10 PAD LAYOUT
A-108 EPSON S1C33T01 PRODUCT PART
No. Pad name X Y No. Pad name X Y
101 A16 2,373 2,288 151 N.C -1,890 2,288
102 N.C 2,247 2,288 152 P74 -1,974 2,288
103 A17 2,142 2,288 153 N.C -2,058 2,288
104 N.C 2,058 2,288 154 P73/SDA1 -2,142 2,288
105 A18 1,974 2,288 155 N.C -2,247 2,288
106 N.C 1,890 2,288 156 P72/SCL1 -2,373 2,288
107 A19 1,806 2,288 157 P71/SDA0 -2,855 1,806
108 N.C 1,722 2,288 158 P70/SCL0 -2,855 1,722
109 A20 1,638 2,288 159 #NMI -2,855 1,638
110 N.C 1,554 2,288 160 PLLS1 -2,855 1,154
111 A21 1,470 2,288 161 PLLS0 -2,855 1,470
112 N.C 1,386 2,288 162 #RESET -2,855 1,386
113 A22 1,302 2,288 163 PLLC -2,855 1,302
114 A23 1,218 2,288 164 VSS -2,855 1,218
115 BVDDE 1,134 2,288 165 P67 -2,855 1,134
116 D15 1,050 2,288 166 P66 -2,855 1,050
117 D14 966 2,288 167 P65 -2,855 966
118 D13 882 2,288 168 P64 -2,855 882
119 D12 798 2,288 169 P63 -2,855 798
120 D11 714 2,288 170 P62 -2,855 714
121 D10 630 2,288 171 VDDE -2,855 630
122 VSS 546 2,288 172 P61 -2,855 546
123 D9 462 2,288 173 P60 -2,855 462
124 D8 378 2,288 174 P57 -2,855 378
125 D7 294 2,288 175 P56 -2,855 294
126 D6 210 2,288 176 P55 -2,855 210
127 D5 126 2,288 177 P54 -2,855 126
128 VDD 42 2,288 178 VSS -2,855 42
129 D4 -42 2,288 179 OSC4 -2,855 -42
130 D3 -126 2,288 180 OSC3 -2,855 -126
131 D2 -210 2,288 181 VDD -2,855 -210
132 D1 -294 2,288 182 P53 -2,855 -294
133 D0 -378 2,288 183 P52 -2,855 -378
134 BVDDE -462 2,288 184 P51/T8UF5 -2,855 -462
135 P87/TM9 -546 2,288 185 P50/T8UF4 -2,855 -546
136 P86/TM8 -630 2,288 186 P16/EXCL5/#DMAEND1 -2,855 -630
137 P85/TM7 -714 2,288 187 P15/EXCL4/#DMAEND0 -2,855 -714
138 VDDE -798 2,288 188 VSS -2,855 -798
139 P84/TM6 -882 2,288 189 P14/FOSC1/DCLK -2,855 -882
140 P83/EXCL9 -966 2,288 190 P13/EXCL3/T8UF3/DPCO -2,855 -966
141 P82/EXCL8 -1,050 2,288 191 P12/EXCL2/T8UF2/DST2 -2,855 -1,050
142 VSS -1,134 2,288 192 P11/EXCL1/T8UF1/DST1 -2,855 -1,134
143 P81/EXCL7 -1,218 2,288 193 P10/EXCL0/T8UF0/DST0 -2,855 -1,218
144 P80/EXCL6 -1,302 2,288 194 DSIO -2,855 -1,302
145 N.C -1,386 2,288 195 P27/TM5 -2,855 -1,386
146 P77 -1,470 2,288 196 P26/TM4 -2,855 -1,470
147 N.C -1,554 2,288 197 P25/TM3 -2,855 -1,554
148 P76 -1,638 2,288 198 P24/TM2 -2,855 -1,638
149 N.C -1,722 2,288 199 P23/TM1 -2,855 -1,722
150 P75 -1,806 2,288 200 P22/TM0 -2,855 -1,806
Note:The S1C33T01 is constructed with 0.35 µm process technology. Since the pad pitch is too small, it is
impossible to use all pads when mounting the chip (die form) on the board. When mounting the
chip, use the pads other than "N.C."