TDA7708 AM/FM/HD-RadioTM submicron technology automotive receiver Data brief Such a low external component count is made possible by cutting-edge circuit and implementation techniques that overcome the major challenges affecting both very-low and zero IF receivers. VFQFPN64 (9 x 9 x 1.0 mm) GAPGPS02776 Features AEC-Q100 qualified AM/FM reception with digital IF processing Fully automotive grade CMOS design AM/FM Band Low-IF, DSP-based architecture Very high dynamic range built-in IF-ADC Minimum external component count Very small footprint package Multipath noise mitigation processing RDS demodulation with group and block synchronization Compatible with HD-RadioTM and DRM Digital Audio Output Fully RoHS-compliant Description The TDA7708 is a single chip fully-CMOS AM/FM tuner aimed at receivers for terrestrial radio broadcasting. The TDA7708 is a complete integrated and optimized RF tuner for AM/FM reception. It allows the implementation of AM/FM solution (and also HD-RadioTM with external STMicroelectronics's STA680 co-processor) for automotive grade receivers and other applications. The TDA7708 combines state-of-art performance with minimum external component count, making it therefore ideal for integration into car radios and other radio devices with challenging performance, quality, reliability and, last but not least, cost requirements. January 2018 The TDA7708 features multiple front-end lownoise amplifiers (LNAs) to cover AM LW/MW/SW bands, and the entire FM band, with advanced DSP-controlled automatic gain control (AGC) amplifier and mixer stages. After on-chip IF filtering, the TDA7708 digitizes the signal with a very high dynamic range ADC; it processes the complex phase-quadrature baseband signal allowing applications like multipath noise mitigation, and integrated RDS decoding. The TDA7708 furthermore integrates the HDRadioTM channel filtering. Besides providing optimal AM/FM quality reception, the TDA7708 makes it the ideal solution to realize a complete HD-RadioTM receiver solution (in combination with the external STA680 HD-RadioTM decoder) or a DRM receiver (paired to the STA660DRM), with a low bill of material, high performance and real automotive grade quality and reliability. The TDA7708CB requires a very small FW code to be downloaded for booting the IC, thus making it especially suited to systems whose microcontroller has limited code storage capability. Table 1: Device summary Order code Package Packing TDA7708 VFQFPN64 (9 x 9 x 1 mm) Tray Tape & Reel VFQFPN64 (9 x 9 x 1 mm) Tape & Reel TDA7708TR TDA7708CB TDA7708CBTR DocID027311 Rev 4 For further information contact your local STMicroelectronics sales office. Tray 1/8 www.st.com Contents TDA7708 Contents 1 Block diagram.................................................................................. 3 2 Electrical specification .................................................................... 4 3 2.1 Absolute maximum ratings ................................................................ 4 2.2 Thermal data ..................................................................................... 4 2.3 General key parameters .................................................................... 4 Package information ....................................................................... 5 3.1 4 2/8 VFQFPN-64 (9x9x1.0mm) package information ............................... 5 Revision history .............................................................................. 7 DocID027311 Rev 4 TDA7708 1 Block diagram Block diagram Figure 1: Functional block diagram I2C/SPI interface AGC CONTROL HW ACCELERA TORS Audio I2S AM 90 ADC DAC DDC DSP 0 FM 90 ADC VICS interface 0 DRM interface SUPPLY 3V3 POST DIVIDERS VCO PLL CRYSTAL OSC HD-Radio interface 36.864 MHz GADG0807160720PS DocID027311 Rev 4 3/8 Electrical specification TDA7708 2 Electrical specification 2.1 Absolute maximum ratings Table 2: Absolute maximum ratings Symbol Parameter Test condition Min Typ Max Units VCC Abs. supply voltage - -0.5 - 3.6 V Tstg Storage temperature - -55 - 150 C ESD absolute minimum withstand voltage VESD >|2000|(1) Charged device model >|500|(2) Charged device model, corner pins Max. input at any pin (latch-up characteristic) - Human Body model V >|750| IINMAX 100 mA Notes: (1)|1000| (2)|400| on pin 14 on pin 14 2.2 Thermal data Table 3: Thermal data Symbol Rth j-amb 2.3 Parameter Test condition Thermal resistance junction-to-ambient Multilayer 2s2p as per JEDEC JESD51-7 Value Units 27 C/W General key parameters Table 4: General key parameters Symbol Parameter Test condition Min Typ Max Units 3.15 3.3 3.45 V - - 350 mA VCC 3.3 V supply voltage - ICC Supply current FM @108 MHz, active interfaces (10 pF load) Tamb Ambient Temperature Range - -40 - 85 C Tj_oper Operative Junction Temp - - - 125 C Dissipated power Rext = 12 Ohm - - 1 W Pdiss 4/8 DocID027311 Rev 4 TDA7708 3 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK (R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 3.1 VFQFPN-64 (9x9x1.0mm) package information Figure 2: VFQFPN-64 (9x9x1.0 mm) package outline BOTTOM VIEW TOP VIEW CAB fff ccc C D2 eee C A A1 A A2 P Pin1 ID r 0.20 64 P D D1 A3 64 0.45 1 fff 1 CBA 2 2 3 3 0.80 DIA. E1 E2 E SEE DETAIL A 4x C C L B TERMINAL TIP L1 C SEATING PLANE b bbb ddd b1 b CAB C (A1) e A1 A1 L2 SECTION C-C SCALE: NONE TERMINAL TIP DETAIL A SCALE: NONE 8511068_B_A0ZG GAPGPS03460 Table 5: VFQFPN-64 (9x9x1.0 mm) package mechanical data Dimensions Ref Inches (1) Millimeters Min. Typ. Max. Min. Typ. Max. - - 14 - - 0.5511 A - - 1.0 - - 0.0394 A1 0.00 - 0.05 0.0000 - 0.0020 A2 0.55 - 0.80 0.0217 - 0.0314 A3 b (2) b1 0.20 REF 0.0079 REF 0.18 0.25 0.30 0.0070 0.0098 0.0118 - 0.15 - - 0.0059 - DocID027311 Rev 4 5/8 Package information TDA7708 Dimensions Ref Min. D D1 Inches (1) Millimeters Typ. Max. Min. 9.00 BSC (3) - 6.70 Max. 0.3543 BSC 8.75 BSC D2 Typ. 0.3444 BSC - - 0.2638 e 0.50 BSC 0.0197 BSC E 9.00 BSC 0.3543 BSC E1(3) 8.75 BSC 0.3444 BSC - E2 - 6.70 - - 0.2638 - L 0.30 - 0.50 0.0118 - 0.0197 L1 0.15 REF 0.0059 REF L2 - 0.10 - - 0.0039 - P - - 0.60 - - 0.0236 Tolerance of form and position aaa 0.15 0.0059 bbb 0.10 0.0039 ccc 0.10 0.0039 ddd 0.05 0.0019 eee 0.08 0.0031 fff 0.10 0.0039 Notes: (1)Values in mm are converted into inches and rounded to 4 decimal digits. (2)Maximum allowable burr is 0.076 mm in all directions. (3)D1 and E1 are Maximum plastic body size dimensions including mold mismatch. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is "0.25 mm (0.0098 inch)" per side. The package is compliant to IPC/JEDEC J-STD-020D June 2007 standard Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices, MSL Level 3. 6/8 DocID027311 Rev 4 TDA7708 4 Revision history Revision history Table 6: Document revision history Date Revision Changes 16-Dec-2014 1 Initial release. 29-Nov-2016 2 Fully revised. 15-May-2017 3 Added 'RDS demodulation' on Section "Features" 25-Jan-2018 4 Updated Section "Description" and Table 1: "Device summary" on cover page. DocID027311 Rev 4 7/8 TDA7708 IMPORTANT NOTICE - PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST's terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers' products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. (c) 2018 STMicroelectronics - All rights reserved 8/8 DocID027311 Rev 4