WF63 Datasheet Amp'ed RF Technology, Inc. WLAN features WF63 Product Specification * 802.11b/g/n, 802.11d Regulatory Domain, 802.11r * Output Power, +23dBm * Power savings mode * Transmit power back-off * Wi-Fi Direct (concurrent) * Wi-Fi Protected Setup * Soft Access Point * Hotspot 2.0 14.6mm x 13.5mm x 2.8 mm * Security: WPA2, AES Description Hardware configuration Amp'ed RF Technology presents the WF63 Wi-Fi Stand-alone * Cortex-M4 microprocessor up to 100 MHz module: 802.11bgn + Host MCU with Wi-Fi * 512K bytes Flash memory protocol stack. The WF63 is a small * 128K bytes RAM memory footprint, low cost RF module including * UART, up to 2.25M baud chip antenna, 6 general purpose and * SPI and I2C interfaces ADC IO lines, several serial interface options, and up to 4M bps data * 6 general purpose I/O throughput using the SPI interface. * 2 x12-bit A/D inputs The complete stack, TCP/IP with WLAN, is hosted on the integrated MCU. * 1 LPO input A * Standby current, 60 A simple AT command interface, artSerial, allows users to easily configure and * RoHS conformance operate the WF63. * FCC/IC/CE certified Embedded software * Amp'edUP WiFi stack * artSerial, AT command set, SDK, Software Development Kit * Mobile application software www.ampedrftech.com 2 Table of Contents 1. 1.1. 1.2. 2. 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 2.7. 2.8. 2.9. 3. 3.1. 3.2. 3.3. 3.4. 3.5. 3.6. 3.7. 3.8. 3.9. 4. 4.1. 4.2. 4.3. Software Architecture ........................................................................................... 4 Protocol stack diagram ....................................................................................................................... 4 Wi-Fi features ..................................................................................................................................... 4 Hardware Specifications....................................................................................... 5 Recommended Operating Conditions ................................................................................................ 5 Absolute Maximum Ratings ............................................................................................................... 5 I/O Operating Conditions .................................................................................................................... 5 Current Consumption ......................................................................................................................... 6 Selected RF Characteristics ............................................................................................................... 6 Transmit Power Back-off .................................................................................................................... 7 Pin Assignment .................................................................................................................................. 9 Pin Placement Diagram (Top View) ................................................................................................. 10 Layout Drawing ................................................................................................................................ 11 Hardware Design ................................................................................................. 12 Block Diagram .................................................................................................................................. 12 Layout ................................................................................................................12 Module Reflow.................................................................................................................................. 12 GPIO Interface ................................................................................................................................. 12 UART Interface................................................................................................................................. 12 PCB Layout Guidelines .................................................................................................................... 13 Reset Circuit ..................................................................................................................................... 13 Reference design ............................................................................................................................. 14 External LPO Input Circuit ................................................................................................................ 15 Regulatory Compliance ...................................................................................... 16 Modular Approval, FCC and IC ........................................................................................................ 17 FCC Label Instructions ..................................................................................................................... 17 CE Label Instructions ....................................................................................................................... 17 5. Ordering Information .......................................................................................... 17 6. Revision History .................................................................................................. 18 www.ampedrftech.com 3 1. Software Architecture 1.1. Protocol stack diagram 1.2. Wi-Fi features * 802.11b/g/n, 802.11d Regulatory Domain, 802.11r * Output Power, +23dBm * Interface, SDIO 2.0, SPI * Wi-Fi Direct (concurrent) * Wi-Fi Display * Wi-Fi Protected Setup * Soft Access Point * Hotspot 2.0 * Security: WPA2, AES * CCX v4 Client Security www.ampedrftech.com 4 2. Hardware Specifications General Conditions (VIN= 3.6V and 25C) 2.1. Recommended Operating Conditions Rating Min Typical Max Unit Operating Temperature Range -40 - 85 C Supply Voltage VIN 2.3 3.6 4.8 Volts Signal Pin Voltage - 2.0 - Volts RF Frequency 2400 - 2495 MHz Rating Min Typical Max Unit Storage temperature range -55 - +150 C Supply voltage VIN -0.3 - +5.0 Volts I/O pin voltage VIO -0.3 - +2.5 Volts RF input power - - -5 dBm 2.2. Absolute Maximum Ratings 2.3. I/O Operating Conditions Symbol Parameter Min Max Unit VIL Low-Level Input Voltage - 0.6 Volts VIH High-Level Input Voltage 1.3 - Volts VOL Low-Level Output Voltage - 0.4 Volts VOH High-Level Output Voltage 2.0 - Volts IOL Low -Level Output Current - 4.0 Ma IOH High-Level Output Current - 4.0 Ma RPU Pull-up Resistor 80 120 K RPD Pull-down Resistor 80 120 K www.ampedrftech.com 5 2.4. Current Consumption Modes (WLAN Max Power Level) Avg Unit Complete Power Down 17 a Sleep 101 a 0.77 Ma RX (idle, 2.4GHz) 62.07 Ma RX (active, 2.4GHz, OFDM) 65.87 Ma TX (active, 2.4GHz, OFDM), 15.5dBm @RF port 257.67 Ma TX (active, 2.4GHz, OFDM), 20.5dBm @RF port 279.67 Ma Data transmission using UART at 115K baud, STA mode 95.2 Ma 13.31 Ma 378 Ma VBAT=3.6v, CPU 42Mhz Power save (beacon period (including DTIM) 100ms, beacon length 1ms) -proprietary power saving features enabled Video streaming; the device is receiving 2.0 Mbps of data using legacy PSM mode (for example, MPEG-4@2Mbps) Ipeak: system maximum peak current draw 2.5. Selected RF Characteristics Parameters Conditions Antenna load Typical Unit 50 ohm Wi-Fi Receiver Sensitivity DSSS 1Mbps@PER<8% -98.0 dBm Sensitivity DSSS 2Mbps@PER<8% -95.0 dBm Sensitivity CCK 5.5Mbps@PER<8% -93.0 dBm Sensitivity CCK 11Mbps@PER<8% -91.5 dBm Sensitivity BPSK 6Mbps@PER<10% -93.5 dBm Sensitivity BPSK 9Mbps@PER<10% -91.5 dBm Sensitivity QPSK 12Mbps@PER<10% -90.5 dBm Sensitivity QPSK 18Mbps@PER<10% -88.0 dBm Sensitivity 16QAM 24Mbps@PER<10% -85.5 dBm Sensitivity 16QAM 36Mbps@PER<10% -82.0 dBm Sensitivity 64QAM 48Mbps@PER<10% -78.0 dBm Sensitivity 64QAM 54Mbps@PER<10% -76.5 dBm Sensitivity BPSK 6.5Mbps@PER<10% -92.0 dBm www.ampedrftech.com 6 Sensitivity QPSK 13Mbps@PER<10% -89.0 dBm Sensitivity QPSK 19.5Mbps@PER<10% -86.5 dBm Sensitivity 16QAM 26Mbps@PER<10% -84.0 dBm Sensitivity 16 QAM 39Mbps@PER<10% -80.5 dBm Sensitivity 64QAM 52Mbps@PER<10% -76.5 dBm Sensitivity 64QAM 58.5Mbps@PER<10% -74.5 dBm Sensitivity 64QAM 65Mbps@PER<10% -73.0 dBm Output Power 802.11b/g BPSK 1/2 21.25 dBm Output Power 802.11b/g BPSK 3/4 21.25 dBm Output Power 802.11b/g QPSK 1/2 21.25 dBm Output Power 802.11b/g QPSK 3/4 21.25 dBm Output Power 802.11b/g 16QAM 1/2 21.25 dBm Output Power 802.11b/g 16QAM 3/4 20.25 dBm Output Power 802.11b/g 64QAM 2/3 19.25 dBm Output Power 802.11b/g 64QAM 3/4 18.25 dBm Output Power 802.11n MCS-0 21.25 dBm Output Power 802.11n MCS-1 21.25 dBm Output Power 802.11n MCS-2 21.25 dBm Output Power 802.11n MCS-3 21.25 dBm Output Power 802.11n MCS-4 20.25 dBm Output Power 802.11n MCS-5 19.25 dBm Output Power 802.11n MCS-6 18.25 dBm Output Power 802.11n MCS-7 17.0 dBm Wi-Fi Transmitter 2.6. Transmit Power Back-off When 2.7 V < VBAT < 3.6 V, the output power shall be backed off by 0.8 Db per300 Mv drop of Vbat below 3.6 V to guarantee meeting spectral mask, EVM, harmonic levels, spurious emissions and regulatory requirements in general. When 2.3 V < VBAT < 2.7 V, an additional back-off of the output power is needed to guarantee meeting spectral mask, EVM, harmonic levels, spurious emissions and regulatory requirements in general. When the load is not 50, the output power is backed off to guarantee meeting spectral mask, EVM, harmonic levels, spurious emissions and regulatory requirements in general. The device is able to withstand a VSWR of up to 12:1 without any damage. When the temperature increases from +25C to +85C, the output power shall be backed off by 0.25 Db per www.ampedrftech.com 7 10C increase to guarantee meeting spectral mask, EVM, harmonic levels, spurious emissions and regulatory requirements in general. Tx Power vs Vin Tx Power dBm 25.0 23.0 21.0 Tx Power dBm 19.0 17.0 15.0 2.4 2.9 3.4 www.ampedrftech.com 8 2.7. Pin Assignment Name Type Pin # Description ALT Function 5V Tolerant Initial State UART Interface RXD I 13 Receive data Y TXD O 14 Transmit data Y RTS O 12 Request to send (active low) I2C Data/Aux Uart Rx Y CTS I 11 Clear to send (active low) I2C Clock/Aux Uart Tx Y I 9 Boot 0 Vin 8 Vin GND 7 GND 10 Reset input (active low for 5 ms) 15 LPO input (optional) Reserved BOOT 0 Power and Ground Reset RESETN I 2.5V max LPO LPO I GPIO - General Purpose Input/Output GPIO [1] I/O 1 General Purpose Input/Output SPI MISO/I2S ext SD Y Input pull down GPIO [2] I/O 2 General Purpose Input/Output SPI MOSI/I2S SD Y Floating GPIO [3] I/O 3 General Purpose Input/Output SPI SCLK/ I2S CK Y Input pull down GPIO [4] I/O 4 General Purpose Input/Output SPI SS/I2S WS Y Input pull down GPIO [5] I/O 5 General Purpose Input/Output ADC 0 Y Input pull down GPIO [6] I/O 6 General Purpose Input/Output ADC 1 Y Input pull down www.ampedrftech.com 9 2.8. Pin Placement Diagram (Top View) www.ampedrftech.com 10 2.9. Layout Drawing Size: 14.6 mm x 13.5 mm x 2.8 mm 531 mil (13.5 mm) 346 mil (8.8 mm) 30 mil (0.76 mm) TXD 14 LPO 15 1 GPIO[01] 31 mil (0.79 mm) 2 GPIO[02] RXD 13 3 GPIO[03] RTS 12 4 GPIO[04] CTS 11 5 GPIO[05] RESET 10 6 GPIO[06] BOOT0 9 7 GND VIN 8 www.ampedrftech.com 11 40 mil (1.0 mm) 575 mil 59 mil (1.5 mm) (14.6 mm) 3. Hardware Design 3.1. Block Diagram WLAN Radio RF 802.11 MAC SPI 802.11 PHY ARM Cortex MCU STM32 UART 512K Flash 96K RAM Clock SPI I2S GPIO 3.2. Layout * All unused pins should be left floating; do not ground. * All GND pins must be well grounded. * The area around the antenna should be free of any ground planes, power planes, trace routings, or metal for at least 6.5 mm in all directions. * Traces should not be routed underneath the module. 3.3. Module Reflow The WF63 is a surface mount module supplied on a 15 pin, 6-layer PCB. The final assembly recommended reflow profiles are: For RoHS/Pb-free applications, Sn96.5/Ag3.0/Cu0.5 solder is recommended. * Maximum peak temperature of 230 - 240C (below 250C). * Maximum rise and fall slope after liquidous of < 2C/second. * Maximum rise and fall slope after liquidous of < 3C/second. * Maximum time at liquidous of 40 - 80 seconds. 3.4. GPIO Interface All GPIOs are capable of sinking and sourcing 4Ma of I/O current. 3.5. UART Interface The UART is compatible with the 16550 industry standard. Four signals are provided with the UART interface. The TXD and RXD pins are used for data while the CTS and RTS pins are used for flow control. www.ampedrftech.com 12 3.6. PCB Layout Guidelines 3.7. Reset Circuit Two types of system reset circuits are detailed below. 3.7.1. External Reset Circuit Note: RPU ranges from 30K ohm to 50K ohm internally. www.ampedrftech.com 13 3.7.2. Internal Reset Circuit Notes: - RPU ranges from 30K ohm to 50K ohm internally. - RRST should be from 1K ohm to 10K ohm 3.8. Reference design www.ampedrftech.com 14 3.9. External LPO Input Circuit The LPO input circuit is optional. The accuracy of the slow clock frequency must be 32.768 KHz 150 ppm. www.ampedrftech.com 15 LPO Parameters: Frequency: 32.768 KHz Tolerance: 150 ppm Voltage Levels: Low: 0.1 V High: 2.0 V Input Capacitance: 2.5 pF maximum 4. Regulatory Compliance Federal Communications Commission statement: This module has been tested and found to comply with the FCC Part15. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Modifications or changes to this equipment not expressly approved by Amp'ed RF Technology may void the user's authority to operate this equipment. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number (A) If using a permanently affixed label, the modular transmitter must be labeled with its own FCC identification number, and, if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: "Contains Transmitter Module FCC ID: X3ZWFMOD9" or "Contains FCC ID: X3ZWFMOD9." (B) If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: "Contains FCC certified transmitter module(s)." To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or www.ampedrftech.com 16 transmitter. Industry Canada statement: Label of the end product: The final end product must be labeled in a visible area with the following "Contains transmitter module IC: 8828A-MOD9" This Class B digital apparatus complies with Canadian ICES-003. Cetappareilnumerique de la classe B estconforme a la norme NMB-003 du Canada. This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Ce 17 ispositive est conforme a la norme CNR-210 d'Industrie Canada applicable aux appareils radio exempts de licence. Son fonctionnement est sujet aux deux conditions suivantes: (1) le 17ispositive ne doit pas produire de brouillage prejudiciable, et (2) ce 17ispositive doit accepter tout brouillage recu, y compris un brouillage susceptible de provoquer un fonctionnement indesirable. 4.1. Modular Approval, FCC and IC FCC ID: X3ZWFMOD9 IC: 8828A-MOD9 In accordance with FCC Part 15, the WF63 is listed above as a Limited Modular Transmitter device. 4.2. FCC Label Instructions The outside of final products that contain a WF63 device must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: X3ZWFMOD9 IC: 8828A-MOD9 Any similar wording that expresses the same meaning may be used. 4.3. CE Label Instructions 0197 5. Ordering Information Part Name Description WF63 Standard version www.ampedrftech.com 17 6. Revision History Data Revision Description 10/26/2017 1.0 Initial WF63 datasheet 12/20/2017 1.1 Add reference design and LPO section www.ampedrftech.com 18