TDA7708LX32 - STMICROELECTRONICS

January 2018

DocID027311 Rev 4

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For further information contact your local STMicroelectronics sales office.

www.st.com

TDA7708

AM/FM/HD-Radio™ submicron technology automotive receiver

Data brief

Features

 AEC-Q100 qualified

 AM/FM reception with digital IF processing

 Fully automotive grade CMOS design

 AM/FM Band

 Low-IF, DSP-based architecture

 Very high dynamic range built-in IF-ADC

 Minimum external component count

 Very small footprint package

 Multipath noise mitigation processing

 RDS demodulation with group and block

synchronization

 Compatible with HD-Radio™ and DRM

 Digital Audio Output

 Fully RoHS-compliant

Description

The TDA7708 is a single chip fully-CMOS AM/FM

tuner aimed at receivers for terrestrial radio

broadcasting.

The TDA7708 is a complete integrated and

optimized RF tuner for AM/FM reception. It allows

the implementation of AM/FM solution (and also

HD-Radio™ with external STMicroelectronics's

STA680 co-processor) for automotive grade

receivers and other applications.

The TDA7708 combines state-of-art performance

with minimum external component count, making

it therefore ideal for integration into car radios

and other radio devices with challenging

performance, quality, reliability and, last but not

least, cost requirements.

Such a low external component count is made

possible by cutting-edge circuit and

implementation techniques that overcome the

major challenges affecting both very-low and

zero IF receivers.

The TDA7708 features multiple front-end low-

noise amplifiers (LNAs) to cover AM LW/MW/SW

bands, and the entire FM band, with advanced

DSP-controlled automatic gain control (AGC)

amplifier and mixer stages.

After on-chip IF filtering, the TDA7708 digitizes

the signal with a very high dynamic range ADC; it

processes the complex phase-quadrature

baseband signal allowing applications like

multipath noise mitigation, and integrated RDS

decoding.

The TDA7708 furthermore integrates the HD-

Radio™ channel filtering.

Besides providing optimal AM/FM quality

reception, the TDA7708 makes it the ideal

solution to realize a complete HD-Radio™

receiver solution (in combination with the external

STA680 HD-Radio™ decoder) or a DRM receiver

(paired to the STA660DRM), with a low bill of

material, high performance and real automotive

grade quality and reliability.

The TDA7708CB requires a very small FW code

to be downloaded for booting the IC, thus making

it especially suited to systems whose

microcontroller has limited code storage

capability.

Table 1: Device summary

Order code

Package

Packing

TDA7708

VFQFPN64

(9 x 9 x 1 mm)

Tray

TDA7708TR

Tape & Reel

TDA7708CB

VFQFPN64

(9 x 9 x 1 mm)

Tray

TDA7708CBTR

Tape & Reel

VFQFPN64 (9 x 9 x 1.0 mm) GAPGPS02776

Contents

TDA7708

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DocID027311 Rev 4

Contents

1 Block diagram .................................................................................. 3

2 Electrical specification .................................................................... 4

2.1 Absolute maximum ratings ................................................................ 4

2.2 Thermal data ..................................................................................... 4

2.3 General key parameters .................................................................... 4

3 Package information ....................................................................... 5

3.1 VFQFPN-64 (9x9x1.0mm) package information ............................... 5

4 Revision history .............................................................................. 7

TDA7708

Block diagram

DocID027311 Rev 4

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1 Block diagram

Figure 1: Functional block diagram

DSP

DDC

GADG0807160720PS

90°

0°

90°

0°

3V3

SUPPLY DIVIDERS

POST VCO PLL OSC

CRYSTAL

36.864 MHz

TORS

ACCELERA

CONTROL

AGC

interface

DRM

interface

HD-Radio

interface

VICS

DAC

interface

I2C/SPI

Audio I2S

ADC

Electrical specification

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2 Electrical specification

2.1 Absolute maximum ratings

Table 2: Absolute maximum ratings

Symbol

Parameter

Test condition

Min

Typ

Max

Units

VCC

Abs. supply voltage

-0.5

3.6

Tstg

Storage temperature

-55

150

°C

VESD

ESD absolute minimum withstand

voltage

Human Body model

>|±2000|(1)

Charged device model

>|±500|(2)

Charged device model, corner

pins

>|±750|

Max. input at any pin

(latch-up characteristic)

IINMAX

±100

Notes:

(1)|±1000| on pin 14

(2)|±400| on pin 14

2.2 Thermal data

Table 3: Thermal data

Symbol

Parameter

Test condition

Value

Units

Rth j-amb

Thermal resistance junction-to-ambient

Multilayer 2s2p as per JEDEC JESD51-7

°C/W

2.3 General key parameters

Table 4: General key parameters

Symbol

Parameter

Test condition

Min

Typ

Max

Units

VCC

3.3 V supply voltage

3.15

3.3

3.45

ICC

Supply current

FM @108 MHz, active interfaces (10 pF

load)

350

Tamb

Ambient Temperature

Range

-40

°C

Tj_oper

Operative Junction Temp

125

°C

Pdiss

Dissipated power

Rext = 12 Ohm

TDA7708

Package information

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3 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

3.1 VFQFPN-64 (9x9x1.0mm) package information

Figure 2: VFQFPN-64 (9x9x1.0 mm) package outline

Table 5: VFQFPN-64 (9x9x1.0 mm) package mechanical data

Ref

Dimensions

Millimeters

Inches (1)

Min.

Typ.

Max.

Min.

Typ.

Max.

0.5511

1.0

0.0394

0.00

0.05

0.0000

0.0020

0.55

0.80

0.0217

0.0314

0.20 REF

0.0079 REF

b (2)

0.18

0.25

0.30

0.0070

0.0098

0.0118

0.15

0.0059

8511068_B_A0ZG

(A1) A1

E1 E

SECTION C-C

SCALE: NONE TERMINAL TIP DETAIL A

SCALE: NONE

A1A1

TERMINAL TIP SEATING

PLANE

SEE

DETAIL A

A2 A1

bbbb

ddd

0.45

Pin1 ID

r 0.20

0.80 DIA.

TOP VIEWBOTTOM VIEW

GAPGPS03460

A BC C C

ccc eee

fff

B AC

fff

4 x θ

bb1

Package information

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Ref

Dimensions

Millimeters

Inches (1)

Min.

Typ.

Max.

Min.

Typ.

Max.

9.00 BSC

0.3543 BSC

D1 (3)

8.75 BSC

0.3444 BSC

6.70

0.2638

0.50 BSC

0.0197 BSC

9.00 BSC

0.3543 BSC

E1(3)

8.75 BSC

0.3444 BSC

6.70

0.2638

0.30

0.50

0.0118

0.0197

0.15 REF

0.0059 REF

0.10

0.0039

0.60

0.0236

Tolerance of form and position

aaa

0.15

0.0059

bbb

0.10

0.0039

ccc

0.10

0.0039

ddd

0.05

0.0019

eee

0.08

0.0031

fff

0.10

0.0039

Notes:

(1)Values in mm are converted into inches and rounded to 4 decimal digits.

(2)Maximum allowable burr is 0.076 mm in all directions.

(3)D1 and E1 are Maximum plastic body size dimensions including mold mismatch. Dimensions D1 and E1 do not

include mold flash or protrusions. Allowable mold flash or protrusions is "0.25 mm (0.0098 inch)" per side.

The package is compliant to IPC/JEDEC J-STD-020D June 2007 standard

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface

Mount Devices, MSL Level 3.

TDA7708

Revision history

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4 Revision history

Table 6: Document revision history

Date

Revision

Changes

16-Dec-2014

Initial release.

29-Nov-2016

Fully revised.

15-May-2017

Added 'RDS demodulation' on Section "Features"

25-Jan-2018

Updated Section "Description" and Table 1: "Device summary" on cover

page.

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