LM385Z-1.2/LFT3 - Texas Instruments

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

www.ti.com

SNVS742E –JANUARY 2000–REVISED APRIL 2013

LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode

Check for Samples: LM185-1.2-N,LM285-1.2-N,LM385-1.2-N

Careful design of the LM185-1.2-N has made the

1FEATURES device exceptionally tolerant of capacitive loading,

2• ±1% and 2% Initial Tolerance making it easy to use in almost any reference

• Operating Current of 10μA to 20mA application. The wide dynamic operating range allows

its use with widely varying supplies with excellent

• 1ΩDynamic Impedance regulation.

• Low Temperature Coefficient The extremely low power drain of the LM185-1.2-N

• Low Voltage Reference—1.235V makes it useful for micropower circuitry. This voltage

• 2.5V Device and Adjustable Device Also reference can be used to make portable meters,

Available regulators or general purpose analog circuitry with

• LM185-2.5 Series and LM185 Series, battery life approaching shelf life.

respectively Further, the wide operating current allows it to

replace older references with a tighter tolerance part.

DESCRIPTION The LM185-1.2-N is rated for operation over a −55°C

The LM185-1.2-N/LM285-1.2-N/LM385-1.2-N are to 125°C temperature range while the LM285-1.2-N is

micropower 2-terminal band-gap voltage regulator rated −40°C to 85°C and the LM385-1.2-N 0°C to

diodes. Operating over a 10μA to 20mA current 70°C. The LM185-1.2-N/LM285-1.2-N are available in

range, they feature exceptionally low dynamic a hermetic TO package and the LM285-1.2-N/LM385-

impedance and good temperature stability. On-chip 1.2-N are also available in a low-cost TO-92 molded

trimming is used to provide tight voltage tolerance. package, as well as SOIC and SOT-23.

Since the LM185-1.2-N band-gap reference uses only

transistors and resistors, low noise and good long

term stability result.

CONNECTION DIAGRAM

Figure 1. T0-92 Package (LP)

(Bottom View) Figure 3. SOIC Package

* Pin 3 is attached to the Die Attach Pad

(DAP) and should be connected to Pin 2 or

left floating.

Figure 2. SOT-23

Figure 4. TO Package (NDV)

(Bottom View)

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

SNVS742E –JANUARY 2000–REVISED APRIL 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS(1)(2)(3)

Reverse Current 30mA

Forward Current 10mA

Operating Temperature Range (4)

LM185-1.2-N −55°C to +125°C

LM285-1.2-N −40°C to +85°C

LM385-1.2-N 0°C to 70°C

ESD Susceptibility (5) 2kV

Storage Temperature −55°C to +150°C

Soldering Information

TO-92 package: 10 sec. 260°C

TO package:10 sec. 300°C

SOIC and SOT-23 Pkg.

Vapor phase (60 sec.) 215°C

Infrared (15 sec.) 220°C

See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications

apply only for the test conditions listed.

(2) Refer to RETS185H-1.2 for military specifications.

(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4) For elevated temperature operation, see Table 1.

(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin.

Table 1. TJ(max) for Elevated Temperature Operation

DEVICE TJ(max) (°C)

LM185-1.2-N 150

LM285-1.2-N 125

LM385-1.2-N 100

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

www.ti.com

SNVS742E –JANUARY 2000–REVISED APRIL 2013

ELECTRICAL CHARACTERISTICS(1)

LM185-1.2-N

LM185BX-1.2-N LM385B-1.2-N

LM185BY-1.2-N LM385BX-1.2-N LM385-1.2-N

LM285-1.2-N LM385BY-1.2-N Units

Parameter Conditions Typ LM285BX-1.2-N (Limit)

LM285BY-1.2-N

Tested Design Tested Design Tested Design

Limit (2) Limit (4) Limit (2) Limit (4) Limit (2) Limit (4)

(3)

Reverse Breakdown TA= 25°C, 1.23 1.223 1.223 1.205 V(Min)

Voltage 10μA≤IR≤20mA 1.247 1.247 1.260 V(Max)

Minimum Operating 8 10 20 15 20 15 20 μA

Current LM385M3-1.2-N 10 15 (Max)

Reverse Breakdown 10μA≤IR≤1mA 1 1.5 11.5 11.5 mV

Voltage Change with (Max)

Current 1mA ≤IR≤20mA 10 20 20 25 20 25 mV

(Max)

Reverse Dynamic IR= 100μA, f = 20Hz 1 Ω

Impedance

Wideband Noise IR= 100μA, 60 μV

(rms) 10Hz ≤f≤10kHz

Long Term Stability IR= 100μA, T = 1000 Hr, 20 ppm

TA= 25°C ±0.1°C

Average Temperature IR= 100μA

Coefficient (5) X Suffix 30 30 ppm/°C

Y Suffix 50 50 ppm/°C

All Others 150 150 150 ppm/°C

(Max)

(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA= TJ= 25°C.

(2) Production tested.

(3) A military RETS electrical specification is available on request.

(4) Specified by design. Not production tested. These limits are not used to calculate average outgoing quality levels.

(5) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between

the operating TMAX and TMIN, divided by TMAX −TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.

THERMAL CHARACTERISTICS

Thermal Resistance TO-92 TO SOIC SOT-23

180°C/W (0.4″leads)

θJA (junction to ambient) 440°C/W 165°C/W 283°C/W

170°C/W (0.125″leads)

θJC (junction to case) N/A 80°C/W N/A N/A

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

SNVS742E –JANUARY 2000–REVISED APRIL 2013

www.ti.com

TYPICAL PERFORMANCE CHARACTERISTICS

Reverse Characteristics Reverse Characteristics

Figure 5. Figure 6.

Temperature Drift of 3

Forward Characteristics Representative Units

Figure 7. Figure 8.

Reverse Dynamic Impedance Reverse Dynamic Impedance

Figure 9. Figure 10.

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

www.ti.com

SNVS742E –JANUARY 2000–REVISED APRIL 2013

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Noise Voltage Filtered Output Noise

Figure 11. Figure 12.

Response Time

Figure 13.

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

SNVS742E –JANUARY 2000–REVISED APRIL 2013

www.ti.com

TYPICAL APPLICATIONS

Figure 14. Wide Input Range Reference Figure 15. Micropower Reference from 9V Battery

Figure 16. Reference from 1.5V Battery

*IQ≃30μA

Figure 17. Micropower* 5V Regulator

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

www.ti.com

SNVS742E –JANUARY 2000–REVISED APRIL 2013

*IQ≃20μA standby current

Figure 18. Micropower* 10V Reference

Figure 19. Figure 20. Precision 1μA to 1mA Current Sources

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

SNVS742E –JANUARY 2000–REVISED APRIL 2013

www.ti.com

METER THERMOMETERS

Calibration

1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1μA/°K

2. Remove short, adjust R2 for correct reading in centigrade

†IQat 1.3V≃500μA

IQat 1.6V≃2.4mA

Figure 21. 0°C−100°C Thermometer

Figure 22.

*2N3638 or 2N2907 select for inverse HFE ≃5

†Select for operation at 1.3V

‡IQ≃600μA to 900μA

Figure 23. Lower Power Thermometer

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

www.ti.com

SNVS742E –JANUARY 2000–REVISED APRIL 2013

Calibration

1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1.8μA/°K

2. Remove short, adjust R2 for correct reading in °F

Figure 24. 0°F−50°F Thermometer

Adjustment Procedure

1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck

coefficient.

2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.

Figure 25. Micropower Thermocouple Cold Junction Compensator

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

SNVS742E –JANUARY 2000–REVISED APRIL 2013

www.ti.com

Thermocouple Seebeck R1 R2 Voltage Voltage

Type Coefficient (Ω) (Ω) Across R1 Across R2

(μV/°C) @ 25°C (mV)

(mV)

J 52.3 523 1.24k 15.60 14.32

T 42.8 432 1k 12.77 11.78

K 40.8 412 953Ω12.17 11.17

S 6.4 63.4 150Ω1.908 1.766

Typical supply current 50μA

Calibration

1. Adjust R1 so that V1 = temp at 1mV/°K

2. Adjust V2 to 273.2mV

†IQfor 1.3V to 1.6V battery volt-

age = 50μA to 150μA

Figure 26. Centigrade Thermometer

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

www.ti.com

SNVS742E –JANUARY 2000–REVISED APRIL 2013

SCHEMATIC DIAGRAM

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

LM185-1.2-N, LM285-1.2-N, LM385-1.2-N

SNVS742E –JANUARY 2000–REVISED APRIL 2013

www.ti.com

REVISION HISTORY

Changes from Revision D (April 2013) to Revision E Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 11

Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N

PACKAGE OPTION ADDENDUM

www.ti.com 13-Jun-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM185BYH-1.2/NOPB ACTIVE TO NDU 2 1000 Green (RoHS

& no Sb/Br) Call TI | POST-PLATE Level-1-NA-UNLIM -55 to 125 ( LM185BYH1.2 ~

LM185BYH1.2)

LM185H-1.2/NOPB ACTIVE TO NDU 2 1000 Green (RoHS

& no Sb/Br) Call TI | POST-PLATE Level-1-NA-UNLIM -55 to 125 ( LM185H1.2 ~

LM185H1.2)

LM285BXM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BX

M1.2

LM285BXMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BX

M1.2

LM285BXZ-1.2/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 285BX

Z-1.2

LM285BXZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type -40 to 85 285BX

Z-1.2

LM285BYM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY

M1.2

LM285BYMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY

M1.2

LM285M-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285

M1.2

LM285MX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285

M1.2

LM285Z-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type -40 to 85 LM28

5Z-1.2

LM385BM-1.2 NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385

BM1.2

LM385BM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385

BM1.2

LM385BMX-1.2 NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385

BM1.2

LM385BMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385

BM1.2

LM385BXM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX

M1.2

LM385BXMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX

M1.2

PACKAGE OPTION ADDENDUM

www.ti.com 13-Jun-2017

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM385BXZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 70 385BX

Z-1.2

LM385BYM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY

M1.2

LM385BYMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY

M1.2

LM385BYZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 70 385BY

Z-1.2

LM385BZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 70 LM385

BZ1.2

LM385M-1.2 NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385

M1.2

LM385M-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385

M1.2

LM385M3-1.2 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI 0 to 70 R11

LM385M3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R11

LM385M3X-1.2 NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI 0 to 70 R11

LM385M3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R11

LM385MX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385

M1.2

LM385Z-1.2/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type LM385

Z-1.2

LM385Z-1.2/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type LM385

Z-1.2

LM385Z-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS

& no Sb/Br) CU SN N / A for Pkg Type 0 to 70 LM385

Z-1.2

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

PACKAGE OPTION ADDENDUM

www.ti.com 13-Jun-2017

Addendum-Page 3

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM285BXMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM285BYMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM285MX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BMX-1.2 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BXMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385BYMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM385M3-1.2 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385M3-1.2/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385M3X-1.2 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385M3X-1.2/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3

LM385MX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Dec-2014

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM285BXMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM285BYMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM285MX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385BMX-1.2 SOIC D 8 2500 367.0 367.0 35.0

LM385BMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385BXMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385BYMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM385M3-1.2 SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM385M3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0

LM385M3X-1.2 SOT-23 DBZ 3 3000 210.0 185.0 35.0

LM385M3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0

LM385MX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Dec-2014

Pack Materials-Page 2

MECHANICAL DATA

NDU0002A

www.ti.com

H02A (Rev F)

4203227/C

www.ti.com

PACKAGE OUTLINE

TYP

0.20

0.08

0.25

2.64

2.10 1.12 MAX

TYP

0.10

0.01

3X 0.5

0.3

TYP

0.6

0.2

1.9

0.95

TYP-80

3.04

2.80

1.4

1.2

(0.95)

SOT-23 - 1.12 mm max heightDBZ0003A

SMALL OUTLINE TRANSISTOR

4214838/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Reference JEDEC registration TO-236, except minimum foot length.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ALL AROUND 0.07 MIN

ALL AROUND

3X (1.3)

3X (0.6)

(2.1)

2X (0.95)

(R0.05) TYP

4214838/C 04/2017

SOT-23 - 1.12 mm max heightDBZ0003A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

www.ti.com

EXAMPLE STENCIL DESIGN

(2.1)

2X(0.95)

3X (1.3)

3X (0.6)

(R0.05) TYP

SOT-23 - 1.12 mm max heightDBZ0003A

SMALL OUTLINE TRANSISTOR

4214838/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL

SCALE:15X

SYMM

PKG

www.ti.com

PACKAGE OUTLINE

3X 2.67

2.03

5.21

4.44

5.34

4.32

12.7 MIN

2X 1.27 0.13

3X 0.55

0.38

4.19

3.17

3.43 MIN

3X 0.43

0.35

(2.54)

NOTE 3

2.6 0.2

4 MAX

SEATING

PLANE

0.076 MAX

(0.51) TYP

(1.5) TYP

TO-92 - 5.34 mm max heightLP0003A

TO-92

4215214/B 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Lead dimensions are not controlled within this area.

4. Reference JEDEC TO-226, variation AA.

5. Shipping method:

a. Straight lead option available in bulk pack only.

b. Formed lead option available in tape and reel or ammo pack.

c. Specific products can be offered in limited combinations of shipping medium and lead options.

d. Consult product folder for more information on available options.

EJECTOR PIN

OPTIONAL

PLANE

SEATING

STRAIGHT LEAD OPTION

321

SCALE 1.200

FORMED LEAD OPTION

OTHER DIMENSIONS IDENTICAL

TO STRAIGHT LEAD OPTION

SCALE 1.200

www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MAX

ALL AROUND

TYP

(1.07)

(1.5) 2X (1.5)

2X (1.07)

(1.27)

(2.54)

FULL R

TYP

( 1.4)0.05 MAX

ALL AROUND

TYP

(2.6)

(5.2)

(R0.05) TYP

3X ( 0.9) HOLE

2X ( 1.4)

METAL

3X ( 0.85) HOLE

(R0.05) TYP

4215214/B 04/2017

TO-92 - 5.34 mm max heightLP0003A

TO-92

LAND PATTERN EXAMPLE

FORMED LEAD OPTION

NON-SOLDER MASK DEFINED

SCALE:15X

SOLDER MASK

OPENING

METAL

SOLDER MASK

OPENING

123

LAND PATTERN EXAMPLE

STRAIGHT LEAD OPTION

NON-SOLDER MASK DEFINED

SCALE:15X

METAL

TYP

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL

12 3

www.ti.com

TAPE SPECIFICATIONS

19.0

17.5

13.7

11.7

11.0

8.5

0.5 MIN

TYP-4.33.7

9.75

8.50

TYP

2.9

2.4 6.75

5.95

13.0

12.4

(2.5) TYP

16.5

15.5

4215214/B 04/2017

TO-92 - 5.34 mm max heightLP0003A

TO-92

FOR FORMED LEAD OPTION PACKAGE

IMPORTANT NOTICE

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its

semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers

should obtain the latest relevant information before placing orders and should verify that such information is current and complete.

TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated

circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and

services.

Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is

accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced

documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements

different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the

associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers

remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have

full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products

used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with

respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous

consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and

take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will

thoroughly test such applications and the functionality of such TI products as used in such applications.

TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,

including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to

assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any

way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource

solely for this purpose and subject to the terms of this Notice.

TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI

products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,

enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically

described in the published documentation for a particular TI Resource.

Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that

include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE

TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY

RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or

endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR

REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO

ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF

MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL

PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,

INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF

PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,

DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN

CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN

ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949

and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such

products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards

and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must

ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in

life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

LM385BM-1.2 LM385BM-1.2/NOPB LM385BMX-1.2 LM385BMX-1.2/NOPB LM385BXM-1.2/NOPB LM385BXMX-

1.2/NOPB LM385BXZ-1.2/NOPB LM385BYM-1.2/NOPB LM385BYMX-1.2 LM385BYMX-1.2/NOPB LM385BYZ-

1.2/NOPB LM385BZ-1.2/NOPB LM385M-1.2 LM385M-1.2/NOPB LM385M3-1.2 LM385M3-1.2/NOPB LM385M3X-

1.2 LM385M3X-1.2/NOPB LM385MX-1.2 LM385MX-1.2/NOPB LM385Z-1.2/LFT3 LM385Z-1.2/LFT4 LM385Z-

1.2/NOPB