PARAMETERS
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –19–
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Clock Signals
t
CK
is defined as 0.5 t
CKI.
The ADSP-2171/ADSP-2172 uses an
input clock with a frequency equal to half the instruction rate; a
clock (which is equivalent to 60 ns) yields a 30 ns processor cycle
16.67 MHz input (equivalent to 33 MHz). t
CK
values within the
range of 0.5 t
CKI
period should be substituted for all relevant
timing parameters to obtain specification value.
Example: t
CKH
= 0.5t
CK
– 7 ns = 0.5 (30 ns) – 7 ns = 8 ns.
Timing Requirement:
t
CKI
CLKIN Period 60 150 ns
t
CKIL
CLKIN Width Low 20 ns
t
CKIH
CLKIN Width High 20 ns
Switching Characteristic:
t
CKL
CLKOUT Width Low 0.5t
CK
– 7 ns
t
CKH
CLKOUT Width High 0.5t
CK
– 7 ns
t
CKOH
CLKIN High to CLKOUT High 0 20 ns
Control Signals
Timing Requirement:
t
RSP
RESET Width Low 5t
CK1
ns
NOTE
1
Applies after power-up sequence is complete. Internal phase lock loop requires no more than 2000 CLKIN cycles assuming stable CLKIN (not including crystal
oscillator start-up time).
CLKIN
CLKOUT
tCKIL tCKOH
tCKH
tCKL
tCKI
tCKIH
Figure 8. Clock Signals
REV. A
–20–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Interrupts and Flags
Timing Requirement:
t
IFS
IRQx or FI Setup before CLKOUT Low
1, 2, 3
0.25t
CK
+ 15 ns
t
IFH
IRQx or FI Hold after CLKOUT High
1, 2, 3
0.25t
CK
ns
Switching Characteristic:
t
FOH
Flag Output Hold after CLKOUT Low
4
0.5t
CK
– 7 ns
t
FOD
Flag Output Delay from CLKOUT Low
4
0.5t
CK
+ 5 ns
NOTES
1
If IRQx and FI inputs meet t
IFS
and t
IFH
setup/hold requirements, they will be recognized during the current clock cycle; otherwise the signals will be recognized on
the following cycle. (Refer to “Interrupt Controller Operation” in the Program Control chapter of the User’s Manual for further information on interrupt servicing.)
2
Edge-sensitive interrupts require pulse widths greater than 10 ns; level-sensitive interrupts must be held low until serviced.
3
IRQx = IRQ0, IRQ1, and IRQ2.
4
Flag Output = FL0, FL1, FL2, and FO.
CLKOUT
FLAG
OUTPUTS
IRQx
FI
t
IFS
t
FOD
t
FOH
t
IFH
Figure 9. Interrupts and Flags
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –21–
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Bus Request/Grant
Timing Requirement:
t
BH
BR Hold after CLKOUT High
1
0.25t
CK
+ 2 ns
t
BS
BR Setup before CLKOUT Low
1
0.25t
CK
+ 17 ns
Switching Characteristic:
t
SD
CLKOUT High to DMS, PMS, BMS, 0.25t
CK
+ 16 ns
RD, WR Disable
t
SDB
DMS, PMS, BMS, RD, WR
Disable to BG Low 0 ns
t
SE
BG High to DMS, PMS, BMS,
RD, WR Enable 0 ns
t
SEC
DMS, PMS, BMS, RD, WR
Enable to CLKOUT High 0.25t
CK
– 7 ns
t
SDBH
DMS, PMS, BMS, RD, WR
Disable to BGH Low
2
0ns
t
SEH
BGH High to DMS, PMS, BMS,
RD, WR Enable
2
0ns
NOTES
1
BR is an asynchronous signal. If BR meets the setup/hold requirements, it will be recognized during the current clock cycle; otherwise the signal will be recognized
on the following cycle. Refer to the ADSP-2100 Family User’s Manual for BR/BG cycle relationships.
2
BGH is asserted when the bus is granted and the processor requires control of the bus to continue.
tBS
BR
tBH
CLKOUT
PMS, DMS
BMS, RD
WR
BG
CLKOUT
tSD
tSDB tSE
tSEC
tSDBH
BGH
tSEH
Figure 10. Bus Request–Bus Grant
REV. A
–22–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Memory Read
Timing Requirement:
t
RDD
RD Low to Data Valid 0.5t
CK
– 9 + w ns
t
AA
A0–A13, PMS, DMS, BMS to Data Valid 0.75t
CK
– 10.5 + w ns
t
RDH
Data Hold from RD High 0 ns
Switching Characteristic:
t
RP
RD Pulse Width 0.5t
CK
– 5 + w ns
t
CRD
CLKOUT High to RD Low 0.25t
CK
– 5 0.25t
CK
+ 7 ns
t
ASR
A0–A13, PMS, DMS, BMS Setup before RD Low 0.25t
CK
– 6 ns
t
RDA
A0–A13, PMS, DMS, BMS Hold after RD Deasserted 0.25t
CK
– 3 ns
t
RWR
RD High to RD or WR Low 0.5t
CK
– 5 ns
w = wait states x t
CK
.
CLKOUT
A0–A13
D
t
RDA
RD
WR
DMS, PMS
BMS
t
RWR
t
RP
t
ASR
t
CRD
t
RDD
t
AA
t
RDH
Figure 11. Memory Read
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –23–
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Memory Write
Switching Characteristic:
t
DW
Data Setup before WR High 0.5 t
CK
– 7 + w n s
t
DH
Data Hold after WR High 0.25t
CK
– 2 ns
t
WP
WR Pulse Width 0.5t
CK
– 5 + w ns
t
WDE
WR Low to Data Enabled 0 ns
t
ASW
A0–A13, DMS, PMS Setup before WR Low 0.25t
CK
– 6 ns
t
DDR
Data Disable before WR or RD Low 0.25t
CK
– 7 ns
t
CWR
CLKOUT High to WR Low 0.25t
CK
– 5 0.25 t
CK
+ 7 ns
t
AW
A0–A13, DMS, PMS, Setup before WR Deasserted 0.75t
CK
– 9 + w ns
t
WRA
A0–A13, DMS, PMS Hold after WR Deasserted 0.25t
CK
– 3 ns
t
WWR
WR High to RD or WR Low 0.5t
CK
– 5 ns
w = wait states x t
CK
.
CLKOUT
A0–A13
D
tWRA
WR
DMS, PMS
tWWR
tWP
tASW tAW
tCWR
RD
tDH tDDR
tWDE
tDW
Figure 12. Memory Write
REV. A
–24–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Serial Ports
Timing Requirement:
t
SCK
SCLK Period 50 ns
t
SCS
DR/TFS/RFS Setup before SCLK Low 4 ns
t
SCH
DR/TFS/RFS Hold after SCLK Low 7 ns
t
SCP
SCLK
IN
Width 20 ns
Switching Characteristic:
t
CC
CLKOUT High to SCLK
OUT
0.25t
CK
0.25t
CK
+ 10 ns
t
SCDE
SCLK High to DT Enable 0 ns
t
SCDV
SCLK High to DT Valid 15 ns
t
RH
TFS/RFS
OUT
Hold after SCLK High 0 ns
t
RD
TFS/RFS
OUT
Delay from SCLK High 15 ns
t
SCDH
DT Hold after SCLK High 0 ns
t
TDE
TFS(Alt) to DT Enable 0 ns
t
TDV
TFS(Alt) to DT Valid 15 ns
t
SCDD
SCLK High to DT Disable 15 ns
t
RDV
RFS (Multichannel, Frame Delay Zero) to DT Valid 15 ns
CLKOUT
SCLK
TFS
RFS
DR
RFS
IN
TFS
IN
DT
ALTERNATE
FRAME MODE
t
CC
t
CC
t
SCK
t
SCP
t
SCP
t
SCS
t
SCH
t
RD
t
RH
RFS
OUT
TFS
OUT
t
SCDV
t
SCDE
t
SCDH
t
SCDD
t
TDE
t
TDV
t
RDV
MULTICHANNEL MODE,
FRAME DELAY 0
(MFD = 0)
Figure 13. Serial Ports
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –25–
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Host Interface Port
Separate Data and Address (HMD1 = 0)
Read Strobe and Write Strobe (HMD0 = 0)
Timing Requirement:
t
HSU
HA2–0 Setup before Start of Write or Read
1, 2
5ns
t
HDSU
Data Setup before End of Write
3
5ns
t
HWDH
Data Hold after End of Write
3
3ns
t
HH
HA2–0 Hold after End of Write or Read
3, 4
3ns
t
HRWP
Read or Write Pulse Width
5
20 ns
Switching Characteristic:
t
HSHK
HACK Low after Start of Write or Read
1, 2
015ns
t
HKH
HACK Hold after End of Write or Read
3, 4
015ns
t
HDE
Data Enabled after Start of Read
2
0ns
t
HDD
Data Valid after Start of Read
2
18 ns
t
HRDH
Data Hold after End of Read
4
0ns
t
HRDD
Data Disabled after End of Read
4
7ns
NOTES
1
Start of Write = HWR Low and HSEL Low.
2
Start of Read = HRD Low and HSEL Low.
3
End of Write = HWR High or HSEL High.
4
End of Read = HRD High or HSEL High.
5
Read Pulse Width = HRD Low and HSEL Low, Write Pulse Width = HWR Low and HSEL Low.
DATA
HD15–0
HSEL
HWR
HACK
HA2–0 ADDRESS
tHSU
tHH
tHWDH
tHRWP
tHSHK tHKH
tHDSU
DATA
HD15–0
HSEL
HRD
HACK
HA2–0 ADDRESS
tHSU
tHH
tHRWP
tHRDH
tHKH
tHSHK
tHRDD
tHDE
tHDD
Figure 14. Host Interface Port (HMD1 = 0, HMD0 = 0)
Host Write Cycle
Host Read Cycle
REV. A
–26–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Host Interface Port
Separate Data and Address (HMD1 = 0)
Read Strobe and Write Strobe (HMD0 = 1)
Timing Requirement:
t
HSU
HA2–0, HRW Setup before Start of Write or Read
1
5ns
t
HDSU
Data Setup before End of Write
2
5ns
t
HWDH
Data Hold after End of Write
2
3ns
t
HH
HA2–0, HRW Hold after End of Write or Read
2
3ns
t
HRWP
Read or Write Pulse Width
3
20 ns
Switching Characteristic:
t
HSHK
HACK Low after Start of Write or Read
1
015ns
t
HKH
HACK Hold after End of Write or Read
2
015ns
t
HDE
Data Enabled after Start of Read
1
0ns
t
HDD
Data Valid after Start of Read
1
18 ns
t
HRDH
Data Hold after End of Read
2
0ns
t
HRDD
Data Disabled after End of Read
2
7ns
NOTES
1
Start of Write or Read = HDS Low and HSEL Low.
2
End of Write or Read = HDS High and HSEL High.
3
Read or Write Pulse Width = HDS Low and HSEL Low.
DATA
HD15–0
HSEL
HRW
HACK
HA2–0 ADDRESS
t
HSU
t
HH
t
HWDH
t
HRWP
t
HSHK
t
HKH
t
HDSU
HDS
DATA
HD15–0
HSEL
HDS
HACK
HA2–0 ADDRESS
t
HSU
t
HH
t
HRWP
t
HRDH
t
HKH
t
HSHK
t
HDE
t
HDD
HRW
t
HRDD
Figure 15. Host Interface Port (HMD1 = 0, HMD0 = 1)
Host Write Cycle
Host Read Cycle
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –27–
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Host Interface Port
Multiplexed Data and Address (HMD1 = 1)
Read Strobe and Write Strobe (HMD0 = 0)
Timing Requirement:
t
HALP
ALE Pulse Width 10 ns
t
HASU
HAD15–0 Address Setup, before ALE Low 5 ns
t
HAH
HAD15–0 Address Hold after ALE Low 2 ns
t
HALS
Start of Write or Read after ALE Low
1, 2
10 ns
t
HDSU
HAD15–0 Data Setup before End of Write
3
5ns
t
HWDH
HAD15–0 Data Hold after End of Write
3
3ns
t
HRWP
Read or Write Pulse Width
4
20 ns
Switching Characteristic:
t
HSHK
HACK Low after Start of Write or Read
1, 2
015ns
t
HKH
HACK Hold after End of Write or Read
3, 5
015ns
t
HDE
HAD15–0 Data Enabled after Start of Read
2
0ns
t
HDD
HAD15–0 Data Valid after Start of Read
2
18 ns
t
HRDH
HAD15–0 Data Hold after End of Read 0 ns
t
HRDD
HAD15–0 Data Disabled after End of Read
5
7ns
NOTES
1
Start of Write = HWR Low and HSEL Low.
2
Start of Read = HRD Low and HSEL Low.
3
End of Write = HWR High or HSEL High.
4
Read Pulse Width = HRD Low and HSEL Low, Write Pulse Width = HWR Low and HSEL Low.
5
End of Read = HRD High or HSEL High.
ADDRESS
t
HDSU
DATA
HACK
HWR
HSEL
HD15–0
t
HRWP
t
HSHK
ALE
t
HALP
t
HALS
t
HKH
t
HAH
t
HASU
t
HWDH
t
HRDH
t
HRDD
t
HDE
ADDRESS DATA
HACK
HRD
HSEL
HAD15–0
t
HRWP
t
HSHK
ALE
t
HALP
t
HALS
t
HKH
t
HAH
t
HASU
t
HDD
Figure 16. Host Interface Port (HMD1 = 1, HMD0 = 0)
Host Write Cycle
Host Read Cycle
REV. A
–28–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2171/ADSP-2172
Parameter Min Max Unit
Host Interface Port
Multiplexed Data and Address (HMD1 = 1)
Read Strobe and Write Strobe (HMD0 = 1)
Timing Requirement:
t
HALP
ALE Pulse Width 10 ns
t
HASU
HAD15–0 Address Setup before ALE Low 5 ns
t
HAH
HAD15–0 Address Hold after ALE Low 2 ns
t
HALS
Start of Write or Read after ALE Low
1
10 ns
t
HSU
HRW Setup before Start of Write or Read
1
5ns
t
HDSU
HAD15–0 Data Setup before End of Write
2
5ns
t
HWDH
HAD15–0 Data Hold after End of Write
2
3ns
t
HH
HRW Hold after End of Write or Read
2
3ns
t
HRWP
Read or Write Pulse Width
3
20 ns
Switching Characteristic:
t
HSHK
HACK Low after Start of Write or Read
1
015ns
t
HKH
HACK Hold after End of Write or Read
2
015ns
t
HDE
HAD15–0 Data Enabled after Start of Read
1
0ns
t
HDD
HAD15–0 Data Valid after Start of Read
1
18 ns
t
HRDH
HAD15–0 Data Hold after End of Read
2
0ns
t
HRDD
HAD15–0 Data Disabled after End of Read
2
7ns
NOTES
1
Start of Write or Read = HDS Low and HSEL Low.
2
End of Write or Read = HDS High and HSEL High.
3
Read or Write Pulse Width = HDS Low and HSEL Low.
ADDRESS
tHDSU
DATA
HACK
HRW
HSEL
HD15–0
tHRWP
tHSHK
ALE tHALP
tHALS
tHKH
tHAH
tHASU
tHWDH
HDS
tHH
tHSU
ADDRESS DATA
HACK
HRW
HSEL
HD15–0
tHRWP
tHSHK
ALE
tHALP tHALS
tHKH
tHAH
tHASU
tHRDH
HDS
tHH
tHSU
tHDE
tHDD tHRDD
Figure 17. Host Interface Port (HMD1 = 1, HMD0 = 1)
Host Write Cycle
Host Read Cycle
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –29–
ADSP-2171/ADSP-2172
ENVIRONMENTAL CONDITIONS
Ambient Temperature Rating:
T
AMB
= T
CASE
– (PD × θ
CA
)
T
CASE
= Case Temperature in °C
PD = Power Dissipation in W
θ
CA
= Thermal Resistance (Case-to-Ambient)
θ
JA
= Thermal Resistance (Junction-to-Ambient)
θ
JC
= Thermal Resistance (Junction-to-Case)
Package θ
JA
θ
JC
θ
CA
TQFP 50°C/W 2°C/W 48°C/W
PQFP 41°C/W 10°C/W 31°C/W
POWER DISSIPATION
To determine total power dissipation in a specific application,
the following equation should be applied for each output:
C × V
DD2
×f
C = load capacitance, f= output switching frequency.
Example:
In an application where external data memory is used and no
other outputs are active, power dissipation is calculated as
follows:
Assumptions:
External data memory is accessed every cycle with 50% of the
address pins switching.
External data memory writes occur every other cycle with
50% of the data pins switching.
Each address and data pin has a 10 pF total load at the pin.
The application operates at V
DD
= 5.0 V and t
CK
= 30 ns.
Total Power Dissipation = P
INT
+ (C × V
DD2
×f)
P
INT
= internal power dissipation from Power vs. Frequency
graph (Figure 18).
(C × V
DD2
× f) is calculated for each output:
# of
Pins × C × V
DD2
× f
Address, DMS 8× 10 pF × 5
2
V × 33.3 MHz = 66.6 mW
Data Output, WR 9× 10 pF × 5
2
V × 16.67 MHz = 37.5 mW
RD 1× 10 pF × 5
2
V × 16.67 MHz = 4.2 mW
CLKOUT 1 × 10 pF × 5
2
V × 33.3 MHz = 8.3 mW
116.6 mW
Total power dissipation for this example is P
INT
+ 116.6 mW.
VALID FOR ALL TEMPERATURE GRADES.
1
POWER REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.
2
IDLE REFERS TO ADSP-2171 STATE OF OPERATION DURING
EXECUTION OF IDLE INSTRUCTION. DEASSERTED PINS ARE
DRIVEN TO EITHER V
DD
OR GND. POWER REFLECTS DEVICE
OPERATING WITH CLKOUT DISABLED.
3
TYPICAL POWER DISSIPATION AT 5.0V V
DD
DURING EXECUTION
OF
IDLE N
INSTRUCTION (CLOCK FREQUENCY REDUCTION).
POWER REFLECTS DEVICE OPERATING WITH CLKOUT DISABLED.
POWER, INTERNAL
V
DD
= 4.5V
186mW
382mW
229mW
148mW
110mW
272321191715 2513 3129 33
V
DD
= 5.0V
V
DD
= 5.5V
225
175
200
300
250
275
325
375
350
400
150
125
301mW
POWER (P
INT
) – mW
1
/
t
CK
– MHz
POWER (P
IDLE
) – mW
POWER, IDLE
50
40
45
65
55
60
70
80
75
85
35
30
272321191715 2513 3129 33
1
/
t
CK
– MHz
48mW
37mW
26mW
82mW
48mW
64mW
V
DD
= 4.5V
V
DD
= 5.0V
V
DD
= 5.5V
IDLE;
IDLE (16)
IDLE (128)
272321191715 2513 3129 33
1
/
t
CK
– MHz
POWER (P
IDLE n
) – mW
POWER,
IDLE n
MODES
82mW
20mW
37mW
23mW
31mW
64mW
44
36
40
56
48
52
60
68
64
72
32
28
24
20
16
28mW
3
1, 2
1
Figure 18. Power vs. Frequency
REV. A
–30–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2171/ADSP-2172
CAPACITIVE LOADING
Figures 19 and 20 show the capacitive loading characteristics of
the ADSP-2171/ADSP-2172.
RISE TIME (0.4V - 2.4V) – ns
28
12
4
8
24
16
20
25 1501251007550 C
L
– pF
V
DD
= 4.5V
Figure 19. Typical Output Rise Time vs. Load Capacitance,
C
L
(at Maximum Ambient Operating Temperature)
+14
+4
–2
+2
+12
+8
+10
25 1501251007550 C
L
– pF
NOMINAL
VALID OUTPUT DELAY OR HOLD – ns
Figure 20. Typical Output Valid Delay or Hold vs. Load
Capacitance, C
L
(at Maximum Ambient Operating
Temperature)
TEST CONDITIONS
Output Disable Time
Output pins are considered to be disabled when they have
stopped driving and started a transition from the measured out-
put high or low voltage to a high impedance state. The output
disable time (t
DIS
) is the difference of t
MEASURED
and t
DECAY
, as
shown in the Output Enable/Disable diagram. The time is the
interval from when a reference signal reaches a high or low volt-
age level to when the output voltages have changed by 0.5 V
from the measured output high or low voltage. The decay time,
t
DECAY
, is dependent on the capacitative load, C
L
, and the cur-
rent load, i
L
, on the output pin. It can be approximated by the
following equation:
t
DECAY
=C
L
•0.5V
i
L
from which
t
DIS
=t
MEASURED
t
DECAY
is calculated. If multiple pins (such as the data bus) are dis-
abled, the measurement value is that of the last pin to stop
driving.
3.0V
1.5V
0.0V
2.0V
1.5V
0.3V
INPUT
OUTPUT
Figure 21. Voltage Reference Levels for AC Measure-
ments (Except Output Enable/Disable)
Output Enable Time
Output pins are considered to be enabled when that have made
a transition from a high-impedance state to when they start driv-
ing. The output enable time (t
ENA
) is the interval from when a
reference signal reaches a high or low voltage level to when the
output has reached a specified high or low trip point, as shown
in the Output Enable/Disable diagram. If multiple pins (such as
the data bus) are enabled, the measurement value is that of the
first pin to start driving.
2.0V
1.0V
tENA
REFERENCE
SIGNAL
OUTPUT
tDECAY
VOH
(MEASURED)
OUTPUT STOPS
DRIVING OUTPUT STARTS
DRIVING
tDIS
tMEASURED
VOL
(MEASURED)
VOH (MEASURED) – 0.5V
VOL (MEASURED) +0.5V
HIGH-IMPEDANCE STATE. TEST CONDITIONS CAUSE
THIS VOLTAGE LEVEL TO BE APPROXIMATELY 1.5V.
VOH
(MEASURED)
VOL
(MEASURED)
Figure 22. Output Enable/Disable
TO
OUTPUT
PIN 50pF
+1.5V
I
OH
I
OL
Figure 23. Equivalent Device Loading for AC Measure-
ments (Including All Fixtures)
ADSP-2173–SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS
K Grade B Grade
Parameter Min Max Min Max Unit
V
DD
Supply Voltage 3.0 3.6 3.0 3.6 V
T
AMB
Ambient Operating Temperature 0 +70 –40 +85 °C
ELECTRICAL CHARACTERISTICS
K/B Grades
Parameter Test Conditions Min Max Unit
V
IH
Hi-Level Input Voltage
1, 2
@ V
DD
= max 2.0 V
V
IH
Hi-Level CLKIN Voltage @ V
DD
= max 2.0 V
V
IH
Hi-Level RESET Voltage @ V
DD
= max 2.2 V
V
IL
Lo-Level Input Voltage
1, 3
@ V
DD
= min 0.4 V
V
OH
Hi-Level Output Voltage
1, 4, 5
@ V
DD
= min
I
OH
= –0.5 mA 2.4 V
@ V
DD
= min
I
OH
= –100 mA
6
V
DD
– 0.3 V
V
OL
Lo-Level Output Voltage
1, 4, 5
@ V
DD
= min
I
OL
= 2 mA 0.4 V
I
IH
Hi-Level Input Current
3
@ V
DD
= max
V
IN
= V
DD
max 10 µA
I
IL
Lo-Level Input Current
3
@ V
DD
= max
V
IN
= 0 V 10 µA
I
OZH
Tristate Leakage Current
7
@ V
DD
= max,
V
IN
= V
DD
max
8
10 µA
I
OZL
Tristate Leakage Current
7
@ V
DD
= max,
V
IN
= 0 V
8
10 µA
I
DD
Supply Current (Idle)
9, 10
@ V
DD
= max 7 mA
I
DD
Supply Current (Dynamic)
10
@ V
DD
= max
t
CK
= 50 ns
11
27 mA
I
DD
Supply Current (Powerdown)
10
Lowest Power Mode
12
100 µA
C
I
Input Pin Capacitance
3, 6, 13
@ V
IN
= 2.5 V,
f
IN
= 1.0 MHz,
T
AMB
= 25°C8pF
C
O
Output Pin Capacitance
6, 7, 13, 14
@ V
IN
= 2.5 V,
f
IN
= 1.0 MHz,
T
AMB
= 25°C8pF
NOTES
1
Bidirectional pins: D0-D23, RFS0, RFS1, SCLK0, SCLK1, TFS0, TFS1, HD0-HD15/HAD0-HAD15.
2
Input only pins: RESET, IRQ2, BR, MMAP, DR0, DR1, HSEL, HSIZE, BMODE, HMD0, HMD1, HRD/HWR, HWR/HDS, PWD, HA2/ALE, HA1-0.
3
Input only pins: CLKIN, RESET, IRQ2, BR, MMAP, DR0, DR1, HSEL, HSIZE, BMODE, HMD0, HMD1, HRD/HWR, HWR/HDS, PWD, HA2/ALE, HA1-0.
4
Output pins: BG, PMS, DMS, BMS, RD, WR, PWDACK, A0-A13, DT0, DT1, CLKOUT, HACK, FL2-0, BGH.
5
Although specified for TTL outputs, all ADSP-2173 outputs are CMOS-compatible and will drive to V
DD
and GND, assuming no dc loads.
6
Guaranteed but not tested.
7
Three-statable pins: A0-A13, D0-D23, PMS, DMS, BMS, RD, WR, DT0, DT1, SCLK0, SCLK1, TFS0, TFS1, RFS0, RSF1, HD0-HD15/HAD0-HAD15.
8
0 V on BR, CLKIN Active (to force three-state condition).
9
Idle refers to ADSP-2173 state of operation during execution of IDLE instruction. Deasserted pins are driven to either V
DD
or GND. Current reflects
device operation with CLKOUT disabled.
10
Current reflects device operating with no output loads.
11
V
IN
= 0.4 V and 2.4 V. For typical figures for supply currents, refer to “Power Dissipation” section.
12
See Chapter 9, of the ADSP-2100 Family User’s Manual for details.
13
Applies to TQFP and PQFP package types.
14
Output pin capacitance is the capacitve load for any three-state output pin.
Specifications subject to change without notice.
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –31–
REV. A
–32–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2173 TIMING PARAMETERS
GENERAL NOTES
Use the exact timing information given. Do not attempt to de-
rive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results for
an individual device, the values given in this data sheet reflect
statistical variations and worst cases. Consequently, you cannot
meaningfully add up parameters to derive longer times.
TIMING NOTES
Switching characteristics specify how the processor changes its
signals. You have no control over this timing; it is dependent on
the internal design. Timing requirements apply to signals that
are controlled outside the processor, such as the data input for a
read operation.
Timing requirements guarantee that the processor operates cor-
rectly with another device. Switching characteristics tell you
what the device will do under a given circumstance. Also, use
the switching characteristics to ensure any timing requirement
of a device connected to the processor (such as memory) is
satisfied.
MEMORY REQUIREMENTS
This chart links common memory device specification names
and ADSP-2173 timing parameters for your convenience.
Common
Parameter Memory Device
Name Function Specification Name
t
ASW
A0-A13, DMS, PMS Address Setup to
Setup before WR Low Write Start
t
AW
A0-A13, DMS, PMS Setup Address Setup
before WR Deasserted to Write End
t
WRA
A0-A13, DMS, PMS Address Hold Time
Hold after WR Deasserted
t
DW
Data Setup before WR High Data Setup Time
t
DH
Data Hold after WR High Data Hold Time
t
RDD
RD Low to Data Valid OE to Data Valid
t
AA
A0-A13, DMS, PMS, Address Access Time
BMS to Data Valid
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –33–
ADSP-2173
Parameter Min Max Unit
Clock Signals
t
CK
is defined as 0.5 t
CKI.
The ADSP-2173 uses an input clock with
a frequency equal to half the instruction rate; a 10.0 MHz input
clock (which is equivalent to 100 ns) yields a 50 ns processor cycle
(equivalent to 20 MHz). t
CK
values within the range of 0.5 t
CKI
period should be substituted for all relevant timing parameters
to obtain specification value.
Example: t
CKH
= 0.5t
CK
– 10 ns = 0.5 (50 ns) – 10 ns = 15 ns.
Timing Requirement:
t
CKI
CLKIN Period 100 160 ns
t
CKIL
CLKIN Width Low 20 ns
t
CKIH
CLKIN Width High 20 ns
Switching Characteristic:
t
CKL
CLKOUT Width Low 0.5t
CK
– 10 ns
t
CKH
CLKOUT Width High 0.5t
CK
– 10 ns
t
CKOH
CLKIN High to CLKOUT High 0 25 ns
Control Signals
Timing Requirement:
t
RSP
RESET Width Low 5t
CK1
ns
NOTE
1
Applies after power-up sequence is complete. Internal phase lock loop requires no more than 2000 CLKIN cycles assuming stable CLKIN (not including crystal
oscillator start-up time).
CLKIN
CLKOUT
tCKIL tCKOH
tCKH
tCKL
tCKI
tCKIH
Figure 24. Clock Signals
REV. A
–34–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2173
Parameter Min Max Unit
Interrupts and Flags
Timing Requirement:
t
IFS
IRQx or FI Setup before CLKOUT Low
1, 2, 3
0.25t
CK
+ 23 ns
t
IFH
IRQx or FI Hold after CLKOUT High
1, 2, 3
0.25t
CK
ns
Switching Characteristic:
t
FOH
Flag Output Hold after CLKOUT Low
4
0.5t
CK
– 10 ns
t
FOD
Flag Output Delay from CLKOUT Low
4
0.5t
CK
+ 5 ns
NOTES
1
If IRQx and FI inputs meet t
IFS
and t
IFH
setup/hold requirements, they will be recognized during the current clock cycle; otherwise the signals will be recognized on
the following cycle. (Refer to “Interrupt Controller Operation” in the Program Control chapter of the User’s Manual for further information on interrupt servicing.)
2
Edge-sensitive interrupts require pulse widths greater than 10 ns; level-sensitive interrupts must be held low until serviced.
3
IRQx = IRQ0, IRQ1, and IRQ2.
4
Flag Output = FL0, FL1, FL2, and FO.
CLKOUT
FLAG
OUTPUTS
IRQx
FI
t
IFS
t
FOD
t
FOH
t
IFH
Figure 25. Interrupts and Flags
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –35–
ADSP-2173
Parameter Min Max Unit
Bus Request/Grant
Timing Requirement:
t
BH
BR Hold after CLKOUT High
1
0.25t
CK
+ 2 ns
t
BS
BR Setup before CLKOUT Low
1
0.25t
CK
+ 22 ns
Switching Characteristic:
t
SD
CLKOUT High to DMS, PMS, BMS, 0.25t
CK
+ 16 ns
RD, WR Disable
t
SDB
DMS, PMS, BMS, RD, WR
Disable to BG Low 0 ns
t
SE
BG High to DMS, PMS, BMS,
RD, WR Enable 0 ns
t
SEC
DMS, PMS, BMS, RD, WR
Enable to CLKOUT High 0.25t
CK
– 10 ns
t
SDBH
DMS, PMS, BMS, RD, WR
Disable to BGH Low
2
0ns
t
SEH
BGH High to DMS, PMS, BMS,
RD, WR Enable
2
0ns
NOTES
1
BR is an asynchronous signal. If BR meets the setup/hold requirements, it will be recognized during the current clock cycle; otherwise the signal will be recognized
on the following cycle. Refer to the ADSP-2100 Family User’s Manual for BR/BG cycle relationships.
2
BGH is asserted when the bus is granted and the processor requires control of the bus to continue.
tBS
BR
tBH
CLKOUT
PMS, DMS
BMS, RD
WR
BG
CLKOUT
tSD
tSDB tSE
tSEC
tSDBH
BGH
tSEH
Figure 26. Bus Request–Bus Grant
REV. A
–36–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2173
Parameter Min Max Unit
Memory Read
Timing Requirement:
t
RDD
RD Low to Data Valid 0.5t
CK
– 15 + w ns
t
AA
A0–A13, PMS, DMS, BMS to Data Valid 0.75t
CK
– 20.5 + w ns
t
RDH
Data Hold from RD High 0 ns
Switching Characteristic:
t
RP
RD Pulse Width 0.5t
CK
– 5 + w ns
t
CRD
CLKOUT High to RD Low 0.25t
CK
– 5 0.25t
CK
+ 10 ns
t
ASR
A0–A13, PMS, DMS, BMS Setup before RD Low 0.25t
CK
– 7 ns
t
RDA
A0–A13, PMS, DMS, BMS Hold after RD Deasserted 0.25t
CK
– 3 ns
t
RWR
RD High to RD or WR Low 0.5t
CK
– 5 ns
w = wait states x t
CK
.
CLKOUT
A0–A13
D
t
RDA
RD
WR
DMS, PMS
BMS
t
RWR
t
RP
t
ASR
t
CRD
t
RDD
t
AA
t
RDH
Figure 27. Memory Read
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –37–
ADSP-2173
Parameter Min Max Unit
Memory Write
Switching Characteristic:
t
DW
Data Setup before WR High 0.5 t
CK
– 7 + w n s
t
DH
Data Hold after WR High 0.25t
CK
– 2 ns
t
WP
WR Pulse Width 0.5t
CK
– 5 + w ns
t
WDE
WR Low to Data Enabled 0 ns
t
ASW
A0–A13, DMS, PMS Setup before WR Low 0.25t
CK
– 7 ns
t
DDR
Data Disable before WR or RD Low 0.25t
CK
– 7 ns
t
CWR
CLKOUT High to WR Low 0.25t
CK
– 5 0.25 t
CK
+ 10 ns
t
AW
A0–A13, DMS, PMS, Setup before WR Deasserted 0.75t
CK
– 11.5 + w ns
t
WRA
A0–A13, DMS, PMS Hold after WR Deasserted 0.25t
CK
– 3 ns
t
WWR
WR High to RD or WR Low 0.5t
CK
– 5 ns
w = wait states x t
CK
.
CLKOUT
A0–A13
D
tWRA
WR
DMS, PMS
tWWR
tWP
tASW tAW
tCWR
RD
tDH tDDR
tWDE
tDW
Figure 28. Memory Write
REV. A
–38–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2173
Parameter Min Max Unit
Serial Ports
Timing Requirement:
t
SCK
SCLK Period 76.9 ns
t
SCS
DR/TFS/RFS Setup before SCLK Low 8 ns
t
SCH
DR/TFS/RFS Hold after SCLK Low 10 ns
t
SCP
SCLK
IN
Width 28 ns
Switching Characteristic:
t
CC
CLKOUT High to SCLK
OUT
0.25t
CK
0.25t
CK
+ 15 ns
t
SCDE
SCLK High to DT Enable 0 ns
t
SCDV
SCLK High to DT Valid 20 ns
t
RH
TFS/RFS
OUT
Hold after SCLK High 0 ns
t
RD
TFS/RFS
OUT
Delay from SCLK High 20 ns
t
SCDH
DT Hold after SCLK High 0 ns
t
TDE
TFS(Alt) to DT Enable 0 ns
t
TDV
TFS(Alt) to DT Valid 19 ns
t
SCDD
SCLK High to DT Disable 25 ns
t
RDV
RFS (Multichannel, Frame Delay Zero) to DT Valid 20 ns
CLKOUT
SCLK
TFS
RFS
DR
RFSIN
TFSIN
DT
ALTERNATE
FRAME MODE
t
CC
t
CC
t
SCK
t
SCP
t
SCP
t
SCS
t
SCH
t
RD
t
RH
RFSOUT
TFSOUT
t
SCDV
t
SCDE
t
SCDH
t
SCDD
t
TDE
t
TDV
t
RDV
MULTICHANNEL MODE,
FRAME DELAY 0
(MFD = 0)
Figure 29. Serial Ports
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –39–
ADSP-2173
Parameter Min Max Unit
Host Interface Port
Separate Data and Address (HMD1 = 0)
Read Strobe and Write Strobe (HMD0 = 0)
Timing Requirement:
t
HSU
HA2–0 Setup before Start of Write or Read
1, 2
8ns
t
HDSU
Data Setup before End of Write
3
8ns
t
HWDH
Data Hold after End of Write
3
3ns
t
HH
HA2–0 Hold after End of Write or Read
3, 4
3ns
t
HRWP
Read or Write Pulse Width
5
30 ns
Switching Characteristic:
t
HSHK
HACK Low after Start of Write or Read
1, 2
020ns
t
HKH
HACK Hold after End of Write or Read
3, 4
020ns
t
HDE
Data Enabled after Start of Read
2
0ns
t
HDD
Data Valid after Start of Read
2
23 ns
t
HRDH
Data Hold after End of Read
4
0ns
t
HRDD
Data Disabled after End of Read
4
15 ns
NOTES
1
Start of Write = HWR Low and HSEL Low.
2
Start of Read = HRD Low and HSEL Low.
3
End of Write = HWR High or HSEL High.
4
End of Read = HRD High or HSEL High.
5
Read Pulse Width = HRD Low and HSEL Low, Write Pulse Width = HWR Low and HSEL Low.
DATA
HD15–0
HSEL
HWR
HACK
HA2–0 ADDRESS
tHSU
tHH
tHWDH
tHRWP
tHSHK tHKH
tHDSU
DATA
HD15–0
HSEL
HRD
HACK
HA2–0 ADDRESS
tHSU
tHH
tHRWP
tHRDH
tHKH
tHSHK
tHRDD
tHDE
tHDD
Figure 30. Host Interface Port (HMD1 = 0, HMD0 = 0)
Host Write Cycle
Host Read Cycle
REV. A
–40–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2173
Parameter Min Max Unit
Host Interface Port
Separate Data and Address (HMD1 = 0)
Read Strobe and Write Strobe (HMD0 = 1)
Timing Requirement:
t
HSU
HA2–0, HRW Setup before Start of Write or Read
1
8ns
t
HDSU
Data Setup before End of Write
2
8ns
t
HWDH
Data Hold after End of Write
2
3ns
t
HH
HA2–0, HRW Hold after End of Write or Read
2
3ns
t
HRWP
Read or Write Pulse Width
3
30 ns
Switching Characteristic:
t
HSHK
HACK Low after Start of Write or Read
1
020ns
t
HKH
HACK Hold after End of Write or Read
2
020ns
t
HDE
Data Enabled after Start of Read
1
0ns
t
HDD
Data Valid after Start of Read
1
23 ns
t
HRDH
Data Hold after End of Read
2
0ns
t
HRDD
Data Disabled after End of Read
2
15 ns
NOTES
1
Start of Write or Read = HDS Low and HSEL Low.
2
End of Write or Read = HDS High and HSEL High.
3
Read or Write Pulse Width = HDS Low and HSEL Low.
DATA
HD15–0
HSEL
HRW
HACK
HA2–0 ADDRESS
t
HSU
t
HH
t
HWDH
t
HRWP
t
HSHK
t
HKH
t
HDSU
HDS
DATA
HD15–0
HSEL
HDS
HACK
HA2–0 ADDRESS
t
HSU
t
HH
t
HRWP
t
HRDH
t
HKH
t
HSHK
t
HDE
t
HDD
HRW
t
HRDD
Figure 31. Host Interface Port (HMD1 = 0, HMD0 = 1)
Host Write Cycle
Host Read Cycle
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –41–
ADSP-2173
Parameter Min Max Unit
Host Interface Port
Multiplexed Data and Address (HMD1 = 1)
Read Strobe and Write Strobe (HMD0 = 0)
Timing Requirement:
t
HALP
ALE Pulse Width 15 ns
t
HASU
HAD15–0 Address Setup, before ALE Low 5 ns
t
HAH
HAD15–0 Address Hold after ALE Low 2 ns
t
HALS
Start of Write or Read after ALE Low
1, 2
15 ns
t
HDSU
HAD15–0 Data Setup before End of Write
3
8ns
t
HWDH
HAD15–0 Data Hold after End of Write
3
3ns
t
HRWP
Read or Write Pulse Width
5
30 ns
Switching Characteristic:
t
HSHK
HACK Low after Start of Write or Read
1, 2
020ns
t
HKH
HACK Hold after End of Write or Read
3, 4
020ns
t
HDE
HAD15–0 Data Enabled after Start of Read
2
0ns
t
HDD
HAD15–0 Data Valid after Start of Read
2
23 ns
t
HRDH
HAD15–0 Data Hold after End of Read 0 ns
t
HRDD
HAD15–0 Data Disabled after End of Read
4
15 ns
NOTES
1
Start of Write = HWR Low and HSEL Low.
2
Start of Read = HRD Low and HSEL Low.
3
End of Write = HWR High or HSEL High.
4
End of Read = HRD High or HSEL High.
5
Read Pulse Width = HRD Low and HSEL Low, Write Pulse Width = HWR Low and HSEL Low.
ADDRESS
tHDSU
DATA
HACK
HWR
HSEL
HD15–0
tHRWP
tHSHK
ALE
tHALP
tHALS
tHKH
tHAH
tHASU
tHWDH
tHRDH
tHRDD
tHDE
ADDRESS DATA
HACK
HRD
HSEL
HAD15–0
tHRWP
tHSHK
ALE
tHALP
tHALS
tHKH
tHAH
tHASU
tHDD
Figure 32. Host Interface Port (HMD1 = 1, HMD0 = 0)
Host Write Cycle
Host Read Cycle
REV. A
–42–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2173
Parameter Min Max Unit
Host Interface Port
Multiplexed Data and Address (HMD1 = 1)
Read Strobe and Write Strobe (HMD0 = 1)
Timing Requirement:
t
HALP
ALE Pulse Width 15 ns
t
HASU
HAD15–0 Address Setup before ALE Low 5 ns
t
HAH
HAD15–0 Address Hold after ALE Low 2 ns
t
HALS
Start of Write or Read after ALE Low
1
15 ns
t
HSU
HRW Setup before Start of Write or Read
1
8ns
t
HDSU
HAD15–0 Data Setup before End of Write
2
8ns
t
HWDH
HAD15–0 Data Hold after End of Write
2
3ns
t
HH
HRW Hold after End of Write or Read
2
3ns
t
HRWP
Read or Write Pulse Width
3
30 ns
Switching Characteristic:
t
HSHK
HACK Low after Start of Write or Read
1
020ns
t
HKH
HACK Hold after End of Write or Read
2
020ns
t
HDE
HAD15–0 Data Enabled after Start of Read
1
0ns
t
HDD
HAD15–0 Data Valid after Start of Read
1
23 ns
t
HRDH
HAD15–0 Data Hold after End of Read
2
0ns
t
HRDD
HAD15–0 Data Disabled after End of Read
2
15 ns
NOTES
1
Start of Write or Read = HDS Low and HSEL Low.
2
End of Write or Read = HDS High and HSEL High.
3
Read or Write Pulse Width = HDS Low and HSEL Low.
ADDRESS
tHDSU
DATA
HACK
HRW
HSEL
HD15–0
tHRWP
tHSHK
ALE tHALP
tHALS
tHKH
tHAH
tHASU
tHWDH
HDS
tHH
tHSU
ADDRESS DATA
HACK
HRW
HSEL
HD15–0
tHRWP
tHSHK
ALE
tHALP tHALS
tHKH
tHAH
tHASU
tHRDH
HDS
tHH
tHSU
tHDE
tHDD tHRDD
Figure 33. Host Interface Port (HMD1 = 1, HMD0 = 1)
Host Write Cycle
Host Read Cycle
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –43–
ADSP-2173
ENVIRONMENTAL CONDITIONS
Ambient Temperature Rating:
T
AMB
= T
CASE
– (PD × θ
CA
)
T
CASE
= Case Temperature in °C
PD = Power Dissipation in W
θ
CA
= Thermal Resistance (Case-to-Ambient)
θ
JA
= Thermal Resistance (Junction-to-Ambient)
θ
JC
= Thermal Resistance (Junction-to-Case)
Package θ
JA
θ
JC
θ
CA
TQFP 50°C/W 2°C/W 48°C/W
PQFP 41°C/W 10°C/W 31°C/W
POWER DISSIPATION
To determine total power dissipation in a specific application,
the following equation should be applied for each output:
C × V
DD2
×f
C = load capacitance, f= output switching frequency.
Example:
In an application where external data memory is used and no
other outputs are active, power dissipation is calculated as
follows:
Assumptions:
External data memory is accessed every cycle with 50% of the
address pins switching.
External data memory writes occur every other cycle with
50% of the data pins switching.
Each address and data pin has a 10 pF total load at the pin.
The application operates at V
DD
= 3.3 V and t
CK
= 50 ns.
Total Power Dissipation = P
INT
+ (C × V
DD2
×f)
P
INT
= internal power dissipation from Power vs. Frequency
graph (Figure 18).
(C × V
DD2
× f) is calculated for each output:
# of
Pins × C × V
DD2
× f
Address, DMS 8× 10 pF × 3.3
2
V × 20 MHz = 17.4 mW
Data Output, WR 9× 10 pF × 3.3
2
V × 10 MHz = 9.8 mW
RD 1× 10 pF × 3.3
2
V × 10 MHz = 1.1 mW
CLKOUT 1 × 10 pF × 3.3
2
V × 20 MHz = 2.2 mW
30.5 mW
Total power dissipation for this example is P
INT
+ 30.5 mW.
45
35
12
40
60
50
55
65
70
75
85
80
90
19 20181716151413
POWER, INTERNAL1
POWER (PINT) – mW
1/ tCK – MHz
71 mW
57 mW
89 mW
55 mW
32 mW
44 mW
11
9
12
10
14
12
13
15
16
17
19
18
20
19 20181716151413
POWER (PIDLE ) – mW
POWER, IDLE1, 2
1/ tCK – MHz
16.2 mW
12.7 mW
20.5 mW
15.5 mW
8.5 mW
11.8 mW
VALID FOR ALL TEMPERATURE GRADES.
1 POWER REFLECTS DEVICE OPERATING WITH NO OUTPUT LOADS.
2 IDLE REFERS TO ADSP-2173 STATE OF OPERATION DURING
EXECUTION OF IDLE INSTRUCTION. DEASSERTED PINS ARE
DRIVEN TO EITHER VDD OR GND. POWER REFLECTS DEVICE
OPERATING WITH CLKOUT DISABLED.
3 TYPICAL POWER DISSIPATION AT 3.3V VDD DURING EXECUTION
OF IDLE n INSTRUCTION (CLOCK FREQUENCY REDUCTION).
POWER REFLECTS DEVICE OPERATING WITH CLKOUT DISABLED.
POWER, IDLE
n MODES3
7
5
12
6
10
8
9
11
12
13
15
14
16
19 20181716151413
IDLE;
IDLE (16)
IDLE (128)
1/ tCK – MHz
POWER (PIDLE n ) – mW
7.8 mW
7.2 mW
16.2 mW
11.8 mW
6.2 mW
6.8 mW
Figure 34. Power vs. Frequency
REV. A
–44–
ADSP-2171/ADSP-2172/ADSP-2173
ADSP-2173
CAPACITIVE LOADING
Figures 35 and 36 show the capacitive loading characteristics of
the ADSP-2173.
16
8
25
12
28
20
24
1501251007550
VDD = 3.3 V
CL – pF
RISE TIME (0.4 V – 2.4 V) – ns
Figure 35. Typical Output Rise Time vs. Load Capacitance,
C
L
(at Maximum Ambient Operating Temperature)
NOMINAL
-2
25
+4
+2
+8
+10
+12
1501251007550
+14
VALID OUTPUT DELAY OR HOLD – ns
C
L
– pF
Figure 36. Typical Output Valid Delay or Hold vs. Load
Capacitance, C
L
(at Maximum Ambient Operating
Temperature)
TEST CONDITIONS
Output Disable Time
Output pins are considered to be disabled when they have
stopped driving and started a transition from the measured out-
put high or low voltage to a high impedance state. The output
disable time (t
DIS
) is the difference of t
MEASURED
and t
DECAY
, as
shown in the Output Enable/Disable diagram. The time is the
interval from when a reference signal reaches a high or low volt-
age level to when the output voltages have changed by 0.5 V
from the measured output high or low voltage. The decay time,
t
DECAY
, is dependent on the capacitative load, C
L
, and the cur-
rent load, i
L
, on the output pin. It can be approximated by the
following equation:
t
DECAY
=C
L
•0.5V
i
L
from which
t
DIS
=t
MEASURED
t
DECAY
is calculated. If multiple pins (such as the data bus) are dis-
abled, the measurement value is that of the last pin to stop
driving.
INPUT
OUTPUT
V
DD
2
V
DD
2
Figure 37. Voltage Reference Levels for AC Measure-
ments (Except Output Enable/Disable)
Output Enable Time
Output pins are considered to be enabled when that have made
a transition from a high-impedance state to when they start driv-
ing. The output enable time (t
ENA
) is the interval from when a
reference signal reaches a high or low voltage level to when the
output has reached a specified high or low trip point, as shown
in the Output Enable/Disable diagram. If multiple pins (such as
the data bus) are enabled, the measurement value is that of the
first pin to start driving.
2.0V
1.0V
tENA
REFERENCE
SIGNAL
OUTPUT
tDECAY
VOH
(MEASURED)
OUTPUT STOPS
DRIVING OUTPUT STARTS
DRIVING
tDIS
tMEASURED
VOL
(MEASURED)
VOH (MEASURED) – 0.5V
VOL (MEASURED) +0.5V
HIGH-IMPEDANCE STATE. TEST CONDITIONS CAUSE
THIS VOLTAGE LEVEL TO BE APPROXIMATELY 1.5V.
VOH
(MEASURED)
VOL
(MEASURED)
Figure 38. Output Enable/Disable
TO
OUTPUT
PIN 50pF
I
OH
I
OL
V
DD
2
Figure 39. Equivalent Device Loading for AC Measure-
ments (Including All Fixtures)
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –45–
128-Lead TQFP Package Pinout
1
128
65
64
39
38
103
102
TOP VIEW
(PINS DOWN)
HD10
HSIZE
HD6
HD7
HD8
HD9
HD11
HD12
HD13
HD14
HD15
PWDACK
GND
GND
NC
NC
NC
HWR/HDS
HRD/HRW
WR
RD
BMS
DMS
PMS
DD
V
DD
V
NC
BMODE
GND
NC
DT0
TFS0
RFS0
DR0
SCLK0
DR1/FI
SCLK1
FL0
FL1
FL2
NC
NC
HMD0
HMD1
HACK
IRQ2
RESET
RFS1/IRQ0
DT1/FO
TFS1/IRQ1
VDD
GND
GND
GND
HA2/ALE
HA1
HA0
HD5
HD4
HD3
HD2
HD1
HD0
GND
A0
A1
A2
A3
A4
A5
A6
A7
XTAL
CLKIN
CLKOUT
GND
A8
A9
A10
A11
A12
A13
NC
MMAP
NC
NC
HSEL
DD
V
DD
V
PWD
NC
NC
D23
D22
D21
D20
D19
GND
D18
D17
D16
D15
D14
D13
D12
D11
GND
D10
D9
D8
D7
D6
D5
D4
D3
GND
D2
D1
D0
NC
NC
NC
NC
NC
BR
BG
VDD
BGH
NC = NO CONNECT
REV. A
–46–
ADSP-2171/ADSP-2172/ADSP-2173
TQFP Pin Configurations
TQFP Pin TQFP Pin TQFP Pin TQFP Pin
Number Name Number Name Number Name Number Name
1 GND 33 A13 65 NC 97 D20
2 GND 34 NC 66 BGH 98 D21
3 HA2/ALE 35 MMAP 67 NC 99 D22
4 HA1 36 NC 68 NC 100 D23
5 HA0 37 NC 69 NC 101 NC
6HSEL 38 PWD 70 BR 102 NC
7 HD5 39 IRQ2 71 NC 103 NC
8 HD4 40 NC 72 BG 104 NC
9 HD3 41 BMODE 73 D0 105 NC
10 HD2 42 NC 74 D1 106 RD
11 HD1 43 NC 75 D2 107 WR
12 HD0 44 V
DD
76 GND 108 GND
13 V
DD
45 GND 77 D3 109 GND
14 GND 46 RESET 78 D4 110 V
DD
15 V
DD
47 NC 79 D5 111 PMS
16 A0 48 HACK 80 D6 112 DMS
17 A1 49 HMD0 81 D7 113 BMS
18 A2 50 HMD1 82 D8 114 PWDACK
19 A3 51 DT0 83 D9 115 HD15
20 A4 52 TFS0 84 D10 116 HD14
21 A5 53 RFS0 85 GND 117 HD13
22 A6 54 DR0 86 V
DD
118 HD12
23 A7 55 SCLK0 87 D11 119 HD11
24 XTAL 56 DT1/FO 88 D12 120 V
DD
25 CLKIN 57 TFS1/IRQ1 89 D13 121 HD10
26 CLKOUT 58 RFS1/IRQ0 90 D14 122 HD9
27 GND 59 GND 91 D15 123 HD8
28 A8 60 DR1/F1 92 D16 124 HD7
29 A9 61 SCLK1 93 D17 125 HD6
30 A10 62 FL0 94 D18 126 HSIZE
31 A11 63 FL1 95 GND 127 HRD/HRW
32 A12 64 FL2 96 D19 128 HWR/HDS
NC = These pins MUST remain unconnected.
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –47–
OUTLINE DIMENSIONS
128-Lead Metric Thin Plastic Quad Flatpack (TQFP)
MILLIMETERS INCHES
SYMBOL MIN TYP MAX MIN TYP MAX
A 1.60 0.063
A
1
0.05 0.15 0.002 0.006
A
2
1.30 1.40 1.50 0.051 0.055 0.059
D 15.75 16.00 16.25 0.620 0.630 0.640
D
1
13.90 14.00 14.10 0.547 0.551 0.555
D
3
12.50 12.58 0.492 0.495
E 21.75 22.00 22.25 0.856 0.866 0.876
E
1
19.90 20.00 20.10 0.783 0.787 0.792
E
3
18.50 18.58 0.728 0.731
L 0.45 0.60 0.75 0.018 0.024 0.030
e 0.42 0.50 0.58 0.017 0.019 0.023
B 0.17 0.22 0.27 0.007 0.009 0.011
0.10 0.004
D
1
128 103
102
65
64
39
38
e B
D1
D3
D
TOP VIEW
(PINS DOWN)
E3E1E
A
L
A2
SEATING
PLANE
D
A1
REV. A
–48–
ADSP-2171/ADSP-2172/ADSP-2173
128-Lead PQFP Package Pinout
HRD/HRW
128L PQFP
(28MM x 28MM)
NC
GND
GND
HWR/HDS
HSIZE
HD6
HD7
HD8
HD9
HD10
GND
GND
WR
NC
RD
NC
NC
NC
NC
HD11
HD12
HD13
HD14
HD15
PWDACK
BMS
DMS
PMS
NC
DD
V
DD
V
1
128 97
96
65
6433
32
TOP VIEW
(PINS DOWN)
HA2/ALE
HA1
HA0
HSEL
HD5
HD4
HD3
HD2
HD1
HD0
GND
A0
A1
A2
A3
A4
A5
A6
A7
XTAL
CLKIN
CLKOUT
GND
A8
A9
A10
A11
A12
A13
NC
DD
V
DD
V
D23
D22
D21
D20
D19
GND
D18
D17
D16
D15
D14
D13
D12
D11
GND
D10
D9
D8
D7
D6
D5
D4
D3
GND
D2
D1
D0
NC
NC
BR
BG
DD
V
NC = NO CONNECT
MMAP
NC
PWD
IRQ2
NC
BMODE
NC
NC
GND
RESET
NC
RFS1/IRQ0
GND
DR1/FI
NC
SCLK1
FL0
FL1
FL2
HACK
HMD0
HMD1
DT0
TFS0
RFS0
DR0
SCLK0
DT1/FO
TFS1/IRQ1
NC
BGH
DD
V
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –49–
PQFP Pin Configurations
PQFP Pin PQFP Pin PQFP Pin PQFP Pin
Number Name Number Name Number Name Number Name
1 HA2/ALE 33 MMAP 65 NC 97 NC
2 HA1 34 NC 66 BR 98 NC
3 HA0 35 PWD 67 NC 99 NC
4HSEL 36 IRQ2 68 BG 100 NC
5 HD5 37 NC 69 D0 101 NC
6 HD4 38 BMODE 70 D1 102 NC
7 HD3 39 NC 71 D2 103 RD
8
HD2
40 NC 72 GND 104 WR
9 HD1 41 V
DD
73 D3 105 GND
10 HD0 42 GND 74 D4 106 GND
11 V
DD
43 RESET 75 D5 107 V
DD
12 GND 44 NC 76 D6 108 PMS
13 V
DD
45 HACK 77 D7 109 DMS
14 A0 46 HMD0 78 D8 110 BMS
15 A1 47 HMD1 79 D9 111 PWDACK
16 A2 48 DT0 80 D10 112 HD15
17 A3 49 TFS0 81 GND 113 HD14
18 A4 50 RFS0 82 V
DD
114 HD13
19 A5 51 DR0 83 D11 115 HD12
20 A6 52 SCLK0 84 D12 116 HD11
21 A7 53 DT1/FO 85 D13 117 V
DD
22 XTAL 54 TFS1/IRQ1 86 D14 118 HD10
23 CLKIN 55 RFS1/IRQ0 87 D15 119 HD9
24 CLKOUT 56 GND 88 D16 120 HD8
25 GND 57 DR1/F1 89 D17 121 HD7
26 A8 58 SCLK1 90 D18 122 HD6
27 A9 59 FL0 91 GND 123 HSIZE
28 A10 60 FL1 92 D19 124 HRD/HRW
29 A11 61 FL2 93 D20 125 HWR/HDS
30 A12 62 NC 94 D21 126 GND
31 A13 63 BGH 95 D22 127 GND
32 NC 64 NC 96 D23 128 NC
NC = These pins MUST remain unconnected.
REV. A
–50–
ADSP-2171/ADSP-2172/ADSP-2173
OUTLINE DIMENSIONS
128-Lead Metric Thin Plastic Quad Flatpack (PQFP)
MILLIMETERS INCHES
SYMBOL MIN TYP MAX MIN TYP MAX
A 4.07 0.160
A
1
0.25 0.010
A
2
3.17 3.49 3.67 0.125 0.137 0.144
D, E 30.95 31.20 31.45 1.219 1.228 1.238
D
1
, E
1
27.90 28.00 28.10 1.098 1.102 1.106
D
3
, E
3
24.73 24.80 24.87 0.974 0.976 0.979
L 0.65 0.88 1.03 0.031 0.035 0.041
e 0.73 0.80 0.87 0.029 0.031 0.034
B 0.30 0.35 0.45 0.012 0.014 0.018
0.10 0.004
D
A
L
A2
SEATING
PLANE
D
A1
1
128 97
96
65
64
33
32
eB
D1
D3
D
E3E1E
TOP VIEW
(PINS DOWN)
ADSP-2171/ADSP-2172/ADSP-2173
REV. A –51–
ORDERING GUIDE*
Ambient Instruction
Temperature Rate Package
Part Number** Range (MHz) Description
ADSP-2171KST-133 0°C to +70°C 33.33 128-Lead TQFP
ADSP-2171BST-133 –40°C to +85°C 33.33 128-Lead TQFP
ADSP-2171KS-133 0°C to +70°C 33.33 128-Lead PQFP
ADSP-2171BS-133 –40°C to +85°C 33.33 128-Lead PQFP
ADSP-2171KST-104 0°C to +70°C 26 128-Lead TQFP
ADSP-2171BST-104 –40°C to +85°C 26 128-Lead TQFP
ADSP-2171KS-104 0°C to +70°C 26 128-Lead PQFP
ADSP-2171BS-104 –40°C to +85°C 26 128-Lead PQFP
ADSP-2173BST-80 –40°C to +85°C 20 128-Lead TQFP
ADSP-2173BS-80 –40°C to +85°C 20 128 Lead PQFP
*Refer to section titled “Ordering Procedure for ADSP-2172 ROM Processors” for information about ordering ROM-coded parts.
**S = Plastic Quad Flatpack, ST = Plastic Thin Quad Flatpack.
PRINTED IN U.S.A. C1984a–6–11/95
–52–