PC2SD11NTZ
Series
■ Features
VDRM : 400V
Non-zero cross type
DIP 6pin
Phototriac Coupler for triggering
1. High repetitive peak off-state voltage (VDRM : 400V)
2. Non-zero crossing functionality
3. 6 pin DIP package
4. Superior noise immunity (dV/dt : MIN. 1 000V/µs)
5. Lead-free components are also available (see Model
Line-up section in this datasheet)
6. Double transfer mold construction (Ideal for Flow
Soldering)
7. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
∗VDRM : 600V type is also available.
(PC3SD11NTZ Series)
■ Description
PC2SD11NTZ Series Phototriac Coupler include an
infrared emitting diode (IRED) optically coupled to an
output Phototriac.
These devices feature full wave control and are
ideal isolated drivers for medium to high current Triacs.
DIP package provides 5.0kV isolation from input to
output with superior commutative noise immunity.
1
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
Date Mar. 31. 2004
© SHARP Corporation
■ Agency approvals/Compliance
1. Triggering for Triacs used to switch on and off
devices which require AC Loads.
For example heaters, fans, motors, solenoids, and
valves.
2. Triggering for Triacs used for implementing phase
control in applications such as lighting control and
temperature control (HVAC).
3. AC line control in power supply applications.
■ Applications
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. 2SD11)
2. Approved by CSA, file No. CA95323 (as model No.
2SD11)
3. Package resin : UL flammability grade (94V-0)
■ Internal Connection Diagram
1
6
4
1
3
5
2
2
3
4
5
6
Anode
Cathode
NC
Anode/Cathode
No external connection
Cathode/Anode
2
■ Outline Dimensions
Product mass : approx. 0.35g Product mass : approx. 0.35g
Product mass : approx. 0.34gProduct mass : approx. 0.33g
∗Pin is not allowed external connection
(Unit : mm)
1. Through-Hole [ex. PC2SD11NTZ] 2. Wide Through-Hole Lead-Form [ex. PC2SD11NVZ]
3. SMT Gullwing Lead-Form [ex. PC2SD11NXP]4. Wide SMT Gullwing Lead-Form [ex. PC2SD11NWP]
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
2SD11
SHARP
mark
"S"
Date code (2 digit)
Rank mark
Model No.
Factory identification mark
Anode
mark
6.5±0.5
0.6±0.2 1.2±0.3
123
654
2SD11
SHARP
mark
"S"
Date code (2 digit)
Rank mark
Model No.
Factory identification mark
Anode
mark
7.62±0.3
Epoxy resin
0.26±0.1
10.16±0.5
2.7MIN.
7.12±0.5
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5 3.5±0.5
7.12±0.5
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
1 2 3
6 5 4
2SD11
SHARP
mark
"S"
Date code (2 digit)
Rank mark
Model No.
Factory identification mark
Anode
mark
7.62±0.3
0.26±0.1
0.75
±0.25
0.75
±0.25
12.0MAX.
10.16±0.5
0.25±0.25
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
7.12±0.5
2.54±0.25
3.5±0.5
2SD11
SHARP
mark
"S"
Date code (2 digit)
Rank mark
Model No.
Factory identification mark
Anode
mark
1 2 3
6 5 4
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
5
Date code (2 digit)
Rank mark
Refer to the Model Line-up table
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
3
repeats in a 20 year cycle
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
■ Electro-optical Characteristics
Parameter Symbol Unit
Input
Output
(Ta=25˚C)
Forward voltage
Reverse current
Repentitive peak OFF-state current
ON-state voltage
Holding current
Critical rate of rise of OFF-state voltage
Minimum trigger current
Isolation resistance
Turn-on time
VF
IR
IDRM
VT
IH
dV/dt
IFT
RISO
ton
V
µA
µA
V
mA
V/µs
mA
Ω
µs
IF=20mA
VR=3V
VD=VDRM
IT=0.1A
VD=6V
VD=1/√−
2 ·VDRM
VD=6V, RL=100Ω
DC500V,40 to 60%RH
V
D=
6V, R
L=
100Ω, I
F=
20mA
Conditions
-
-
-
-
0.1
1 000
-
5
×
1010
-
1.2
-
-
-
-
2 000
-
1011
-
1.4
10
1
2.5
3.5
-
10
-
100
MIN. TYP. MAX.
Transfer
charac-
teristics
Rank A
■ Absolute Maximum Ratings
Parameter Symbol Rating Unit
(Ta=25˚C)
Forward current
Reverse voltage
RMS ON-state current
Peak one cycle surge current
Repetitive peak OFF-state voltage
Isolation voltage
Operating temperature
Storage temperature
Soldering temperature
*2
*1
IF
VR
IT(rms)
Isurge
VDRM
Viso(rms)
Topr
Tstg
Tsol
mA
V
A
A
V
kV
˚C
˚C
˚C
*3
*4
50
6
0.1
1.2
400
5.0
−30 to +100
−55 to +125
270
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
*4 Lead solder plating models: 260˚C
Input
Output
4
PC2SD11NTZ Series
1mm
Soldering area
Sheet No.: D2-A07401EN
Lead Form
Shipping Package
Model No.
Through-Hole
MAX.10
Sleeve
50pcs/sleeve
Wide Through-HoleSMT Gullwing
PC2SD11NTZAF PC2SD11NVZAFPC2SD11NXZAF A
IFT[mA]
(VD=6V,
RL=100Ω)
Rank mark
5
Please contact a local SHARP sales representative to inquire about production status.
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
■ Model Line-up (1) (Lead-free components)
■ Model Line-up (2) (Lead solder plating components)
Lead Form
Shipping Package
Model No.
Through-Hole
MAX.10
Sleeve
50pcs/sleeve
Wide Through-HoleSMT Gullwing
PC2SD11NTZA PC2SD11NVZAPC2SD11NXZA A
IFT[mA]
(VD=6V,
RL=100Ω)
Rank mark
Lead Form
Shipping Package
Model No.
Wide SMT Gullwing
MAX.10
Taping
1 000pcs/reel
Sleeve
50pcs/sleeve
SMT Gullwing Wide SMT Gullwing
PC2SD11NWZAF PC2SD11NXPAF PC2SD11NWPAF A
IFT[mA]
(VD=6V,
RL=100Ω)
Rank mark
Lead Form
Shipping Package
Model No.
Wide SMT Gullwing
MAX.10
Taping
1 000pcs/reel
Sleeve
50pcs/sleeve
SMT Gullwing Wide SMT Gullwing
PC2SD11NWZA PC2SD11NXPA PC2SD11NWPA A
IFT[mA]
(VD=6V,
RL=100Ω)
Rank mark
6
PC2SD11NTZ Series
Forward current IF (mA)
Ambient temperature Ta (°C)
0
10
20
30
40
50
60
70
−30 100050
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 RMS ON-state Current vs.
Ambient Temperature
Sheet No.: D2-A07401EN
RMS ON-state current IT (rms) (mA)
0
25
50
75
100
125
150
175
Ambient temperature Ta (°C)
−30 100050
0 0.5 1 1.5 2 2.5 3
Forward current IF (mA)
Forward voltage VF (V)
1
5
10
50
100
Ta=100°C
75°C
50°C
25°C
0°C
−30°C
Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs.
Ambient Temperature
0
14
12
10
8
6
4
2
Minimum trigger current IFT (mA)
−40 −20 0 20 406080100
Ambient temperature Ta (°C)
VD=6V
RL=100Ω
Fig.6 ON-state Voltage vs.
Ambient Temperature
ON-state voltage VT (V)
1
2.2
2
1.8
1.6
1.4
1.2
−40 −20 100806040200
Ambient temperature Ta (°C)
IT=100mA
Fig.5 Relative Repetitive Peak OFF-state
Voltage vs. Ambient Temperature
Relative repetitive peak OFF-state voltage
VDRM (Tj=Ta) / VDRM (Tj=25°C)
0.7
1.3
1.2
1.1
1
0.9
0.8
−40 −20 0 20 40 60 80 100
Ambient temperature Ta (°C)
7
PC2SD11NTZ Series
Fig.9 Turn-on Time vs. Forward Current
Sheet No.: D2-A07401EN
Repetitive peak OFF-state current IDRM (A)
10−10
10−8
10−6
10−9
10−7
−40 −20 100806040200
Ambient temperature Ta (°C)
VD=400V
Remarks : Please be aware that all data in the graph are just for reference.
Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature
Turn-on time ton (µs)
10
100
1 000
1 10010
Forward current IF (mA)
VD=6V
RL=100Ω
Ta=25°C
Fig.7 Holding Current vs.
Ambient Temperature
Holding current IH (mA)
0.1
1
10
−40 −20 100806040200
Ambient temperature Ta (°C)
VD=6V
● Recommended Foot Print (reference)
8
SMT Gullwing Lead-form Wide SMT Gullwing Lead-form
2.542.54
1.7
2.2
10.2
2.542.54
1.7
2.2
8.2
(Unit : mm)
PC2SD11NTZ Series
■ Design Considerations
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less.
Please refrain from using these devices in a direct drive configuration.
These Phototriac Coupler are intended to be used as triggering device for main Triacs.
Please ensure that the output rating of these devices will be sufficient for triggering the main output Triac of
your choice. Failure to do may result in malfunctions.
In phase control applications or where the Phototriac Coupler is being by a pulse signal, please ensure that
the pulse width is a minimum of 1ms.
For designs that will experience excessive noise or sudden changes in load voltage, please include an
appropriate snubber circuit as shown in the below circuit.
Please keep in mind that Sharp Phototriac Couplers incorporate superor dV/dt ratings which can often
eliminate the need for a snubber circuit.
● Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should
provide at least twice the minimum required triggering current from initial operation.
● Design guide
Sheet No.: D2-A07401EN
9
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
● Standard Circuit (Medium/High Power Triac Drive Circuit)
Triac
Load
PC2SD11NTZ
Note) Please add the snubber circuit according to a condition.
Any snubber or varistor used for the above mentioned scenarios should be located
as close to the main output triac as possible.
6
4
1
2
5
3
AC Line
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
11
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
● Presence of ODC
■ Package specification
12
12.0
6.7
5.8
10.8
15.0
6.35
5.9
10.8
520
±2
520
±2
● Sleeve package
1. Through-Hole or SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
(Unit : mm)
2. Wide Through-Hole or Wide SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
13
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
B
H
H
A
C
G
5˚MAX.
Dimensions List (Unit:mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
7.8±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
2. Wide SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
14
Dimensions List
A
24.0±0.3
B
11.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
12.2±0.1
I
0.4±0.05
J
4.15±0.1
K
7.6±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
(Unit : mm)
J
GI
EC
B
A
H
H
5˚MAX.
F D
K
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
25.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
15
■ Important Notices
PC2SD11NTZ Series
Sheet No.: D2-A07401EN
