HSP053-4M5 4-line ESD protection for high speed lines Datasheet - production data Applications The HSP053-4M5 is designed to protect against to electro-static discharge sub-micron technology circuits driving: The ultra-low variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes it compatible with HDMI 2.0 (= 5.94 Gbps) and USB 3.1 Gen 2 (= 10 Gbps). QFN-5L package Features HDMI 1.4 and HDMI 2.0 USB 3.1 Gen 1 and Gen 2 Digital video interface Display port Serial ATA Very compact 500 m pitch package, for easy PCB layout Ultra-large bandwidth: 18 GHz Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND) Low leakage current: < 1 nA Extended operating junction temperature range: -40 C to 150 C Thin package: 0.4 mm max. RoHS compliant Description The HSP053-4M5 is a 4 channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The device is packaged in QFN 1.3 mm x 0.8 mm with a 500 m pitch. I/O 1 Benefits Figure 1: Functional diagram 1 High ESD protection level High integration Suitable for high density boards GND 5 I/O 2 4 I/O 3 2 Complies with the following standards MIL-STD 883G method 3015-7 class 3B > 8 kV Exceeds IEC61000-4-2 level 4 10 kV (contact discharge) 25 kV (air discharge) January 2018 DocID029599 Rev 3 This is information on a product in full production. I/O 4 3 1/11 www.st.com Characteristics 1 HSP053-4M5 Characteristics Table 1: Absolute maximum ratings (Tamb = 25 C) Symbol Parameter Value Unit 10 25 kV Contact discharge Air discharge VPP Peak pulse voltage Tstg Storage temperature range -65 to +150 Tj Operating junction temperature range -40 to +150 TL Maximum lead temperature for soldering during 10 s C 260 Table 2: Electrical characteristics (Tamb = 25 C) Symbol VBR Test condition IR = 1 mA Min. Typ. 5.3 5.8 VRM IRM 5.0 VRM = 3.6 V 70 nA 3 16 Rd Dynamic resistance, Pulse duration 100ns GND fC 2/11 nA IEC 61000-4-2, +8 kV contact measured at 30 ns VI/O = 0 V, VOSC = 30 mV V I/O to GND 0.68 GND to I/O 0.65 F = 2.5 GHz to 9 GHz 0.15 0.2 F = 200 MHz to 2.5 GHz 0.35 0.5 F = 2.5 GHz to 9 GHz 0.25 0.4 - 3dB 18 DocID029599 Rev 3 V 50 VRM = 5.0 V CI/O - I/O Unit <1 VCL CI/O - Max. pF GHz HSP053-4M5 1.1 Characteristics Characteristics (curves) Figure 2: Leakage current versus junction temperature (typical values) I R(nA) Figure 3: S21 attenuation measurement 10 V R=V RM= 3.6 V IO to GND 1 0.1 0.01 0 25 50 75 100 125 150 Tj (C) Figure 4: HDMI2.0 5.94 Gbps eye diagram without HSP053-4M5 (with worst case reference cable and EQ) 250 mV/div Figure 5: HDMI2.0 5.94 Gbps eye diagram with HSP053-4M5 (with worst case reference cable and EQ) 250 mV/div 28.1 ps/div Figure 6: HDMI1.4 3.35 Gbps eye diagram (without HSP053-4M5) 250 mV/div 28.1 ps/div Figure 7: HDMI1.4 3.35 Gbps eye diagram (with HSP053-4M5) 250 mV/div 49.8 ps/div DocID029599 Rev 3 49.8 ps/div 3/11 Characteristics HSP053-4M5 Figure 8: USB3.1 Gen2 10 Gbps eye diagram without HSP053-4M5 (with type-C connector, reference cable, EQ with ADC = 6 dB and DFE) 100 mV/div Figure 9: USB3.1 Gen2 10 Gbps eye diagram with HSP053-4M5 (with type-C connector, reference cable, EQ with ADC = 6 dB and DFE) 100 mV/div 16.7 ps/div Figure 10: USB3.1 Gen1 5Gbps eye diagram without HSP053-4M5 (with Type-C connector, reference cable and EQ) 100 mV/div 16.7 ps/div Figure 11: USB3.1 Gen1 5Gbps eye diagram with HSP053-4M5 (with Type-C connector, reference cable and EQ) 100 mV/div 33.5 ps/div Figure 12: ESD response to IEC61000-4-2 (+8 kV contact discharge) 4/11 ESD level Vpp +8kV 186V 33.5 ps/div Figure 13: ESD response to IEC61000-4-2 (-8 kV contact discharge) VCL@30ns VCL@60ns VCL@100ns 16V 13V 9V DocID029599 Rev 3 ESD level V pp -8kV -161V V CL@30ns V CL@60ns V CL@100ns -7V -5V -2V HSP053-4M5 Characteristics Figure 14: TLP characteristic DocID029599 Rev 3 Figure 15: TDR measurement 5/11 Package information 2 HSP053-4M5 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 2.1 MicroQFN-5L package information Figure 16: MicroQFN-5L package outline 6/11 DocID029599 Rev 3 Package information HSP053-4M5 Table 3: MicroQFN-5L package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.36 0.38 0.40 0.0141 0.0149 0.0157 A1 0.00 0.02 0.05 0.0000 0.0007 0.0019 A2 0.15 0.25 0.35 0.0059 0.0098 0.0137 A3 0.130 0.0051 b 0.16 0.20 0.24 0.0062 0.0078 0.0094 D 1.20 1.30 1.40 0.0472 0.0511 0.0551 e 0.50 0.0196 E 0.70 0.80 0.90 0.0275 0.0314 0.0354 L 0.20 0.25 0.30 0.0078 0.0098 0.0118 Figure 17: Footprint (dimensions in mm) 5 4 0.3 0.2 0.45 0.5 #1 Figure 18: Marking H3 Figure 19: Tape and reel specification DocID029599 Rev 3 7/11 Recommendation on PCB assembly HSP053-4M5 3 Recommendation on PCB assembly 3.1 Solder paste 1. 2. 3. 4. 3.2 Placement 1. 2. 3. 4. 5. 6. 3.3 Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of 0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. 2. 8/11 Halide-free flux qualification ROL0 according to ANSI/J-STD-004. "No clean" solder paste is recommended. Offers a high tack force to resist component movement during high speed. Solder paste with fine particles: powder particle size is 20-45 m. To control the solder paste amount, the closed via is recommended instead of open vias. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. DocID029599 Rev 3 Recommendation on PCB assembly HSP053-4M5 3.4 Reflow profile Figure 20: ST ECOPACK(R) recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DocID029599 Rev 3 9/11 Ordering information 4 HSP053-4M5 Ordering information Figure 21: Ordering information scheme HSP 05 3 - 4 M5 High speed protection Breakdown voltage VBR (5.3 V min) Version 3: Very high bandwidth Number of lines protected Package QFN-5L (1.3 x 0.8 mm) Table 4: Ordering information Order code Marking(1) Package Weight Base qty. Delivery mode HSP053-4M5 H3 QFN-5L 4.24 mg 6000 Tape and reel Notes: (1)The 5 marking can be rotated by multiples of 90 to differentiate assembly location Revision history Table 5: Document revision history 10/11 Date Revision Changes 22-Nov-2016 1 Initial release. 21-Dec-2017 2 New product version. 29-Jan-2018 3 Updated Table 2: "Electrical characteristics (Tamb = 25 C)". 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All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2018 STMicroelectronics - All rights reserved DocID029599 Rev 3 11/11