W241024A 128K x 8 HIGH SPEED CMOS STATIC RAM GENERAL DESCRIPTION The W241024A is a high speed, low power CMOS static RAM organized as 131072 x 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES * High speed access time: 12/15/20 nS (max.) * All inputs and outputs directly TTL compatible * Low power consumption: - Active: 600 mW (typ.) * Three-state outputs * Available packages: 32-pin 300 mil SOJ, 400 mil SOJ, skinny DIP and standard type one TSOP (8 mm x 20 mm), and small type one TSOP (8 mm x 13.4 mm) * Single +5V power supply * Fully static operation BLOCK DIAGRAM PIN CONFIGURATIONS VDD A11 A9 A8 A13 WE CS2 A15 VDD NC A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NC 1 32 VDD A16 2 31 A15 CS2 VSS A0 . . A14 3 30 A12 4 29 WE A7 5 28 A13 A6 6 27 A8 A5 7 26 A9 A4 8 25 A11 CS2 A3 9 24 OE A2 10 23 A1 0 CS1 OE A1 11 22 CS1 WE A0 12 21 I/O 8 I/O 1 13 20 I/O 7 I/O 2 14 19 I/O 6 I/O 3 15 18 I/O 5 VSS 16 17 I/O 4 32-pin TSOP DECODER CORE ARRAY A16 CONTROL DATA I/O I/O1 . . I/O8 PIN DESCRIPTION 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 SYMBOL A0-A16 I/O1-I/O8 OE A10 CS1 I/O8 I/O7 I/O6 I/O5 I/O4 V SS DQ3 DQ2 DQ1 A0 A1 A2 A3 -1- CS1, CS2 DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Inputs WE OE VDD VSS NC Write Enable Input Output Enable Input Power Supply Ground No Connection Publication Release Date: July 1998 Revision A9 W241024A TRUTH TABLE CS1 H X L L L CS2 X L H H H OE X X H L X MODE Not Selected Not Selected Output Disable Read Write WE X X H H L VDD CURRENT ISB, ISB1 ISB, ISB1 IDD IDD IDD I/O1-I/O8 High Z High Z High Z Data Out Data In DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +7.0 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W C C Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. Operating Characteristics (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C) PARAMETER Input Low Voltage Input High Voltage Input Leakage Current SYM. VIL VIH ILI TEST CONDITIONS VIN = VSS to VDD Output Leakage Current ILO VI/O = VSS to VDD Output Low Voltage Output High Voltage Operating Power Supply Current VOL VOH IDD CS1 = VIH (min.) or CS2 = VIL (max.) or OE = VIH (min.) or WE = VIL (max.) IOL = +8.0 mA IOH = -4.0 mA 12 CS1 = VIL (max.), and CS2 = VIH (min.) I/O = 0 mA, Cycle = min. Duty = 100% Standby Power Supply Current 15 20 ISB CS1 = VIH (min.), or CS2 = VIL (max.) Cycle = min. ISB1 CS1 VDD -0.2V or CS2 0.2V Note: Typical characteristics are at VDD = 5V, TA = 25 C. -2- MIN. -0.5 +2.2 -10 TYP. - MAX. +0.8 VDD +0.5 +10 UNIT V V -10 - +10 A 2.4 - - 0.4 200 V V mA - - 200 170 30 mA mA mA - - 10 mA A W241024A CAPACITANCE (VDD = 5V, TA = 25 C, f = 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT Input Capacitance CIN VIN = 0V 8 pF Input/Output Capacitance CI/O VOUT = 0V 10 pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER CONDITIONS Input Pulse Levels 0V to 3V Input Rise and Fall Times 5 nS Input and Output Timing Reference Level 1.5V Output Load CL = 30 pF, IOH/IOL = -4 mA/8 mA AC Test Loads and Waveform R1 480 ohm R1 480 ohm 5V 5V OUTPUT 5pF Including Jig and Scope OUTPUT 30 pF Including Jig and Scope R2 255 ohm R2 255 ohm (For TCLZ1, TCLZ2, TOLZ, TCHZ1, TCHZ2, TOHZ, TWHZ, TOW ) 3.0V 90% 90% 10% 0V 10% 5 nS 5 nS -3- Publication Release Date: July 1998 Revision A9 W241024A AC Characteristics, continued (VDD = 5V 10%, VSS = 0V, TA = 0 to 70 C) Read Cycle PARAMETER SYM. W241024A-12 W241024A-15 W241024A-20 MIN. MAX. MIN. MAX. MIN. MAX. UNIT Read Cycle Time TRC 12 - 15 - 20 - nS Address Access Time TAA - 12 - 15 - 20 nS Chip Select Access Time CS1 TACS1 - 12 - 15 - 20 nS CS2 TACS2 - 12 - 15 - 20 nS TAOE - 6 - 7 - 10 nS CS1 TCLZ1* 3 - 3 - 3 - nS CS2 TCLZ2* 3 - 3 - 3 - nS TOLZ* 0 - 0 - 0 - nS Output Enable to Output Valid Chip Selection to Output in Low Z Output Enable to Output in Low Z Chip Deselection to Output in CS1 TCHZ1* - 6 - 7 - 10 nS High Z CS2 TCHZ2* - 6 - 7 - 10 nS Output Disable to Output in High Z TOHZ* - 6 - 7 - 10 nS Output Hold from Address Change TOH 3 - 3 - 3 - nS * These parameters are sampled but not 100% tested. Write Cycle W241024A-12 W241024A-15 W241024A-20 MIN. MAX. MIN. MAX. MIN. MAX. TWC 12 - 15 - 20 - nS CS1 TCW1 10 - 13 - 17 - nS CS2 TCW2 10 - 13 - 17 - nS Address Valid to End of Write TAW 10 - 13 - 17 - nS Address Setup Time TAS 0 - 0 - 0 - nS Write Pulse Width TWP 10 - 10 - 12 - nS Write Recovery Time CS1 , WE TWR1 0 - 0 - 0 - nS CS2 TWR2 0 - 0 - 0 - nS Data Valid to End of Write TDW 7 - 9 - 10 - nS Data Hold from End of Write TDH 0 - 0 - 0 - nS Write to Output in High Z TWHZ* - 7 - 8 - 10 nS Output Disable to Output in High Z TOHZ* - 7 - 8 - 10 nS Output Active from End of Write TOW 0 - 0 - 0 - nS PARAMETER SYM. Write Cycle Time Chip Selection to End of Write * These parameters are sampled but not 100% tested. -4- UNIT W241024A TIMING WAVEFORMS Read Cycle 1 (Address Controlled) TRC Address TOH TAA TOH D OUT Read Cycle 2 (Chip Select Controlled) CS1 TACS1 TCHZ1 TACS2 CS2 TCHZ2 TCLZ1 DOUT TCLZ2 Read Cycle 3 (Output Enable Controlled) TRC Address TAA OE TAOE TOH TOLZ CS1 TACS1 TCLZ1 CS2 TCHZ1 T ACS2 TCLZ2 TCHZ2 TOHZ DOUT -5- Publication Release Date: July 1998 Revision A9 W241024A Timing Waveforms, continued Write Cycle 1 (OE Clock) T WC Address TWR1 OE TCW1 CS1 CS2 TCW2 TAW WE TWR2 TWP TAS TOHZ (1, 4) D OUT TDW TDH D IN Write Cycle 2 (OE = VIL Fixed) TWC Address T CW1 TWR1 CS1 TCW2 CS2 TAW WE TWR2 T WP TAS TOH TWHZ (1, 4) TOW (2) (3) D OUT TDW TDH D IN Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. Dout provides the read data for the next address. 4. Transition is measured 500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested. -6- W241024A ORDERING INFORMATION PART NO. ACCESS TIME (nS) OPERATING CURRENT MAX. (mA) STANDBY CURRENT MAX. (mA) PACKAGE W241024AI-12 12 200 10 400 mil SOJ W241024AI-15 15 200 10 400 mil SOJ W241024AI-20 20 170 10 400 mil SOJ W241024AJ-12 12 200 10 300 mil SOJ W241024AJ-15 15 200 10 300 mil SOJ W241024AJ-20 20 170 10 300 mil SOJ W241024AK-12 12 200 10 300 mil skinny DIP W241024AK-15 15 200 10 300 mil skinny DIP W241024AK-20 20 170 10 300 mil skinny DIP W241024AQ-12 12 200 10 Small type one TSOP W241024AQ-15 15 200 10 Small type one TSOP W241024AQ-20 20 170 10 Small type one TSOP W241024AT-12 12 200 10 Standard type one TSOP W241024AT-15 15 200 10 Standard type one TSOP W241024AT-20 20 170 10 Standard type one TSOP Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. -7- Publication Release Date: July 1998 Revision A9 W241024A PACKAGE DIMENSIONS 32-pin P-DIP Skinny (300 mil) Symbol A A1 A2 B B1 c D E E1 e1 L D 32 17 E1 1 16 Dimension in Inches Dimension in mm Min. Nom. Max. Min. Nom. Max. 5.08 0.200 0.015 0.38 0.145 0.150 0.155 3.68 3.81 3.94 0.016 0.018 0.022 0.41 0.46 0.56 0.058 0.060 0.064 1.47 1.52 1.63 0.008 0.010 0.014 0.20 0.25 0.36 40.64 41.15 1.60 1.62 0.295 0.315 0.335 7.49 8.00 8.50 0.286 0.290 0.294 7.26 7.36 7.46 0.090 0.100 0.110 2.29 2.54 2.79 0.120 0.130 0.140 3.05 3.30 3.56 0.450 0.470 11.43 11.94 0 a eA S 0.430 15 0 15 10.92 0.065 1.65 Notes: E S 1. Dimension D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimension D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec. c Base Plane A1 A A2 L Mounting Plane B1 e1 eA a B 32-pin SOJ (300 mil) Symbol 17 32 A E He 16 Dimension in mm Nom. Max. Min. Nom. __ __ __ __ __ 0.140 __ 0.095 0.100 0.105 2.413 2.540 2.667 B b c 0.026 0.028 0.032 0.660 0.711 0.813 0.016 0.018 0.022 0.406 0.457 0.559 0.008 0.010 0.014 0.203 0.254 0.356 D E e 0.815 0.825 0.835 20.701 20.955 21.209 0.295 0.300 0.305 7.493 7.620 7.747 0.044 0.050 0.056 1.118 1.270 1.422 e He 0.247 0.267 0.287 6.274 6.782 7.290 0.325 0.080 __ 0.335 __ 0.345 __ 8.255 L S Y 8.509 __ 8.763 __ __ __ __ 0 __ 0.045 0.004 10 0.508 2.032 __ __ 0 c A L e1 B e A1 b Y Seating Plane -8- __ __ __ D S 3.556 __ A1 A2 A2 Max. __ 0.020 1 1 Dimension in Inches Min. 1.143 0.102 10 W241024A Package Dimensions, continued 32-pin SOJ (400 mil) Symbol 32 A A1 A2 b1 b c D E e e1 HE L S y 17 E 1 HE 16 D c A2 A b b1 s e Dimension in mm Min. Max. Min. Nom. Max. 0.145 3.33 3.51 3.68 2.91 Nom. 0.131 0.138 0.635 0.025 0.105 0.110 0.115 2.67 2.79 0.026 0.028 0.032 0.66 0.71 0.81 0.016 0.018 0.020 0.41 0.46 0.51 0.006 0.008 0.011 0.15 0.20 0.28 0.820 0.825 0.830 20.83 20.96 21.08 0.400 0.405 10.03 10.16 10.29 0.044 0.050 0.056 1.12 1.27 0.360 0.37 0.380 9.15 9.40 9.65 0.435 0.445 11.05 11.18 11.31 0.395 0.440 2.08 0.082 1.14 0.045 0.10 0.004 -5 1.42 2 6 2 -5 6 Notes: 1. Dimension D Max & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches 5. General appearance spec. should be based on final visual inspection spec. L e1 A1 Dimension in inches Seating Plane y 32-pin Standard Type One TSOP HD Dimension in Inches Dimension in mm Symbol D A c M e E 0.10(0.004) b __ A2 0.037 b 0.007 c D 0.720 E HD L L __ 0.002 L1 Nom. A1 e A Min. 0.047 Min. Nom. __ __ __ Max. 1.20 0.006 0.05 0.039 0.041 0.95 1.00 1.05 0.008 0.009 0.17 0.20 0.23 0.005 0.006 0.007 0.12 0.15 0.17 0.724 0.728 18.30 18.40 18.50 0.311 0.315 0.319 7.90 8.00 8.10 0.780 0.787 0.795 19.80 20.00 20.20 __ 0.016 __ A2 Y 0.000 A1 1 L1 __ Max. 0.020 0.020 0.031 __ 3 __ __ 0.024 0.40 __ __ 0.004 0.00 5 1 0.50 0.50 0.80 __ 3 0.15 __ 0.60 __ 0.10 5 Y Note: Controlling dimension: Millimeter -9- Publication Release Date: July 1998 Revision A9 W241024A Package Dimensions, continued 32-pin Small Type One TSOP HD Symbol D Min. c e E b A 2 A A1 L Y L1 Nom. Max. A 1 Dimension in Inches Dimension in mm Min. Max. 1.25 0.049 A1 0.002 0.006 0.05 A2 b c 0.037 0.039 0.041 0.95 1.00 1.05 0.007 0.008 0.009 0.17 0.20 0.27 0.0056 0.0059 0.0062 0.14 0.15 0.16 D E HD e 0.461 L 0.012 0.020 0.028 L1 0.027 Y 0.000 0 0.15 0.465 0.469 11.70 11.80 11.90 0.311 0.315 0.319 7.90 8.00 8.10 0.520 0.528 0.536 13.20 13.40 13.60 0.50 0.020 0.30 0.50 0.70 0.675 0.004 3 5 0.00 0 Controlling dimension: Millimeters - 10 - Nom. 0.10 3 5 W241024A VERSION HISTORY VERSION DATE PAGE DESCRIPTION A9 Jul. 1998 1, 7, 10 Add small type one TSOP (8 mm x 13.4 mm) package Headquarters Winbond Electronics (H.K.) Ltd. No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792647 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006 Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab. 2730 Orchard Parkway, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502 Note: All data and specifications are subject to change without notice. - 11 - Publication Release Date: July 1998 Revision A9