Dream of a Rich Future is Now Reality Corporate Profile Hynix Semiconductor is a leading supplier of advanced semiconductor memory and Image Sensor products. We design, develop, manufacture and market a wide variety of DRAM and NAND Flash memories, and CMOS Image Sensors (CIS). Memory components are an essential part of leading-edge Computing, Consumer, Communication and Wireless applications. Image Sensors are used in a wide range of wireless communications and handheld consumer applications DRAM and NAND Flash memories are focus products CMOS Image Sensors will diversify product portfolio 2008 Revenues of USD$6.2bn Market capitalization of USD$2.4bn as of December 2008 Global presence with 4 manufacturing sites and 26 sales offices worldwide 21,400 employees worldwide Recent Accomplishments 2009~2008 2007 2009 2007 03*Developed and acquired Intel validation for 2-Rank 8GB DDR3 RDIMM 11*Signed a partnership agreement with Siliconfile Technologies Inc. to cooperate on CMOS Image Sensor business 02*Developed the World's First 44nm DDR3 DRAM 2008 12*Developed the World's First 2Gb Mobile DRAM *Acquired Intel validation for 1Gb DDR2 DRAM *Developed industry's first 1Gb GDDR5 DRAM 11*Introduced Industry's Fastest 7Gbps, 1Gb GDDR5 Graphics DRAM 10*Signed PRAM technology and licensing agreement with Ovonyx 08*Completed Construction of 300mm Fabrication Plant of 3rd Factory in Cheongju 09*Developed world's first 24 stack NAND Flash multi-chip package *Demonstrated World's First 16GB 2-Rank R-DIMM Using MetaRAMTM Technology 04*Developed the world's fastest Mobile LPDDR2 02*Introduced 2-Rank 8GB DDR2 RDIMM 01*Signed an agreement for joint R&D for next-generation non-volatile memory technology with Numonyx *Announced 800MHz, 1GB / 2GB UDIMM Intel Validation 08*Signed ZRAM technology and licensing agreement with Innovative Silicon *Developed industry's fastest, smallest 1Gb Mobile DRAM Main Memory _ Graphics Memory _ Consumer Memory _ Mobile Memory _ NAND Flash Memory_ p_4 2007 05*Acquired the industry's first validation on DDR3 DRAM from Intel 03*Signed cross licensing agreement with Sandisk and signed MOU for joint development of x4 NAND Flash technology *Developed the world's fastest ECC Mobile DRAM 01*Founded sales subsidiary in India (HSIS) *Developed world's fastest memory module based on `wafer level package' technology p_8 p_10 p_12 p_14 CIS p_17 2006~2004 2003~1983 2006 2003 12*Announced industry's first 60nm 1Gb DDR2 800MHz based modules 06*Established Environment / Safety / Health Lab *Developed the world's fastest 200MHz 512Mb Mobile DRAM 09*Opened 300mm R&D (3R) fab in Icheon 04*Founded manufacturing company in China (HSMC) 2005 04*Established JV with ST Micro in China (HSSL) 01*Signed strategic alliance with ProMOS 2004 10*Transferred non-memory product lines to MagnaChip Semiconductor Ltd. 08*Signed cooperative agreement with Wuxi City, China to build chip plant 04*Established strategic joint development alliance with STMicro for NAND Flash 2001 03*Changed corporate name to `Hynix Semiconductor Inc.' 1999 10*Merged with LG Semicon 1983 02*Established Hyundai Electronics Industries Co., Ltd. Main Memory DDR3 DDR3 General Description The next generation main memory standard, DDR3 SDRAM, can transfer data twice as fast as the current generation DDR2 DRAM's. DDR3 SDRAM boasts high performance and low power consumption. It supports data transfer rate up to 1.6Gb/s and operates at a lower power supply voltage of 1.5V compared to DDR2. The DDR3 SDRAM is eco-friendly for it can operate at even lower voltage of 1.35V contributing to lower power dissipation and extended battery life in mobile systems. The low-power operation is also of benefit to high-density memory systems such as servers and data centers. Hynix plans to offer DDR3 densities from 1Gb to 4Gb, and is currently supporting up to 2Gb DDR3. Hynix's DDR3 modules exploit functions such as ZQ calibration, fly-by topology, dynamic on-die-termination, and levelization to ensure better signal integrity which guarantees higher performance. DDR2 VS. DDR3 Performance / Watt Comparison DDR2 VS. DDR3 Subject DDR2 DDR3 Data Rate 400, 533, 667, 800 Mbps 800, 1066, 1333, 1600 Mbps VDD / VDDQ 1.8V 0.1V 1.5V 0.075V Support Density 256Mb ~ 4Gb 512Mb ~ 4Gb Bank 512Mb : 4 Bank / 1Gb : 8 Bank 8 Bank Data Pre-fetch 4 bit 8 bit Package Type 60FBGA for x4 / x8, 84FBGA for x16 78FBGA for x4 / x8, 96FBGA for x16 Interface SSTL-18 SSTL-15 DQS Signaling Single / Differential Differential Only Driver Calibration Off-Chip Driver Calibration Self calibration with ZQ pin DQS-CLK De-skewing No Yes (Write Leveling) On Die Termination Yes Yes / Dynamic ODT Reset pin No Yes (Soft power-up) Key Features of High Speed Interface Experience High Speeds! 4 Hynix Semiconductor Inc. Main Memory PC memory & Server Memory General Description It is well known that demand for Notebook PCs has exceeded Desktop PCs. Users now demand a powerful, full-featured mobile system, with low power consumption, extended battery life and connectivity. New portable form factors such as Netbook have emerged in the PC market. Relatively low price point is the primary driving factor, especially in light of the current global economic conditions. Mobility and weight are other features that make this product attractive to consumers. Servers are now consolidating and adopting Virtualization technology to lower TCO (Total Cost of Ownership), with lower hardware costs and efficiencies. Higher speeds and higher density memory would be key requirements in a Virtualized server environment. DDR2 / DDR3 Speed Migration Hynix has always been at the leading edge of memory innovation. Hynix is currently supplying 66nm 1Gb DDR2/DDR3 and has started ramping 54nm 1Gb DDR2/DDR3 production. Hynix offers DDR3 Registered DIMMs which provide higher memory density, speed and memory bandwidth, and reliability for high performance servers. Hynix is also developing 1.35V DDR3 RDIMMs for lower power consumption in server platforms. SODIMM RDIMM SODIMM Features RDIMM Features - 512MB ~ 4GB DDR3 SODIMMs in volume production - Industry standard thickness allows easy installation - Applications include Notebooks in all form factors, Slim PC's, All-in-One PC's and UMPCs - Speeds up to 800MHz DDR2 - Speeds up to 1600MHz DDR3 - 1GB ~ 16GB DDR3 RDIMMs in volume production - Industry standard thickness allows easy installation - Low-power operation for servers and datacenters - Speeds up to 800MHz DDR2 - Speeds up to 1333MHz DDR3 Your notebook just got a little lighter and faster Portable computing applications can benefit from Hynix's proprietary packaging technology used in high density SODIMMs. Improve reliability of your server systems with Hynix Registered DIMMs. High Density in small packages! Most reliable memory! Hynix Semiconductor Inc. 5 Main Memory Product Line-up DDR2 SDRAM MODULE (240pin-UDIMM) VDD MODULE DENSITY ORG. BASED COM. SPEED PART NUMBER COMPONENT PKG. #OF RANK HEIGHT AVAIL. DDR2 800-666 DDR2 667-555 DDR2 800-666 DDR2 667-555 HMP351U6AFR8C-S6 HMP351U6AFR8C-Y5 HMP351U7AFR8C-S6 HMP351U7AFR8C-Y5 HYMP125U64CP8-S5 HMP125U6EFR8C-S5 HYMP125U72CP8-S5 HMP125U7EFR8C-S5 HYMP112U64CP8-S5 HMP112U6EFR8C-S5 HYMP112U72CP8-S5 HMP112U7EFR8C-S5 HMP512U6FFP8C-S5 HMP512U7FFP8C-S5 FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) 2 2 2 2 2 2 2 2 1 1 1 1 2 2 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm Now Now Now Now Now Now Now Now Now Now Now Now Now Now PART NUMBER COMPONENT PKG. #OF RANK HEIGHT AVAIL. FBGA (60ball) FBGA (63ball) FBGA (63ball) FBGA (63ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) 2 4 4 4 2 2 2 2 1 1 2 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm 30mm Now Now Now Now Now Now Now Now Now Now Now COMPONENT PKG. #OF RANK HEIGHT AVAIL. FBGA (65ball) FBGA (65ball) FBGA (63ball) FBGA (63ball) FBGA (63ball) FBGA (63ball) FBGA (60ball) FBGA (60ball) 4 4 4 4 2 2 2 2 18.3mm 18.3mm 18.3mm 18.3mm 18.3mm 18.3mm 18.3mm 18.3mm Now Now Now Now Now Now Now Now COMPONENT PKG. #OF RANK HEIGHT AVAIL. FBGA (63ball) FBGA (63ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) 4 4 2 2 2 4 4 2 2 2 2 2 2 2 2 2 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm 30.35mm Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now 512Mx64 256Mx8 512Mx72 256Mx8 256Mx64 128Mx8 DDR2 800-555 256Mx72 128Mx8 DDR2 800-555 128Mx64 128Mx8 DDR2 800-555 128Mx72 128Mx8 DDR2 800-555 128Mx64 128Mx72 64Mx8 64Mx8 DDR2 800-555 DDR2 800-555 4GB 2GB 1.8V 1GB DDR2 SDRAM MODULE (240pin-RDIMM) VDD 1.8V MODULE DENSITY ORG. BASED COM. SPEED 512Mx4 DDR2 800-555 DDR2 800-555 8GB 1Gx72 512Mx4 (DDP) 4GB 512Mx72 256Mx4 DDR2 800-555 128MX8 DDR2 800-555 2GB 256Mx72 256MX4 DDR2 800-555 128Mx4 DDR2 667-555 DDR2 667-555 HMP31GP7AFR4C-S5 HMP31GP7EMR4C-S5 HYMP31GP72CMP4-Y5 HMP31G7EMR4C-Y5 HYMP151P72CP4-S5 HMP151P7EFR4C-S5 HYMP125P72CP8-S5 HMP125P7EFR8C-S5 HYMP125P72CP4-S5 HMP125P7EFR4C-S5 HMP525P7FFP4C-Y5 DDR2 SDRAM MODULE (240pin-VLP RDIMM) VDD MODULE DENSITY ORG. 8GB 1Gx72 4GB 512Mx72 2GB 256Mx72 1.8V BASED COM. SPEED 1Gx4 (QDP) 1Gx4 (DDP) 512Mx4 (DDP) DDR2 667-555 DDR2 533-444 DDR2 800-555 DDR2 667-555 256MX4 DDR2 800-555 DDR2 800-555 PART NUMBER HYMP41GP72CNP4L-Y5 HYMP41GP72CNP4L-C4 HMP41GV7AMR4C-S5 HMP41GV7AMR4C-Y5 HYMP351P72CMP4L-S5 HMP351V7EMR4C-S5 HYMP125P72CP4L-S5 HMP125V7EFR4C-S5 DDR2 SDRAM MODULE (240pin-FBDIMM) VDD MODULE DENSITY 8GB 1.8V 1.55V 4GB ORG. 1Gx72 BASED COM. 512Mx4 (DDP) 512Mx4 SPEED DDR2 800-555 DDR2 800-666 256Mx4 DDR2 800-555 128Mx8 DDR2 800-555 128MX8 DDR2 800-555 128MX4 DDR2 800-555 512Mx72 2GB 256Mx72 8GB 1Gx72 512Mx4 DDR2 667-555 4GB 512Mx72 256Mx4 DDR2 667-555 2GB 256Mx72 128MX8 DDR2 667-555 PART NUMBER HMP31GF7EMR4C-S5xx HYMP31GF72CMP4xx-S5 HMP31GF7AFR4C-S6xx HMP151F7EFR4C-S5xx HYMP151F72CP4xx-S5 HMP151F7EFR8C-S5xx HYMP151F72CP8xx-S5 HMP125F7EFR8C-S5xx HYMP125F72CP8xx-S5 HMP525F7FFP4C-S5xx HYMP525F72CP4xx-S5 HMP31GL7AFR4C-Y5xx HMP151L7EFR4C-Y5xx HYMP151L72CP4xx-Y5 HMP125L7EFR8C-Y5xx HYMP125L72CP8xx-Y5 FBD P/N xx : (AMB vender)(Revison) DDR2 SDRAM MODULE (240pin-SODIMM) VDD MODULE AMB vender N: intel, D: IDT, E NEC BASED COM. SPEED PART NUMBER COMPONENT PKG. #OF RANK HEIGHT AVAIL. 4GB 512Mx64 256Mx8 DDR2 800-666 2GB 256Mx64 128Mx8 DDR2 800-555 1GB 128Mx64 64Mx16 DDR2 800-555 128Mx8 DDR2 667-555 HMP351S6AFR8C-S6 HYMP125S64CP8-S5 HMP125S6EFR8-S5 HYMP112S64CP6-S5 HMP112S6EFR6-S5 HYMP512S64CP8-Y5 FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) FBGA (60ball) 2 2 2 2 2 2 30mm 30mm 30mm 30mm 30mm 30mm Now Now Now Now Now Now DENSITY ORG. 1.8V "Not all products are listed here. Please contact local sales administrator for the complete list of products." 6 Hynix Semiconductor Inc. Main Memory Product Line-up DDR3 SDRAM MODULE (240pin-UDIMM) VDD MODULE DENSITY ORG. BASED COM. SPEED 512Mx64 256Mx8 1333-999 512Mx72 256Mx8 1333-999 256Mx64 128Mx8 1333-999 256Mx72 128Mx8 1333-999 128Mx64 128Mx8 1333-999 128Mx72 128Mx8 1333-999 4GB 1.5V 2GB 1GB COMPONENT PKG. #OF RANK HEIGHT HMT351U6MFR8C-H9 PART NUMBER FBGA (82ball) 2 30mm AVAIL. Now HMT351U6AFR8C-H9 FBGA (82ball) 2 30mm Now HMT351U7MFR8C-H9 FBGA (82ball) 2 30mm Now HMT351U7AFR8C-H9 FBGA (82ball) 2 30mm Now HMT125U6AFP8C-H9 FBGA (78ball) 2 30mm Now HMT125U6BFR8C-H9 FBGA (78ball) 2 30mm Now HMT125U7AFP8C-H9 FBGA (78ball) 2 30mm Now HMT125U7BFR8C-H9 FBGA (78ball) 2 30mm Now HMT112U6AFP8C-H9 FBGA (78ball) 1 30mm Now HMT112U6BFR8C-H9 FBGA (78ball) 1 30mm Now HMT112U7AFP8C-H9 FBGA (78ball) 1 30mm Now HMT112U7BFR8C-H9 FBGA (78ball) 1 30mm Now COMPONENT PKG. #OF RANK HEIGHT AVAIL. DDR3 SDRAM MODULE (240pin-RDIMM) VDD MODULE DENSITY 16GB ORG. 2Gx72 BASED COM. SPEED 1Gx4 (DDP) 1066-777 HMT42GR7AMR4C-G7 FBGA (82ball) 4 30mm Q3 '09 512Mx8 1333 HMT42GR7AUP4C-HE FBGA (82ball) 2 30mm Q3 '09 (MetaRAM DDP) 1066 HMT42GR7AUP4C-GC FBGA (82ball) 2 30mm Q3 '09 512Mx4 (Planar) 1333-999 HMT31GR7AFR4C-H9 FBGA (82ball) 2 30mm June '09 June '09 256Mx8 8GB 1Gx72 512Mx4 (DDP) 1.5V 4GB 2GB 512Mx72 256Mx72 1066-777 1066-777 PART NUMBER HMT31GR7AFR8C-G7 FBGA (82ball) 4 30mm HMT31GR7AMP4C-G7 FBGA (78ball) 4 30mm Now HMT31GR7BMR4C-G7 FBGA (78ball) 4 30mm April '09 May '09 256Mx8 1333 HMT31GR7AUP4C-HF FBGA (78ball) 2 30mm (MetaRAM DDP) 1066 HMT31GR7AUP4C-GC FBGA (78ball) 2 30mm Now 256Mx8 1333-999 HMT351R7AFR8C-H9 FBGA (82ball) 2 30mm June '09 128Mx8 1066-777 256Mx4 1333-999 256Mx4 1333-999 256Mx8 1333-999 128Mx8 1333-999 256Mx8 1066-777 128Mx8 1066-777 HMT151R7AFP8C-G7 FBGA (78ball) 4 30mm Now HMT151R7BFR8C-G7 FBGA (78ball) 4 30mm Now HMT151R7AFP4C-H9 FBGA (78ball) 2 30mm Now HMT151R7BFR4C-H9 FBGA (78ball) 2 30mm Now HMT125R7AFP4C-H9 FBGA (78ball) 1 30mm Now HMT125R7BFR4C-H9 FBGA (78ball) 1 30mm Now June '09 HMT325R7AFR8C-H9 FBGA (82ball) 1 30mm HMT125R7AFP8C-H9 FBGA (78ball) 1 30mm Now HMT125R7BFR8C-H9 FBGA (78ball) 1 30mm Now June '09 HMT325R7AFR8C-G7 FBGA (82ball) 1 30mm HMT125R7AFP8C-G7 FBGA (78ball) 1 30mm Now HMT125R7BFR8C-G7 FBGA (78ball) 1 30mm Now DDR3 SDRAM MODULE (240pin-VLP RDIMM) VDD MODULE DENSITY 8GB ORG. 1Gx72 BASED COM. SPEED 1Gx4 (DDP) 1066-777 512Mx4 (DDP) 4GB 512Mx72 256Mx8 (DDP) 1.5V 1333-999 1066-777 512Mx4 (Planar) 1333-999 2GB 256Mx72 256Mx4 1333-999 2GB 256Mx72 128Mx8 1333-999 COMPONENT PKG. #OF RANK HEIGHT AVAIL. HMT41GV7AMR4C-G7 FBGA (82ball) 4 18.75mm Q3 '09 HMT351V7AMP4C-H9 FBGA (78ball) 2 18.75mm Now HMT351V7BMR4C-H9 FBGA (78ball) 2 18.75mm Apr '09 HMT351V7AMR8C-G7 FBGA (78ball) 4 18.75mm Now HMT351V7BMR8C-G7 FBGA (78ball) 4 18.75mm Apr '09 Q3 '09 PART NUMBER HMT351V7AFR8C-H9 FBGA (82ball) 2 18.75mm HMT125V7AFP4C-H9 FBGA (78ball) 1 18.75mm Now HMT125V7BFR4C-H9 FBGA (78ball) 1 18.75mm Now HMT125V7AFP8C-H9 FBGA (78ball) 2 18.75mm Now HMT125V7BFR8C-H9 FBGA (78ball) 2 18.75mm Now DDR3 SDRAM MODULE (240pin-SODIMM) VDD MODULE DENSITY 4GB 1.5V ORG. 512Mx64 BASED COM. SPEED PART NUMBER COMPONENT PKG. #OF RANK HEIGHT AVAIL. 256Mx8 1333-999 HMT351S6AFR8C-H9 FBGA (82ball) 2 30mm Q3 '09 HMT125S6AFP8C-H9 FBGA (78ball) 2 30mm Now HMT125S6BFR8C-H9 FBGA (78ball) 2 30mm Now 2GB 256Mx64 128Mx8 1333-999 1GB 128Mx64 64Mx16 1333-999 HMT112S6AFP6C-H9 FBGA (96ball) 2 30mm Now HMT112S6BFR6C-H9 FBGA (96ball) 2 30mm Now "Not all products are listed here. Please contact local sales administrator for the complete list of products." The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com Hynix Semiconductor Inc. 7 Graphics Memory 54nm 1Gb GDDR5 General Information Product Bit Organization Experience the Richness of Entertainment Op. Frequency Power Supply Package Interface Function 1Gb GDDR5 (54nm Tech) 16Bank x 2Mbit x 32 I/O 16Bank x 4Mbit x 16 I/O Up to 7Gbps VDD(Q) = 1.5V FBGA 170 ball (12mm x 14mm) POD_15 Refresh : 8192 cycle / 32ms CL = 5 ~ 20, BL = 8 Burst Type : Sequential Data Mask @ Write General Description Since the introduction of the world's first Graphics DDR SDRAM in 1999, Hynix has played a leadership role in the Graphics memory market by offering cost effective and high performance products. Last November Hynix introduced the world's fastest 1Gb GDDR5 Graphics DRAM. The newly introduced 1Gb GDDR5 is built on the company's leading edge 54 nm process technology. It operates at 7Gbps which is 40% improvement compared to 66nm 5Gbps GDDR5, and processes up to 28GB/s (Gigabyte per seconds). It is also designed to minimize power consumption at 1.35V power supply. This product is ideal in high-end applications including high-end PC and next generation game consoles which require higher graphic performance and quality to deliver a rich entertainment experience to the end user. Hynix also supports GDDR3, DDR3 and DDR2 products for performance and mainstream markets. Hynix will contribute more values for our customers success with the higher performance, quality and technology leadership. Graphics Product Spec. Comparison 8 Hynix Semiconductor Inc. Picture 1. Graphic Memory Bandwidth Trend Applications Graphics Memory Product Line-up GRAPHICS DDR2 SDRAM DENSITY ORG. 1Gb 64Mx16 512Mb 32Mx16 256Mb 16Mx16 SPEED 500MHz (2.0ns) 400MHz (2.5ns) 400MHz (2.5ns) 600MHz (1.6ns) 500MHz (2.0ns) 500MHz (2.0ns) 400MHz (2.5ns) 500MHz (2.0ns) 450Mhz (2.2ns) 400MHz (2.5ns) 350Mhz (2.8ns) 300Mhz (3.3ns) 600MHz (1.6ns) 500MHz (2.0ns) 500MHz (2.0ns) 450MHz (2.2ns) 400MHz (2.5ns) 350MHz (2.8ns) PART NUMBER H5PS1G63EFR-20L H5PS1G63EFR-25C HY5PS1G1631CFR-25C H5PS5162FFR-16C H5PS5162FFR-20C H5PS5162FFR-20L H5PS5162FFR-25C HY5PS121621CFP-2 HY5PS121621CFP-22 HY5PS121621CFP-25 HY5PS121621CFP-28 HY5PS121621CFP-33 HY5PS561621BFP-16 HY5PS561621BFP-2 HY5PS561621BFP-2L HY5PS561621BFP-22 HY5PS561621BFP-25 HY5PS561621BFP-28 PKG. FEATURE AVAIL. FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) FBGA (84ball) 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 4Bank, 2.0V / 2.0V 4Bank, 2.0V / 2.0V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 2.0V / 2.0V 4Bank, 2.0V / 2.0V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 2.0V / 2.0V 4Bank, 2.0V / 2.0V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now PKG. FEATURE AVAIL. FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) FBGA (96ball) 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.8V / 1.8V 4Bank, 1.5V / 1.5V 4Bank, 1.5V / 1.5V 4Bank, 1.5V / 1.5V 4Bank, 1.5V / 1.5V Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now Now FEATURE AVAIL. GRAPHICS DDR3 SDRAM DENSITY ORG. 1Gb 64Mx16 512Mb 32Mx16 SPEED 900MHz (1.1ns) 800MHz (1.2ns) 800MHz (1.2ns) 700Mhz (1.4ns) 800MHz (1.2ns) 700Mhz (1.4ns) 600MHz (1.6ns) 700MHz(1.4ns) 600MHz (1.6ns) 500MHz (2.0ns) 1,000MHz (1.0ns) 900MHz (1.1ns) 800MHz (1.2ns) 700Mhz (1.4ns) 800MHz (1.2ns) 700Mhz (1.4ns) 600MHz (1.6ns) 500MHz (2.0ns) PART NUMBER H5TS1G63BFR-11C H5TS1G63BFR-12C H5TQ1G63BFR-12C H5TQ1G63BFR-14C H5TS1G63AFR-12C H5TS1G63AFR-14C H5TS1G63AFR-16C H5TQ1G63AFR-14C H5TQ1G63AFR-16C H5TQ1G63AFR-20C H5TS5163MFR-N0C H5TS5163MFR-11C H5TS5163MFR-12C H5TS5163MFR-14C H5TQ5163MFR-12C H5TQ5163MFR-14C H5TQ5163MFR-16C H5TQ5163MFR-20C GRAPHICS GDDR3 SDRAM DENSITY ORG. 1Gb 32Mx32 512Mb 16Mx32 SPEED 1,300MHz (0.77ns) 1,200MHz (0.8ns) 1,000MHz (1.0ns) 900MHz (1.1ns) 700MHz (1.4ns) 1,300MHz (0.77ns) 1,200MHz (0.8ns) 1,000MHz (1.0ns) 900MHz (1.1ns) 700MHz (1.4ns) 500MHz (2.0ns) 700MHz (1.4ns) 550MHz (1.8ns) PART NUMBER PKG. H5RS1H23MFR-N3C H5RS1H23MFR-N2C H5RS1H23MFR-N0C H5RS1H23MFR-11C H5RS1H23MFR-14C H5RS5223CFR-N3C H5RS5223CFR-N2C H5RS5223CFR-N0C H5RS5223CFR-11C H5RS5223CFR-14C H5RS5223CFR-20C H5RS5223CFR-14L H5RS5223CFR-18C FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) FBGA (136ball) 8banks, 1.9V / 1.9V 8banks, 1.9V / 1.9V 8banks, 1.9V / 1.9V 8banks, 1.8V /1 .8V 8banks, 1.8V / 1.8V 8Bank, 2.05V / 2.05V 8Bank, 2.05V / 2.05V 8Bank, 2.05V / 2.05V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.8V / 1.8V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V Now Now Now Now Now Now Now Now Now Now Now Now Now GRAPHICS GDDR5 SDRAM DENSITY ORG. 1Gb 32Mx32 512Mb 16Mx32 SPEED 6.0Gbps 5.5Gbps 5.0Gbps 4.5Gbps 4.0Gbps 4.5Gbps 4.0Gbps 3.6Gbps 3.2Gbps 4.5Gbps 4.0Gbps 3.6Gbps 3.2Gbps PART NUMBER H5GQ1H24AFR-R0C H5GQ1H24AFR-T3C H5GQ1H24AFR-T2C H5GQ1H24AFR-T1C H5GQ1H24AFR-T0C H5GQ1H24MJ(F)R-T1C H5GQ1H24MJ(F)R-T0C H5GQ1H24MJ(F)R-N8C H5GQ1H24MJ(F)R-N6C H5GQ5223MFR-T1C H5GQ5223MFR-T0C H5GQ5223MFR-N8C H5GQ5223MFR-N6C The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com PKG. FEATURE AVAIL. FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) FBGA (170ball) 16Bank, TBD 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 16Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V 8Bank, 1.5V / 1.5V Q2 '09 Q2 '09 Q2 '09 Q2 '09 Q2 '09 Now Now Now Now Now Now Now Now Hynix Semiconductor Inc. 9 Consumer Memory General Description Consumer DRAM Usage Map We now live in the Digital Era. Digital televisions, DVD and Set-Top Box give us rich entertainment, while Car navigation systems provide comfort and convenience. All of these digital consumer appliances need semiconductor memory for performance improvement, power savings and size reduction. Hynix has full line-up of DRAM (Dynamic RAM) to meet the needs of a wide range of consumer applications. Hynix offers a family of SDRAM (Synchronous DRAM) in 64Mb~256Mb densities, packaged in TSOP-II & FBGA offered at industrial range temperature range of -40C to 85C and featuring very low power consumption. DDR & DDR2 SDRAMs (Double Data Rate SDRAMs) are available for high-end consumer applications requiring higher data transfer rates. In many applications, such as Digital Television and Set-Top-Box, SDRAM has been replaced by DDR & DDR2 SDRAM technologies. Sometimes, the most important things may not be visible Although hidden from view, Hynix Consumer Memories have been used in a variety of applications offered by a number of companies to realize a multitude of miracles. Consumer DRAM Readiness Good things come in small packages! 10 Hynix Semiconductor Inc. Consumer Memory Product Line-up SDR SDRAM DENSITY 64Mb 128Mb 256Mb ORG. PART NUMBER SPEED POWER PKG. VOL. AVAIL. x16 x16 HY57V641620FTP 5/6/7/H Normal / Low TSOP 3.3V Now HY57V66FFP 5/6/7/H Normal / Low FBGA 3.3V Now x16 HY5V66FF6P 5/6/7/H Normal Power FBGA 3.3V Now x16 H57V6462GTR 50 / 60 / 75 / A3 Normal Power TSOP 3.3V Q3 '09 x16 H57V6462GFR 50 / 60 / 75 / A3 Normal Power FBGA 3.3V Q3 '09 x16 HY57V281620FTP 5/6/7/H Normal / Low TSOP 3.3V Now x16 HY5V26FFP 5/6/7/H Normal / Low FBGA 3.3V Now x16 H57V1262GTR 50 / 60 / 75 / A3 Normal Power TSOP 3.3V Q3 '09 x16 H57V1262GFR 50 / 60 / 75 / A3 Normal Power FBGA 3.3V Q3 '09 Now x8 HY57V56820FTP 6/H Normal / Low TSOP 3.3V x16 HY57V561620FTP 6/H Normal / Low TSOP 3.3V Now x16 HY5V56FFP 6/H Normal / Low FBGA 3.3V Now x32 HY5V52AFP 6/H Normal / Low FBGA 3.3V Now x8 H57V2582GTR 50 / 60 / 75 / A3 Normal Power TSOP 3.3V Q3 '09 x16 H57V2562GTR 50 / 60 / 75 / A3 Normal Power FBGA 3.3V Q3 '09 x16 H57V2562GFR 50 / 60 / 75 / A3 Normal Power FBGA 3.3V Q3 '09 ORG. PART NUMBER SPEED POWER PKG. VOL. AVAIL. x16 H5DU6462CTR J / D43 / D5 Normal / Low TSOP 2.5V Now x16 H5DU6462CFR J / D43 / D5 Normal / Low FBGA 2.5V Now DDR SDRAM DENSITY 64Mb 128Mb 256Mb 512Mb x16 HY5DU281622FTP 4 / 5 / D43 / D4 / J / H Normal / Low TSOP 2.5V Now x16 H5DU1262GTR F4 / E3 / E4 / J3 / K2 / K3 Normal / Low TSOP 2.5V Q2 '09 x16 H5DU1262GFR F4 / E3 / E4 / J3 / K2 / K3 Normal / Low FBGA 2.5V Q2 '09 x8 HY5DU568822FTP 4 / D43 / J Normal / Low TSOP 2.5V Now x16 HY5DU561622FTP 4 / D43 / J Normal / Low TSOP 2.5V Now x16 HY5DU561622FFP 4 / D43 / J Normal / Low FBGA 2.5V Now x8 H5DU2582GTR F4 / E3 / E4 / J3 / K2 / K3 Normal Power TSOP 2.5V Q3 '09 x16 H5DU2562GFR F4 / E3 / E4 / J3 / K2 / K3 Normal Power FBGA 2.5V Q3 '09 x8 H5DU2582GTR F4 / E3 / E4 / J3 / K2 / K3 Normal Power TSOP 2.5V Q3 '09 x16 H5DU2562GFR F4 / E3 / E4 / J3 / K2 / K3 Normal Power FBGA 2.5V Q3 '09 x8 HY5DU128822DTP D43 / J / K / H / L Normal Power TSOP 2.5V Now x8 HY5DU12822DFP D43 / J / K / H / L Normal Power FBGA 2.5V Now x16 HY5DU121622DTP D43 / J / K / H / L Normal Power TSOP 2.5V Now x16 HY5DU121622DFP D43 / J / K / H / L Normal Power FBGA 2.5V Now x8 H5DU5182ETR F4 / E3 / E4 / J3 / K2 / K3 Normal Power TSOP 2.5V Q4 '09 Q4 '09 x8 H5DU5182EFR F4 / E3 / E4 / J3 / K2 / K3 Normal Power FBGA 2.5V x16 H5DU5162ETR F4 / E3 / E4 / J3 / K2 / K3 Normal Power TSOP 2.5V Q4 '09 x16 H5DU5162EFR F4 / E3 / E4 / J3 / K2 / K3 Normal Power FBGA 2.5V Q4 '09 ORG. PART NUMBER SPEED POWER PKG. VOL. AVAIL. x16 HY5P5561621BFP E3 / C4 / Y5 / S5 Normal / Low FBGA 1.8V Now x16 HY5P5561621BFR E3 / C4 / Y5 / S5 Normal / Low FBGA 1.8V Now x8 HY5PS12821CFP E3 / C4 / Y4 / Y5 / S5 Normal / Low FBGA 1.8V Now DDR2 SDRAM DENSITY 256Mb 512Mb 1Gb 2Gb x8 H5PS5182FFR E3 / C4 / Y4 / Y5 / S5 Normal / Low FBGA 1.8V Now x16 HY5PS121621CFP E3 / C4 / Y4 / Y5 / S5 Normal / Low FBGA 1.8V Now x16 H5PS5162FFR E3 / C4 / Y4 / Y5 / S5 / G7 Normal / Low FBGA 1.8V Now x8 HY5PS1G831CFP E3 / C4 / Y5 / S5 Normal / Low FBGA 1.8V Now x8 H5PS1G83EFR E3 / C4 / Y5 / S5 Normal / Low FBGA 1.8V Now x16 HY5PS1G1631CFP E3 / C4 / Y5 / S5 Normal / Low FBGA 1.8V Now x16 H5PS1G63EFR E3 / C4 / Y5 / S5 / G7 Normal / Low FBGA 1.8V Now x16 H5PS2G63EMR Y5 / S5 Normal / Low FBGA 1.8V Q3 '09 The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com Hynix Semiconductor Inc. 11 Mobile Memory General Description Hynix Mobile Memory technology unleashes the best mobile experience on the go. As mobile devices get smaller, sleeker, and lighter than ever, consumers will be able to choose from a wide range of mobile devices to keep them connected, entertained, informed, and productive. As consumers' life styles become more mobile, there is ever increasing demand for connectivity. Mobile devices will require high performance memories, with very low power consumption for extended battery life. Devices that use Hynix Mobile Memory enables everything you love on-the-go. Hynix Mobile Memory products offered in small footprint packages have superior power saving features useful in all handheld devices such as cellular phones, PDAs, MP3 players, etc. Hynix Mobile Memories are ideal for portable applications which require very low power consumption. Hynix's Mobile Business Group offers a broad variety of products enabling our customers to deliver next-generation devices in time to market. MCP Line-up Mobile DRAM Broad Product Line: SDR / DDR, x16 / x32 organizations, 128Mb to 2Gb densities Diverse Packaging Options: Discrete, KGD (Known Good Die), MCP (Multi Chip Package), PoP (Package on Package), Ci-MCP (Card Interface MCP) Small Form Factor Packages: For use in the most space-constrained handheld applications Low Power Features: Programmable Drive strength, Partial Array Self Refresh, Auto Temperature Compensated Self Refresh mode Major Applications: Mobile Phone, PDA, MP3 Player, Digital Still Camera, MID(Mobile Internet Device), PND(Portable Navigation Device), Personal Media Player (PMP), Handheld Game Console MCP Small Form Factor package saves space in Handheld Devices High Capacity Data Storage, High Speed, with Low Power Consumption In-house manufacturing provides cost efficient solutions in a timely manner Major Application - Mobile Phone, Smartphone, PDA Phone, Digital Still Camera, MID(Mobile Internet Device), Wireless LAN Card, Handheld Game Console e-NAND e-NAND : Combination of NAND Flash and the Flash Controller with MMC interface, in a single package Simple read/write memory using standard MMC 4.2 protocol interface. No additional firmware for NAND management required Controller includes NAND software such as FTL, ECC, FAT-16/32 Enhanced Mobility with Small Components! 12 Hynix Semiconductor Inc. e-NAND Introduction & Concept Mobile Memory Product Line-up MOBILE SDR DENSITY 2G 1G 512Mb 256Mb 128Mb SPEED VOL. PKG. 128Mx16 ORG. H55S2G62MFR-60M PART NUMBER 166MHz (6.0ns) 1.8V FBGA(54ball) / KGD AVAIL. Now 64Mx32 H55S2G22MFR-60M 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now 64Mx32 (reduced page) H55S2G32MFR-60M 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now 64Mx16 H55S1G62MFP-60M 166MHz (6.0ns) 1.8V FBGA(54ball) / KGD Now Now 32Mx32 H55S1G22MFP-60M 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD 32Mx32 (reduced page) H55S1G32MFP-60M 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now 32Mx16 HY5S7B6ALFP-6E 166MHz (6.0ns) 1.8V FBGA(54ball) / KGD Now 16Mx32 HY5S7B2ALFP-6E 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now 32Mx16 H55S5162DFR-60M 166MHz (6.0ns) 1.8V FBGA(54ball) / KGD Now 16Mx32 H55S5122DFR-60M 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now 16Mx32 (reduced page) H55S5132DFR-60M 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now 16Mx16 HY5S5B6HLFP-6E 166MHz (6.0ns) 1.8V FBGA(54ball) / KGD Now 8Mx32 HY5S5B2CLFP-6E 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now 16Mx16 H55S2562JFR-60M 166MHz (6.0ns) 1.8V FBGA(54ball) / KGD Now 8Mx32 H55S2622JFR-60M 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now 8Mx32 (reduced page) H55S2532JFR-60M 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now 8Mx16 H55S1262EFP-60M 166MHz (6.0ns) 1.8V FBGA(54ball) / KGD Now 4Mx32 H55S1222EFP-60M 166MHz (6.0ns) 1.8V FBGA(90ball) / KGD Now MOBILE DDR DENSITY 2Gb 1Gb 512Mb 256Mb 128Mb PART NUMBER SPEED VOL. PKG. AVAIL. 128Mx16 ORG. H5MS2G62MFR-J3M / E3M DDR333 / DDR400 1.8V FBGA(60ball) / KGD Now 64Mx32 H5MS2G22MFR-J3M / E3M DDR333 / DDR400 1.8V FBGA(90ball) / KGD Now 64Mx32 (reduced page) H5MS2G32MFR-J3M / E3M DDR333 / DDR400 1.8V FBGA(90ball) / KGD Now 64Mx16 H5MS1G62MFP-J3M / E3M DDR333 / DDR400 1.8V FBGA(60ball) / KGD Now 32Mx32 H5MS1G22MFP-J3M / E3M DDR333 / DDR400 1.8V FBGA(90ball) / KGD Now 32Mx32 (reduced page) H5MS1G32MFP-J3M / E3M DDR333 / DDR400 1.8V FBGA(90ball) / KGD Now 32Mx16 HY5MS7B6BLFP-6E DDR333 1.8V FBGA(60ball) / KGD Now 16Mx32 HY5MS7B2BLFP-6E DDR333 1.8V FBGA(90ball) / KGD Now 32Mx16 H5MS5162DFR-J3M / E3M DDR333 / DDR400 1.8V FBGA(60ball) / KGD Now 16Mx32 H5MS5122DFR-J3M / E3M DDR333 / DDR400 1.8V FBGA(90ball) / KGD Now 16Mx32 (reduced page) H5MS5132DFR-J3M / E3M DDR333 / DDR400 1.8V FBGA(90ball) / KGD Now 16Mx16 HY5MS5B6BLFP-6E DDR333 1.8V FBGA(60ball) / KGD Now 8Mx32 HY5MS5B2ALFP-6E DDR333 1.8V FBGA(90ball) / KGD Now 16Mx16 H5MS2562JFR-J3M / E3M DDR333 / DDR400 1.8V FBGA(60ball) / KGD Now 8Mx32 H5MS2622JFR-J3M / E3M DDR333 / DDR400 1.8V FBGA(90ball) / KGD Now 8Mx32 (reduced page) H5MS2532JFR-J3M / E3M DDR333 / DDR400 1.8V FBGA(90ball) / KGD Now 8Mx16 H5MS1262EFP-J3M / E3M DDR333 / DDR400 1.8V FBGA(60ball) / KGD Now 4Mx32 H5MS1222EFP-J3M / E3M DDR333 / DDR400 1.8V FBGA(90ball) / KGD Now The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com Hynix Semiconductor Inc. 13 NAND Flash Memory General Description Hynix provides a broad range of NAND Flash products density from 128Mb to 256Gb with various types of packaging. (TSOP, ULGA and FBGA) Due to the proliferation of digital content, NAND Flash memory products are used in a wide variety of applications such as MP3, PMP, Digital camera, Camcorder, Memory card, USB flash drive and other consumer electronics such as Game console, Navigation. Currently, Hynix NAND Flash Memory is being widely adopted in the mobile handset application and we are also developing PC storage solutions based on the NAND Flash chips. To meet the growing demand for high capacity and improved performance in mobile applications, Hynix is offering HiFFS(Flash File System) software with eHiFFS system that enhances NAND chip performance and reliability. NAND Flash Key Features Product Voltage Organization Page & Block size (byte) tRC (min.) / tWC (min.) 25ns tR (max) Program time (typ) Erase time (typ) MONO / DDP Operating Current (ICC) QDP / DSP Copy-back Cache program Function Cache Read 2 plane Op. Extended Data Out Special Function OTP Unique ID 48nm 16Gb MLC 3.3V x8 4KB + 128B / 512KB 25ns 60us < 800us 2.5ms 15(typ.) ~ 30mA(max) 20(typ.) ~ 40mA(max) O with Data out Write, Read & Erase O O O 41nm 32Gb MLC 3.3V x8 4KB + 224B / 512KB 25ns 60us 1000us(TBD) 2.5ms 20(typ.) ~ 40mA(max) 20(typ.) ~ 40mA(max)(TBD) O with Data out O O Write, Read & Erase O O O 3xnm 32Gb MLC 3.3V x8 8KB + 436B / 1MB 30ns 400us(max) 1600us(TBD) 1.5ms 30(typ.) ~ 50mA(max) 30(typ.) ~ 50mA(max) O with Data out O O Write, Read & Erase O O O 5K / 10years 1 TSOP / ULGA / DSP 5K / 10years 1 VLGA TBD TBD VLGA(TBD) Endurance / PKG E/W Cycles / Retention NOP PKG NAND Flash Application 14 Hynix Semiconductor Inc. Software Support HiFFS Software The management of data on NAND Flash memory is complicated due to limitations of NAND Flash memory. One of the most important limitations of NAND Flash memory is the inability to rewrite data without block erase. HiFFS Software solution is required to compensate for erase cycle limitations. Additionally, it extends the life of Hynix NAND Flash with wear-leveling algorithms. eHiFFS is the software solution for mobile embedded systems. It is an essential system software for consumer applications including Smart phones, PDAs, MP3 player, PMPs, Digital TVs and Digital Camcoders. eHiFFS Software eHiFFS software supports partition manager, logical to physical mapping, wear-leveling, bad block management and prevents read disturbance. High Performance / High Reliability / Ease of Portability Host Interface - Supports various host interfaces ( ONFI BA, LBA, eMMC etc...) - Option for additional features Robust Flash Management with Hynix proprietary Software (eHiFFS) High performance interface optimized for Hynix NAND Flash NAND Flash Storage for Fun and Excitement! Hynix Semiconductor Inc. 15 NAND Flash Product Line-up SLC PRODUCT HY27US08281A HY27US08561A HY27US08121B H27U518S2C HY27US081G1M HY27US081G1A HY27UF081G2A HY27US081G2A H27U1G8F2B HY27UF082G2B HY27UF084G2B HY27UG088G5(D)B HY27UH08AG5B H27UAG8F2M H27UBG8G2M H27UCG8H2M TECH CELL DENSITY BLOCK SIZE STACK VCC/ORG PACKAGE AVAILABILITY REMARK 90nm 90nm 70nm 57nm 70nm 57nm 70nm 70nm 48nm 57nm 57nm 57nm 57nm 41nm 41nm 41nm SLC 128Mb 256Mb 512Mb 512Mb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 4Gb 8Gb 16Gb 16Gb 32Gb 64Gb 16KB 16KB 16KB 16KB 16KB 16KB 128KB 128KB 128KB 128KB 128KB 128KB 128KB 256KB (4KB Page) 256KB (4KB Page) 256KB (4KB Page) Mono Mono Mono Mono Mono Mono Mono Mono Mono Mono Mono DDP QDP Mono DDP QDP 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 1.8V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 TSOP / USOP TSOP / USOP / FBGA TSOP / USOP / FBGA TSOP USOP TSOP TSOP / USOP / FBGA FBGA TSOP TSOP / FBGA TSOP TSOP / LGA TSOP ULGA ULGA ULGA NOW NOW NOW Dec `08 NOW NOW NOW NOW Dec `08 NOW NOW NOW NOW May `09 Jun `09 Jun `09 EOL DEC `10 EOL DEC `10 EOL DEC `09 EOL DEC `10 EOL DEC `09 EOL DEC `10 EOL DEC `09 EOL DEC `09 EOL DEC `11 EOL Jun `10 EOL Jun `10 2CE / Dual CH. 2CE TECH CELL DENSITY BLOCK SIZE STACK VCC/ORG PACKAGE AVAILABILITY REMARK 4Gb 8Gb 8Gb 16Gb 16Gb 16Gb 32Gb 32Gb 32Gb 64Gb 64Gb 64Gb 128Gb 128Gb 128Gb 128Gb 256Gb 64Gb 128Gb 64Gb 256KB 256KB 512KB 256KB 512KB (4KB Page) 512KB (4KB Page) 256KB 512KB (4KB Page) 512KB (4KB Page) 256KB 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 512KB (4KB Page) 768KB (192 Block) 768KB (192 Block) 256KB (4KB Page) Mono Mono Mono DDP Mono Mono QDP DDP Mono DSP QDP DDP ODP DSP ODP QDP ODP DDP QDP QDP 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 3.3V / x8 TSOP TSOP TSOP TSOP TSOP / VLGA TSOP / ULGA TSOP TSOP VLGA TSOP DSP TSOP / VLGA VLGA LSOP TSOP DSP LLGA VLGA LLGA VLGA LLGA ULGA NOW NOW NOW NOW NOW Apr ' 09 NOW NOW NOW NOW NOW Now NOW NOW NOW Now Apr ' 09 Mar ' 09 Mar ' 09 Jun `09 2CE 2CE MLC / TLC PRODUCT HY27UT084G2A HY27UT088G2A H27U8G8T2B HY27UU08AG5A H27UAG8T2M H27UAG8T2A HY27UV08BG5A H27UBG8U5M H27UBG8T2M HY27UW08CGFA H27UCG8V5M H27UCG8UDM H27UDG8WFM H27UDG8WFMTR-BC H27UDG8YFMXR-BC H27UDG8VEM H27UEG8YEM H2EUCG8N11YR-C H2EUDG8P11XR-C H27UCG8H2M 57nm 57nm 48nm 57nm 48nm 41nm 57nm 48nm 41nm 57nm 48nm 41nm 48nm 48nm 48nm 41nm 41nm 48nm 48nm 41nm MLC TLC 2CE 2CE 2CE 4CE 2CE Dual CH. 4CE 4CE 4CE 4CE, Dual CH. 4CE, Dual CH. Emulated NAND Emulated NAND 2CE uSD PRODUCT H24U51TM2ARH H24U51TM3BRH H24U1GTM1MRQ H24U1GTM3ARH H24U2GUM1MRQ H24U2GUM3ARH H24U2GTM3BRH H24U4GVM3MRH H24U4GUM3ARH H24U8GVM3MRH H24YAGVM3MRH DENSITY TECH. 8GB 16GB 57nm 48nm 57nm 48nm 57nm 48nm 41nm 48nm 41nm 41nm 41nm PRODUCT DENSITY TECH. H26M01002MAR H26M11002MAR H26M11002AAR H26M11001BAR H26M22002AAR H26M21002BAR H26M21001CAR H26M34002MAR H26M34002AAR H26M32002BAR H26M32001CAR H26M48002MAR H26M44002AAR H26M42001BAR H26M54001AJR H26M68001MJR 512MB 1GB 1GB 1GB 2GB 2GB 2GB 4GB 4GB 4GB 4GB 8GB 8GB 8GB 16GB 32GB 57nm 60nm 57nm 48nm 57nm 48nm 41nm 60nm 57nm 48nm 41nm 57nm 48nm 41nm 41nm 41nm 512MB 1GB 2GB 4GB NAND COMPONENT DENSITY STACK SPEC. uSD CLASS AVAILABILITY EOL 4Gb 4Gb 8Gb 8Gb 8Gb 8Gb 16Gb 8Gb 16Gb 16Gb 16Gb Mono Mono Mono Mono DDP DDP Mono QDP DDP QDP ODP SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 SD2.0 Class-2 Class-4 Class-2 Class-4 Class-2 Class-6 Class-6 (TBD) Class-6 Class-6 (TBD) Class-6 (TBD) Class-6 (TBD) Aug '09 TBD Jun '09 TBD Jun '09 TBD TBD TBD TBD TBD TBD Aug '09 TBD Jun '09 TBD Jun '09 TBD TBD TBD TBD TBD TBD e-NAND 16 Hynix Semiconductor Inc. NAND COMPONENT DENSITY STACK SPEC. AVAILABILITY 4Gb 8Gb 8Gb 8Gb 8Gb 16Gb 16Gb 8Gb 8Gb 16Gb 16Gb 8Gb 16Gb 32Gb 32Gb 32Gb Mono Mono Mono Mono DDP Mono Mono QDP QDP DDP DDP ODP QDP DDP QDP ODP MMC4.2 MMC4.2 MMC4.2 MMC4.3 MMC4.2 MMC4.2 MMC4.3 MMC4.2 MMC4.2 MMC4.2 MMC4.3 MMC4.2 MMC4.2 MMC4.3 MMC4.3 MMC4.3 NOW NOW NOW Q2 NOW Q2 End of Q2 NOW NOW Q2 Q2 NOW Q2. End of Q2 End of Q2 End of Q2 The information in this product brochure is subject to change. Up to date information on our products and technologies may be obtained from our website. www.hynix.com CIS (CMOS Image Sensor) General Description Hynix entered the CMOS Image Sensor business in 2007, to continue with its long term growth strategy. Through close cooperation with industryleading business partners and with its expertise in the memory business, Hynix successfully introduced competitive and cost effective image sensors in the following year. Hynix aims to diversify its product portfolio by developing a wide range of higher resolution application-specific products to meet market demand. Applications CMOS Image Sensor CMOS Image Sensor is a device that converts an optical image to an electrical signal using a CMOS manufacturing technology. CMOS technology allows the integration of the image sensor and digital signal processor on the same chip, resulting in faster, smaller, cost effective and lower power image sensing devices. CMOS Image Sensor market has high growth potential, with demand expected to rise by 10 percent annually through 2011. Its main applications are camera phones, digital still cameras, and video conferencing systems, but the market for CMOS Image Sensor is rapidly diversifying into various applications including surveillance systems, automotive cameras, and medical system. Camera Attachment Ratio of Mobile Phones Camera Phone Resolution Trend (Main Camera) Hynix CMOS Image Sensor Hynix is now offering CMOS Image Sensors for various consumer applications, delivering outstanding performance and providing innovative and cost-effective solutions. Hynix is continuously enhancing its technological excellence accelerating technology development to provide quality products and meet customers needs. Hynix CMOS Image Sensor Pixel Technology Migration Experience Clear and Vivid Images with Hynix CMOS Image Sensors Hynix Semiconductor Inc. 17 CIS(CMOS Image Sensor) Product Line-up CMOS Image Sensor Product Lineup and Key Features VGA (YACBAA0S) Pixel Size Array Format (Active) Optical Format Imaging Area Color Filter Array Scan Mode Frame Rate Shutter Automatic Function Window size Flash Support 2.25umx2.25um 640Hx480V 1/10-inch 1.44mmx1.08mm RGB Bayer color filters Progressive 30-fps @ 24MHz Electronic rolling Shutter (ERS) Exposure, white balance, black level calibration, anti-flicker, color saturation, defect correction, aperture correction Programmable (including VGA, QVGA, CIF, QCIF) Xenon and LED Sensitivity SNR Dynamic Range ADC Data Rate Programmable Supply Voltage Power Consumption Operating Temp. Range 0.750V / LuxSec 35dB 60dB on-chip, 10-bit 12 megapixels per second (master clock, 24MHz) Exposure, white balance, blanking, vertical blanking, color, sharpness, gamma correction, lens shading correction, X-Y image flip, zoom, windowing Digital I/O: 1.7V ~ 3.0V Digital Core: 1.7V ~ 1.9V Analog & Pixel: 2.6V ~ 3.0V 100mW (Typical) -20 to 70 2M (YACD5B1S) Pixel Size Optical Format Array Format (Active) Imaging Area Color Filter Array Scan Mode Frame Rate Shutter Automatic Function Window size Flash Support 1.75umx1.75um 1/5-inch 1600Hx1200V 2.80mmx2.10mm RGB Bayer color filters Progressive Max 15-fps @ full resolution Electronic rolling Shutter (ERS) Exposure, white balance, black level calibration, anti-flicker, color saturation, defect correction, aperture correction Programmable (including UXGA, SVGA, QSVGA) Xenon and LED Sensitivity SNR ADC Data Rate Programmable Supply Voltage Power Consumption Operating Temp. Range TBD 32dB (est.) on-chip, 10-bit 36 megapixels per second (Internal PLL clock = 72MHz) Exposure, white balance, blanking, vertical blanking, color, sharpness, gamma correction, lens shading correction, X-Y image flip, zoom, windowing Digital I/O: 1.7V ~ 3.0V Digital Core: 1.7V ~ 1.9V Analog & Pixel: 2.6V ~ 3.0V TBD -20 to 70 3M (YACE4A1S) Pixel Size Optical Format Array Format (Active) Imaging Area Color Filter Array Scan Mode Flash Support Automatic Function Window size Sub-Sampling Sensitivity 1.75umx1.75um 1/4-inch 2048Hx1356V TBD RGB Bayer color filters Progressive Xenon and LED Exposure, white balance, black level calibration, anti-flicker, color saturation, defect correction, aperture correction, Anti-Shaking, Auto Focus Control Programmable 1/2, 1/4 0.475V / lux-sec @ 550nm (est.) SNR ADC Programmable 1.75umx1.75um 1/3.2 inch 2624Hx1984V 4.59mmx3.47mm RGB Bayer color filters Xenon and LED Progressive 15-fps @ QSXGA (Full Resolution) -10 to 70 Bayer (10-bit), MIPI TBD TBD ADC Dynamic Range Feature Frame Rate Shutter Supply Voltage Power Consumption Operating Temp. Range 32dB (est.) On-chip, 10-bit Exposure, white balance, blanking, vertical blanking, color, sharpness, gamma correction, lens shading correction, X-Y image flip, zoom, windowing 15-fps @ QXGA / 30-fps @ XGA Electronic rolling Shutter (ERS) Digital I/O: 1.7V ~ 3.0V Digital Core: 1.7V ~ 1.9V Analog & Pixel: 2.6V ~ 3.0V 80mW (Active) 7A (Standby) -20 to 60 5M (YACF3A1C) Pixel Size Optical Format Array Format (Active) Imaging Area Color Filter Array Flash Support Scan Mode Frame Rate Sub Sampling Operating Temp. Range Data Interface Format Sensitivity SNR 18 Hynix Semiconductor Inc. Shutter Supply Voltage Power Consumption Serial Interface On-chip, 10-bit TBD DPC, Programmable BLC, LCS, Analog / Digital Gain Control, X-Y Flip, Windowing, Sub-sampling, Scaling, Slew Rate control, Exposure Control, Xenon / LED Support Electronic rolling Shutter (ERS) With Global Reset Release Digital I/O: 1.6V ~ 3.1V Digital Core: 1.8V 10% Analog & Pixel: 2.6V ~ 3.1V <350mW Yes Global Sales Network HEADQUARTERS & FACTORY EUROPE HYNIX SEMICONDUCTOR INC. (H.S.I) HYNIX SEMICONDUCTOR DEUTSCHLAND GMBH. (H.S.D) Am Prime Parc 13 Kelsterbacher Str. 16 D-65479 Raunheim Germany Tel: 49-6142-921-100 / 206 Fax: 49-6142-921-290 / 214 HEADQUARTERS & FACTORY San 136-1, Ami-Ri, Bubal-Eub, Icheon-si, Kyoungki-Do, Korea 467-701 Tel: 82-31-630-4114 Fax: 82-31-630-4103 MARKETING & SALES DIVISION 891 Daechi-dong, Kangnam-gu, Seoul, 135-738, Korea Tel: 82-2-3459-5114 Fax: 82-2-3459-5987/8 CHEONGJU FACTORY 1, Hyangjeong-dong, Hungduk-gu, Cheongju-si, Chungbuk, 361-725, Korea Tel: 82-43-270-3114 Fax: 82-43-270-2145 AMERICA HYNIX SEMICONDUCTOR AMERICA INC. (H.S.A) 3101 North First Street, San Jose, CA 95134, U.S.A Tel: 1-408-232-8000 Fax: 1-408-232-8103 ATLANTA OFFICE 907 Santa Anita Drive Woodstock, GA 30189, U.S.A Tel: 1-678-445-7768 Fax: 1-678-445-8120 AUSTIN OFFICE 4201 West Parmer Lane Bldg. 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(H.S.I.S) BANGALORE OFFICE Unit 10, Level 8, Innovator Building, ITPB(International Technology Park Bangalore), Whitefield Road, Bangalore 560066, India Tel: 91-80-4126-5271~2 Fax: 91-80-4126-5274 LIMERICK OFFICE 3rd Floor, Ivernia Hall, 97 Henry Street Limerick, Ireland Tel: 353-61-400-755 Fax: 353-61-400-757 HYNIX SEMICONDUCTOR TAIWAN INC. (H.S.T) 11F, 392, Ruey Kuang Road, Neihu, Taipei 114, Taiwan, R.O.C Tel: 886-2-8752-2300 STIRLING OFFICE Office 2/1 Springfield House Laurel Hill Business Park, Laurel Hill Stirling, FK 7 9JQ, Scotland, U.K Tel: 44-1932-827-750 Fax: 44-1932-827-759 HYNIX SEMICONDUCTOR (Shanghai) CO., LTD. (H.S.C.S) Room 2702-2705, Maxdo Center, No.8, Xing Yi RD, Changning Zone, Shanghai, China Tel: 86-21-5208-0505 Fax: 86-21-5208-0802 ASIA HYNIX NUMONYX SEMICONDUCTOR LTD. 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